JPH06784U - IC card - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an IC card improved in structure so that external stress is not directly transmitted to the IC. A center-approximating contact member 12 that comes into contact with the lower side near the center of the substrate 2 is provided on a bridge member 12a that connects between the legs 11 of the frame 1, and comes into contact with the upper side near the first short side of the substrate 2. The first short side close contact member 13b is provided on the leg 11 of the frame 1, and the second short side close contact member 13a that contacts the upper side of the substrate 2 near the second short side is provided on the leg 11 of the frame 1, The second short side of the substrate 2 is connected to the central proximity contact member 12 and the second
Both legs 11 of the frame 1 from between the short side contact members 13a
Then, the first short side of the substrate 2 is pushed between the legs 11 of the frame 1, and the first short side close contact member 13b, the center close contact member 12 and the second short side close contact member are inserted. The substrate 2 is held so as to be sandwiched between the upper cover 3 and the lower cover 4a.
A space is secured between the substrate 2 and the IC 321. [Effect] It is possible to prevent damage or failure of the IC or the like. External stress applied to the land and terminals of the connector can be reduced.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC card, and more particularly to an IC card having an improved substrate holding structure to improve reliability.

[0002]

[Prior art]

 FIG. 3 is an exploded perspective view of an example of a conventional IC card. The IC card 300 includes a substrate 320, a frame 310, an upper cover 330 and a lower cover 340.

The substrate 320 has a rectangular shape and has an IC 321 mounted thereon and a connector 322 fixedly mounted on the first short side. Further, a positioning protrusion 323 is formed near the first short side of both long sides.

The frame 310 has legs 311 along both long sides of the substrate 320 and a body 314 along the second short sides. The legs 311 of the frame 310 are provided with a plurality of abutting members 312 that abut on the lower sides of both long sides of the substrate 320, and a positioning groove 313 into which the positioning protrusion 323 of the substrate 320 is fitted. The body 314 has a height capable of installing a modular jack or the like.

In the assembly, first, the substrate 320 is placed on the contact member 312 of the frame 310, then the upper cover 330 is covered and bonded, and finally the lower cover 340 is bonded.

FIG. 4 is a partial cross-sectional view of the IC card 300. The lower surface of the substrate 320 contacts the contact member 312 of the frame 310, and the IC 321 contacts the upper cover 330 and is held so as to be sandwiched.

[0007]

[Problems to be solved by the device]

 In the above-mentioned conventional IC card 300, since the IC 321 is in contact with the upper cover 330, when external stress such as bending or twisting is applied to the IC card 300, the external force is directly transmitted from the upper cover 330 to the IC 321. However, there is a problem in that the reliability may be reduced due to damage or failure. Therefore, an object of the present invention is to provide an IC card with improved reliability by improving the structure so that external stress is not directly transmitted to the IC.

[0008]

[Means for Solving the Problems]

 The IC card according to the present invention has a substantially rectangular board on which an IC is mounted and a connector is fixedly mounted on a first short side, legs along both long sides of the board, and a body along a second short side. In an IC card having a frame having a base and an upper cover and a lower cover that protect the substrate from above and below, a central contact member that abuts a lower side (or an upper side) near the center of the substrate is used as a leg of the frame. Alternatively, a first short side contact member that contacts the upper side (or lower side) of each long side of the base plate near the first short side is provided on the leg of the frame. The second short side close contact member that abuts on the upper side (or the lower side) near the second short side of the board is provided on the leg of the frame or the bridge member that connects the legs, and the second short side of the board is at the center. Insert between the proximal contact member and the second short side proximal contact member and between the legs of the frame. Then, the first short side of the board is pushed between the legs of the frame so that the board is sandwiched between the first short side close contact member, the center close contact member and the second short side close contact member. The structure is characterized in that a space is provided between the upper cover and the lower cover and the substrate and the IC for holding.

[0009]

[Action]

 In the IC card of the present invention, the upper cover and the lower cover, the board, and the board are held by sandwiching the board by the first short side close contact member, the center close contact member, and the second short side close contact member. The IC is independent and a space is secured between them. Therefore, external stress is prevented from being directly transmitted to the IC, and the reliability can be improved.

[0010]

【Example】

 Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings. The invention is not limited to this. FIG. 1 is an exploded perspective view of an IC card 100 according to an embodiment of the present invention. The IC card 100 includes a substrate 2, a frame 1, an upper cover 3 and a lower cover 4. The substrate 2 has a substantially rectangular shape, and the IC 321 is mounted on the substrate 2, and the connector 22 is fixed to the first short side. In addition, a positioning protrusion 23 is formed near the first short side of both long sides. The positioning protrusion 23 may be provided on the connector 22.

The frame 1 has legs 11 extending along both long sides of the substrate 2 and a body 15 extending along the second short sides. The legs 11 of the frame 1 are connected to each other by a bridge member 12a in the vicinity of the center thereof, and the bridge member 12a is provided with a plurality of central contact members 12 that contact the lower side of the substrate 2 in the vicinity of the center. Further, near the second short side of the leg 11 of the frame 1, a second short side close contact member 13a that abuts on the upper side of the substrate 2 near the second short side is provided in a protruding manner. Further, near the first short side of the leg 11 of the frame 1, a first short side near contact member 13b that abuts on the upper side of the first short side of the long side of the substrate 2 is provided in a protruding manner. A positioning groove 14 into which the positioning protrusion 23 of the base plate 2 is fitted is provided. The body 15 has a height capable of installing a modular jack or the like.

For assembly, first, the substrate 2 is set up obliquely with the second short side facing down, and between the bridge member 12a of the frame 1 and the second short side contact member 13a to between the two legs of the frame 1. Insert the second short side. Next, the first short side of the substrate 2 is lowered, and the lower side near the first short side is pressed against the first short side near contact member 13b. Then, since the upper surface of the first short side contact member 13b is tapered and the leg 11 of the frame 1 has elasticity and spreads a little, the first short side of the substrate 2 contacts the first short side close contact. Get over the contact member 13b. The lower surface of the substrate 2 is supported by the central contact member 12a, and the upper surface of the substrate 2 is supported by the second short side contact member 13a and the first short side contact member 13b. It Finally, the upper cover 3 and the lower cover 4 are attached.

FIG. 2 is a partial cross-sectional view of the IC card 100. The lower surface of the substrate 2 contacts the central contact member 12 of the frame 1, and the upper surface of the substrate 2 contacts the second short side contact member 13a and the first short side contact member 13b of the frame 1, It is held so as to be sandwiched. A void 101 is formed between the IC 321 and the upper cover 3.

As described above, in the IC card 100, external stress is prevented from being directly transmitted to the IC. In addition, external stress applied to the land and the terminals of the connector 22 can be reduced.

[0015]

[Effect of device]

 According to the IC card of the present invention, it is possible to prevent external stress from being directly transmitted to parts such as ICs, so that damage and failure can be prevented. Further, external stress applied to the land and the terminal of the connector can be reduced. Therefore, the reliability is improved, the range of selection of parts, connectors, etc. is widened, and the IC card can be made thinner.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an IC card according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of the IC card of FIG.

FIG. 3 is an exploded perspective view of an example of a conventional IC card.

FIG. 4 is a partial cross-sectional view of the IC card of FIG.

[Explanation of symbols]

 100 IC card 1 frame 2 substrate 3 upper cover 4 lower cover 11 leg 12 center close contact member 12a bridge member 13a second short side close contact member 13b first short side close contact member 15 body

Claims (1)

[Scope of utility model registration request] 1. A substantially rectangular substrate on which an IC is mounted and a connector is fixedly mounted on a first short side, a leg along both long sides of the substrate, and a body along a second short side. In an IC card having a frame and an upper cover and a lower cover that protect the board from above and below, a central contact member that contacts the lower side (or upper side) near the center of the board is a leg or a leg of the frame. A first short side contact member that is provided on a bridge member connecting between the two and contacts the upper side (or the lower side) of the first short side of both long sides of the board is provided on the leg of the frame. The second short side close contact member that contacts the upper side (or the lower side) near the short side of the board is provided in the leg of the frame or the bridge member that connects the legs, and the second short side of the substrate is near the center close contact member. And between the second short side contact member and the two legs of the frame, and then the board The first short side is pushed between the legs of the frame, and the first short side close contact member, the center close contact member, and the second short side close contact member are held so as to sandwich the substrate, and the upper cover and An IC card having a space between the lower cover, the substrate and the IC.