JPH0660192U - Mounting structure for electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a mounting structure for electronic parts that easily fixes heat-generating electronic parts and has a large heat dissipation effect. [Structure] In a mounting structure of an electronic component in an electronic device in which a substrate 5 on which electronic components 3a, 3b and 4 including a heat-generating electronic component 4 such as a transistor are mounted is arranged in a case 1, heat is generated. The electronic component 4 is arranged on the back side of the substrate 5, and is arranged so as to be sandwiched between the substrate and the inner surface of the case so that the outer surface 7 of the heat-generating electronic component 4 directly contacts the inner surface of the case.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to heat dissipation from an electronic device having a heat-generating electronic component such as a transistor.

[0002]

[Prior art]

 2. Description of the Related Art Conventionally, a large heat dissipation plate such as 22 is used for heat dissipation of a heat generating electronic component such as a transistor 21 mounted on a substrate 20 as shown in FIG. The heat emitted from 21 was being radiated. As another method, as shown in FIG. 3, a heat radiating plate 28 is arranged in contact with the side wall of a case 27 in which a base plate 26 on which the transistor 25 is mounted is accommodated, and the transistor 25 is brought into contact with it. Further, the fixing metal fitting 29 is applied, the fixing metal fitting 29 is stopped by the screw 30, the transistor 25 is pressed against the heat radiating plate 28, and the heat from the transistor 25 is released to the case 27 via the heat radiating plate 28.

[0003]

[Problems to be solved by the device]

 However, the method of FIG. 2 has the drawbacks that a large heat dissipation plate must be used, leading to an increase in cost, and that a large space for the large heat dissipation plate must be secured. In addition, the method of FIG. 3 has the disadvantages that the heat dissipation plate 28, the fixing metal fitting 29, the screw 30, and other parts are separately required, resulting in high cost and troublesome mounting.

An object of the present invention is to provide an electronic component mounting structure that does not have such drawbacks and that can easily fix an electronic component that generates heat and that has a large heat dissipation effect.

[0005]

[Means for Solving the Problems]

 According to the present invention, in an electronic component mounting structure in an electronic device in which a substrate on which an electronic component including a heat-generating electronic component such as a transistor is mounted is arranged in a case, only the heat-generating electronic component is on the back side of the substrate. The heat generating electronic component is sandwiched between the substrate and the inner surface of the case so that the outer surface of the heat generating electronic component directly contacts the inner surface of the case.

[0006]

[Action]

 The heat from the heat-generating electronic component is radiated through the case that is in direct contact.

[0007]

【Example】

 FIG. 1 shows a case where the present invention is implemented as a discharge lamp lighting device, in which a case 1 contains an electronic device 2. The case 1 is made of aluminum, for example, and is covered with a lid (not shown) if necessary. The electronic device 2 comprises a substrate 5 on the front surface of which electronic components 3a, 3b, etc. that do not generate heat or generate a small amount of heat are mounted, and on the back surface of which is mounted an electronic component 4 that generates heat, such as a transistor, and the substrate 5 is a case. It is arranged below the stepped portion 6 provided on the side wall of 1.

The outer surface 7 of the heat-generating electronic component 4 such as a transistor mounted on the back surface of the substrate 5 is in direct contact with the inner surface of the bottom of the case 1. A spacer 8 made of an elastic material such as rubber is arranged between the upper surface of the electronic component 4 and the back surface of the substrate 5. The height from the bottom surface of the case 1 to the step portion 6 is slightly smaller than the total thickness of the substrate 5, the spacer 8 and the electronic component 4.

The electronic component 3 a, 3 b, etc. are arranged on the front surface, and the heat generating electronic component 4 such as a transistor is arranged on the rear surface via the spacer 8. As the height from the bottom surface of the case 1 to the stepped portion 6 is slightly smaller than the total thickness of the substrate 5, the spacer 8 and the electronic component 4, when inserted into The substrate 5 is inserted while the server 8 is compressed. Therefore, the electronic component 4 is sandwiched between the substrate 5 and the inner surface of the bottom portion of the case 1 and is firmly fixed, and the heat from the electronic component 4 is radiated through the case 1 in direct contact.

In order to enhance the heat dissipation effect, grease or the like may be applied to the outer surface 7 of the electronic component 4 that contacts the case 1. It should be noted that the method of fixing the substrate 5 is arbitrary, such as providing a bendable claw portion in the case 1 instead of the step portion 6, inserting the substrate 5 from the upper side of the case 1, and then bending and fixing the substrate 5. is there.

If the outer surface of the heat-generating electronic component arranged on the back surface contacts the case, the substrate 5 may be arranged so as to contact not the bottom surface of the case but other surface such as a side surface. . When arranging a plurality of heat-generating electronic components having different thicknesses on the back surface of the substrate 5, the thickness of the spacer 8 is adjusted to keep the distance between the substrate 5 and the inner surface of the case 1 constant. Should be

[0012]

[Effect of device]

 According to the present invention, the heat-generating electronic components arranged on the back surface of the substrate come into direct contact with the case, so the heat from the heat-generating electronic components is dissipated through the case and the entire case is As a heat sink, an extremely high heat dissipation effect can be obtained. Further, it is not necessary to separately prepare a heat radiating plate as in the conventional case, and it is not necessary to secure a space for the heat radiating plate. Further, there are advantages that the substrate can be fixed easily and can be easily assembled.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a mounting structure for an electronic component of the present invention.

FIG. 2 is a diagram showing a conventional heat dissipation method having a heat dissipation plate.

FIG. 3 is a diagram showing another conventional heat dissipation method having a heat dissipation plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 case 2 electronic device 3a electronic component 3b electronic component 4 heat-generating electronic component 5 substrate 6 step 7 outer surface of heat-generating electronic component 8 spacer

Claims (1)

[Scope of utility model registration request] 1. In an electronic component mounting structure in an electronic device in which a substrate on which an electronic component including a heat-generating electronic component such as a transistor is mounted is arranged in a case, only the heat-generating electronic component is the back side of the substrate. The electronic component mounting structure is arranged so as to be sandwiched between the substrate and the inner surface of the case so that the outer surface of the heat generating electronic component directly contacts the inner surface of the case.