JPH0664332U - Thin illuminated switch - Google Patents

Abstract

(57) [Abstract] [Purpose] An object is to provide a thin illuminated switch that can be automatically mounted and can be made small and thin. [Structure] In this thin illuminated switch, a frame 24 having first and second openings 24a, 24b is fixed to a substrate 2 having first and second circuit patterns 4, 14. In addition, the LED chips 26 and 28 have the first opening 24a.
It is installed inside. These LED chips 26, 28
Is sealed with a transparent resin portion 34. Further, the tactile spring 36 and the plunger plate 38 are installed in the second opening 24b. The second opening 24b is covered with the sheet 40.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thin illuminated switch equipped with an LED.

[0002]

[Prior art]

 As a conventional illuminated switch, there is one disclosed in Japanese Patent Laid-Open No. 2-276118. In this illuminated switch, the connection terminal for the switch and the electrode terminal for the LED are insert-molded to form a mounting body as a housing having two recesses. An electrode is exposed in each of the recesses, a push spring, a push plate for pushing the push spring, and a cover plate for holding the push spring are housed or attached in one of the recesses, and the LED is provided in the other recess. The chip was housed and sealed with a light-transmitting resin.

[0003]

[Problems to be solved by the device]

 In the conventional illuminated switch as described above, the switching part and the light emitting part are separated from the center of the housing to the left and right, and it has not been possible to cope with the rapid surface mounting of electronic components in recent years. . That is, in order to support surface mounting, it is necessary to flatten the center of gravity on the upper surface side of the housing and to secure an area larger than the suction surface of the vacuum suction collet (nozzle) of the automatic mounting device. However, in the case of the illuminated switch, the center of gravity of the illuminated switch is near the boundary between the switching part and the light emitting part, and there is a large unevenness, so that there is a problem that vacuum adsorption cannot be performed.

Further, when the housing is formed by insert molding, it is necessary to form a concave portion to provide a housing portion for the LED chip or the like, and to provide a contact or an electrode in the concave portion. The shape of the lead frame that forms the electrodes and electrodes became complicated, which was an obstacle to miniaturization and thinning. In particular, in devices such as mobile phones that are rapidly becoming smaller and thinner in recent years, the thinning of the illuminated switch is an essential item for making the entire device smaller and thinner. It was desired to make the illuminated switch even smaller and thinner.

The present invention has been made in view of the above problems, and an object thereof is to provide an automatic mount and a thin illuminated switch that can be made small and thin.

[0006]

[Means for Solving the Problems]

 The thin illuminated switch of the present invention has a frame provided with first and second openings fixed on a substrate having first and second circuit patterns on its surface, and an LED chip in the first opening. Is attached and sealed with a transparent resin portion, and a tactile spring and a plunger plate are installed in the second opening and covered with a sheet.

[0007]

[Action]

 In the thin illuminated switch of the present invention, since the housing is formed by fixing the board and the frame, the circuit pattern can be formed on the board in advance, and the thickness of the frame and the board can be freely set. It can be changed, and it can be made thinner. In addition, since the tactile spring is pressed using the seat and the plunger plate, the switching part can be made thin and flat, which makes the switching part and the light emitting part the same height, and the automatic mounting It enables surface mounting.

[0008]

【Example】

 1 is an exploded perspective view of a thin illuminated switch according to an embodiment of the present invention, FIG. 2 is a perspective view of the thin illuminated switch, FIG. 3 is a sectional view thereof, and FIG. 4 is a plan view of a substrate. 2 is an insulating substrate made of glass epoxy or the like. Reference numeral 4 is a first circuit pattern formed of independent patterns 6 to 12 each having a substantially rectangular shape formed on the substrate 2. Reference numeral 14 is a second circuit pattern which is also formed of a ring-shaped pattern 16 formed on the substrate 2 and a contact pattern 18 formed in the center thereof. The patterns 6 to 12 and the ring-shaped pattern 16 are drawn out to the notches provided on the side surfaces of the substrate 2 to form the through-hole terminals 20, respectively. The contact pattern 18 is drawn out to the back surface side of the board 2 through a through hole 22 provided in the ring-shaped pattern 16 of the board 2, and further from there to a cutout portion on the side surface of the board 2 to form a through hole terminal 20. Is formed. The cutouts provided on the side surface of the substrate 2 separate the through holes of the aggregated substrate when the large aggregated substrate capable of taking a large number of substrates 2 is individually cut by the slicing machine. It has been formed.

Reference numeral 24 is an insulating frame made of synthetic resin or the like, and has first and second openings 24 a and 24 b at positions corresponding to the first and second circuit patterns 4 and 14. An adhesive is printed on the back surface side of the frame 24 and is fixed on the substrate 2.

Reference numerals 26 and 28 denote LED chips that emit red light and blue light, respectively. The LED chips 26 and 28 in this embodiment are mounted on the patterns 8 and 10, respectively, and wire-bonded to the patterns 6 and 12 by gold wires 30 and 32, respectively. Although two LED chips are used in this embodiment, the number and combination of colors can be arbitrarily selected, and when such a change is made, the number is matched to the number of LED chips. The number of patterns 6 to 12 is also increased or decreased.

Reference numeral 34 denotes a transparent resin portion made of epoxy resin or the like, which is filled in the first opening portion 24 a and seals the LED chips 30 and 32.

Reference numeral 36 denotes a reversible tactile spring whose center is curved toward the front side, is housed in the second opening 24 b, and is mounted on the substrate 2 so that its outer peripheral portion is in contact with the ring-shaped pattern 16. .

Reference numeral 38 denotes a plunger plate for pressing and reversing the vicinity of the center of the tactile spring 36.

Reference numeral 40 denotes a sheet having heat resistance and flexibility made of a polyimide sheet or the like, and an adhesive agent is applied to the back surface of the sheet to adhere to the front surface of the frame 2 so as to cover and seal the entire second opening 24b. Has been done.

In the thin illuminated switch of the present embodiment having the above-mentioned configuration, when the sheet 40 is pressed, the center of the tactile spring 36 is inverted and comes into contact with the contact pattern 18, and the contact pattern 18 and the ring are contacted via the tactile spring 36. The pattern 16 becomes conductive and is turned on. As a result, power is supplied to one of the LED chips 26, 28 based on a signal from the circuit of the device to which the thin illumination type switch is attached, and the LED chips 26, 28 are turned on.

In the thin illuminated switch of the present embodiment, the first and second circuit patterns 4 and 14 are formed on the surface of the substrate 2, and the frame 24 can be molded and processed by itself. The structure is such that the thickness of the substrate 2 and the frame 24 can be reduced.

Further, as shown in FIG. 3, the upper surfaces of the sheet 40 and the transparent resin portion 34 are formed so as to be flush with each other. Therefore, the upper surface of the thin illuminated switch becomes flat and can be sucked by the suction nozzle 44 of the automatic mounting device as shown in FIG. As shown in FIG. 3 and the like, a slight groove 24c is formed between the first and second openings 24a and 24b, but this is the first opening when the transparent resin part 34 is formed. It is a groove for preventing sagging of the transparent resin filled in 24a. The groove 24c can be easily filled and flattened by extending the sheet 40.

Further, since the contact pattern 18 formed on the substrate 2 is drawn out through the through hole 22 and does not come into contact with the outer periphery of the tactile spring 36 or the ring-shaped pattern 16, special insulation measures are taken. No need to give.

In this embodiment, the circular tactile spring 36 is used so as to match the shape of the second opening 24b of the frame 24. The plan view of the second opening 24b is shown in FIG. In addition to the rectangular shape, the tactile spring 36 may be changed to have a rectangular planar shape.

[0020]

[Effect of device]

 According to the present invention, since the substrate and the frame can be made thin due to their structures, a thin illuminated switch can be provided.

Further, since the surface can be flattened, it can be supplied as a surface mount component that can be automatically mounted.

Furthermore, since insert molding is not required, there is no need for expensive equipment investment such as insert molding equipment.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a thin illuminated switch according to an embodiment of the present invention.

FIG. 2 is a perspective view of the thin illuminated switch shown in FIG.

FIG. 3 is a cross-sectional view of the thin illuminated switch shown in FIG.

FIG. 4 is a plan view of the substrate shown in FIG.

FIG. 5 is an explanatory diagram showing a state in which a thin illuminated switch is sucked by a suction nozzle of an automatic mounting device.

FIG. 6 is an exploded perspective view showing an example using another tactile spring.

[Explanation of symbols]

 2 substrate 4 1st circuit pattern 6 to 12 pattern 14 2nd circuit pattern 16 ring pattern 18 contact pattern 20 through hole terminal 22 through hole 24 frame 24a first opening 24b second opening 26, 28 LED chip 34 transparent resin 36 Tactile spring 38 Plunger plate 40 Seat

Claims (3)

[Scope of utility model registration request] 1. An insulating substrate, first and second circuit patterns respectively formed on the substrate, and fixed to the substrate and at positions corresponding to the first and second circuit patterns. A frame provided with first and second openings, an LED chip attached to and connected to the first circuit pattern in the first opening, and the LED chip sealed in the first opening. A transparent resin portion, a reversible tactile spring installed on the second circuit pattern in the second opening, a plunger plate mounted on the tactile spring, and heat resistance covering the entire second opening. A thin illuminated switch characterized by comprising a sheet. 2. The thin illuminator according to claim 1, wherein the height of the transparent resin portion and the height of the sheet are the same so that the center of the upper surface is flattened to allow suction for automatic mounting. Type switch. 3. The second circuit pattern is composed of a ring-shaped pattern which is always in contact with the tactile spring and a contact pattern which is provided in the center of the ring-shaped pattern and contacts when the tactile spring is reversed. 2. The thin illuminated switch according to claim 1, wherein wiring is provided on the back side of the substrate through a through hole provided in the ring-shaped pattern of the substrate, and is extended to an external connection pattern.