JPH0667576B2 - Thin disk manufacturing method - Google Patents
Thin disk manufacturing methodInfo
- Publication number
- JPH0667576B2 JPH0667576B2 JP2890486A JP2890486A JPH0667576B2 JP H0667576 B2 JPH0667576 B2 JP H0667576B2 JP 2890486 A JP2890486 A JP 2890486A JP 2890486 A JP2890486 A JP 2890486A JP H0667576 B2 JPH0667576 B2 JP H0667576B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat
- thin disk
- copolymers
- spread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Optical Record Carriers (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は薄型ディスクの製造方法、特にフレキシブルビ
デオディスク等の、薄型高密度情報記録ディスクや溝付
き光学的情報記録基板の製造方法に関する。The present invention relates to a method for manufacturing a thin disk, and more particularly to a method for manufacturing a thin high-density information recording disk or a grooved optical information recording substrate such as a flexible video disk.
従来、高密度情報記録ディスクの製造は、ポリメチルメ
タクリレート、ポリカーボネート等の熱可塑性樹脂を、
射出成形、圧縮成形により表面に信号用の凹凸が設けら
れた状態に成形し、冷却・固化する方法で製造されてい
る。Conventionally, high density information recording discs have been manufactured with thermoplastic resins such as polymethylmethacrylate and polycarbonate.
It is manufactured by a method in which it is molded by injection molding or compression molding in a state where unevenness for signals is provided on the surface, and then cooled and solidified.
このような方法では、薄型化が難しく、厚さ1.0mm以下
の光学メモリー媒体を製造することは困難であった。こ
れは、第３図に示すように、信号用の凹凸部分31に対し
て、その下の基底部32の厚みをかなり大きくしないと、
強度上等の問題から成形が困難であることを主因として
いた。With such a method, it is difficult to reduce the thickness and it is difficult to manufacture an optical memory medium having a thickness of 1.0 mm or less. This is because, as shown in FIG. 3, if the thickness of the base portion 32 thereunder is considerably large with respect to the uneven portion 31 for signals,
The main reason was that molding was difficult because of problems such as strength.
本発明は以上の問題点に鑑みなされたものであり、その
目的は、1.0mm以下の厚さのフレキシブルディスク等を
従来より容易に製造することのできる方法を提供するこ
とにある。The present invention has been made in view of the above problems, and an object thereof is to provide a method by which a flexible disk or the like having a thickness of 1.0 mm or less can be manufactured more easily than before.
上記目的達成可能な本発明の薄型ディスクの製造方法
は、２枚重ね合せた耐熱性シートのそれぞれの外表面上
に、直接または他の層を介して可塑状態の樹脂を展延さ
せ、該樹脂に信号用の凹凸を転写形成しつつ、耐熱性シ
ートに接着固化することを特徴とする。The method for producing a thin disk of the present invention that can achieve the above-mentioned object is to spread a resin in a plastic state on the outer surface of each of two heat-resistant sheets that are superposed on each other, directly or through another layer. It is characterized in that it is adhered and solidified on the heat resistant sheet while transferring the unevenness for signals onto the sheet.
以下、本発明を更に詳細に説明する。Hereinafter, the present invention will be described in more detail.
本発明の一実施態様において、まず、原盤に電鋳加工を
施して製造した、凹凸状の表面を有するスタンパーを対
をなす金型の両内面に設置する。さらに、対の金型同士
が向かい合う空間内に、２枚重ね合わせた耐熱性シート
を、両スタンパーと間隔をおき且つ対面するように設置
する。２枚の耐熱シートは重ね合わすが接着はしないで
おく。In one embodiment of the present invention, first, stampers having an uneven surface, which are manufactured by subjecting a master to electroforming, are installed on both inner surfaces of a pair of molds. Further, in the space where the pair of molds face each other, two heat-resistant sheets are placed so as to face each other with a gap therebetween. Put the two heat-resistant sheets on top of each other, but do not bond them.
次いで、金型を型締めしつつ、あるいは型締め後、該金
型内のスタンパーと耐熱性シート面とが構成する空間
に、可塑状態の樹脂を展延しあまねくゆきわたらせる。
該樹脂は前記スタンパーによりその表面に信号用の凹凸
が転写されると共に耐熱性シートに接着固化し、２枚の
薄形ディスクが同時に形成できる。Next, while the mold is clamped, or after the mold is clamped, the resin in a plastic state is spread throughout the space formed by the stamper and the heat-resistant sheet surface in the mold.
The resin is used to transfer signal irregularities to the surface of the resin by the stamper, and at the same time, the resin is adhered and solidified on a heat-resistant sheet to form two thin disks at the same time.
本発明において可塑状態の樹脂を展延させる方法として
は、軟化した樹脂を形締めされつつある金型で圧縮する
圧縮成形法、液状樹脂を型締めされた金型内に注入する
注型成形法、加熱した熱可塑性樹脂を金型内に射出する
射出成形法のいずれを使ってもよい。In the present invention, as a method of spreading the resin in a plastic state, a compression molding method in which a softened resin is compressed by a mold being clamped, and a casting molding method in which a liquid resin is injected into the clamped mold Any of the injection molding methods of injecting a heated thermoplastic resin into a mold may be used.
また、本発明において可塑状態の樹脂を展延させ耐熱性
シートに接着させる工程の前に、さらにそれらの接着力
を向上させるために、予め耐熱性シートに接着性の強い
層（接着層）を設けてもよい。この接着層は接着力を向
上させるだけでなく耐熱シートの保護にも役立つ。Further, in the present invention, before the step of spreading the resin in a plastic state and adhering it to the heat-resistant sheet, in order to further improve the adhesive force thereof, a layer having a strong adhesiveness (adhesive layer) is previously formed on the heat-resistant sheet. It may be provided. This adhesive layer not only improves the adhesive strength, but also helps protect the heat-resistant sheet.
本発明に用いる耐熱性シートつまりベースとなるフィル
ムは、凹凸パターン形成時の可塑状態の樹脂の温度に耐
えるものであり、熱硬化性の耐熱フィルムが好ましい。
この熱硬化性の耐熱フィルムの代表的例としては、ポリ
イミドフィルム、ポリアミドイミドフィルム、エポキシ
樹脂フィルム、シリコーン樹脂フィルム、ポリエステル
イミドフィルム、ポリエステルフィルム、及びテトラフ
ルオロエチレン−ヘキサフルオロプロピレン共重合体フ
ィルム、テトラフルオロエチレン−パーフルオロアルキ
ルビニルエーテル共重合体フィルムなどのフッ素樹脂フ
ィルムなどがある。The heat-resistant sheet used in the present invention, that is, the base film, withstands the temperature of the resin in the plastic state at the time of forming the uneven pattern, and is preferably a thermosetting heat-resistant film.
Typical examples of the thermosetting heat resistant film include polyimide film, polyamideimide film, epoxy resin film, silicone resin film, polyesterimide film, polyester film, and tetrafluoroethylene-hexafluoropropylene copolymer film, tetra film. Examples thereof include fluororesin films such as fluoroethylene-perfluoroalkyl vinyl ether copolymer films.
本発明に用いる、表面に案内溝が形成される樹脂として
熱可塑性樹脂が好ましい。この熱可塑性樹脂の代表的な
ものには、ポリサルホン、ポリオレフィン、エチレン−
酢酸ビニル共重合体やエチレン−アクリレート共重合体
やエチレン−プロピレン共重合体等のポリオレフィン共
重合体、ポリオレフィンハロゲン化物、酢酸ビニル−塩
化ビニル共重合体や塩化ビニル−アクリルニトリル共重
合体等の塩化ビニル共重合体、塩化ビニリデン−塩化ビ
ニル共重合体や塩化ビニリデン−塩化ビニル−アクリル
ニトリル共重合体等の塩化ビニリデン共重合体、ポリス
チレン、スチレン−アクリルニトリル共重合体（AS樹
脂）やスチレン−アクリルニトリル−ブタジエン共重合
体（ABS樹脂）等のスチレン共重合体、ｐ−メチルスチ
ロールや2,5−ジクロルスチロールやビニルアントラセ
ンなど、あるいはそれらの共重合体（スチロール共重合
体）、クマロンおよびインデンあるいはこれらとスチレ
ンとの共重合体、テルペン樹脂ないしピコライト、アク
リル樹脂、ポリアクリルニトリル、アクリルニトリル−
酢酸ビニル共重合体やアクリルニトリル−ビニルピリジ
ン共重合体やアクリルニトリル−メタクリル酸メチル共
重合体等のアクリルニトリル共重合体、ポリアクリルア
ミドないし、アクリルニトリルにアセトンを作用させた
ダイアセトンアクリルアミドポリマー、ポリ酢酸ビニ
ル、アクリル酸エステルやビニルエステルやビニルエー
テルやエチレン等の酢酸ビニルとの共重合体、ポリビニ
ルエーテル、ポリアミド、熱可塑性ポリエステル、ポリ
ビニルアルコールまたはポリビニルアセタール系樹脂、
ポリウレタン、数平均分子量6,000以下のポリビニルカ
ルバゾールまたはビニルカルバゾールとエチレもしくは
スチレン等のポリビニルカルバゾール共重合体等の含窒
素ビニル重合体、ポリブタジエンまたはブタジエン−ス
チレン共重合体やイソプレン−イソブチレン共重合体等
のジエ系重合体、ポリエーテル、ポリカーボネート、ポ
リエチレンイミン類、セルロース系樹脂あるいは上記樹
脂の２種類以上のブレンド体、またはその他の熱可塑性
樹脂とのブレンド体などがある。A thermoplastic resin is preferably used as the resin used in the present invention in which the guide groove is formed on the surface. Typical examples of this thermoplastic resin include polysulfone, polyolefin, ethylene-
Polyvinyl chloride copolymers such as vinyl acetate copolymers, ethylene-acrylate copolymers and ethylene-propylene copolymers, polyolefin halides, chlorides such as vinyl acetate-vinyl chloride copolymers and vinyl chloride-acrylonitrile copolymers. Vinylidene chloride-copolymers such as vinyl copolymers, vinylidene chloride-vinyl chloride copolymers and vinylidene chloride-vinyl chloride-acrylonitrile copolymers, polystyrene, styrene-acrylonitrile copolymers (AS resin) and styrene-acryl Styrene copolymers such as nitrile-butadiene copolymer (ABS resin), p-methylstyrene, 2,5-dichlorostyrene, vinylanthracene, etc., or their copolymers (styrene copolymers), coumarone and indene. Alternatively, a copolymer of these with styrene, terpene Resin or Piccolyte, acrylic resin, polyacrylonitrile, acrylonitrile -
Acrylonitrile copolymers such as vinyl acetate copolymers, acrylonitrile-vinyl pyridine copolymers, acrylonitrile-methyl methacrylate copolymers, polyacrylamides, or diacetone acrylamide polymers obtained by reacting acetone with acrylonitrile, polyacrylonitrile. Vinyl acetate, copolymers with acrylic acid ester or vinyl ester, vinyl ether or vinyl acetate such as ethylene, polyvinyl ether, polyamide, thermoplastic polyester, polyvinyl alcohol or polyvinyl acetal resin,
Polyurethane, nitrogen-containing vinyl polymers such as polyvinylcarbazole having a number average molecular weight of 6,000 or less, or polyvinylcarbazole and polyvinylcarbazole copolymers such as ethylene or styrene, polybutadiene or butadiene-styrene copolymers, isoprene-isobutylene copolymers, etc. Examples thereof include polymers, polyethers, polycarbonates, polyethyleneimines, cellulosic resins, blends of two or more of the above resins, and blends with other thermoplastic resins.
本発明の方法では、信号用の凹凸部分とその下の基底部
とを別種の材質を用いて薄型ディスクを成形し、しか
も、その基底部に予め成形されている強度の高い耐熱性
シートを使用するので、基底部を凹凸部分よりも相対的
に厚くしなくてもディスクの成形は容易にできる。すな
わち、本法によれば、ディスクの薄型化が図れる。In the method of the present invention, a thin disc is formed by using different kinds of materials for the signal concavo-convex portion and the base portion thereunder, and furthermore, a high-strength heat-resistant sheet preformed on the base portion is used. Therefore, the disk can be easily formed without making the base portion relatively thicker than the uneven portion. That is, according to this method, the disc can be made thinner.
更に本発明は、 ２枚同時に薄型ディスクが製造されるので生産性が高
い、 ２枚の耐熱シートが対称に配された状態で製造工程が
進行するので、途中の展延工程で該耐熱シート上に形成
される信号部分の歪は、小さくなるという利点もある。Further, according to the present invention, since two thin disks are manufactured at the same time, the productivity is high. Since the manufacturing process proceeds in a state in which the two heat-resistant sheets are symmetrically arranged, the heat-resistant sheets can be formed on the heat-resistant sheet during the spreading process in the middle. There is also an advantage that the distortion of the signal portion formed in 1 is reduced.
実施例１ 第１図において、原盤に電鋳加工を施して製造した、表
面に凹凸を有する２つのスタンパー11を金型12の両面に
それぞれ設置し、２つのスタンパー11間に熱分解温度が
300℃以上で厚さ50μｍのポリイミドテープを耐熱シー
ト13として２枚重ね合わせて設置した。２枚の耐熱シー
ト13の中央付近の両側に硬化した数平均分子量８万のポ
リエチルメタクリレート樹脂14を供給し、該樹脂14と耐
熱シート13とを金型12で圧縮した。該樹脂14は金型12中
央から周囲方向へ流動してゆき第２図のように金型内全
体に広がり、２枚の耐熱シート13に接着固化すると共
に、スタンパー11によりその表面に凹凸のパターンが形
成された。Example 1 In FIG. 1, two stampers 11 each having an uneven surface, which are produced by subjecting a master to electroforming, are installed on both sides of a mold 12, respectively, and a thermal decomposition temperature between the two stampers 11 is increased.
Two heat-resistant sheets 13 of polyimide tape having a thickness of 50 μm at 300 ° C. or more were placed on top of each other. A cured polyethylmethacrylate resin 14 having a number average molecular weight of 80,000 was supplied to both sides near the center of the two heat-resistant sheets 13, and the resin 14 and the heat-resistant sheet 13 were compressed by a mold 12. The resin 14 flows from the center of the mold 12 to the peripheral direction, spreads throughout the mold as shown in FIG. 2, and is adhered and solidified to the two heat-resistant sheets 13, and the stamper 11 forms an uneven pattern on the surface. Was formed.
以上詳細に説明したように、２枚重ね合せた耐熱性シー
トのそれぞれの外表面上に、直接または他の層を介して
可塑状態の樹脂を展延させ、該樹脂に信号用の凹凸を転
写形成しつつ、耐熱性シートに接着固化することによ
り、1.0mm以下の厚さのフレキシブルディスク等を従来
より容易に製造することができるようになった。。As described above in detail, a resin in a plastic state is spread on each outer surface of two heat-resistant sheets which are superposed, directly or through another layer, and unevenness for signals is transferred to the resin. By bonding and solidifying the heat-resistant sheet while forming it, a flexible disk or the like having a thickness of 1.0 mm or less can be manufactured more easily than before. .
第１図、第２図は本法の一実施例を示す模式図、第３図
は、射出成形方法により成形された薄型ディスクの断面
図である。 11:スタンパー 12:金型、13:耐熱シート 14:樹脂 31:信号用の凹凸部分、32:基底部1 and 2 are schematic views showing an embodiment of the present method, and FIG. 3 is a cross-sectional view of a thin disk molded by an injection molding method. 11: Stamper 12: Mold, 13: Heat-resistant sheet 14: Resin 31: Concavo-convex part for signal, 32: Base part
Claims (6)
外表面上に、直接または他の層を介して可塑状態の樹脂
を展延させ、該樹脂に信号用の凹凸を転写形成しつつ、
耐熱性シートに接着固化することを特徴とする薄型ディ
スクの製造方法。Claim: What is claimed is: 1. A resin in a plastic state is spread on each outer surface of two heat-resistant sheets which are superposed on each other, either directly or through another layer, while transferring unevenness for signals to the resin. ,
A method for manufacturing a thin disk, which comprises adhering and solidifying to a heat resistant sheet.
脂の展延を同時に行うことを特徴とする特許請求の範囲
第１項記載の薄型ディスクの製造方法。2. The method for manufacturing a thin disk according to claim 1, wherein the resin in a plastic state is spread on the two heat resistant sheets at the same time.
ことを特徴とする特許請求の範囲第１項または第２項記
載の薄型ディスクの製造方法。3. The method for producing a thin disk according to claim 1 or 2, wherein the resin in a plastic state is spread by a compression molding method.
ことを特徴とする特許請求の範囲第１項記載の薄型ディ
スクの製造方法。4. The method for producing a thin disk according to claim 1, wherein the resin in a plastic state is spread by a cast molding method.
ことを特徴とする特許請求の範囲第１項または第２項記
載の薄型ディスクの製造方法。5. The method for manufacturing a thin disk according to claim 1 or 2, wherein the plastic resin is spread by an injection molding method.
を特徴とする特許請求の範囲第１項〜第５項の何れか１
項記載の薄型ディスクの製造方法。6. The heat-resistant sheet is made of a thermosetting resin, and any one of claims 1 to 5 is set forth.
A method for manufacturing a thin disk according to the item.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2890486A JPH0667576B2 (en) | 1986-02-14 | 1986-02-14 | Thin disk manufacturing method |
| US07/473,106 US5160462A (en) | 1986-02-14 | 1990-02-02 | Preparing optical memory medium by laminating a thermoplastic resin layer on a thermosetting resin sheet |
| US07/928,322 US5378516A (en) | 1986-02-14 | 1992-08-12 | Thin type optical memory medium and method for preparing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2890486A JPH0667576B2 (en) | 1986-02-14 | 1986-02-14 | Thin disk manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62187005A JPS62187005A (en) | 1987-08-15 |
| JPH0667576B2 true JPH0667576B2 (en) | 1994-08-31 |
Family
ID=12261396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2890486A Expired - Fee Related JPH0667576B2 (en) | 1986-02-14 | 1986-02-14 | Thin disk manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0667576B2 (en) |
-
1986
- 1986-02-14 JP JP2890486A patent/JPH0667576B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62187005A (en) | 1987-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |