JPH069151U - Surface mount type electronic parts container - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] A surface mount type that can reduce the mounting area, ensure reliable mounting, and visually and easily confirm the soldering state during mounting. Provide a container for electronic components. A plurality of terminals are formed at a central portion of a base 11 having a bottom 11a formed by molding a molding material and having a bottom surface positioned on a mounting surface and a side wall 11b rising from a peripheral edge of the bottom and having a notch formed at a predetermined position. 12a is embedded and held, the tip of the terminal is arranged on the mounting surface and molded along the outside of the side wall of the base, and the electronic component is held by the base to connect to the outside through the terminal. Then, the opening of the metallic lid 13 is fitted to the outside of the side wall of the base to seal the electronic component.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a surface mount type electronic component container in which a soldering state during mounting can be easily checked.

[0002]

[Prior art]

 Recently, piezoelectric vibrators, especially inexpensive and high-performance quartz vibrators, are widely used as a reference for frequency, time, etc. in various electronic devices. In order to achieve compact size, high reliability, and maintain high-precision frequency, a large number of crystal oscillators have a small-sized crystal oscillator and an oscillation circuit consisting of a semiconductor integrated circuit housed together in a container. Manufactured and used. In this type of conventional crystal oscillator, for example, a quartz piece with an oscillation circuit made of a semiconductor integrated circuit and electrodes formed on a base made of an insulating substrate such as ceramics is placed on top of it and covered with a cover to make it airtight in a vacuum. It is designed to be sealed. In this way, the electrodes formed on the plate surface of the crystal piece can be shielded from the outside air, so that the inside of the container can be kept in a stable state chemically and physically for a long period of time. High accuracy can be maintained. Further, in recent electronic devices, it is particularly desired that the shape and size be small and lightweight, and efforts are being made to automate the assembly process as much as possible. For this reason, active devices such as transistors and ICs and passive devices such as resistors and capacitors are often surface-mounted. This type of surface mount device can be made small in size and can be automatically arranged at a predetermined position on the printed circuit board using a parts feeder or the like. Then, after all components are placed on the printed circuit board, they are passed through a reflow oven or the like to melt and mount the solder applied to the terminals of each component, thus assembling electronic devices with little human intervention. It is possible to significantly improve productivity.

Therefore, there is a demand for a surface mount type crystal oscillator that is smaller in shape and has no lead terminal than a crystal oscillator that is housed in a metal container that has been widely used in the past and leads out the lead terminal. As such a surface mount type crystal oscillator, for example, a surface mount type oscillator using a base formed by molding a lead frame having lead terminals formed in a predetermined shape with a thermoplastic resin is considered. FIG. 2 is an assembly perspective view showing an example of such an oscillator, in which a small crystal unit 1 housed in a metal container is mounted on an insulating substrate 3 together with circuit components 2 constituting an oscillation circuit. Place on 4. The base 4 is formed into a bottomed box shape with a molding material, and the lead frame 5 is embedded and held in the bottom of the base 4. The tip side of the lead frame 5 is exposed to the inner bottom part of the base 4, the base side penetrates the bottom part of the base 4, and a part is located on the outer surface of the bottom part of the base 4, and is also the same as the outer surface. It extends outwardly on the surface and bridges the frame portion (not shown). Then, the circuit of the insulating substrate 3 is electrically connected to the base end portion of the lead frame, and the base 4 is covered with the cover 6 for sealing. The holding piece 7 extends from the bottom of the base 4 and stands up along the side wall, for example, the side portion of the cover 6 is soldered and held.

By the way, it is desired that the electronic device using such a surface-mounted piezoelectric oscillator has a particularly small size. However, if the board surface of the terminal is extended along the mounting surface of the printed circuit board, the soldering area for the printed circuit board will be large, but the mounting area will be correspondingly large. Further, since such a piezoelectric oscillator is mounted on a printed circuit board by using, for example, an automatic assembler, it is desired that the soldering state can be confirmed after the mounting work. However, if the terminals are extended along the mounting surface, soldering is performed on the back surface of the terminals, so there is a problem that it is difficult to visually confirm the soldering state.

[0005]

[Problems to be solved by the device]

 The present invention has been made in view of the above circumstances, and it is possible to reduce the mounting area, to perform reliable mounting, and to easily and surely check the soldering state during mounting by visual inspection. The purpose of the present invention is to provide a container for electronic components.

[0006]

[Means for Solving the Problems]

 In the present invention, the base is formed by molding a mold material into a bottomed box, the front end is embedded and held, and the base end is placed on the mounting surface. An insulating substrate on which an oscillation circuit that is held and led out to the outside through a lead frame is mounted, and a metallic lid that fits an opening outside the side wall of the base to seal the electronic component It is characterized by that.

[0007]

【Example】

 Hereinafter, one embodiment of the present invention will be described in detail with reference to the assembly perspective view shown in FIG. In the figure, reference numeral 11 denotes a crystal oscillator housed in a cylindrical metal container, for example, which is mounted on an insulating substrate 13 together with circuit components 12 constituting an oscillation circuit, and the insulating substrate 13 is placed on a base 14. The insulating substrate 13 is formed by forming a conductive pattern of a predetermined shape with a metal foil or the like on the plate surface of a plate-shaped insulating material such as ceramic, and by forming a conductive pattern of the semiconductor integrated circuit, the circuit components 12 such as C and R, and the like. The crystal oscillator 11 is mounted to form an oscillation circuit. The base 14 is formed by molding a molding material such as an epoxy-based synthetic resin into a bottomed box shape, and the lead frame 15 is embedded and held in the bottom of the base 14. The lead frame 15 is a thin metal plate formed into a predetermined shape by pressing, etching or the like. The tip end portion 15a of the lead frame 15 is exposed on the inner bottom surface of the base 14, and the base end portion 15b penetrates the bottom surface of the base 14 and is partially embedded in the outer surface of the bottom portion of the base 14 to expose the plate surface. Further, it extends outward and bridges a frame part (not shown). Then, a circuit such as a power source and an oscillation output of the insulating substrate 13 is electrically connected to the tip end portion of the lead frame 15 and led out to the outside. The base end portion 15b of the lead frame 15 is molded on the base 14 and then cut at a predetermined portion and bent upward to be molded along the outside of the side wall of the base 14. Then, the opening of the lid body 16 formed by pressing a thin metal plate is fitted to the outside of the side wall of the base 14 so as to be sealed.

With such a configuration, since the tip end portion of the terminal is bent upward along the outside of the side wall of the base, the projected area of the printed circuit board on which the terminal is mounted can be reduced and the mounting area can be reduced. Can be reduced. The solder melted during mounting rises along the outer surface of the tip of the terminal to improve the reliability of soldering, and the soldering state can be easily confirmed visually.

[0009]

[Effect of device]

 As described above in detail, according to the present invention, when the surface mounting is performed, the solder rises on the tip surface of the lead terminal, the reliability of the soldering can be improved, and the soldering state can be visually checked easily. It is possible to provide a container for surface-mounting electronic components that can be confirmed, has good flatness of terminals on the mounting surface, has excellent workability during assembly, has good productivity, and can be downsized in shape. it can.

[0010]

[Brief description of drawings]

FIG. 1 is an assembled perspective view showing an example of a surface mount type electronic component container according to an embodiment of the present invention.

FIG. 2 is an assembled perspective view showing an example of a conventional container of a surface mount type electronic component.

[Explanation of symbols]

 11 crystal oscillator 12 circuit component 13 insulating substrate 14 base 15 lead frame 16 lid

Claims (1)

[Scope of utility model registration request] 1. A base formed by molding a molding material into a bottomed box shape, and a lead formed along the outside of a side wall of the base with a base end portion which is held by embedding a front end portion in the base and is mounted on the mounting surface. A frame, an insulating substrate on which an oscillator circuit held by the base and led out to the outside through the terminal is mounted, and a metal member for sealing the electronic component by fitting an opening to the outer side wall of the base. A container for surface-mounted electronic components, comprising: a lid.