JPH0683035A - Mask structure for flexible circuit board - Google Patents
Mask structure for flexible circuit boardInfo
- Publication number
- JPH0683035A JPH0683035A JP15732593A JP15732593A JPH0683035A JP H0683035 A JPH0683035 A JP H0683035A JP 15732593 A JP15732593 A JP 15732593A JP 15732593 A JP15732593 A JP 15732593A JP H0683035 A JPH0683035 A JP H0683035A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- patterns
- mask
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011800 void material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 238000010019 resist printing Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂を基材とするフィ
ルム上にパターンを形成したフレキシブル回路基板用マ
スク構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board mask structure having a pattern formed on a resin-based film.
【０００２】[0002]
【従来の技術】従来のフレキシブル回路基板用マスク
は、図２に示す様に、マスク基材１上にフレキシブル回
路基板の配線パターンに相当する本パターン２を形成し
た構造であった。このマスクを使って露光、現像後、銅
をエッチングし、銅パターンを配したフレキシブル回路
基板を供給していた。なお、回路基板が完成した際に支
持体が無く、銅パターンのみが形成される一層構造部分
マスク上相当部３、銅パターンと一層もしくは多層の支
持体で形成された多層構造部分マスク上相当部４を図２
に示しておく。2. Description of the Related Art A conventional flexible circuit board mask has a structure in which a main pattern 2 corresponding to a wiring pattern of a flexible circuit board is formed on a mask substrate 1 as shown in FIG. After exposure and development using this mask, copper was etched to supply a flexible circuit board having a copper pattern. In addition, when the circuit board is completed, there is no support and only the copper pattern is formed on the one-layer structure partial mask corresponding part 3, and the multilayer structure partial mask upper part corresponding to the copper pattern and one or more multilayer support. Figure 4
It shows in.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前述の従来構
造では、エッチング時に本パターンと本パターンの間の
空隙部にエッチング液が集中し、他の部分に比べて、空
隙部に隣接するパターンのエッチング量が多くなり、パ
ターン形状精度の劣るフレキシブル回路基板を供給せざ
るをえないという課題を有する。そこで本発明はこのよ
うな課題を解決するもので、その目的とするところは、
パターンの形状精度の高いフレキシブル回路基板を供給
するところにある。However, in the above-mentioned conventional structure, the etching solution is concentrated in the voids between the main patterns during etching, so that the pattern adjacent to the voids is more concentrated than the other portions. There is a problem that the amount of etching increases and a flexible circuit board having a poor pattern shape precision cannot be supplied. Therefore, the present invention solves such a problem, and the purpose thereof is to
This is to supply a flexible circuit board with a high pattern shape accuracy.
【０００４】[0004]
【課題を解決するための手段】本発明のフレキシブル回
路基板用マスク構造は、樹脂を基材とするフィルム上に
パターンを形成したフレキシブル回路基板において、最
終的には消滅するダミーパターンを本パターンの空隙部
に形成する事により、ダミーパターンに隣接する本パタ
ーンの形状精度を向上させた事を特徴とする。According to the mask structure for a flexible circuit board of the present invention, in a flexible circuit board in which a pattern is formed on a film having a resin as a base material, a dummy pattern that will eventually disappear is formed in the main pattern. It is characterized in that the shape accuracy of the main pattern adjacent to the dummy pattern is improved by forming it in the void portion.
【０００５】[0005]
【実施例】本発明はフレキシブル回路基板において、マ
スク上の本パターンの空隙部に最終的には消滅するダミ
ーパターンを設け、そのマスクを使って、パターンを露
光工程で焼き付け、現像し、エッチング時にダミーパタ
ーンがエッチング液による銅の浸食の緩衝壁になる事に
より、ダミーパターンに隣接する銅の本パターンの形状
精度を向上させ、形状精度の高いフレキシブル回路基板
を供給することを可能にする、フレキシブル回路基板用
マスク構造。EXAMPLE A flexible circuit board according to the present invention is provided with a dummy pattern that will eventually disappear in a void portion of a main pattern on a mask in a flexible circuit board, and the mask is used to print, develop, and etch the pattern in an exposure process. By making the dummy pattern a buffer wall against copper erosion by the etching solution, it is possible to improve the shape accuracy of the copper main pattern adjacent to the dummy pattern and to supply a flexible circuit board with high shape accuracy. Mask structure for circuit boards.
【０００６】以下に本発明の実施例を図面にもとづいて
説明する。図１は本発明のフレキシブル回路基板用マス
クの平面図、図２は従来のフレキシブル回路基板用マス
クの平面図である。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a mask for a flexible circuit board of the present invention, and FIG. 2 is a plan view of a conventional mask for a flexible circuit board.
【０００７】本発明のフレキシブル回路基板用マスク
は、マスク基材１上にフレキシブル回路基板の配線パタ
ーンに相当する本パターン２を形成し、さらに、本パタ
ーンと本パターンの空隙部にダミーパターン５を形成し
た構造である。フレキシブル回路基板を製造する際には
本発明のマスクを使って露光し、現像後、銅をエッチン
グして、配線パターンを形成するのであるが、本発明の
マスクを使えば、エッチングの際にシャワー状に降り注
ぐエッチング液に対する緩衝壁として、ダミーパターン
５が機能し、ダミーパターン５に隣接する本パターン２
へ注ぐシャワー状のエッチング液の勢いを柔らげること
になる。これにより、ダミーパターン５に隣接する本パ
ターン２の過剰エッチングを緩和することができる。な
お本パターン２は、多層の支持体で形成された多層構造
部分に、つながっている為、脱落しないが、ダミーパタ
ーン５は銅パターンのみが形成される一層構造部分内に
あり、多層の支持体で形成された多層構造部分と、切り
離されている為、エッチング完了後、脱落し、消滅す
る。この後、必要に応じ、ソルダーレジスト印刷、メッ
キを行い、形状精度の高いフレキシブル回路基板が完成
する。In the mask for a flexible circuit board of the present invention, a main pattern 2 corresponding to the wiring pattern of the flexible circuit board is formed on a mask base material 1, and a dummy pattern 5 is further provided in the space between the main pattern and the main pattern. It is the formed structure. When manufacturing a flexible circuit board, the mask of the present invention is used for exposure, and after development, copper is etched to form a wiring pattern. With the mask of the present invention, a shower is used for etching. The dummy pattern 5 functions as a buffer wall for the etching solution that drops like a pattern, and the main pattern 2 adjacent to the dummy pattern 5
This will soften the momentum of the shower-like etching solution. As a result, excessive etching of the main pattern 2 adjacent to the dummy pattern 5 can be mitigated. Since this pattern 2 is connected to the multi-layered structure portion formed of the multi-layered support, it does not fall off, but the dummy pattern 5 is in the single-layered structure portion in which only the copper pattern is formed. Since it is separated from the multi-layered structure portion formed in, it will fall off and disappear after the etching is completed. Then, if necessary, solder resist printing and plating are performed to complete a flexible circuit board with high shape accuracy.
【０００８】[0008]
【発明の効果】以上述べたように発明によれば、マスク
上の本パターンの空隙部に、最終的には消滅するダミー
パターンを設け、そのマスクを使って、パターンを露光
工程で焼き付け、現像し、エッチング時に、ダミーパタ
ーンがエッチング液による銅の浸食の緩衝壁になる事に
より、従来のダミーパターンを設けていないマスクを使
った方式に比べて、ダミーパターンに隣接する銅の本パ
ターンの形状精度を向上させ、形状精度の高いフレキシ
ブル回路基板を供給することを可能にするという効果を
有する。As described above, according to the invention, a dummy pattern that will eventually disappear is provided in the void portion of the main pattern on the mask, and the pattern is printed and exposed in the exposure process using the mask. However, the shape of the copper main pattern adjacent to the dummy pattern is different from the conventional method using a mask without a dummy pattern because the dummy pattern serves as a buffer wall for copper erosion by the etching solution during etching. This has the effect of improving the accuracy and making it possible to supply a flexible circuit board having a high shape accuracy.
【図１】 本発明のフレキシブル回路基板用マスクの平
面図。FIG. 1 is a plan view of a mask for a flexible circuit board according to the present invention.
【図２】 従来のフレキシブル回路基板用マスクの平面
図。FIG. 2 is a plan view of a conventional flexible circuit board mask.
１‥‥マスク基材 ２‥‥本パターン ３‥‥一層構造部分マスク上相当部 ４‥‥多層構造部分マスク上相当部 ５‥‥ダミーパターン 1 mask base material 2 this pattern 3 layer structure part corresponding to the mask 4 layer structure part corresponding to the mask 5 dummy pattern
Claims (1)
を形成したフレキシブル回路基板において、最終的には
消滅するダミーパターンを本パターンの空隙部に形成す
る事により、本パターンの形状精度を向上させた事を特
徴とするフレキシブル回路基板用マスク構造。1. In a flexible circuit board in which a pattern is formed on a resin-based film, a dummy pattern that will eventually disappear is formed in a void portion of the main pattern to improve the shape accuracy of the main pattern. A mask structure for flexible circuit boards, which is characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15732593A JP2742863B2 (en) | 1993-06-28 | 1993-06-28 | Flexible circuit board manufacturing method and mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15732593A JP2742863B2 (en) | 1993-06-28 | 1993-06-28 | Flexible circuit board manufacturing method and mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0683035A true JPH0683035A (en) | 1994-03-25 |
| JP2742863B2 JP2742863B2 (en) | 1998-04-22 |
Family
ID=15647234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15732593A Expired - Fee Related JP2742863B2 (en) | 1993-06-28 | 1993-06-28 | Flexible circuit board manufacturing method and mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2742863B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048963A (en) * | 2005-08-10 | 2007-02-22 | Sharp Corp | Printed wiring board manufacturing method, printed wiring board photomask, and photomask creation program |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878150A (en) * | 1981-11-02 | 1983-05-11 | Nec Corp | Glass mask |
| JPS62299852A (en) * | 1986-06-19 | 1987-12-26 | Toshiba Corp | Exposure mask |
| JPS6459832A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Manufacture of semiconductor device |
-
1993
- 1993-06-28 JP JP15732593A patent/JP2742863B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878150A (en) * | 1981-11-02 | 1983-05-11 | Nec Corp | Glass mask |
| JPS62299852A (en) * | 1986-06-19 | 1987-12-26 | Toshiba Corp | Exposure mask |
| JPS6459832A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048963A (en) * | 2005-08-10 | 2007-02-22 | Sharp Corp | Printed wiring board manufacturing method, printed wiring board photomask, and photomask creation program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2742863B2 (en) | 1998-04-22 |
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