JPH0692983B2 - Head for liquid crystal board and printed circuit board tester - Google Patents
Head for liquid crystal board and printed circuit board testerInfo
- Publication number
- JPH0692983B2 JPH0692983B2 JP59209824A JP20982484A JPH0692983B2 JP H0692983 B2 JPH0692983 B2 JP H0692983B2 JP 59209824 A JP59209824 A JP 59209824A JP 20982484 A JP20982484 A JP 20982484A JP H0692983 B2 JPH0692983 B2 JP H0692983B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- liquid crystal
- head
- main body
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 title description 31
- 239000011800 void material Substances 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000000523 sample Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 244000126211 Hericium coralloides Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、液晶板やプリント基板等をテストする際に用
いられるテスターのヘツド（テスターをテストすべき液
晶板やプリント基板のリードその他に接続する時に用い
られる部分）に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a head of a tester used for testing a liquid crystal plate, a printed circuit board or the like (connecting to a lead or the like of the liquid crystal plate or the printed circuit board to be tested). The part used when doing).
周知のように液晶板は、例えば第６図に示すような構造
のもので、平板状の透明板11,12の間に液晶を封入した
もので透明板11,12の内側に多数の線状等の導電部や透
明電極が設けられこれらに接続する多数のリード13が両
透明板縁部の対向した面に相互に直交する方向に設けら
れている。As is well known, the liquid crystal plate has, for example, a structure as shown in FIG. 6, in which liquid crystal is enclosed between flat plate-shaped transparent plates 11 and 12, and a large number of linear lines are formed inside the transparent plates 11 and 12. Conductive parts such as the above and transparent electrodes are provided, and a large number of leads 13 connected to these are provided in mutually orthogonal directions on the facing surfaces of the edges of both transparent plates.
又プリント基板は、各種の電子部品が設置されると共に
それらを結ぶ導電部が形成されていて所定の電気回路を
形成するものでその周縁部等には同様にリードが形成さ
れている。Further, the printed circuit board is provided with various electronic parts and conductive parts connecting them to form a predetermined electric circuit, and leads are similarly formed on the peripheral part thereof.
このような液晶板やプリント基板等をテストするテスタ
ーのヘツドの従来例としては、第７図に示すものが知ら
れている。この従来例は、ピンプローブ方式と呼ばれて
いるもので、アクリル板等の基板15に多数のプローブピ
ン16が植設されているもので、このプローブピン16は外
筒17とこれに上下方向に摺動可能に保持されているコン
タクトピン18よりなり、更に外筒17内に配置されたスプ
リング（図示してない）によりコンタクトピン18が常に
上方に押し上げられている。又コンタクトピン18の他端
は配線19によりテスターに接続されている。As a conventional example of a head of a tester for testing such a liquid crystal plate or a printed circuit board, the one shown in FIG. 7 is known. This conventional example is called a pin probe method, in which a large number of probe pins 16 are planted on a substrate 15 such as an acrylic plate. The contact pin 18 is slidably held by the contact pin 18, and the contact pin 18 is constantly pushed upward by a spring (not shown) arranged in the outer cylinder 17. The other end of the contact pin 18 is connected to the tester by the wiring 19.
この従来のピンプローブ方式のヘツドを用いて液晶板や
プリント基板等のテストを行なう場合、テスターのヘツ
ドの各コンタクトピン18が液晶板の各リード或はプリン
ト基板の各リードや導電部分に接触するように配置しこ
れを押圧することによつて各コンタクトピン18がリード
等に所定の接触圧にて接触するようにして通電してテス
トが行なわれる。When a liquid crystal plate, a printed circuit board or the like is tested using this conventional pin probe type head, each contact pin 18 of the head of the tester contacts each lead of the liquid crystal plate or each lead or conductive portion of the printed circuit board. By arranging in this way and pressing this, each contact pin 18 is brought into contact with the lead or the like at a predetermined contact pressure, and electricity is applied to perform a test.
しかしながら液晶板の各リードは極めて数が多く互いに
接近して配置されており、プリント基板のリードも接近
して配置されたものが多い。そのため第７図に示すピン
プローブ方式のヘツドでは、プローブピン16が外筒17内
にコンタクトピン18やスプリングを設けた構造であるた
め外筒の径を小さくするには限度があり、そのためコン
タクトピン間の間隔を狭くすることが出来ず、前記のよ
うにリード間の間隔の狭い液晶板やプリント基板に合わ
せたヘツドを作ることが困難である。この欠点を解消す
るために第７図に示すようにプローブピン16を２列,3列
等にし各プローブピンを斜めにずらした配置にしてあ
る。しかしこのように配置した場合にも一定の限度があ
り、リード間の間隔のより狭い液晶板に対しては適用出
来ない場合がある。又列の数を更に多くすれば狭いリー
ドに対しても適用し得るが、リードの長さを長くしなけ
ればならない新たな問題が生ずる。このようにピンプロ
ーブ方式のヘツドを用いたテスターでは、液晶板自体を
直接測定出来ず、そのために液晶テレビ，電卓等の完成
品に組込んだ後に完成品のテストの時に液晶板を測定し
なければならない。したがつて細かい点にわたつてまで
の正確な検査が困難である。又検査の結果不良個所が発
見された時の修繕や部品交換が面倒である。However, the leads of the liquid crystal plate are extremely large in number and are arranged close to each other, and the leads of the printed circuit board are often arranged close to each other. Therefore, in the pin probe type head shown in FIG. 7, since the probe pin 16 has a structure in which the contact pin 18 and the spring are provided in the outer cylinder 17, there is a limit in reducing the diameter of the outer cylinder. Since the space between the leads cannot be narrowed, it is difficult to form a head suitable for a liquid crystal plate or a printed circuit board with a narrow space between the leads as described above. In order to eliminate this drawback, as shown in FIG. 7, the probe pins 16 are arranged in two rows, three rows, etc., and the probe pins 16 are arranged so as to be slanted. However, even with such an arrangement, there is a certain limit, and it may not be applicable to a liquid crystal plate having a narrower space between leads. Further, if the number of rows is further increased, the method can be applied to a narrow lead, but a new problem arises that the length of the lead must be increased. In such a tester using a pin probe type head, the liquid crystal plate itself cannot be directly measured. Therefore, the liquid crystal plate must be measured at the time of testing the finished product after it has been incorporated into a finished product such as an LCD TV or a calculator. I have to. Therefore, it is difficult to perform accurate inspection up to the minute point. Further, when a defective part is found as a result of the inspection, repair and parts replacement are troublesome.
液晶板やプリント基板テスト用のテスターのヘツドの他
の従来例として第８図に示すようなコンタクトを備えた
ものが知られている。このヘツドは、タングステンワイ
ヤー方式と呼ばれているもので、タングステンワイヤー
21を図示するような形状にすることによつてタングステ
ンワイヤー自体にばね性を持たせたものである。この従
来例においては、タングステンワイヤー自体がばね性を
有しているためにスプリング等を収納する外筒等を必要
としないために各コンタクト（タングステンワイヤー）
を比較的接近させ得る。しかしタングステンワイヤーが
ある程度の径を有しているためにそのまま一列に並び配
置したのでは液晶板等に使用するヘツドとしては不十分
であつて、そのために図示するように各コンタクト21の
接触部22を円弧状に並び配置し、これによつて液晶板の
テスト用に適応出来るようにしてある。しかしこのよう
に接触部22を円弧状にしてあるためにあまり多くのコン
タクトを配置することが出来ない。一方液晶板やプリン
ト基板に設けられているリードは可成り数多く設けられ
ているので、一度に液晶板等のテストを行なうことが出
来ず何回にも分けて測定しなければならない不便さがあ
る。しかも前述のように液晶板等のリードは各リードの
幅が狭く各リード間が極めて微小間隔であるので各リー
ドとヘツドの各コンタクトとの位置合わせが面倒であ
り、このような面倒な位置合わせを必要とする測定を何
度にも分けて行なうことは好ましくない。As another conventional example of a head of a tester for testing a liquid crystal plate or a printed circuit board, one having a contact as shown in FIG. 8 is known. This head is called the tungsten wire method.
The tungsten wire itself has a spring property by forming 21 as shown in the figure. In this conventional example, since the tungsten wire itself has a spring property, an outer cylinder or the like for housing the spring or the like is not required, so that each contact (tungsten wire)
Can be relatively close together. However, since the tungsten wires have a certain diameter, it is not sufficient to arrange them in a line as they are as a head used for a liquid crystal plate or the like. Are arranged side by side in an arc shape, which makes it possible to adapt for testing liquid crystal plates. However, since the contact portion 22 has an arc shape in this way, too many contacts cannot be arranged. On the other hand, since the leads provided on the liquid crystal plate and the printed circuit board are quite large in number, it is not possible to test the liquid crystal plate etc. at one time, and there is the inconvenience of having to measure multiple times. . Moreover, as described above, the leads of the liquid crystal panel and the like have a narrow width between the leads and have a very small interval between the leads, so that the alignment of each lead and each contact of the head is troublesome, and such a troublesome alignment is required. It is not preferable to carry out the measurement that requires the measurement repeatedly.
本発明の液晶板，プリント基板テスター用ヘツドは、微
小幅の溝を微小間隔をおいて多数形成した本体と、前記
本体の溝内に少なくとも接触部が本体外に出るように配
置された接触部とばね部と配線部とがすべて薄板でその
板面が同一平面上に位置するように形成されていてそれ
自体ばね性を有している厚さのうすいコンタクトとを有
するものである。A head for a liquid crystal plate and a printed circuit board tester according to the present invention comprises a main body in which a large number of grooves having a minute width are formed at a minute interval, and a contact portion arranged so that at least a contact portion comes out of the body in the groove of the body. And the spring portion and the wiring portion are all thin plates and are formed such that their plate surfaces are located on the same plane, and each has a thin contact having a spring property.
又本発明の液晶板，プリント基板テスター用ヘツドは、
前記の構造であつて更に本体の各溝内に収納されている
コンタクトのテスター側への配線に接続するための接続
部の長さおよびコンタクトへの取付け位置の異なる数種
類のものを隣接する種類が互に異なるように順次繰り返
し配置した構造のものである。Further, the head for a liquid crystal plate and a printed circuit board tester of the present invention is
In the above structure, there are different types of adjacent types with different lengths of connecting portions for connecting to the tester side wiring of the contacts housed in the respective grooves of the main body and different attachment positions for the contacts. It has a structure in which the layers are sequentially and repeatedly arranged so as to be different from each other.
以下本発明の液晶板，プリント基板テスター用ヘツドの
実施例を図面にもとづいて詳細に説明する。第１図は本
発明ヘツドの実施例の斜視図、第２図は第１図における
II−II線断面図である。これら図において１はヘツドで
多数の微小幅の溝2a,3aを夫々有している本体２と蓋３
（これらはコンタクトのガイドの役割を有している）と
により構成され全体としてケース状になつている。又溝
内には先端に接触部５を有しこれとばね部と配線部とが
すべて薄板でその板面が同一平面上に位置するように一
体に形成されたコンタクト４が夫々収納配置されてい
る。Hereinafter, embodiments of the head for a liquid crystal plate and a printed circuit board tester of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of an embodiment of the head of the present invention, and FIG. 2 is a view in FIG.
FIG. 11 is a sectional view taken along line II-II. In these figures, reference numeral 1 is a head, and a main body 2 and a lid 3 each of which has a large number of grooves 2a and 3a having a minute width.
(These have the role of guides for the contacts) and are in the shape of a case as a whole. Further, the contact 4 is provided in the groove at the tip thereof, and the contact 4, which is integrally formed so that the spring portion and the wiring portion are all thin plates and their plate surfaces are located on the same plane, are housed and arranged. There is.
これらヘツド１の各構成部品を更に詳しく説明すると、
本体２にはコンタクト４の幅（厚さ）より僅かに広い幅
の溝2aが多数形成されていて櫛歯状になつている。又蓋
３は本体２にかぶせた時に本体２の各溝2aと一致する位
置に同一幅の溝3aが多数形成されている。更にこの蓋３
に形成された溝は、コンタクト４を収納した時にその接
触部５が蓋３の外に出るようにその先端部分では上方ま
で取除いた形状になつている。コンタクト４は、ヘアー
ピン状に曲げられた形状をなしこれによつてばね性をも
たせたもので前述のように上方の先端部には接触部５が
形成され又下方には更に下にのびる配線部が設けられて
いる。To explain each component of the head 1 in more detail,
The main body 2 is provided with a large number of grooves 2a having a width slightly wider than the width (thickness) of the contact 4 and has a comb-tooth shape. The lid 3 has a large number of grooves 3a of the same width formed at positions corresponding to the respective grooves 2a of the main body 2 when the cover 3 is covered with the main body 2. Furthermore, this lid 3
The groove formed in 1 has a shape in which the contact portion 5 is removed to the outside of the lid 3 so that the contact portion 5 comes out of the lid 3 when the contact 4 is stored. The contact 4 has a shape bent into a hairpin shape and has a spring property by this, and as described above, the contact portion 5 is formed at the upper end portion and the wiring portion extends further downward. Is provided.
これら各部をまず本体２の各溝2a位置に形成した貫通孔
にコンタクト４の配線部６を挿入することによつて本体
２の各溝位置にコンタクト４を夫々配置してから蓋３を
することによつてヘツド１が形成される。つまり各コン
タクト４は本体２の溝2aと蓋３の溝3aとにて形成され空
間内にその先端の接触部５が外に出た状態にて収納され
保持される。この場合、コンタクトの形状として蓋をす
る前には第２図に示すよりも両端4a,4bが開いたものに
し蓋をすることによつてこれがすぼめられて図示する状
態になるようにしてもよい。その場合は、コンタクト４
にはその両端4a,4bが開こうとする力が働くので安定し
た状態にて収納保持されることになる。又接触部５には
上方へ向かう力が常に働くので、コンタクトの接触部と
液晶板等のリードとの接触の際にこの接触部が押し下げ
られた時のばね圧が強くなり十分な接触圧をもたせるこ
とが可能になる。First, the contact 4 is placed in each groove position of the main body 2 by inserting the wiring portion 6 of the contact 4 into the through hole formed in each groove 2a position of the main body 2, and then the lid 3 is placed. Thereby forming the head 1. That is, each contact 4 is formed and formed by the groove 2a of the main body 2 and the groove 3a of the lid 3, and is housed and held in the space with the contact portion 5 at the tip thereof being exposed. In this case, as the shape of the contact, the both ends 4a and 4b may be opened more than those shown in FIG. 2 before the cover is closed, and the cover may be closed so as to be in the state shown in the drawing. . In that case, contact 4
Since both ends 4a, 4b of the slab have a force to open them, they are stored and held in a stable state. Further, since an upward force is always applied to the contact portion 5, when the contact portion of the contact and the lead of the liquid crystal plate or the like are contacted with each other, the spring pressure when the contact portion is pushed down becomes strong and a sufficient contact pressure is obtained. It becomes possible to have it.
以上のような構造のヘツド１を第６図に示すような構造
の液晶板のリード部分の各リード13に夫々コンタクト４
の接触部５が接するように設置してこれを押圧すれば接
触部５が押されコンタクト４のばね性によつて適切な接
触圧にて接触させてテストを行なうことが出来る。その
場合、このヘツド１はコンタクト４の厚さとコンタクト
間の間隔（本体２の溝間の間隔）のみによつて各コンタ
クト間のピツチが決まるのでピツチを小にすることが出
来、液晶板やプリント基板の測定用として十分対応させ
ることが出来る。例えばコンタクトとして薄い金属板
（ベリリウム銅板等）を図示する形状に打ち抜いて金メ
ツキしたものが使用され、その厚さは極めて薄くなし得
る。又本体２や蓋３は射出成形法等の合成樹脂の成形加
工によつて幅の狭い沢山な溝を有ししかも各溝間の間隔
が極めて小であるものでも容易に形成することが出来
る。したがつてリード間隔が小である液晶板やプリント
基板用に適用し得るものが出来る。The head 1 having the above-described structure is connected to each lead 13 of the lead portion of the liquid crystal plate having the structure shown in FIG.
If the contact portion 5 is installed so as to come into contact with the contact portion 5 and is pressed, the contact portion 5 is pressed so that the contact portion 5 is brought into contact with an appropriate contact pressure due to the springiness of the contact 4 to perform a test. In that case, since the pitch between the contacts of the head 1 is determined only by the thickness of the contacts 4 and the distance between the contacts (the distance between the grooves of the main body 2), the pitch can be reduced, and the liquid crystal plate or the print can be printed. It can be sufficiently used for substrate measurement. For example, a thin metal plate (such as a beryllium copper plate) punched into the shape shown in the drawing and plated with gold is used as the contact, and the thickness thereof can be made extremely thin. Further, the main body 2 and the lid 3 can be easily formed by molding a synthetic resin such as an injection molding method even if they have a large number of narrow grooves and the intervals between the grooves are extremely small. Therefore, it can be applied to a liquid crystal plate or a printed circuit board having a small lead interval.
コンタクトとしてすべて同一形状のものを用いてもよい
が第２図に示すように配線部の長さおよび設置位置の異
なる数種類（図示するものはA,B,Cの３種類）のものを
作り、これを例えばA,B,C,A,B,C,…のように順に繰り返
し配置するようにすれば配線部６からの配線７が各々比
較的離れた配置になるのでテスターへの接続を直接行な
わずに符号８に示す部分に接続端子部を設け市販のソケ
ツトによる接続が可能になる。これによりヘツドの取外
しが可能となる。All contacts may have the same shape, but as shown in Fig. 2, several types with different wiring lengths and installation positions (three types A, B and C are shown) are used. If this is repeatedly arranged in order, for example, A, B, C, A, B, C, ..., the wirings 7 from the wiring section 6 are arranged relatively distant from each other, so that the connection to the tester is directly made. Without doing so, a connection terminal portion is provided at the portion indicated by reference numeral 8 to enable connection with a commercially available socket. This allows the head to be removed.
第３図および第４図はコンタクトの他の変形例を示すも
のである。第３図に示すものは板ばね状のコンタクトで
その根元の支持部4cと先の部分のばね性をもたせた部分
4dとよりなつている。第４図は屈曲部4eを形成したもの
で、この屈曲部4eより先の部分にばね性をもたせたもの
である。3 and 4 show another modification of the contact. The one shown in FIG. 3 is a leaf-spring-shaped contact, and the support portion 4c at the base thereof and the portion having the elasticity of the tip portion.
It is more connected with 4d. FIG. 4 shows that a bent portion 4e is formed, and a portion ahead of the bent portion 4e has a spring property.
第５図は、第２図に示す形状のコンタクトに突起９を設
けたものでこれによつて配線部６を中心とした回動を防
止することが出来る。これによつて第１図に示す本体２
の溝2a間の仕切り部分を除去することが可能になり、本
体２や蓋３の構造を簡単化することが出来る。In FIG. 5, the contact having the shape shown in FIG. 2 is provided with the projection 9, and thereby the rotation around the wiring portion 6 can be prevented. As a result, the main body 2 shown in FIG.
It is possible to remove the partition portion between the grooves 2a, and the structure of the main body 2 and the lid 3 can be simplified.
本発明の液晶板，プリント基板テスター用ヘツドは、各
コンタクトが薄いばね性を有するものでしかも本体の微
小幅の微小間隔をおいて形成された溝内に収納保持され
ているので、各コンタクトが狭いピツチで配置されてい
るから液晶板やプリント基板を直接一度に測定すること
が可能である。又液晶板の測定の場合、例えば本発明の
ヘツドと上向きと下向きに夫々配置することにより液晶
板の両透明板の夫々のリードに両ヘツドのコンタクトを
接触せしめて一度に測定することが可能である。したが
つて従来完成品で行なわれていたものと同等又はそれ以
上の精度にての測定が可能である。更に各コンタクトと
して実施例のもののように配線部の長さや設置位置の異
なる種類のものを繰返し配置したヘツドを用いればヘツ
ドの端子部に市販のソケツトを使用し得る。又ヘツドが
端子部にて取外し可能になるので極めて便利である。In the liquid crystal plate and printed circuit board tester head of the present invention, each contact has a thin spring property and is housed and held in the groove formed at a minute interval of the main body, so that each contact is Since it is arranged with a narrow pitch, it is possible to directly measure the liquid crystal plate or the printed circuit board at one time. Further, in the case of measuring a liquid crystal plate, for example, by arranging the head of the present invention upward and downward, respectively, it is possible to bring the contacts of both heads into contact with the leads of both transparent plates of the liquid crystal plate and perform the measurement at one time. is there. Therefore, it is possible to perform measurement with an accuracy equal to or higher than that of the conventional finished product. Further, if a head in which different kinds of wiring portions having different lengths or installation positions are repeatedly arranged as each contact is used as each contact, a commercially available socket can be used for the terminal portion of the head. Further, the head can be removed at the terminal portion, which is extremely convenient.
第１図は本発明のヘツドの斜視図、第２図は第１図にお
けるII−II線断面図、第３図乃至第５図は夫々本発明で
用いられるコンタクトの変形例を示す図、第６図は液晶
板の斜視図、第７図は従来のヘツドの一部分を示す斜視
図、第８図は他の従来のヘツドの一部分を示す斜視図で
ある。 １……ヘツド、２……本体、３……蓋、４……コンタク
ト、５……接触部、６……配線部。1 is a perspective view of a head of the present invention, FIG. 2 is a sectional view taken along the line II-II in FIG. 1, and FIGS. 3 to 5 are views showing modified examples of contacts used in the present invention. 6 is a perspective view of a liquid crystal plate, FIG. 7 is a perspective view showing a part of a conventional head, and FIG. 8 is a perspective view showing a part of another conventional head. 1 ... Head, 2 ... main body, 3 ... lid, 4 ... contact, 5 ... contact part, 6 ... wiring part.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大沢 敏雄 埼玉県川口市並木２丁目30番１号 第一精 工株式会社内 (56)参考文献 実開 昭58−103383（ＪＰ，Ｕ) 実公 昭49−22355（ＪＰ，Ｙ１) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Osawa 2-30-1, Namiki, Kawaguchi City, Saitama Daiichi Seiko Co., Ltd. (56) References: SAI 58-103383 (JP, U) Sho 49-22355 (JP, Y1)
Claims (2)
た本体と、前記本体の溝に対応する位置に夫々溝を形成
した蓋と、接触部とばね部と配線部とがすべて薄板でそ
の板面が同一平面上に位置するように一体に形成したコ
ンタクトとを備え、前記コンタクトが前記本体に前記蓋
を取り付けた時に前記各溝により形成される空隙内に接
触部が外部にあらわれるように収納保持され前記コンタ
クトがその配線部が長さおよび上記接触部に対して横方
向の形成位置が異なっている複数種類あり、相互に隣接
されたコンタクトの種類が異なるものである液晶板、プ
リント基板テスター用ヘッド。1. A main body in which a large number of grooves having a minute width are formed at minute intervals, a lid having grooves formed at positions corresponding to the grooves of the body, a contact portion, a spring portion, and a wiring portion are all thin plates. And a contact integrally formed such that its plate surface is located on the same plane, and the contact portion is exposed outside in a void formed by each groove when the contact is attached to the main body. There are a plurality of types in which the contacts are housed and held in such a manner that the wiring portions have different lengths and the formation positions in the lateral direction with respect to the contact portions are different, and the types of adjacent contacts are different. Printed circuit board tester head.
た本体と、前記本体の溝に対応する位置に夫々溝を形成
した蓋と、接触部とばね部と配線部とがすべて薄板でそ
の板面が同一平面上に位置するように一体に形成したコ
ンタクトとを備え、前記コンタクトが前記本体に前記蓋
を取り付けた時に前記各溝により形成される空隙内に接
触部が外部にあらわれるように収納保持され前記コンタ
クトがその配線部が長さおよび上記接触部に対して横方
向の形成位置が異なっている複数種類あり、相互に隣接
されたコンタクトの種類が異なるものであり、更に各コ
ンタクトがいずれも前記空隙内に収納された状態よりも
接触部側が開いた形状に形成しこれを該空隙内に接触部
に予圧がかかるように収納保持した液晶板、プリント基
板テスター用ヘッド。2. A thin plate having a main body in which a large number of grooves having a small width are formed at a small interval, a lid having grooves formed at positions corresponding to the grooves of the main body, a contact portion, a spring portion, and a wiring portion are all thin plates. And a contact integrally formed such that its plate surface is located on the same plane, and the contact portion is exposed outside in a void formed by each groove when the contact is attached to the main body. As described above, there are a plurality of types in which the contact is housed and held, and the wiring portion thereof has a different length and a formation position in the lateral direction with respect to the contact portion, and the types of contacts adjacent to each other are different. The contacts are formed in a shape in which the contact portion side is opened more than the state of being housed in the void, and the contacts are housed and held in the void so that the contact portion is preloaded. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59209824A JPH0692983B2 (en) | 1984-10-08 | 1984-10-08 | Head for liquid crystal board and printed circuit board tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59209824A JPH0692983B2 (en) | 1984-10-08 | 1984-10-08 | Head for liquid crystal board and printed circuit board tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6189558A JPS6189558A (en) | 1986-05-07 |
| JPH0692983B2 true JPH0692983B2 (en) | 1994-11-16 |
Family
ID=16579221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59209824A Expired - Lifetime JPH0692983B2 (en) | 1984-10-08 | 1984-10-08 | Head for liquid crystal board and printed circuit board tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0692983B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH076531Y2 (en) * | 1988-09-05 | 1995-02-15 | 富士通オートメーション株式会社 | Measuring probe |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4922355U (en) * | 1972-06-01 | 1974-02-25 |
-
1984
- 1984-10-08 JP JP59209824A patent/JPH0692983B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6189558A (en) | 1986-05-07 |
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