JPH067559B2 - Hybrid integrated circuit mounting method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for mounting a hybrid integrated circuit, and more particularly to bonding a chip-like component onto an integrated circuit pattern on a substrate using a conductive adhesive. Regarding the method.

[Prior Art and Problems Thereof] A hybrid integrated circuit obtained by bonding a chip-shaped component to an integrated circuit pattern formed on a substrate by a thin film method or a thick film method and making an electrical connection is It is said that the circuit design and manufacturing technology have reached a level close to completion.

With the recent spread of office automation (OA) devices and computer-related devices, hybrid integrated circuit boards are indispensable for thermal heads, image sensors, etc. that have several to several tens of wires per 1 mm. Has become. Since gold is often used for the wiring of these devices, a protective film is formed on the wiring layer or solder is used to avoid problems such as diffusion of gold into the solder (solder scumming). A method of stacking materials with good resistance has also been proposed, but there are problems such as an increase in the number of processes and deterioration of nearby semiconductor components due to solder flux. Instead of this, a conductive adhesive such as an epoxy resin is often used.

By the way, when connecting chip components such as resistance elements,
Generally, as shown in FIG. 2, the circuit pattern 1 on the substrate 101
02, the conductive adhesive 104 is applied to two portions of the connection portions 102A and 102B of the chip 103 with the electrodes 103A and 103B, and the chip is placed on the conductive adhesive 104.

However, in this method, the electrodes 103A and 10
3B is connected to the conductive adhesive 104 by the conductive adhesive 104 and may be short-circuited, and the adhesive strength is weak.

Therefore, in order to solve the above-mentioned drawbacks, for example, as shown in FIG. 3, an epoxy-based insulating adhesive 105 is applied between epoxy-based conductive adhesives 104 to enhance the adhesiveness and to improve the electrodes 103A and 103B. There has been proposed a method of electrically insulating the two. In this way, the adhesion is increased,
In some cases, the conductive particles in the conductive adhesive migrate to the surface of the insulating adhesive to cause a short circuit.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a high-density and highly reliable hybrid integrated circuit.

[Means for Solving Problems] Therefore, in the present invention, when a chip component is bonded to a predetermined position on an integrated circuit pattern on a substrate, a conductive resin is used for connection of an electrode portion of the chip component, The portions corresponding to the electrodes are adhered using an insulating resin made of a resin different from the conductive resin.

[Operation] That is, not only the electrodes are bonded but also the electrodes are bonded using the insulating resin, so that the bonding strength is increased. Further, since this insulating resin and the conductive resin used for connecting the electrode portions do not mix with each other or migrate to each other, it is extremely effective in preventing a short circuit between the electrodes.

EXAMPLES Examples of the present invention will be described below in detail with reference to the drawings.

First, on the electrodes 2A and 2B of the wiring pattern 2 for the integrated circuit formed on the insulating ceramic substrate 1, the epoxy-based conductive resin 3 manufactured by Sumitomo Bakelite Co., Ltd., which is commercially available under the trade name CRM1030, is 1 Apply as shown in FIG.

Then, between the electrodes 2A and 2B, that is, on the underlying ceramic substrate 1, a silicone-based insulating resin 4 manufactured by Toray Silicone Co., Ltd. under the trade name JCR6120 is sold.
Is applied as shown in FIG. 1 (b).

Then, on this, both end electrodes 5 of the chip-shaped resistance element 5 are formed.
A and 5B are placed so as to correspond to the electrodes 2A and 2B of the wiring pattern 2 respectively, and these adhesives are heated and cured, so that the resistance on the wiring pattern 2 is increased as shown in FIG. 1 (c). The devices are bonded together to form a hybrid integrated circuit.

In this way, the resistance element 5 is also adhered by the insulating resin 4 even in the portion between the both electrodes 5A and 5B, and the adhesion strength is extremely high. Further, since the epoxy resin is used as the conductive resin and the silicone resin is used as the insulating resin, there is no mixing or transfer between the two and they are independent of each other. ,
No short circuit occurs between electrodes. Therefore, it is extremely reliable.

In the examples, the case where an epoxy resin such as an epoxy adhesive containing silver particles is used as the conductive resin and the silicone resin is used as the insulating resin has been described, but it is not necessarily limited to this. Without this,
A polyimide resin such as a polyimide adhesive containing silver particles is used as the conductive resin, and a silicone resin is used as the insulating resin. For example, a combination that does not mix with or migrate to each other, that is, a conductive resin composed of different resins and A combination may be appropriately selected from the insulating resins. However, as an exception, the epoxy-based insulating resin manufactured by Sumitomo Bakelite Co., Ltd., which is commercially available under the trade name of CRM1105A, does not mix with either the epoxy-based conductive resin or the polyimide-based conductive resin. It can also be used in cases.

That is, when the properties of the resin before curing are similar to each other, such as the molecule and the size of the molecular weight, the solvent, the curing agent, etc., the two are mixed and a short circuit occurs due to the migration of the conductive particles in the conductive resin. It is thought to occur. Therefore, it is sufficient to select adhesives made of different resins.

For example, the conductive resin is preferably a polyimide resin, an epoxy resin, a vinyl chloride resin mixed with particles having relatively high conductivity such as silver or gold, and the insulating resin is a polyimide resin or epoxy. A resin, a silicone resin, an acrylic resin, a urethane resin, a phenol resin, a vinyl chloride resin, or the like is preferable, and an appropriate combination may be selected from these.

Further, by using a silicone-based resin as the insulating resin, the characteristics of the silicone resin itself, that is, the amount of impurities is small, the stress absorbability is good, etc. can be utilized to prevent contamination of the semiconductor surface or to prevent large chip parts. The reliability can be improved and the mounting can be diversified such as mounting on the tower.

[Effects of the Invention] As described above, according to the present invention, when the electrodes of the chip-shaped component are bonded to the integrated circuit substrate by using the conductive resin, the configuration of the conductive resin is provided between the electrodes. Since it is made to adhere by an insulating resin that uses a resin different from the substance, neither resin will mix and there will be no short circuit between electrodes even in the case of high-density wiring.
It is possible to obtain a hybrid integrated circuit having high adhesive strength and extremely high reliability.

Further, even in the case of a high-density hybrid integrated circuit, highly reliable mounting is possible without using solder. Therefore, as in the case of using solder, a protective film is formed or a material resistant to solder is used. There is no need to increase the number of steps such as coating the circuit pattern with, and it is possible to mount at low cost and easily.

[Brief description of drawings]

1 (a) to 1 (c) are explanatory views showing a method for mounting a hybrid integrated circuit according to an embodiment of the present invention, and FIGS. 2 and 3 show a mounting example of a conventional hybrid integrated circuit. It is a figure. 1 ... Ceramic substrate, 2 ... Wiring pattern, 2A, 2B ...
Electrodes, 3 ... Epoxy-based conductive resin, 4 ... Silicone-based insulating resin, 5 ... Resistance element, 5A, 5B ... Both end electrodes, 101
... substrate, 102 ... circuit pattern, 102A, 102B ...
Electrodes, 103 ... Chip (resistive element), 103A, 103
B ... Electrode, 104 ... Conductive adhesive, 105 ... Insulating adhesive.

Claims (2)

[Claims] 1. When an electrode of a chip-shaped component is adhered to the integrated circuit pattern formed on a substrate by using a conductive resin, a conductive resin is provided in the integrated circuit pattern region where the electrode of the chip-shaped component contacts. While supplying the insulating resin made of a material different from the conductive resin, which does not mix with the conductive resin or migrate to each other, in the inter-electrode region, A method of manufacturing a hybrid integrated circuit, wherein the electrodes of the chip-shaped component are brought into contact with each other, and the inter-electrode region of the chip-shaped component is brought into contact with the insulating resin so that they are fixed to each other. . 2. The conductive resin is either an epoxy resin or a polyimide resin, and the insulating resin is a silicone resin. Of manufacturing a hybrid integrated circuit of.