JPH066094A - Board fixing method for electronic components with lead wires - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a method of fixing a substrate of an electronic component, which bends the lead wire for various electronic components in a constant manner. [Structure] Lead wires 2a, 2b of an electronic component 1 inserted into a predetermined hole of a board 3 are cut into a predetermined length, and a swing lever 4 is cut.
It is bent by swinging a and 4b and fixed to the substrate. At that time, the strokes of the levers 4a and 4b are changed for each wire diameter and material of the lead wires 2a and 2b of the electronic component 1, and the lead wires 2a and 2b are bent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing a board of an electronic component in an automatic electronic component inserting machine for automatically inserting an electronic component having a lead wire into a predetermined hole of the substrate.

[0002]

2. Description of the Related Art A conventional board fixing method for electronic components with lead wires is to fix lead wires 2a, 2b of an electronic component 1 inserted in a predetermined hole of a board 3 to a fixing portion 6 as shown in FIG. 3 (a). Swing levers 4a, 4b which are cut into a predetermined length by cutters 5a, 5b inside and swung along the lower surface of the substrate 3.
The method of fixing the bending electronic component 1 to the substrate as shown in FIG. In the drawings, the cutting mechanism of the cutters 5a and 5b is omitted.

[0003]

However, in the method of fixing the electronic component with the lead wire to the substrate as described above, the bending angle of the lead wires 2a and 2b when fixing the electronic component 1 is determined by the lead wire 2a, Depending on the wire diameter and material of 2b, it may damage the lead wires 2a, 2b,
There is a problem that the quality is not stable, such as the electronic component 1 falling off.

In view of the above-mentioned problems, the present invention makes it possible to bend the lead wires constantly with respect to many kinds of electronic parts having the lead wires having different wire diameters and materials, and the lead wires come into contact with each other or the electronic parts The purpose is to prevent falling off.

[0005]

In order to achieve the above object, the present invention cuts a lead wire of an electronic component inserted in a predetermined hole of a substrate into a predetermined length at a fixing portion located below the substrate. It comprises a first step and a second step of bending the lead wire of the electronic component by a rocking lever of the fixing portion and fixing the lead wire of the electronic component on the substrate. In the second step, the wire diameter of the lead wire of the electronic component to be inserted. And a method of fixing a substrate of an electronic component in which the stroke of the lever of the fixing portion is changed or the distance between the levers is changed for each material.

[0006]

According to the present invention, the above-described method for fixing an electronic component to a substrate enables constant bending of lead wires for many types of electronic components having lead wires having different wire diameters and materials.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will be given below with reference to an embodiment of a method of fixing a substrate of an electronic component of the present invention. The configuration of the apparatus for carrying out the method for fixing a substrate of an electronic component of the present invention is the same as the configuration of the conventional example except for the control of the swing lever. That is, FIG. 3 (a)
The lead wires 2a and 2b of the electronic component 1 inserted in the predetermined holes of the substrate 3 as shown in FIG.
It is cut to a predetermined length with a and 5b, and is bent and fixed to the substrate 3 by swinging the swing levers 4a and 4b as shown in FIG. 3 (b). The feature of the present embodiment is that in the above-mentioned configuration,
As shown in FIG. 4, the strokes of the levers 4a and 4b are normally reduced as shown in FIG. 1a or reduced as shown in FIG. The lead wires 2a and 2b are bent to fix the electronic component 1 to the substrate 3.

Further, as shown in FIG. 2, the distance between the levers 4a and 4b is normally set as shown in FIG. 2a, narrowed as shown in FIG. 2b, or widened as shown in FIG. The lead wires 2a and 2b are bent according to the wire diameters and materials of the lead wires 2a and 2b, and the electronic component 1 is fixed to the substrate 3. In the above-mentioned two embodiments, the electronic parts having different lead wire diameters and materials are connected to the lead wires 2a, 2
b is bent at a constant angle.

[0009]

As is apparent from the above description of the embodiments, the present invention is a method of fixing an electronic component having a lead wire extended to a substrate, wherein the electronic component is inserted into a predetermined hole of the substrate. A first step of cutting the lead wire into a predetermined length at a fixing portion located below the substrate; and a second step of fixing the lead wire of the electronic component to the bent substrate by a swing lever of the fixing portion, In the second step, the stroke of the lever of the fixing portion is changed for each wire diameter and material of the lead wire of the electronic component to be inserted. Alternatively,
Since the distance between the levers is changed, the lead wires of various electronic parts can be bent uniformly, which is of great industrial value.

[Brief description of drawings]

FIG. 1A is a schematic configuration diagram of an apparatus for carrying out an electronic component fixing method of the first invention, and FIG. 1B is a schematic configuration diagram of a state in which a lever stroke of the apparatus is reduced.

FIG. 2 (a) is a schematic configuration diagram of an apparatus for carrying out the electronic component fixing method of the second invention of the present invention (b) is a configuration diagram of the apparatus in a state where the distance between the levers is narrowed (c) is Configuration diagram of the device with the levers widened

FIG. 3 is a schematic configuration diagram of an apparatus for implementing a conventional electronic component fixing method.

[Explanation of symbols]

 1 electronic component main body 2a lead wire 2b lead wire 3 substrate 4a lever 4b lever 6 fixing part

Claims (2)

[Claims] 1. A first step of cutting a lead wire of an electronic component inserted into a predetermined hole of a substrate into a predetermined length at a fixing portion located under the substrate, and the electronic component by a swing lever of the fixing portion. A second step of bending the lead wire and fixing it to the substrate. In the second step, an electronic component with a lead wire for changing the stroke of a lever for each wire diameter and material of the lead wire of the electronic component to be inserted. Substrate fixing method. 2. A first step of cutting a lead wire of the electronic component inserted into a predetermined hole of a substrate into a predetermined length at a fixing portion located below the substrate; A second step of bending a lead wire of a component and fixing the lead wire to a substrate. In the second step, an electronic instrument with a lead wire for changing a distance between levers according to a wire diameter and a material of the lead wire of the electronic component to be inserted. Board fixing method for components.