JPH0680888B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH0680888B2 JPH0680888B2 JP60261028A JP26102885A JPH0680888B2 JP H0680888 B2 JPH0680888 B2 JP H0680888B2 JP 60261028 A JP60261028 A JP 60261028A JP 26102885 A JP26102885 A JP 26102885A JP H0680888 B2 JPH0680888 B2 JP H0680888B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- solder
- diameter
- component
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は、電気回路基板の半田付けに関するものであ
る。Description: FIELD OF THE INVENTION The present invention relates to soldering an electric circuit board.
〔発明の背景〕 従来の半田付方法は、実開昭60-28958号公報に記載の様
に、電気回路基板の下面の半田付法を向上させる事は考
えられているが、上面に半田ペーストを使用する両面同
時半田付けの場合は、半田ペーストが下面の半田に引張
られ、下面に落下し、半田不足をきたし、上面の半田付
け不良になる事があつた。BACKGROUND OF THE INVENTION The conventional soldering method is considered to improve the soldering method of the lower surface of the electric circuit board, as described in Japanese Utility Model Laid-Open No. 60-28958, but the solder paste is applied to the upper surface. In the case of double-sided simultaneous soldering using, the solder paste was pulled by the solder on the lower surface and dropped on the lower surface, resulting in insufficient solder, resulting in poor soldering on the upper surface.
本発明の目的は、上面に半田ペースト又は成型半田等を
使用する両面同時半田付けに於ける上面側の半田付不良
を無くし、品質を向上させる半田付方法を提供するにあ
る。An object of the present invention is to provide a soldering method for improving quality by eliminating soldering defects on the upper surface side in double-sided simultaneous soldering using solder paste or molded solder on the upper surface.
本発明の要点は、半田付ランドサイズについて、上面の
ランドを下面より大きくする事により、半田溶融時の半
田フイレツトの保持力を向上させ、且つ、上部より下部
の半田の凝固を早めさせ、上部の半田の落下を防止し半
田付け不良を低減する事である。The gist of the present invention is that, regarding the soldering land size, by making the land on the upper surface larger than the lower surface, the holding force of the solder fillet at the time of melting the solder is improved, and the solidification of the solder in the lower part is accelerated from the upper part. It is to prevent the solder from dropping and reduce the soldering failure.
第１図において、７及び８は導体で、下部より上部を大
きくしてある。９はフローソルダウエーブで第２図に示
す従来のものより幅をせまくしてある。In FIG. 1, 7 and 8 are conductors whose upper portion is larger than lower portion. Reference numeral 9 is a flow solder wave, which is narrower than the conventional one shown in FIG.
この様な状態において、フローソルダウエーブ９上を通
過させれば、溶融した半田ペーストとフローソルダウエ
ーブの接触時間が短かくなり、下部側に引張られる確率
が軽減されると共に、上部の保持力が増し、半田の落下
を防止する事が出来る。又、下部のランドを小さくする
事により、上部より下部の凝固が早く、上部の半田の落
下を防げる事が出来る。In such a state, if the molten solder paste and the flow solder wave are passed over the flow solder wave 9, the contact time between the melted solder paste and the flow solder wave becomes short, the probability of being pulled to the lower side is reduced, and the holding force of the upper portion is reduced. It is possible to prevent the solder from dropping. Also, by making the land of the lower part smaller, the solidification of the lower part is faster than that of the upper part, and the dropping of the solder on the upper part can be prevented.
なお図において、１は電気回路基板絶縁部,2は導体,3は
半田ペースト,4は部品リード,5はフローソルダウエー
ブ,6は半田付不良,7,8は導体,9はフローソルダウエーブ
である。In the figure, 1 is an insulating portion of an electric circuit board, 2 is a conductor, 3 is a solder paste, 4 is a component lead, 5 is a flow solder wave, 6 is a poor soldering, 7 and 8 are conductors, and 9 is a flow solder wave. is there.
本発明の効果は、電気回路基板の半田付け不良が軽減
し、品質が向上する事である。The effect of the present invention is that the soldering failure of the electric circuit board is reduced and the quality is improved.
第１図は本発明に用いられる基板要部の一例を示す断面
図、第２図は従来の基板断面図である。 １…電気回路基板絶縁部、２…導体、３…半田ペース
ト、４…部品リード、５…フローソルダウエーブ、６…
半田付不良、7,8…導体、９…フローソルダウエーブFIG. 1 is a sectional view showing an example of a main part of a substrate used in the present invention, and FIG. 2 is a sectional view of a conventional substrate. 1 ... Insulation part of electric circuit board, 2 ... Conductor, 3 ... Solder paste, 4 ... Component lead, 5 ... Flow solder wave, 6 ...
Bad soldering, 7,8 ... conductor, 9 ... flow solder wave
Claims (1)
じ、上下を接続するようにした両面半田付基板におい
て、 該基板の部品面の半田付ランドの径を、半田フロー面の
半田付ランドの径より大きくし、該部品面半田付ランド
には半田ペーストを用い、半田フロー面半田付ランドを
半田フローにより、該部品リードを通じて半田フロー面
の伝導熱により半田付ペーストを溶融して半田接続した
ことを特徴とする半田付方法。1. A double-sided soldering board, in which upper and lower parts are connected to each other through a component lead inserted into a component insertion hole, the diameter of a soldering land on a component surface of the board is set to a diameter of a soldering land on a solder flow surface. The diameter is larger than the diameter, and a solder paste is used for the component surface soldering land, and the soldering flow surface soldering land is melted and soldered by the conductive heat of the solder flow surface through the component lead by the solder flow. A soldering method characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261028A JPH0680888B2 (en) | 1985-11-22 | 1985-11-22 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261028A JPH0680888B2 (en) | 1985-11-22 | 1985-11-22 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62122296A JPS62122296A (en) | 1987-06-03 |
| JPH0680888B2 true JPH0680888B2 (en) | 1994-10-12 |
Family
ID=17356043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60261028A Expired - Lifetime JPH0680888B2 (en) | 1985-11-22 | 1985-11-22 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680888B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533666U (en) * | 1978-08-23 | 1980-03-04 |
-
1985
- 1985-11-22 JP JP60261028A patent/JPH0680888B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62122296A (en) | 1987-06-03 |
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