JPH0685111A - Tape carrier type semiconductor device and assembling method thereof - Google Patents

Abstract

(57) [Summary] [Object] In the tape carrier type semiconductor device 1, the liquid resin of the resin sealing body 5 is prevented from flowing out to the outer periphery of the sealing region on the back surface of the flexible film substrate 3A. Further, cracking of the resin sealing body 5 of the tape carrier type semiconductor device 1 is prevented. [Structure] In the tape carrier type semiconductor device 1, an outflow prevention groove 3C is formed in the sealing region on the back surface of the flexible film substrate 3A. In addition, the tape carrier type semiconductor device 1
In the assembling process, the step of forming the flexible film substrate 3A having the outflow prevention groove 3C, the resin sealing body 5
And the step of cutting a part of the flexible film substrate 3A and the step of mounting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier type semiconductor device, and is particularly effective when applied to a tape carrier type semiconductor device in which a semiconductor pellet mounted on a flexible film substrate is sealed with a resin sealing body. Technology.

[0002]

BACKGROUND ART tape carrier as a driving IC of the liquid crystal display device (TCP: T ape C arrier P ackage or T
AB: T ape A utomated B onding ) type semiconductor device is used. The tape carrier type semiconductor device is thin and suitable for mass production, and is widely used as an inexpensive semiconductor device.

In this tape carrier type semiconductor device, a semiconductor pellet is mounted on a flexible film substrate (insulating resin film substrate). The flexible film substrate is formed, for example, by cutting a tape-shaped (long-shaped) polyimide resin into a predetermined length. A plurality of leads are arranged on the surface of the flexible film substrate. The leads are formed by etching a Cu foil film attached on the surface of the flexible film substrate. Usually, a plating layer is formed on the surface of this lead, and this plating layer has the effect of improving the adhesiveness with solder during mounting.

A device hole (opening for mounting pellets) is formed in a substantially central region of the flexible film substrate. One end of the lead projects into the device hole, and one end of the lead is electrically connected to an external terminal (bonding pad) of the semiconductor pellet arranged in the device hole. The external terminal of the semiconductor pellet and one end of the lead are electrically and mechanically connected via a protruding electrode (for example, an Au bump electrode), and this connection is performed by a thermocompression bonding (gang bonding) method.

A plurality of external terminals connected to the respective external terminals of the liquid crystal display device and the printed wiring board are arranged in the peripheral area of the flexible film substrate, and each of the plurality of external terminals is described above. The other ends of the plurality of wires are electrically and integrally connected. Usually, in a tape carrier type semiconductor device, an external terminal of a liquid crystal display device is electrically and mechanically connected to an external terminal of a flexible film substrate through an anisotropic conductive film. Also, in the tape carrier type semiconductor device, the external terminals of the flexible film substrate are electrically and mechanically connected to the external terminals of the printed wiring board via solder.

The element forming surface of the semiconductor pellet mounted on the flexible film substrate and a part of the lead, particularly one end of the lead, mainly protects the semiconductor pellet from external stress and external environment and reinforces the mechanical strength of the lead. It is sealed with a resin sealing body for the purpose such as. As the resin sealing body, for example, a liquid resin obtained by liquefying an epoxy resin with alcohol is used. The liquid resin is applied as a nozzle drawing method (potting method) and then cured at a temperature of about 100 to 200 [° C.] to form a resin sealing body. Application of the liquid resin by the nozzle drawing method is performed from the element forming surface side of the semiconductor pellet, and a part of the liquid resin applied to the front surface is applied to the back surface of the flexible film substrate through the device hole.

The tape carrier type semiconductor device is described in, for example, "Introduction to TAB Technology", page 43, page 59, pages 197 to 209, published by the Industrial Research Institute.

[0008]

However, in the above-mentioned tape carrier type semiconductor device, the following matters to be improved have occurred.

In the tape carrier type semiconductor device, a resin sealing body is formed for the purpose of protecting the element forming surface of the semiconductor pellet. This resin sealing body is performed by the nozzle drawing method as described above, and on the element forming surface side of the semiconductor pellet, in proportion to the moving range of the nozzle for applying the liquid resin,
The liquid resin can be accurately applied in the sealing region including the element forming surface of the semiconductor pellet and a part of the surface of the flexible film substrate on the semiconductor pellet side. However, of the liquid resin, the liquid resin that flows out to the back surface of the flexible film substrate through the device hole of the flexible film substrate cannot be stopped in the sealing area, and flows out to the outer periphery of the sealing area. To do. Therefore, in the assembly process of the tape carrier type semiconductor device, after the resin sealing body is formed, the cutting device holds the outer periphery of the sealing region of the flexible film substrate, and a part of the peripheral region of the flexible film substrate is sandwiched. At the time of cutting, the resin sealing body that has flowed out to the outer periphery of the sealing region is sandwiched and a crack occurs in the resin sealing body. A part of the peripheral region of the flexible film substrate to be cut corresponds to a region of a sprocket hole for transportation, a region where leads for testing are arranged, and the like.

After the tape carrier type semiconductor device is completed, the tape carrier type semiconductor device is mounted on the liquid crystal display device by a thermocompression bonding method using an anisotropic conductive film. For this reason, when the outer periphery of the sealing region of the flexible film substrate is pressure bonded by the bonding device and thermocompression bonding is performed, the resin sealing body that has flowed out to the outer periphery of the sealing region is pressure bonded, and similarly, the resin sealing is performed. A crack occurs in the stopper. Therefore, in the assembly process (including mounting), the yield of the tape carrier type semiconductor device decreases.

An object of the present invention is to provide a technique capable of preventing the liquid resin of the resin encapsulant from flowing out to the outer periphery of the encapsulation region on the back surface of the flexible film substrate in the tape carrier type semiconductor device. It is in.

Another object of the present invention is to achieve the above object,
It is an object of the present invention to provide a technique capable of preventing cracking of a resin sealing body of a tape carrier type semiconductor device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0014]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

(1) A semiconductor pellet is arranged in a device hole formed in a central region of the flexible film substrate, and the peripheral region of the surface of the flexible film substrate is provided as an external terminal on an element formation surface of the semiconductor pellet. One end of the lead formed on the substrate is electrically connected via a protruding electrode, and includes a semiconductor pellet element forming surface, a front surface of the flexible film substrate, and a part of the back surface on the semiconductor pellet side. In a tape carrier type semiconductor device for forming a resin encapsulant in which liquid resin is applied and cured from the element forming surface side of the semiconductor pellet in the region, the periphery of the back surface facing the front surface of the flexible film substrate A backside of the flexible film substrate between the sealing region and the outer perimeter of the sealing region or along the outer perimeter of the device hole in the sealing region. Constituting the outflow preventing grooves having a depth in the thickness direction from. The lead formed on the surface of the flexible film substrate is covered with a solder resist film formed in the sealing region, and the outflow prevention groove is formed in a region overlapping with the solder resist film.

(2) In the method of assembling a tape carrier type semiconductor device, in the peripheral region of the back surface of the flexible film substrate, between the sealing region and the outer periphery of the sealing region, or the flexible region. Forming a flow-out prevention groove having a depth in the thickness direction from the back surface of the flexible film substrate in the sealing region along the outer periphery of the device hole formed in the central region of the flexible film substrate, A semiconductor pellet is arranged in the device hole of the flexible film substrate, and the external terminals of the element forming surface of the semiconductor pellet are provided with the leads formed in the peripheral region of the surface facing the back surface of the flexible film substrate. A step of electrically connecting one end via a protruding electrode, and an element forming surface of the semiconductor pellet, in a sealing region including each of the semiconductor pellet side part of the front surface and the back surface of the flexible film substrate, After applying the liquid resin from the element forming surface side of the semiconductor pellet, after absorbing the liquid resin flowing out to the outer periphery of the sealing region out of the liquid resin flowing out to the back surface of the flexible film substrate in the outflow prevention groove. A step of curing the liquid resin to form a resin encapsulant, and sandwiching the outer peripheral portion of the sealing area on the front surface and the back surface of the flexible film substrate, Process for cutting the tape carrier type semiconductor device, and crimping the outer peripheral portion of the sealing region on the back surface of the flexible film substrate and mounting the other end of the lead on the front surface of the flexible film substrate. Electrically connecting to the device and mounting the tape carrier type semiconductor device.

[0017]

According to the above-mentioned means (1), the liquid resin forming the resin encapsulant, which flows out from the front surface of the flexible film substrate through the device hole to the back surface, flows out of the encapsulation region. The liquid resin that absorbs is absorbed by the outflow prevention groove,
The liquid resin can be prevented from flowing out of the sealing region. As a result, a tape carrier type semiconductor device having a resin sealing body in the sealing region can be constructed.

According to the above-mentioned means (2), the outflow prevention groove is formed in advance in the sealing region on the back surface of the flexible film substrate or in the boundary portion of the sealing region, and the front surface of the flexible film substrate is formed. Of the liquid resin forming the resin encapsulant flowing out from the device hole to the back surface, the liquid resin that flows out to the outside of the sealing area is absorbed by the outflow prevention groove, and the liquid resin to the outside of the sealing area is absorbed. Since it is possible to prevent outflow, when cutting a part of the peripheral region of the flexible film substrate or mounting the tape carrier type semiconductor device, the resin encapsulant formed outside the encapsulating region is used. No stress is applied, and cracking of the resin sealing body can be prevented. As a result, in assembly (including assembly and mounting) of the tape carrier type semiconductor device, the yield of the tape carrier type semiconductor device can be improved.

The structure of the present invention will be described below together with an embodiment in which the present invention is applied to a tape carrier type semiconductor device.

In all the drawings for explaining the embodiments, parts having the same functions are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0021]

EXAMPLES Example 1 A tape carrier type semiconductor device according to Example 1 of the present invention will be described with reference to FIG. 1 (cross-sectional view) and FIG. 2 (partial plan view of FIG. 1).

As shown in FIG. 1 and FIG. 2, the tape carrier type semiconductor device 1 includes a flexible film substrate 3A (flexible film substrate 3A, leads 3B, islands, etc.
The semiconductor pellet 2 is mounted.

The flexible film substrate 3A is formed, for example, by cutting a tape-shaped (long-shaped) polyimide resin film into a predetermined length. The polyimide resin film having a thickness of, for example, about 70 to 80 [μm] is used. Further, the flexible film substrate 3A may be formed of a so-called organic film such as a polyamide resin film, a polyester resin film, a polyester sulfone resin film, a polyester ketone resin film, or a composite film thereof, in addition to the above materials.

Although the flexible film substrate 3A is shown in FIG. 1 after being cut, it is shown in FIG.
It has an area where a sprocket hole for transport is formed and an area where a test lead is arranged on the right and left sides.

A plurality of leads 3B are arranged in the peripheral region of the surface of the flexible film substrate 3A (the surface on the same side as the element forming surface of the semiconductor pellet 2). The lead 3B is fixed to the surface of the flexible film substrate 3A with an adhesive layer (not shown) interposed. An epoxy resin, for example, is used as the adhesive layer.

The lead 3B is mainly composed of, for example, a Cu foil film, and a conductive plating layer (not shown) is formed on at least the surface of the area of the Cu foil film which is in direct contact with the outside air.
The Cu foil film of the lead 3B is formed by pasting the Cu foil film on the surface of the flexible film substrate 3A and patterning the Cu foil film by a photolithography technique (including an etching technique). The Cu foil film is, for example, 30 [μ
The film thickness is about m].

One end of the lead 3B (semiconductor pellet 2
The side) is electrically and mechanically connected to an external terminal (bonding pad) (not shown) of the semiconductor pellet 2 via a protruding electrode (bump electrode) 2A. The protruding electrode 2
A is formed of, for example, Au or a laminated layer mainly containing Au.

The semiconductor pellet 2 is formed of, for example, a single crystal silicon substrate, and a plurality of semiconductor elements forming a drive circuit (liquid crystal driver circuit) are arranged on the surface of the single crystal silicon substrate which is the element formation surface. The external terminals of the semiconductor pellet 2 are formed in the same wiring layer as the wiring connecting the semiconductor elements, for example, the aluminum wiring. The semiconductor pellets 2 are arranged within a region defined by a device hole 3D formed in a substantially central portion of the flexible film substrate 3A.

The lead 3B is a flexible film substrate 3A.
Of the device hole 3 on one side of the lead 3B.
Projected into D. On the surface of the flexible film substrate 3A, the other end of the left lead 3B in FIG. 1 is connected to the liquid crystal display device (6) (see FIG. 5). Right lead 3B
The other end of is connected to the printed wiring board (7).

The surface of the plurality of leads 3B arranged on the surface of the flexible film substrate 3A is based on the adhesion of solder when the tape carrier type semiconductor device 1 is connected to the printed wiring board (7). It is covered with a solder resist film 4 mainly for the purpose of preventing a short circuit in 3B. For the solder resist film 4, for example, an epoxy resin is used, and 5
It is formed with a film thickness of about 20 [μm]. The solder resist film 4 is formed, for example, by applying it by screen printing and then curing it at a temperature of about 100 to 200 [° C.].

The solder resist film 4 is provided in the peripheral region except the region of the device hole 3D and the connection region between one end of the lead 3B and the external terminal of the semiconductor pellet 2 in the central region, and the liquid crystal display device at the other end of the lead 3B and the print. It is formed on the surface of the flexible film substrate 3A except for the connection region with each of the wiring substrates. In other words, the solder resist film 4 matches the outer edge of the solder resist film 4 with the outer edge of the sealing region in which the resin sealing body (5) is formed,
Alternatively, the outer edge of the solder resist film 4 is located inside the outer edge of the sealing region.

As shown in FIGS. 1 and 2, the back surface facing the front surface of the flexible film substrate 3A prevents the liquid resin of the resin sealing body (5) from flowing out to the outer periphery of the sealing region. An outflow prevention groove 3C is formed. The outflow prevention groove 3C is provided in the sealing region where the resin sealing body (5) is formed, specifically, between the sealing region and the outer periphery of the sealing region (outer edge of the sealing region), Alternatively, it is formed in the sealing region along the outer periphery of the device hole 3D. That is, the outflow prevention groove 3C is arranged in a region overlapping with the solder resist film 4 described above. As shown in FIG. 1, the outflow prevention groove 3C has a substantially semicircular cross-sectional shape, and as shown in FIG. 2, the planar shape is a ring shape (the exact shape is a square shape). The outflow prevention groove 3C is formed in the depth direction from the back surface of the flexible film substrate 3A to a depth of several to ten and several [μm] and is formed to have a groove width dimension of substantially the same dimension. It has been confirmed that the outflow prevention groove 3C formed in 1) can sufficiently prevent outflow of the liquid resin.

At least the element forming surface of the semiconductor pellet 2, the protruding electrode 4, and one end of the lead 3B are covered and sealed with a resin sealing body 5. The resin sealing body 5 is formed mainly for the purpose of protecting the semiconductor pellets 2 and the like from the external environment. As the resin sealing body 5, for example, a liquid resin obtained by liquefying an epoxy resin with alcohol is used. The liquid resin is dropped and applied by a nozzle drawing method (potting method) and then cured at a temperature of about 100 to 200 [° C.].

Next, the assembly process (including mounting) of the tape carrier type semiconductor device 1 described above will be briefly described with reference to FIGS. 3 to 5 (cross-sectional views showing each process).

First, the semiconductor pellet 2 is arranged in the device hole 3D of the flexible film substrate 3A, and one end of the lead 3B on the surface of the flexible film substrate 3A and the external terminal 2A of the semiconductor pellet 2 are respectively projected electrodes. 4 electrically and mechanically. The flexible film substrate 3A
Is before the cutting step, and has a region where the sprocket holes are arranged and a region where the test leads are arranged. Further, an outflow prevention groove 3C is formed in advance on the back surface of the flexible film substrate 3A. In the present embodiment, the outflow prevention groove 3C is provided in the flexible film substrate 3A with the device hole 3 formed therein.
D and a sprocket hole are formed by punching, and the back surface of the flexible film substrate 3A is pressed by a die having a projection shape to cause plastic deformation. According to this method, there is no need to add a new step for forming the outflow prevention groove 3C, and the assembly process can be greatly shortened.

Next, as shown in FIG. 3, liquid resin is applied from the element forming surface side of the semiconductor pellet 2 into the sealing region including the element forming surface of the semiconductor pellet 2 by a nozzle drawing method. The liquid resin is applied by the nozzle 51. At this time, of the applied liquid resin, the device hole 3D
The liquid resin flowing out to the back surface of the flexible film substrate 3A through the flow-through prevention groove 3C is absorbed in the portion flowing out to the outer periphery of the sealing region and can be retained in the sealing region. After that, the liquid resin is cured to form the resin sealing body 5.

Next, as shown in FIG. 4, in the cutting device, the front surface and the back surface of the flexible film substrate 3A are clamped by the clamping force F1 on the outer periphery of the resin sealing body 5,
A part of the peripheral region of the flexible film substrate 3A (the region where the sprocket holes are arranged, etc.) is cut and removed. In this cutting step, since the resin sealing body 5 is formed in the sealing region, the resin sealing body 5 does not crack.
When this cutting step is completed, the tape carrier type semiconductor device 1 is almost completed.

Next, as shown in FIG. 5, the liquid crystal display device 6
The tape carrier type semiconductor device 1 is mounted on and the tape carrier type semiconductor device 1 is connected to the printed wiring board 7. The liquid crystal display device 6 is a transparent glass substrate 6
A and the liquid crystal display portion 6B are provided, and the other end of the lead 3B of the tape carrier type semiconductor device 1 is electrically and mechanically connected to the wiring 6C on the transparent glass substrate 6A with the anisotropic conductive film 8 interposed. This connection is performed by the pressure bonding force F2 on the outer periphery of the resin sealing body 5 by the thermocompression bonding method. In this thermocompression bonding process, the resin encapsulation body 5 is formed in the encapsulation region, so that the resin encapsulation body 5 does not crack. The printed wiring board 7 includes an insulating resin substrate 7A and a wiring 7B, and the other end of the lead 3B of the tape carrier type semiconductor device 1 is electrically and mechanically connected to the wiring 7B with a solder 9 interposed therebetween.

As described above, according to this embodiment,
The following configuration and the operational effects of this configuration can be obtained.

(1) The semiconductor pellet 2 is placed in the device hole 3D formed in the central region of the flexible film substrate 3A.
And one end of the lead 3B formed in the peripheral region of the surface of the flexible film substrate 3A is electrically connected to the external terminal on the element formation surface of the semiconductor pellet 2 via the protruding electrode 4. An element formation surface of the semiconductor pellet 2,
Resin sealing in which a liquid resin is applied and cured from the element forming surface side of the semiconductor pellet 2 in a sealing region including a part of the front surface and the back surface of the flexible film substrate 3A on the semiconductor pellet 2 side. In the tape carrier type semiconductor device 1 forming the body 5, in the peripheral region of the back surface facing the front surface of the flexible film substrate 3A, between the sealing region and the outer periphery of the sealing region, Alternatively, an outflow prevention groove 3C having a depth in the thickness direction from the back surface of the flexible film substrate 3A is formed along the outer periphery of the device hole 3D in the sealing region. The leads 3B formed on the surface of the flexible film substrate 3A are covered with the solder resist film 4 formed in the sealing region, and the outflow prevention groove 3C is formed in a region overlapping with the solder resist film 4. To be done.

According to this configuration (1), of the liquid resin forming the resin encapsulation body 5 flowing out from the front surface of the flexible film substrate 3A to the back surface through the device hole 3D, outside the sealing region. The liquid resin that flows out to the outside can be absorbed by the outflow prevention groove 3C, and the liquid resin can be prevented from flowing out of the sealing region. As a result, the tape carrier type semiconductor device 1 having the resin sealing body 5 in the sealing region can be configured.

(2) In the method for assembling the tape carrier type semiconductor device 1, in the peripheral region of the back surface of the flexible film substrate 3A, between the sealing region and the outer periphery of the sealing region, or An outflow prevention groove 3C having a depth in the thickness direction from the back surface of the flexible film substrate 3A in the sealing region along the outer periphery of the device hole 3D formed in the central region of the flexible film substrate 3A. And the semiconductor pellet 2 is placed in the device hole 3D of the flexible film substrate 3A, and the semiconductor pellet 2 faces the rear surface of the flexible film substrate 3A at an external terminal on the element formation surface of the semiconductor pellet 2. Electrically connecting one end of the lead 3B formed in the peripheral region of the surface of the semiconductor pellet 2 through the protruding electrode 2A, the element forming surface of the semiconductor pellet 2, the front surface and the back surface of the flexible film substrate 3A. Of the liquid resin flowing out to the back surface of the flexible film substrate 3A while the liquid resin is applied from the element forming surface side of the semiconductor pellet 2 into the sealing region including each part of the semiconductor pellet 2 side. A step of absorbing the liquid resin flowing out to the outer periphery of the sealing region by the outflow prevention groove 3C and then hardening the liquid resin to form the resin sealing body 5, the surface of the flexible film substrate 3A, and The outer peripheral portion of the sealing area on the back surface is sandwiched, and the flexible film substrate 3A
Of the peripheral region of the flexible film substrate 3A, and the outer peripheral portion of the sealing region on the back surface of the flexible film substrate 3A is crimped to complete the tape carrier type semiconductor device 1. Electrically connecting the other end of the surface lead to the liquid crystal display device 6 and mounting the tape carrier type semiconductor device 1.

According to this structure (1), the outflow prevention groove 3C is formed in advance in the sealing region on the back surface of the flexible film substrate 3A or in the boundary portion of the sealing region, and the flexible film substrate 3A is formed. Of the liquid resin forming the resin encapsulant 5 that flows out from the front surface to the back surface through the device hole 3D, the liquid resin that flows out to the outside of the sealing region is the outflow prevention groove 3
Since it can be absorbed by C and the liquid resin can be prevented from flowing out to the outside of the sealing area, when cutting a part of the peripheral area of the flexible film substrate 3A or when mounting the tape carrier type semiconductor device 1. Also in the above, stress is not applied to the resin sealing body 5 formed outside the sealing region, and cracking of the resin sealing body 5 can be prevented. As a result, in the assembly (including assembly and mounting) of the tape carrier type semiconductor device 1, the yield of the tape carrier type semiconductor device 1 can be improved.

(Example 2) Example 2 is a second example of the present invention in which the shape of the outflow prevention groove of the flexible film substrate is changed in the tape carrier type semiconductor device.

A tape carrier type semiconductor device according to a second embodiment of the present invention will be described with reference to FIG. 6 (main part sectional view).

In the tape carrier type semiconductor device 1 according to the second embodiment, as shown in FIG. 6A, the outflow prevention groove 3C has a semi-elliptical cross section.

In the tape carrier type semiconductor device 1 of the second embodiment, as shown in FIG. 6B, the outflow prevention groove 3C is formed.
The cross-sectional shape of is formed in an inverted V shape.

In the tape carrier type semiconductor device 1 of the second embodiment, as shown in FIG. 6C, the outflow prevention groove 3C is formed.
The cross-sectional shape of is composed of an inverted concave shape.

In any of the tape carrier type semiconductor devices 1, the same effect as that of the first embodiment can be obtained.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, the present invention can be used even when a semiconductor pellet is mounted on the surface of a flexible film substrate without a device hole. In this case, the present invention forms the outflow prevention groove on the surface of the flexible film substrate. Further, in the present invention, a dam may be used instead of the outflow prevention groove.

The present invention also relates to a driving I for a liquid crystal display device.
Not limited to C, it can be applied to IC cards, watch ICs, and the like, and a semiconductor pellet may be equipped with a circuit system such as a dynamic random access memory.

[0053]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

In the tape carrier type semiconductor device, it is possible to prevent the liquid resin of the resin sealing body from flowing out to the outer periphery of the sealing region on the back surface of the flexible film substrate.

In addition to the above effects, cracking of the resin sealing body of the tape carrier type semiconductor device can be prevented.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a tape carrier type semiconductor device that is Embodiment 1 of the present invention.

FIG. 2 is a plan view of the tape carrier type semiconductor device.

FIG. 3 is a sectional view of a first step of an assembly process of the tape carrier type semiconductor device.

FIG. 4 is a sectional view of a second step.

FIG. 5 is a sectional view of a third step.

FIG. 6 is a sectional view of a tape carrier type semiconductor device which is Embodiment 2 of the present invention.

[Explanation of symbols]

1 ... Tape carrier type semiconductor device, 2 ... Semiconductor pellet, 3A ... Flexible film substrate, 3B ... Lead, 3C ...
Outflow prevention groove, 3D ... Device hole, 4 ... Solder resist film, 5 ... Resin sealing body, 6 ... Liquid crystal display device, 7 ... Printed wiring board.

Claims (3)

[Claims] 1. A semiconductor pellet is disposed in a device hole formed in a central region of a flexible film substrate, and the semiconductor pellet is provided as an external terminal on an element forming surface of the semiconductor pellet in a peripheral region of the surface of the flexible film substrate. One end of the formed lead is electrically connected via a protruding electrode, and a sealing region including the element forming surface of the semiconductor pellet, the front surface of the flexible film substrate, and a part of the back surface on the semiconductor pellet side. In a tape carrier type semiconductor device in which a liquid resin is applied from the element forming surface side of the semiconductor pellet and cured to form a resin sealing body, a peripheral region of a back surface facing the front surface of the flexible film substrate. Between the sealing region and the outer periphery of the sealing region, or along the outer periphery of the device hole in the sealing region, from the back surface of the flexible film substrate A tape carrier type semiconductor device comprising an outflow prevention groove having a depth in the thickness direction. 2. The lead formed on the surface of the flexible film substrate according to claim 1, is covered with a solder resist film formed in the sealing region, and the outflow prevention groove is formed in the solder. A tape carrier type semiconductor device, characterized in that it is formed in a region overlapping with a resist film. 3. A device formed in the peripheral region of the back surface of the flexible film substrate, between the sealing region and the outer periphery of the sealing region, or in the central region of the flexible film substrate. Forming a flow-out prevention groove having a depth in the thickness direction from the back surface of the flexible film substrate in a sealing region along the outer periphery of the hole, and in a device hole of the flexible film substrate. A semiconductor pellet is arranged, and one end of a lead formed in a peripheral region of a surface opposite to the back surface of the flexible film substrate is electrically connected to an external terminal on an element formation surface of the semiconductor pellet through a protruding electrode. Liquid resin from the element forming surface side of the semiconductor pellet in a sealing region including the connecting step and the element forming surface of the semiconductor pellet, a part of the front surface and the back surface of the flexible film substrate on the semiconductor pellet side, respectively. Apply In addition, of the liquid resin that has flowed out to the back surface of the flexible film substrate, the liquid resin that flows out to the outer periphery of the sealing region is absorbed by the outflow prevention groove, and then the liquid resin is cured to form a resin sealing body. The step of forming and sandwiching the outer peripheral portion of the sealing region on the front and back surfaces of the flexible film substrate and cutting a part of the peripheral region of the flexible film substrate to complete the tape carrier type semiconductor device. And a tape carrier type semiconductor device in which the outer peripheral portion of the sealing region on the back surface of the flexible film substrate is crimped and the other end of the lead on the front surface of the flexible film substrate is electrically connected to a mounting device. And a step of mounting the tape carrier type semiconductor device.