JPH0666032U - Automatic adhesive tape tensioner - Google Patents

Abstract

(57) [Abstract] [Purpose] An adhesive tape is automatically attached to a semiconductor wafer and a ring frame so that wrinkles do not occur on the adhesive tape during attachment. [Structure] Semiconductor wafer 1 set on stage 3
And a front narrowing device 5 capable of releasing the narrowing of both ends of the tape 4 on the tip side of the ring frame 2 in the width direction, and the narrowing device 5 is moved to pull out the adhesive tape 4 above the ring frame 2. The tape pull-out mechanism 6, the rear narrowing device 7 capable of unfastening the widthwise ends of the pulled-out adhesive tape 4 behind the ring frame 2, and pulling the respective narrowing devices 5, 7 to the outside. A tension applying mechanism 8 for applying a tension to the adhesive tape 4 and a tape pressing mechanism 9 for pressing the adhesive tape 4 to which the tension is applied to the semiconductor wafer 1 and the ring frame 2 on the stage 3 are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an adhesive tape automatic tensioning device that attaches an adhesive tape to a semiconductor wafer and a ring frame in order to attach the semiconductor wafer to the ring frame in the manufacturing process of integrated circuits and the like.

[0002]

[Prior art]

 In a general semiconductor manufacturing process, when cutting a semiconductor wafer on which an integrated circuit pattern is formed into individual integrated circuit chips by dicer cutting in a grid pattern, the cut integrated circuit chips do not scatter into pieces. In order to do so, the semiconductor wafer A to be dicer cut is fixed in advance inside the ring frame B with the adhesive tape C as shown in FIG.

As an apparatus for sticking the semiconductor wafer A to the ring frame B with the adhesive tape C as described above, there has conventionally been an adhesive tape applying apparatus shown in FIG. This apparatus mounts a semiconductor wafer A, sets a ring frame B on the outer periphery thereof, a stage D, a tape base E on which an adhesive tape C wound in a roll is set, and an adhesive tape C drawn from the stage. When a handle I is rotated in the direction of the arrow shown in FIG. 2B and a tape fixing base F for temporarily fixing it with a slight gap above D, the rotating plate M in the same figure is moved along the peripheral edge of the ring frame B. And a cutting device H to which a cutter G that moves by moving is attached.

The work procedure by this adhesive tape tensioning device will be described below in order. ． The semiconductor wafer A is placed on the stage D, and the ring frame B is placed concentrically on the outer circumference of the stage. ． Holding the tip of the adhesive tape C set on the tape base E by hand, pull out the tape C above the semiconductor wafer A and the ring frame B, and bond the tip portion of the adhesive tape C to the tape fixing base F, The adhesive tape C is stretched on the semiconductor wafer A and the ring frame B without bending. ． A rubber roller (not shown) is manually pressed onto the adhesive tape C and rolled in the pulling direction of the same tape C, and the back surface (adhesive surface) of the same tape C is pressed against the semiconductor wafer A and the ring frame B to contact them. The tape C is adhered. ． The cutter support arm K of the cutting device H is laid down on the stage D as shown in FIG. The blade edge is pressed against the upper surface of the peripheral edge of the ring frame B at a position several mm outside the inner peripheral edge. Next, when the handle I is rotated in the direction of the arrow in FIG. 3B to rotate the rotating plate M which is rotatably attached to the support arm K by the bearing L, the cutter G runs on the same peripheral edge and adheres. Tape C is cut into a circle. ． After the cutting is completed, the support arm K of the cutting device H is erected at the position shown in FIG. 3A, and the adhesive tape C on the outer side of the cut adhesive tape 4 is peeled off from the ring frame B and removed. As a result, the semiconductor wafer A is fixed to the inside of the ring frame B by the adhesive tape C as shown in FIG.

[0005]

[Problems to be solved by the device]

 By the way, in the adhesive tape tensioning device of FIG. 3, when the adhesive tape C is stretched on the semiconductor wafer A and the ring frame B so as not to bend in the steps 1 to 3, the adhesive tape C is pulled out to the adhesive tape C. Since the tension is applied only along the direction, the adhesive tape C may extend in that direction to cause vertical wrinkles. If the adhesive tape C is pressed and stuck to the semiconductor wafer A and the ring frame B while the vertical wrinkles are generated, the semiconductor wafer A and the ring frame B are not completely adhered to the wrinkle portion of the adhesive tape C. If the semiconductor wafer A is subjected to dicer cutting in this state, the adhesive is insufficiently adhered, and the wrinkled chips are peeled off from the adhesive tape C and scattered, or vertical wrinkles are suddenly extended during cutting and the semiconductor The wafer A may be displaced and the cutter may cut the integrated circuit portion. Inferior products are generated due to these causes, and the product yield is deteriorated.

An object of the present invention is to make it possible to automatically attach an adhesive tape to a semiconductor wafer and a ring frame, and to prevent wrinkles from being generated on the adhesive tape during the attachment so that the adhesive tape is not cut when the semiconductor wafer is dicer cut. It is to provide an adhesive tape automatic tensioning device that prevents the generation of non-defective products.

[0007]

[Means for Solving the Problems]

 As shown in FIG. 1, the apparatus for automatically adhering an adhesive tape according to the present invention pulls out an adhesive tape 4 onto a stage 3 on which a semiconductor wafer 1 is set and a ring frame 2 is set on the outside thereof. In an automatic adhesive tape tensioning device in which the adhesive tape 4 is pressed against the semiconductor wafer 1 and the ring frame 2 and attached to them, the front narrowing capable of releasing the both ends in the width direction on the tip side of the adhesive tape 4 is released. The tool 5 and the tape pull-out mechanism 6 for moving the narrowing tool 5 to pull out the adhesive tape 4 above the ring frame 2, and the widthwise both ends of the pulled-out adhesive tape 4 behind the ring frame 2. A rear narrowing device 7 capable of releasing the narrowing action, a tension applying mechanism 8 for pulling each of the narrowing devices 5, 7 to the outside in the width direction of the adhesive tape 4 to apply tension to the adhesive tape 4 in the same direction, Same tenacity The emissions applying mechanism 8 is made and a tape pressing mechanism 9 for pressing the adhesive tape 4 which tension is applied to the semiconductor wafer 1 and the ring frame 2 on Stage 3.

[0008]

[Action]

 In the adhesive tape automatic tensioning device of the present invention, the semiconductor wafer 1 and the ring frame 2 are set on the stage 3, and then both ends of the adhesive tape 4 in the width direction are grasped by the front narrowing device 5, Further, when the front narrowing device 5 is moved (advanced) by the tape pull-out mechanism 6, the adhesive tape 4 is pulled out onto the semiconductor wafer 1 and the ring frame 2 on the stage 3. When the adhesive tape 4 is pulled out to a predetermined position, the tape pull-out mechanism 6 stops, and the adhesive tape 4 also stops, and in this state, the rear narrowing device 7 causes the width of the adhesive tape 4 to the rear of the ring frame 2. Both ends in the direction are sandwiched. Next, the two clamps 5 and 7 are pulled outward by the tension applying mechanism 8 in the width direction of the adhesive tape 4, whereby the adhesive tape 4 is pulled in the same direction and tension is applied to the same adhesive tape 4 in the same direction. It In this state, the adhesive tape 4 is pressed against the semiconductor wafer 1 and the ring frame 2 on the stage 3 by the tape pressing mechanism 9 and adheres to them.

[0009]

Embodiment 1 FIG. 1 shows a first embodiment of the adhesive tape automatic tensioning device of the present invention. In FIG. 1, reference numeral 1 is a semiconductor wafer having a large number of integrated circuit patterns formed on its surface, 2 is a ring frame in which the semiconductor wafer 1 can be arranged inside, and 4 is a roll shape. It is an adhesive tape wound around. The semiconductor wafer 1, ring frame 2 and adhesive tape 4 are the same as those conventionally used.

Reference numeral 3 shown in FIG. 1 denotes a stage on which the semiconductor wafer 1 and the ring frame 2 are placed, and the stage 3 is formed in an octagonal shape having a size such that the ring frame 2 can be arranged outside the semiconductor wafer 1.

Reference numeral 5 shown in FIG. 1 is a front narrowing device. Two front narrowing fasteners 5 are provided on the side of the stage 3, and each of them has a chuck 11 that can release the narrowing edge of the adhesive tape 4 from the upper and lower sides as shown in FIG. , A chuck cylinder 12 for driving the chuck 11, and when a not-shown operation switch is turned on, the chuck cylinder 12 operates to open and close the chuck 11 up and down. I am doing it. The chuck 11 is arranged such that the clamping position of the stage 3 is slightly higher than the upper surface of the stage 3.

Reference numeral 7 shown in FIG. 1 is a rear narrowing device. The rear narrowing device 7 is arranged behind the stage 3 (on the side of the roll of the adhesive tape 4) and outside the width of the adhesive tape 4. The rear narrowing device 7 is composed of a chuck 16 and a chuck cylinder 17 like the front narrowing device 5, and opens and closes up and down when the chuck cylinder 17 operates.

Reference numeral 6 shown in FIG. 1 denotes a tape pull-out mechanism, which uses a rodless cylinder, which is arranged beside the stage 3. This tape pull-out mechanism 6 reciprocates the chuck 11 in the direction of arrow XX from the position shown by the solid line in FIG. 1B to the position shown by the phantom line, and the adhesive tape sandwiched by the chuck 11 is moved. 4 is pulled out.

Reference numeral 8 shown in FIG. 1 denotes two tension applying mechanisms, each of which uses a cylinder. Of these two tension applying mechanisms 8, the front tension applying mechanism 8 (on the left side in FIG. 1B) is arranged on the outer side in the width direction of the adhesive tape 4 in the tape pulling mechanism 6, and the rods 15 and 16 thereof are the tape pulling mechanism. When the rods 15 and 16 are connected to 6, and the rods 15 and 16 retreat in the Y-Y direction (the widthwise outer side of the adhesive tape 4) of FIG. 1B, the tape pull-out mechanism 6 is pulled in the same direction, and the rod 15 , 16 are pushed back, the tape pull-out mechanism 6 is also pushed back.

Of the two tension applying mechanisms 8, the rear tension applying mechanism 8 (on the right side in FIG. 1B) is arranged on the outer side in the width direction of the adhesive tape 4, and the rods 18 and 19 of the tension applying mechanism 8 are the rear narrowing device. When the rods 18 and 19 are connected to the chuck 16 of FIG. 7 and retreat in the YY direction (outside the width direction of the adhesive tape 4) of FIG. 1B, the chuck 16 is pulled in the same direction, , 19 are pushed back, the chuck 16 is also pushed back.

Reference numeral 9 shown in FIG. 1 denotes a tape pressing mechanism, which is a rubber roller 20 longer than the width of the adhesive tape 4 attached to the rodless cylinders 21 and 22 on the outside of the stage 3, as shown in FIG. It is possible to move laterally from the position indicated by the solid line to the position indicated by the phantom line. Also, when the rodless cylinders 21 and 22 are moved up and down by an elevator mechanism (not shown), the solid line is shown in FIG. It is adapted to descend from a position to a position indicated by an imaginary line and to press the upper surface of the adhesive tape 4.

The adhesive tape automatic tensioning device shown in the figure is equipped with a cutting device similar to the adhesive tape tensioning device of FIG. 3, and the cutting edge of the cutter 25 of the cutting device is attached to the periphery of the ring frame 2. The pressure-sensitive adhesive tape 4 is cut into a circular shape by pressing it on the upper surface at a position several mm outside the inner circumference circle and running the cutter 25 on the same peripheral edge.

[0018]

[Description of Operation of Device of FIG. 1] Next, an example of use of the adhesive tape automatic tensioning device of the present invention shown in FIG. 1 will be described. 1. When the semiconductor wafer 1 and the ring frame 2 are set on the stage 3 and then the chuck cylinder 12 of the front narrowing fixture 5 is operated, the tip of the adhesive tape 4 is moved by the chuck 11 of the front narrowing fixture 5. Both sides in the width direction are gripped from above and below. 2. When the front narrowing device 5 is moved (advanced) to the left side in FIG. 1 by the tape pull-out mechanism 6, the adhesive tape 4 is pulled out to the semiconductor wafer 1 and the ring frame 2 on the stage 3. 3. When the adhesive tape 4 is pulled out to a predetermined position, the tape pull-out mechanism 6 stops and the adhesive tape 4 also stops. 4. When the chuck cylinder 17 of the rear narrowing tool 7 is operated in the stopped state, the chuck 16 of the rear narrowing tool 7 grips the widthwise ends of the adhesive tape 4 behind the ring frame 2 from above and below. To be done. 5. The front clamp 5 in FIG. 1 is pulled outward by the front tension applying mechanism 8 and the rear clamp 7 is pulled outward by the rear tension applying mechanism 8 to be clamped to the respective clamps 5, 7. The adhesive tape 4 is pulled outward in the width direction, and tension is applied to the adhesive tape 4. 6. In this state, the rubber roller 20 of the tape pressing mechanism 9 descends and presses the adhesive tape 4. In this pressed state, the rubber roller 20 is laterally moved by the rodless cylinders 21 and 22 from the position indicated by the solid line in FIG. 1 (b) to the position indicated by the phantom line, and the adhesive tape 4 is attached to the semiconductor wafer 1 on the stage 3 and the ring. Press on the frame 2 and stick them together. 7. In this state, the cutter 25 cuts the adhesive tape 4 on the peripheral edge of the ring frame 2 along the peripheral edge. 8. After the completion of the cutting of the adhesive tape 4, the rubber roller 20 moves up and then moves back to the home position shown by the solid line in FIG. 9. Further, the front and rear tension applying mechanisms 8 in FIG. 1 advance (return to the original position), and the outward pulling of the front narrowing device 5 and the rear narrowing device 7 is released. 10. Then, the cylinder 12 is operated to release the adhesion of the adhesive tape 4 by the chuck 11, and the cylinder 17 is operated to release the adhesion of the adhesive tape 4 by the chuck 16. That is, the next standby state with the adhesive tape is started. The unnecessary adhesive tape 4 on the stage 3 is removed from the stage 3 by an appropriate means.

[0019]

[Effect of device]

 According to the adhesive tape automatic tensioning device of the present invention, since the adhesive tape 4 can be automatically (mechanically) attached to the semiconductor wafer 1 and the ring frame 2, not only the work is simplified, but also the adhesive tape is used. Since vertical wrinkles do not occur on the tape 4 when the tape 4 is attached, it is possible to eliminate the occurrence of defective products at the time of dicer cutting, and the yield and work efficiency are improved.

[Brief description of drawings]

FIG. 1A is a side view showing an embodiment of an adhesive tape automatic tensioning device of the present invention, and FIG. 1B is a plan view thereof.

FIG. 2 is a perspective view of a semiconductor wafer fixed inside a ring frame with an adhesive tape.

3A and 3B are side views showing an example of a conventional adhesive tape automatic tensioning device, FIG. 3A showing a temporarily fixed state of the adhesive tape, and FIG. 3B temporarily fixed. The state where the adhesive tape is cut after the semiconductor wafer and the ring frame are adhered to the adhesive tape.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Ring Frame 3 Stage 4 Adhesive Tape 5 Front Narrowing Tool 6 Tape Drawing Mechanism 7 Rear Narrowing Tool 8 Tensioning Mechanism 9 Tape Pressing Mechanism

Claims (1)

[Scope of utility model registration request] 1. A semiconductor wafer 1 is set, and an adhesive tape 4 is drawn out onto a stage 3 having a ring frame 2 set on the outside thereof, and the adhesive tape 4 is attached to the semiconductor wafer 1.
Also, in the adhesive tape automatic tensioning device that is pressed against the ring frame 2 and attached to them, the front narrowing device 5 and the narrowing device 5 capable of unfastening the both ends in the width direction on the tip side of the adhesive tape 4 are released. A tape pull-out mechanism 6 that moves and pulls the adhesive tape 4 above the ring frame 2; and a rear narrowing device 7 that can unfasten both widthwise ends of the pulled-out adhesive tape 4 behind the ring frame 2. , A tension applying mechanism 8 for pulling each of the narrow fasteners 5 and 7 outward in the width direction of the adhesive tape 4 to apply tension to the adhesive tape 4 in the same direction, and an adhesive applied with tension by the tension applying mechanism 8. An automatic adhesive tape tensioning device comprising a tape pressing mechanism 9 for pressing the tape 4 onto the semiconductor wafer 1 on the stage 3 and the ring frame 2.