JPH0676834U - Infrared camera - Google Patents
Infrared cameraInfo
- Publication number
- JPH0676834U JPH0676834U JP2156293U JP2156293U JPH0676834U JP H0676834 U JPH0676834 U JP H0676834U JP 2156293 U JP2156293 U JP 2156293U JP 2156293 U JP2156293 U JP 2156293U JP H0676834 U JPH0676834 U JP H0676834U
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- infrared
- optical system
- system storage
- storage chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 238000005192 partition Methods 0.000 claims abstract description 19
- 239000000428 dust Substances 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 230000002265 prevention Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009529 body temperature measurement Methods 0.000 abstract description 2
- 238000012856 packing Methods 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
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- Radiation Pyrometers (AREA)
Abstract
(57)【要約】
【目的】 赤外線カメラの光学系走査機構への埃の侵入
を阻止するようにした赤外線カメラを提供すること。
【構成】 回転ミラ−とガルバノメ−タとの間隙に温度
校正用壁を立設し，この温度校正用壁の回転ミラ−対向
面に対して室温検出用センサを近接配置するとともに，
光学系走査機構が収納された光学系収納室と，電気回路
部分を収納する回路系収納室との間に防塵用の仕切壁を
設けることにより本体ケ−スを分割配置し，回路系収納
室に外気を導入，排気する空冷装置を配置するようにし
たものである。
【効果】 回路系収納室は外気により空冷されるととも
に，埃を含んだ外気は回路系収納室のみを通過し，光学
系収納室には外部からの埃が侵入し，付着することはな
い。その上，環境温度に対して校正されているので，温
度測定に誤差を生じることもない。
(57) [Abstract] [Purpose] To provide an infrared camera that prevents dust from entering the optical system scanning mechanism of the infrared camera. [Composition] A temperature calibration wall is erected in the gap between the rotary mirror and galvanometer, and a room temperature detection sensor is placed close to the surface facing the rotary mirror of the temperature calibration wall.
The main body case is divided and arranged by providing a partition wall for dust prevention between the optical system storage chamber in which the optical system scanning mechanism is stored and the circuit system storage chamber in which the electric circuit part is stored. An air-cooling device that introduces outside air and exhausts it is arranged. [Effect] While the circuit system storage chamber is air-cooled by the outside air, the outside air containing dust passes only through the circuit system storage chamber, and dust from the outside does not enter and adhere to the optical system storage chamber. Moreover, since it is calibrated to the ambient temperature, there is no error in temperature measurement.
Description
【０００１】[0001]
この考案は，赤外線熱画像装置に使用される赤外線カメラに関するもので，特 に，光学系走査機構部分に埃がはいらないように構成された赤外線カメラに関す るものである。 The present invention relates to an infrared camera used in an infrared thermal imager, and particularly to an infrared camera configured so that dust is not contained in the optical system scanning mechanism part.
【０００２】[0002]
一般に，被写体表面から放射される赤外線を検出して，その温度分布を可視像 （熱画像）として表示する赤外線熱画像装置に使用される赤外線カメラとしては ，図１０〜図１１に示すように構成されている。 まず，この赤外線カメラの光学系走査機構について説明する。 被写体１の表面からの光は，ケ−ス１１の開口部１２に設けられているシリコ ンウインド４によって可視光２が遮断され，赤外線３のみが赤外線カメラ内に入 射される。内部に入射した赤外線（赤外線像）３はシリコンウインド４と同一平 面に位置している第１の折り返しミラ−５により回転ミラ−７とほぼ同一平面に 位置している振動ミラ−６方向に反射される。 In general, as an infrared camera used in an infrared thermal imaging device that detects infrared rays emitted from the surface of a subject and displays the temperature distribution as a visible image (thermal image), as shown in FIGS. It is configured. First, the optical system scanning mechanism of this infrared camera will be described. With respect to the light from the surface of the subject 1, the visible light 2 is blocked by the silicon window 4 provided in the opening 12 of the case 11, and only the infrared ray 3 is incident on the infrared camera. The infrared ray (infrared image) 3 incident on the inside is directed by the first folding mirror 5 located on the same plane as the silicon window 4 in the direction of the vibration mirror 6 located substantially on the same plane as the rotating mirror 7. Is reflected.
【０００３】 この反射光（赤外線３）は振動ミラ−６により垂直方向に約１０°振られて， 回転ミラ−７の各平面鏡７ａ・・・に入射する。従って，各平面鏡７ａ・・・は ，振動ミラ−６がカルバノメ−タ１３により垂直方向に振動しているので，被写 体１の表面を少しずつ垂直方向にずれた部分を水平方向に走査することになる。The reflected light (infrared ray 3) is vertically shaken by about 10 ° by the vibration mirror 6 and is incident on each of the plane mirrors 7 a of the rotating mirror 7. Therefore, in each of the plane mirrors 7a, since the vibration mirror 6 is vibrating in the vertical direction by the carbanometer 13, the portion of the surface of the object 1 which is slightly shifted in the vertical direction is scanned in the horizontal direction. It will be.
【０００４】 通常，この種装置の水平走査線数は１００本程度である。８面体の回転ミラ− ７が用いられているので，振動ミラ−６が１０°振る間に回転ミラ−７は少なく とも１２．５回転しなくてはならず，実際には振動ミラ−６の復路に要する時間 も考慮して１６回転している。 即ち，回転ミラ−７の１６回転で垂直方向１０°の範囲が走査され，この入射 した赤外線３は，第２の折り返しミラ−８方向へ反射され，ここで集光レンズ９ 方向へ反射され，この集光レンズ９でその光束が絞られて赤外線検出器１０に入 射され，光電変換される。そして，この熱画像の電気信号は，増幅器１４で増幅 され，プロセッサ１５により各種の信号処理がなされ，表示装置１６に表示され る。Normally, the number of horizontal scanning lines of this type of device is about 100. Since the octahedral rotating mirror 7 is used, the rotating mirror 7 must rotate at least 12.5 while the shaking mirror 6 shakes 10 °. Taking into consideration the time required for the return trip, 16 revolutions are made. That is, the range of 10 ° in the vertical direction is scanned by 16 rotations of the rotary mirror 7, and the incident infrared ray 3 is reflected in the second folding mirror 8 direction, and is reflected in the condenser lens 9 direction here, The light flux is narrowed by the condenser lens 9 and is incident on the infrared detector 10 for photoelectric conversion. Then, the electric signal of the thermal image is amplified by the amplifier 14, subjected to various kinds of signal processing by the processor 15, and displayed on the display device 16.
【０００５】 なお，この１面の平面鏡７ａで赤外線検出器１０には，０．１°に相当する赤 外線３が入射する。そして，次の平面鏡７ｂが走査する時は，振動ミラ−６の面 が０．１°ずれるため，先に平面鏡７ａで水平走査した部分とは垂直方向に０． １°ずれた位置が同様に走査される。従って，回転ミラ−７の１２．５回転で被 写体１の垂直方向１０°を走査し，又，水平方向に関しては回転ミラ−７の各平 面鏡７ａ・・・により水平視野角（この実施例では１５°）が走査される。そこ で，リアルタイムで水平走査線１００本の熱画像を得るために，回転ミラ−７は 回転速度を１４４００ｒｐｍの高速で回転するように設定され，赤外線検出器１ ０から１秒間に１５画面のリアルタイムの熱画像信号が得られる。The infrared ray 3 corresponding to 0.1 ° is incident on the infrared detector 10 by the one-sided plane mirror 7a. Then, when the next plane mirror 7b scans, the surface of the vibration mirror 6 deviates by 0.1 °, so that it is 0. Positions offset by 1 ° are similarly scanned. Therefore, 12.5 rotations of the rotary mirror 7 scans the object 1 in the vertical direction of 10 °, and in the horizontal direction, the horizontal mirror 7a of the rotary mirror 7 ... In the example, 15 °) is scanned. Then, in order to obtain a thermal image of 100 horizontal scanning lines in real time, the rotation mirror-7 is set to rotate at a high rotation speed of 14400 rpm, and the infrared detector 10 displays 15 screens in 1 second in real time. A thermal image signal of is obtained.
【０００６】 なお，回転ミラ−７は，８面の平面鏡７ａ・・・により環状に構成され，回転 中心に対して各平面鏡７ａ・・・はすべて平行な面角度を持たせてモ−タ（図示 せず）の回転軸に取付られている。回転ミラ−７の周囲は，各平面鏡７ａ・・・ に埃が付着するのを阻止するとともに，回転ミラ−７が回転することにより生じ る騒音を防止するために，ミラ−カバ−部（図示せず）で覆われている。 次に，赤外線検出器（スプライト素子）１０は，シリコンウインド４と垂直方 向において離間させるとともに，可能なかぎりシリコンウインド４が位置してい る垂直面方向に近づけて配置されている。The rotary mirror 7 is composed of eight plane mirrors 7a ... In an annular shape, and the plane mirrors 7a ... It is attached to the rotating shaft (not shown). In order to prevent dust from adhering to the respective plane mirrors 7a ... And to prevent noise generated by the rotation of the rotating mirror 7, the mirror cover part (Fig. It is covered with (not shown). Next, the infrared detector (sprite element) 10 is separated from the silicon window 4 in the vertical direction and is arranged as close as possible to the vertical surface direction in which the silicon window 4 is located.
【０００７】[0007]
赤外線検出器１０は，その感度を維持するために，一定温度に冷却されなけれ ばならない。然しながら，赤外線カメラの内部には，多くの熱発生源があるため ，環境温度を一定にする必要上，外気を吸入して強制循環させ，赤外線カメラ内 部を冷却するように構成されている。 The infrared detector 10 must be cooled to a constant temperature in order to maintain its sensitivity. However, since there are many heat sources inside the infrared camera, it is necessary to keep the ambient temperature constant, and it is designed to cool the inside of the infrared camera by inhaling the outside air and forcibly circulating it.
【０００８】 一方，赤外線カメラの使用環境は，近年大きく広がり，清掃工場などのように ，埃の多い場所等でも使用されているため，外気を吸入することにより，内部に 埃が侵入し，この埃が回転ミラ−７等の光学系に付着してしまい，正確に赤外線 量，即ち，温度を測定することが出来なくなるという問題があった。 そこで，外気の吸入口にフィルタ−を配設することも考えられるが，この場合 には，フィルタ−をしばしば交換しなければならず，保守が面倒である等の問題 がある。On the other hand, the environment in which the infrared camera is used has spread greatly in recent years, and since it is also used in dusty places such as in cleaning factories, when inhaling the outside air, dust invades inside and There is a problem that dust adheres to the optical system such as the rotating mirror 7 and the infrared ray amount, that is, the temperature cannot be accurately measured. Therefore, it is conceivable to install a filter at the intake port for the outside air, but in this case, the filter must be replaced often, and maintenance is troublesome.
【０００９】[0009]
この考案は，回転ミラ−とガルバノメ−タとの間隙に温度校正用壁を立設し， この温度校正用壁の回転ミラ−対向面に対して室温検出用センサを近接配置する とともに，光学系走査機構が収納された光学系収納室と，電気回路部分を収納す る回路系収納室との間に防塵用の仕切壁を設けることにより本体ケ−スを分割配 置し，回路系収納室に外気を導入，排気する空冷装置を配置するようにしたもの である。 In this invention, a temperature calibration wall is erected in the gap between the rotary mirror and the galvanometer, and a room temperature detection sensor is arranged close to the rotary mirror facing surface of the temperature calibration wall, and an optical system is provided. The main body case is divided and arranged by providing a dustproof partition between the optical system storage room that houses the scanning mechanism and the circuit system storage room that houses the electric circuit part. An air-cooling device that introduces and exhausts outside air is installed in the room.
【００１０】[0010]
回路系収納室には，空冷装置により外気が導入され，内部を空冷しつつ外部に 排気される。この際，外気は光学系走査機構が収納されている光学系収納室を通 過することはないので，外気による埃が光学系に付着することはない。 Outside air is introduced into the circuit room by an air-cooling device, and the inside is cooled while being exhausted to the outside. At this time, the outside air does not pass through the optical system storage chamber in which the optical system scanning mechanism is stored, so dust from the outside air does not adhere to the optical system.
【００１１】[0011]
この考案の実施例を，図１〜図９に基づいて詳細に説明する。 図１は赤外線カメラのハウジング２１内部を示す平面図，図２は赤外線カメラ の正面図，図３は図１のＡ−Ａ線要部断面図，図４はハウジング２１の一部切欠 側面図，図５はカバ−２２の要部断面図，図６，図７は防塵用のパッキング３６ の平面図および断面図，図８，図９はそれぞれ仕切壁２３の開口部３２に装着す るパッキング３７の正面図および側面図である。なお，従来例と同一のものは同 一名称を使用するとともに，同一符号を付して，その説明を省略する。 An embodiment of the present invention will be described in detail with reference to FIGS. 1 is a plan view showing the inside of the housing 21 of the infrared camera, FIG. 2 is a front view of the infrared camera, FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 4 is a partial cutaway side view of the housing 21. 5 is a cross-sectional view of the main part of the cover 22, FIGS. 6 and 7 are plan views and cross-sectional views of the dustproof packing 36, and FIGS. 8 and 9 are packings 37 mounted in the openings 32 of the partition wall 23, respectively. It is a front view and a side view of. The same parts as those in the conventional example have the same names, are given the same reference numerals, and explanations thereof are omitted.
【００１２】 図１〜図２において，赤外線カメラの外形を形成するケ−ス本体２０は，ハウ ジング２１とカバ−２２とにより構成されており，ハウジング２１およびカバ− ２２の内部は，仕切壁２３により光学系収納室２４と回路系収納室２５とに区分 されており，回路系収納室２５が位置する両側面には，外気の導入口および排気 口となる格子状の窓２６，２７が透設されている。1 and 2, a case body 20 forming the outer shape of an infrared camera is composed of a housing 21 and a cover 22, and the inside of the housing 21 and the cover 22 is a partition wall. It is divided into an optical system storage chamber 24 and a circuit system storage chamber 25 by 23. On both side surfaces where the circuit system storage chamber 25 is located, grid-like windows 26 and 27 serving as an inlet and an outlet for outside air are provided. It is transparently installed.
【００１３】 光学系収納室２４には，ゲルマニウムウインド４，第１の折り返しミラ−５， 振動ミラ−６，回転ミラ−７，第２の折り返しミラ−８，集光レンズ９，ガルバ ノメ−タ１３，赤外線検出器１０のセンサ部１０ｂ等が配設されている。さらに ，カルバノメ−タ１３と回転ミラ−７との間には，室温校正用壁２８が設けられ ており，この室温校正用壁２８に対向する回転ミラ−７上には，室温検出用セン サ２９が配設されている。なお，この実施例では，透過させる赤外線の波長によ りゲルマニウムウインド４が採用されているが，波長が異なれば，シリコンウイ ンド等でもよい。In the optical system storage chamber 24, a germanium window 4, a first folding mirror 5, a vibrating mirror 6, a rotating mirror 7, a second folding mirror 8, a converging lens 9, a galvanic mirror 9 are provided. 13, the sensor portion 10b of the infrared detector 10 and the like are provided. Further, a room temperature calibration wall 28 is provided between the carbanometer 13 and the rotary mirror 7, and a room temperature detection sensor is provided on the rotary mirror 7 facing the room temperature calibration wall 28. 29 are provided. In this embodiment, the germanium window 4 is used depending on the wavelength of the infrared ray to be transmitted, but a silicon window or the like may be used if the wavelength is different.
【００１４】 回路系収納室２５には，増幅器１４，プロセッサ１５等の回路基板３９，赤外 線検出器１０およびそのク−ラ−部１０ａ，空冷装置３０，端子部３１等が配設 されている。The circuit system storage chamber 25 is provided with an amplifier 14, a circuit board 39 such as a processor 15, an infrared ray detector 10 and its cooler portion 10a, an air cooling device 30, a terminal portion 31 and the like. There is.
【００１５】 仕切壁２３は，ケ−ス本体２０内を光学系収納室２４と回路系収納室２５との 間を仕切り，光学系収納室２４への埃の侵入を阻止するために，設けられたもの で，図４，図５に示すように，ハウジング２１側とカバ−２２側とにそれぞれ互 いに対向して設けられており，ハウジング２１の上面をカバ−２２で覆うと，ケ −ス本体２０は，仕切壁２３により光学系収納室２４と回路系収納室２５とに分 割されるように構成されている。The partition wall 23 is provided to partition the inside of the case body 20 between the optical system storage chamber 24 and the circuit system storage chamber 25 and prevent dust from entering the optical system storage chamber 24. As shown in FIGS. 4 and 5, the housing 21 side and the cover 22 side are provided so as to face each other. When the upper surface of the housing 21 is covered with the cover 22, The main body 20 is configured to be divided into an optical system storage chamber 24 and a circuit system storage chamber 25 by a partition wall 23.
【００１６】 ハウジング２１側の仕切壁２３には，図３に示すように，光学系収納室２４と 回路系収納室２５とに連通する半円形の開口部３２が設けられており，この開口 部３２には，赤外線検出器１０のセンサ部１０ｂからク−ラ−部１０ａへと連通 する管１０ｃが貫通するもので，この開口部３２の両側には，ケ−ブル（図示せ ず）を貫通させるためのケ−ブル溝３３，３４が同様にハウジング２１側に透設 されている。As shown in FIG. 3, the partition wall 23 on the housing 21 side is provided with a semicircular opening 32 that communicates with the optical system storage chamber 24 and the circuit system storage chamber 25. A pipe 10c, which communicates from the sensor portion 10b of the infrared detector 10 to the cooler portion 10a, penetrates through 32. A cable (not shown) penetrates both sides of the opening 32. Similarly, cable grooves 33 and 34 are provided on the housing 21 side so as to be transparent.
【００１７】 カバ−２２側の仕切壁２３端部，即ち，ハウジング２１側の仕切壁２３と当接 する部分には，図６，７に示すように，ゴム等の弾性部材で形成された断面Ｕ字 状のパッキング３６が嵌め込まれている。ハウジング２１側の開口部３２には， 光学系収納室２４へ回路系収納室２５からの埃が侵入しないように，図８，９に 示すように，ゴム等の弾性部材で，中心部分に開口部３２の大きさの孔３７ａが 形成されたパッキング３７が装着されている。仕切壁２３の両収納室２４，２５ に対向する少なくとも一面には，パ−マロイのような磁気シ−ルド部材で形成さ れている磁気シ−ルド板３８が固着されている。As shown in FIGS. 6 and 7, at the end of the partition wall 23 on the cover 22 side, that is, at the portion that contacts the partition wall 23 on the housing 21 side, a cross section formed of an elastic member such as rubber is shown. A U-shaped packing 36 is fitted. In order to prevent dust from the circuit system storage chamber 25 from entering the optical system storage chamber 24, the opening 32 on the housing 21 side is opened in the center by an elastic member such as rubber as shown in FIGS. A packing 37 in which a hole 37a having the size of the portion 32 is formed is attached. A magnetic shield plate 38, which is formed of a magnetic shield member such as permalloy, is fixed to at least one surface of the partition wall 23 facing both the storage chambers 24 and 25.
【００１８】 次に，作用動作について説明する。 ハウジング２１内の所定位置に各部品を配設した後，カバ−２２側の仕切壁２ ３端部に，パッキング３６を嵌合するとともに，開口部３２に位置するク−ラ− 部１０ａの管１０ｃ部分にパッキング３７を位置決めし，テ−プで束線されたケ −ブルをケ−ブル溝３３，３４にぴったりはめ込んだ後，ハウジング２１の上面 をカバ−２２で覆う。 ハウジング２１とカバ−２２との仕切壁２３上端は，互いにパッキング３６を 介して密着固定するとともに，光学系収納室２４と回路系収納室２５との間隙は ，パッキング３７が配設されている開口部３２とケ−ブルでふさがれたケ−ブル 溝３３，３４とにより連通されている。Next, the operation will be described. After arranging the parts at predetermined positions in the housing 21, the packing 36 is fitted to the end of the partition wall 23 on the side of the cover 22 and the pipe of the cooler part 10a located in the opening 32. The packing 37 is positioned at the portion 10c, the cables bundled by the tape are fitted into the cable grooves 33 and 34, and then the upper surface of the housing 21 is covered with the cover 22. The upper end of the partition wall 23 between the housing 21 and the cover 22 is tightly fixed to each other via a packing 36, and the gap between the optical system storage chamber 24 and the circuit system storage chamber 25 is an opening in which a packing 37 is arranged. The portion 32 and the cable grooves 33 and 34, which are closed with cables, communicate with each other.
【００１９】 そこで，赤外線カメラの電源がオンされると，空冷装置３０が駆動され，ケ− ス本体２０の側壁に開設されている一方の窓２６から外気が吸引され，ケ−ス本 体２０内部の回路系収納室２５のみを通過して内部を冷却しつつ他方の窓２７か ら外部に排気される。Then, when the power of the infrared camera is turned on, the air-cooling device 30 is driven, and the outside air is sucked through one of the windows 26 provided in the side wall of the case body 20, so that the case body 20 is closed. While passing through only the internal circuit system storage chamber 25 to cool the inside, the gas is exhausted to the outside from the other window 27.
【００２０】 この際，開口部３２はパッキング３７で遮蔽されているとともに，ケ−ブルと ケ−ブル溝３３，３４との間隙は，パッキング３６によりほぼ覆われるので，窓 ２６から流入する埃を含んだ外気は，ほとんど回路系収納室２５のみを通過し， 光学系収納室２４に侵入することはない。At this time, since the opening 32 is shielded by the packing 37 and the gap between the cable and the cable grooves 33, 34 is almost covered by the packing 36, the dust flowing from the window 26 is prevented. The contained outside air almost passes through only the circuit system storage chamber 25 and does not enter the optical system storage chamber 24.
【００２１】 しかしながら，光学系収納室２４には，回転ミラ−７のモ−タやガルバノメ− タ１３等の熱発生源が配設されているので，これらによる熱が発生し，光学系収 納室２４内の室温が高くなる。そのため，測定誤差が生じる。 そこで，光学系収納室２４内の環境温度に対して，被写体１からの温度（赤外 線量）を補正しなければならない。However, since the heat source such as the motor of the rotating mirror 7 and the galvanometer 13 is arranged in the optical system storage chamber 24, heat is generated by these and the optical system is stored. The room temperature in the chamber 24 becomes high. Therefore, a measurement error occurs. Therefore, it is necessary to correct the temperature (infrared dose) from the subject 1 with respect to the environmental temperature in the optical system storage chamber 24.
【００２２】 そこで，ゲルマニウムウインド４を通過した被写体１から放射された赤外線３ は，回転ミラ−７により走査されるが，回転ミラ−７は，最初に室温校正用壁２ ８を走査する。そこで，この室温校正用壁２８の温度を基準温度として室温検出 用センサ２９で検出した環境温度を校正し，プランクの放射公式から，実際の被 写体１の温度が測定される。なお，室温校正用壁２８は，回転ミラ−７の風切り 音を軽減する効果もある。 従って，光学系収納室２４の環境温度が高くなっても，常に正確な被写体１の 温度を測定することが出来る。Therefore, the infrared rays 3 emitted from the subject 1 that has passed through the germanium window 4 are scanned by the rotating mirror 7, and the rotating mirror 7 first scans the room temperature calibration wall 28. Therefore, the ambient temperature detected by the room temperature detecting sensor 29 is calibrated using the temperature of the room temperature calibration wall 28 as a reference temperature, and the actual temperature of the object 1 is measured from Planck's radiation formula. The room temperature calibration wall 28 also has the effect of reducing the wind noise of the rotating mirror 7. Therefore, even if the environmental temperature of the optical system storage chamber 24 becomes high, the temperature of the subject 1 can be always measured accurately.
【００２３】[0023]
この考案は，回転ミラ−とガルバノメ−タとの間隙に温度校正用壁を立設し， この温度校正用壁の回転ミラ−対向面に対して室温検出用センサを近接配置する とともに，光学系走査機構が収納された光学系収納室と，電気回路部分を収納す る回路系収納室との間に防塵用の仕切壁を設けることにより本体ケ−スを分割配 置し，回路系収納室に外気を導入，排気する空冷装置を配置するようにしたので ，回路系収納室は外気により空冷されるとともに，埃を含んだ外気は回路系収納 室のみを通過し，光学系収納室には外部からの埃が侵入し，付着することはない 。その上，環境温度に対して校正されているので，温度測定に誤差を生じること もない。 In this invention, a temperature calibration wall is erected in the gap between the rotary mirror and the galvanometer, and a room temperature detection sensor is arranged close to the rotary mirror facing surface of the temperature calibration wall, and an optical system is provided. The main body case is divided and arranged by providing a dustproof partition between the optical system storage room that houses the scanning mechanism and the circuit system storage room that houses the electric circuit part. Since the air-cooling device that introduces and exhausts the outside air is arranged in the room, the circuit system storage room is air-cooled by the outside air, and the outside air containing dust passes only through the circuit system storage room, and the optical system storage room does not. Dust from outside does not enter and adhere. Moreover, since it is calibrated to the ambient temperature, there is no error in temperature measurement.
【図１】この考案の実施例を示すもので，ハウジングの
平面図である。FIG. 1 is a plan view of a housing showing an embodiment of the present invention.
【図２】この考案の実施例を示す赤外線カメラの正面図
である。FIG. 2 is a front view of an infrared camera showing an embodiment of the present invention.
【図３】この考案の実施例を示すもので，図１のＡ−Ａ
断面図である。FIG. 3 shows an embodiment of the present invention, which is taken along the line AA of FIG.
FIG.
【図４】この考案の実施例を示すもので，ハウジング２
１の一部切欠側面図である。FIG. 4 shows an embodiment of the present invention, the housing 2
It is a partially cutaway side view of FIG.
【図５】この考案の実施例を示すもので，カバ−２２の
要部断面図である。FIG. 5 shows an embodiment of the present invention and is a cross-sectional view of the main part of the cover 22.
【図６】この考案の実施例を示すもので，防塵用のパッ
キング３６の平面図である。FIG. 6 is a plan view of the dustproof packing 36 according to the embodiment of the present invention.
【図７】この考案の実施例を示すもので，防塵用のパッ
キング３６の断面図である。FIG. 7 is a sectional view of a dustproof packing 36 according to the embodiment of the present invention.
【図８】この考案の実施例を示すもので，仕切壁２３の
開口部３２に装着するパッキング３７の正面図である。FIG. 8 shows an embodiment of the present invention, and is a front view of a packing 37 attached to the opening 32 of the partition wall 23.
【図９】この考案の実施例を示すもので，仕切壁２３の
開口部３２に装着するパッキング３７の側面図である。FIG. 9 shows an embodiment of the present invention and is a side view of a packing 37 mounted in the opening 32 of the partition wall 23.
【図１０】従来例を示す要部斜視図である。FIG. 10 is a perspective view of a main part showing a conventional example.
【図１１】従来例を示すもので，一部切欠要部平面図で
ある。FIG. 11 is a partially cutaway plan view of a conventional example.
１・・・・・被写体 ３・・・・・赤外線 ４・・・・・ゲルマニウムウインド ５・・・・・第１の折り返しミラ− ６・・・・・振動ミラ− ７・・・・・回転ミラ− ８・・・・・第２の折り返しミラ− ９・・・・・集光レンズ １０・・・・赤外線検出器 １３・・・・ガルバノメ−タ ２０・・・・ケ−ス本体 ２３・・・・仕切壁 ２４・・・・光学系収納室 ２５・・・・回路系収納室 ２８・・・・室温校正用壁 ２９・・・・室温検出用センサ ３０・・・・空冷装置 ３８・・・・磁気シ−ルド板 1 ... Subject 3 ... Infrared 4 ... Germanium window 5 ... First folding mirror 6 ... Vibration mirror 7 ... Rotation Mirror 8 ... Second folding mirror 9 ... Condensing lens 10 ... Infrared detector 13 ... Galvanometer 20 ... Case body 23.・ ・ ・ Partition wall 24 ・ ・ ・ Optical system storage room 25 ・ ・ ・ ・ Circuit system storage room 28 ・ ・ ・ ・ Room temperature calibration wall 29 ・ ・ ・ ・ ・ ・ Room temperature detection sensor 30 ・ ・ ・ ・ ・ ・ Air cooling device 38 ・... Magnetic shield plates
Claims (2)
を透過するウインドと，このウインドを透過した赤外線
を受光して，垂直方向に反射する第１の折り返しミラ−
と，この第１の折り返しミラ−からの前記赤外線を受光
して垂直方向に所定角度走査する振動ミラ−と，この振
動ミラ−を駆動するガルバノメ−タと，この振動ミラ−
により垂直方向に走査された前記赤外線を受光し，これ
を水平方向に走査する回転ミラ−と，この回転ミラ−か
らの水平および垂直走査された前記赤外線を受光して水
平方向に反射する第２の折り返しミラ−とからなる光学
系走査機構と， この光学系走査機構により走査された赤外線を受光して
熱画像信号として出力する赤外線検出器からの熱画像信
号を増幅するとともに，画像処理するプロセッサとを備
えた赤外線カメラにおいて， 前記回転ミラ−と前記ガルバノメ−タとの間隙に温度校
正用壁を立設し，この温度校正用壁の前記回転ミラ−対
向面に対して室温検出用センサを近接配置するととも
に，前記光学系走査機構が収納された光学系収納室と，
前記電気回路部分を収納する回路系収納室との間に防塵
用の仕切壁を設けることにより前記本体ケ−スを分割配
置し， 前記回路系収納室に外気を導入，排気する空冷装置を配
置したことを特徴とする赤外線カメラ。1. A window for transmitting only infrared rays emitted from the surface of an object and a first folded mirror for receiving the infrared rays transmitted through the window and reflecting the infrared rays in a vertical direction.
A vibration mirror that receives the infrared rays from the first folding mirror and scans in the vertical direction at a predetermined angle, a galvanometer that drives the vibration mirror, and the vibration mirror.
A rotary mirror that receives the infrared light scanned in the vertical direction by the camera and scans the infrared light in the horizontal direction, and a second mirror that receives the horizontal and vertical scanned infrared light from the rotary mirror and reflects the infrared light in the horizontal direction. And a processor for amplifying a thermal image signal from an infrared detector which receives infrared rays scanned by the optical scanning mechanism and outputs it as a thermal image signal, and which also processes an image. In the infrared camera provided with, a temperature calibration wall is erected in a gap between the rotary mirror and the galvanometer, and a room temperature detecting sensor is provided on a surface of the temperature calibration wall facing the rotary mirror. An optical system storage chamber in which the optical system scanning mechanism is stored while being arranged in proximity to each other,
The main body case is divided and arranged by providing a partition wall for dust prevention between the circuit system accommodating chamber for accommodating the electric circuit part, and an air cooling device for introducing and exhausting outside air into the circuit system accommodating chamber is arranged Infrared camera characterized by having done.
−ルド部材を固着したことを特徴とする請求項１に記載
の赤外線カメラ。2. The infrared camera according to claim 1, wherein a magnetic shield member is fixed to at least one surface of the partition wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993021562U JP2586366Y2 (en) | 1993-04-01 | 1993-04-01 | Infrared camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993021562U JP2586366Y2 (en) | 1993-04-01 | 1993-04-01 | Infrared camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0676834U true JPH0676834U (en) | 1994-10-28 |
| JP2586366Y2 JP2586366Y2 (en) | 1998-12-02 |
Family
ID=12058463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993021562U Expired - Lifetime JP2586366Y2 (en) | 1993-04-01 | 1993-04-01 | Infrared camera |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2586366Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114550496A (en) * | 2022-03-10 | 2022-05-27 | 长安大学 | A highway information warning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010315U (en) * | 1983-06-28 | 1985-01-24 | 西部電機工業株式会社 | electric valve control device |
| JPS617246A (en) * | 1984-06-14 | 1986-01-13 | モンテジソン、ソチエタ、ペル、アツイオーニ | Manufacture of aromatic urethanes from nitroaromatic compound |
| JPH0467386A (en) * | 1990-07-03 | 1992-03-03 | Canon Inc | Optical information recording/reproducing device |
| JP3091939U (en) * | 2002-08-06 | 2003-02-21 | 株式会社ワイ・イー・データ | Multi memory card reader |
-
1993
- 1993-04-01 JP JP1993021562U patent/JP2586366Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010315U (en) * | 1983-06-28 | 1985-01-24 | 西部電機工業株式会社 | electric valve control device |
| JPS617246A (en) * | 1984-06-14 | 1986-01-13 | モンテジソン、ソチエタ、ペル、アツイオーニ | Manufacture of aromatic urethanes from nitroaromatic compound |
| JPH0467386A (en) * | 1990-07-03 | 1992-03-03 | Canon Inc | Optical information recording/reproducing device |
| JP3091939U (en) * | 2002-08-06 | 2003-02-21 | 株式会社ワイ・イー・データ | Multi memory card reader |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114550496A (en) * | 2022-03-10 | 2022-05-27 | 长安大学 | A highway information warning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2586366Y2 (en) | 1998-12-02 |
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