JPH0688091U - Socket for IC parts - Google Patents

Abstract

(57) [Abstract] [Purpose] I has a structure that does not require the formation of through-holes on a printed wiring board on which sockets are mounted, and that matches characteristic impedance when mounting IC components.
Provide a socket for C parts. [Structure] An insulating substrate 13 is fitted and fixed in a through hole provided in a plate thickness direction, has a contactor 1 for contacting a lead terminal of an IC component at one end, and is connected to a printed wiring board at the other end. In the IC component socket in which the electrode terminal 5 having the use lead is formed, the connecting lead is bent along the contact surface of the insulating substrate 13 with the printed wiring board and extended by a desired length.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC component socket for mounting IC components and the like.

[0002]

[Prior art]

 A known device of this type has a structure as shown in FIG. FIG. 3 is a partial sectional view of a conventional IC component socket.

Usually, this type of socket has a structure in which a plurality of through holes are provided at predetermined positions of the insulating substrate 3, and the electrode terminals 5 are fitted and fixed in the through holes. A contact 1 having a split pin structure into which a terminal lead of an IC component (not shown) is inserted is provided at one end of the electrode terminal 5. By inserting the terminal lead of the IC component into this contact 1, the electrode terminal 5 is inserted. And the IC component are electrically connected. The contactor 1 is joined to the inner wall surface of the electrode terminal 5 so as to be electrically conductive. The other end of the electrode terminal 5 is formed so as to project from the insulating substrate 3 to the outside. The terminal lead 2 is inserted into a corresponding through hole of a printed wiring board (not shown) and soldered to the IC component. And the printed wiring board are electrically connected.

Such an IC component socket is mounted on the printed wiring board in advance by using the terminal leads 2, and the IC component terminal leads are inserted into the contactors 1 as necessary to replace the IC components with a touch. be able to. In such a conventional socket, a through hole for inserting the terminal lead 2 needs to be provided in the printed wiring board in advance when it is attached to the printed wiring board. Further, the electrode terminal 5 is built in the insulating substrate 3, but when viewed as a transmission line, the signal line is exposed and connected to the printed wiring board.

[0005]

[Problems to be solved by the device]

 The above-mentioned conventional IC component socket requires through holes for inserting terminal leads in order to mount the socket on the printed wiring board, which requires man-hours for drilling the printed wiring board. There was a problem to do. Moreover, in transmitting high-frequency signals, it is necessary to match the characteristic impedance of the transmission line.In the conventional socket, the contact and the terminal lead are considered to be the transmission line by integrating them, but these are exposed. There was a problem that the structure did not match the characteristic impedance.

The present invention has been made to solve the above-mentioned problems, and does not require the formation of through holes on a printed wiring board on which a socket is mounted, and it can reduce the characteristic impedance when mounting IC components. It is an object of the present invention to provide an IC component socket having a matching structure.

[0007]

[Means for Solving the Problems]

 According to the present invention, the connecting lead of the electrode terminal is bent along the contact surface of the insulating substrate with the printed wiring board and extended by a desired length. The connecting lead can extend to the side surface of the insulating substrate. It is also possible to wrap the through surface of the electrode terminal with a conductor surface via a dielectric to form a coaxial structure and fit and fix it to an insulating substrate to bond the conductor surface.

[0008]

[Action]

 According to the present invention, since the IC component socket is configured as described above, it is possible to mount the printed circuit board by surface mounting without requiring through holes in the printed circuit board in advance. Further, when the connecting leads extend to the side surface of the insulating substrate, surface mounting becomes easier and wiring connection to the printed wiring board becomes easier. If the electrode terminals are wrapped with a conductor on a conductor surface to form a coaxial structure, high frequency signals can be impedance-matched and transmitted.

[0009]

【Example】

 FIG. 1 is a view showing a sectional structure of an IC component socket according to an embodiment of the present invention. 2 is a perspective view thereof. The structure of the contactor 1 at one end of the electrode terminal 5 is the same as the conventional structure. In the conventional socket, the other end of the electrode terminal 5 serves as an electrode lead and protrudes to the outside of the insulating substrate 3, but in the present proposal, this is bent along the contact surface with the printed wiring board and the predetermined size is obtained. Extend for the length of. Therefore, when connecting to the printed wiring board, surface mounting is performed on the contact portion provided on the printed wiring board on the surface of the bent electrode terminal.

It is desirable that the extending portions are extended to the side surface of the insulating substrate 3 to form the ground terminal portion 5a and the signal terminal portion 5b in consideration of the solder rise of the solder joint portion of the electrode terminal 5. Normally, one electrode terminal 5 constitutes the ground terminal portion, and a plurality of electrode terminals 5 constituting the signal terminal portion are formed.

In the embodiment shown in FIG. 1, a portion of the electrode terminal 5 forming the signal terminal is surrounded by a dielectric 4 surrounding the insertion portion of the electrode terminal 5 into the insulating substrate 3, and the outer side thereof is covered by a conductor 6. The case has a coaxial line structure. The conductor 6 is connected to the electrode terminal of the ground terminal and soldered to the ground terminal of the printed wiring board. Therefore, the signal line of the signal terminal can have a uniform and stable grounding structure of the coaxial line.

In order to form an electrode terminal having a coaxial structure, a large through hole having a size different from the through hole of the electrode terminal of the ground terminal portion is provided in the signal terminal portion, and the conductor 6 is formed on the inner wall surface. After that, it can be formed by inserting the electrode terminal 5 wrapped with the dielectric 4.

[0013]

[Effect of device]

 As described in detail with reference to the embodiments above, in the present invention, since the socket is configured without using the connection lead of the electrode terminal, the through hole is not required for mounting on the printed wiring board, and therefore the man-hour required for drilling is reduced. Can be reduced.

Further, since the mounting of the socket and the printed wiring board is surface mounting, it is not necessary to provide a clearance hole when mounting on the multilayer board, and therefore high density mounting on the multilayer board becomes possible.

Further, the transmission line inside the socket has a coaxial structure, which has an advantage that high-speed and high-frequency signals can be normally transmitted.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a perspective view of an embodiment of the present invention.

FIG. 3 is a sectional view showing a conventional structure.

[Explanation of symbols]

 1 contactor 3 insulating substrate 4 dielectric 5 electrode terminal 6 earth conductor

Claims (3)

[Scope of utility model registration request] 1. A contact, which is fitted and fixed in a through hole provided in a plate thickness direction of an insulating substrate, has a contact for contacting a terminal lead of an IC component at one end, and a connection to a printed wiring board at the other end. In a socket for an IC component in which an electrode terminal having a wiring lead is formed, the connecting lead is bent along a contact surface of the insulating substrate with the printed wiring board, and is extended by a desired length. IC component socket. 2. The IC component socket according to claim 1, wherein the connection lead extends to a side surface of the insulating substrate. 3. The conductor surface is provided by wrapping a through surface of the electrode terminal with a conductor surface via a dielectric and fittingly fixing the conductor surface to the insulating substrate as a coaxial structure.
Alternatively, the IC component socket described in 2.