JPH0694588B2 - Strip pretreatment device - Google Patents
Strip pretreatment deviceInfo
- Publication number
- JPH0694588B2 JPH0694588B2 JP14097986A JP14097986A JPH0694588B2 JP H0694588 B2 JPH0694588 B2 JP H0694588B2 JP 14097986 A JP14097986 A JP 14097986A JP 14097986 A JP14097986 A JP 14097986A JP H0694588 B2 JPH0694588 B2 JP H0694588B2
- Authority
- JP
- Japan
- Prior art keywords
- strip
- induction heating
- vacuum
- discharge
- pretreatment device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000006698 induction Effects 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、亜鉛の真空蒸着ライン等の真空処理ライン
で用いられる帯板の前処理装置に関するものである。TECHNICAL FIELD The present invention relates to a strip plate pretreatment apparatus used in a vacuum processing line such as a zinc vacuum deposition line.
帯板を真空中にて表面処理を施す場合、真空中にて表面
の酸化層を取り除き、処理に際し最適の温度に帯板を予
熱する必要がある。When the surface treatment of the strip is performed in vacuum, it is necessary to remove the oxide layer on the surface in vacuum and preheat the strip to an optimum temperature during the treatment.
真空中にて帯板の酸化層を取り除く手段としてはブラシ
研削があるが、表面凹部が十分処理できないという難点
があつた。Although brush grinding is a means for removing the oxide layer of the strip in a vacuum, it has a drawback that the surface recess cannot be sufficiently processed.
また、真空中にて昇温する方法としてはヒートロールを
用いることができるが高速化に対応できず、かつ制御性
も良くないという問題があり、赤外線炉を用いた場合で
は炉長が長くなるという難点があつた。A heat roll can be used as a method of raising the temperature in a vacuum, but there is a problem that it cannot cope with high speed and the controllability is not good, and when an infrared furnace is used, the furnace length becomes long. There was a difficulty.
さらに、酸化層の除去と昇温の両者を同時に行う方法と
してガス還元炉を設置する方法があるが、炉長が長く、
温度が高くなり過ぎ、真空中にガスを導入するため真空
システムが大きくなるという問題があつた。Furthermore, there is a method of installing a gas reduction furnace as a method of simultaneously performing both removal of the oxide layer and temperature rise, but the furnace length is long,
There was a problem that the temperature became too high and the vacuum system became large because the gas was introduced into the vacuum.
そこで、この発明は前記のような従来技術による帯板の
前処理手法の不都合な点を解決して、コンパクトで制御
性の良い帯板の前処理装置を提供することを目的とす
る。SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the above-mentioned disadvantages of the conventional strip plate pretreatment method and to provide a compact strip plate pretreatment device with good controllability.
この発明による帯板の前処理装置は、真空中にてグロー
放電によるスパツタ洗浄部と誘導加熱部とを組み合わせ
た点に特徴がある。The strip plate pretreatment apparatus according to the present invention is characterized in that a spatula cleaning section by glow discharge in vacuum and an induction heating section are combined.
以下、図示するこの発明の実施例により説明する。 Hereinafter, description will be made with reference to the illustrated embodiment of the present invention.
添付した図面には、この発明による帯板の前処理装置実
施例の全体図を示した。ここで、真空装置内の処理ライ
ン上流側にはスパツタ洗浄部Ａが配置されており、その
下流側には誘導加熱部Ｂが配置されている。The attached drawings show an overall view of an embodiment of a strip pretreatment device according to the present invention. Here, the sputter cleaning unit A is arranged on the upstream side of the processing line in the vacuum apparatus, and the induction heating unit B is arranged on the downstream side thereof.
スパツタ洗浄部Ａは放電用陽極２とこの放電用陽極２を
とり囲んで下側に開口する断面略状の導体からなる陰
極５を備え、陰極５内面は絶縁体６で被覆して放電用陽
極２との間の直接放電を防止している。The sprayer cleaning section A includes a discharge anode 2 and a cathode 5 which surrounds the discharge anode 2 and is formed of a conductor having a substantially cross-section that opens downward. Direct discharge between the two is prevented.
ここで、陰極５は接地されており、放電用陽極２は絶縁
体３で間隔を取つて陰極５に取り付けられると共に適切
な直流電源４から正電荷が印加される。Here, the cathode 5 is grounded, the discharge anode 2 is attached to the cathode 5 with an insulator 3 at an interval, and a positive charge is applied from an appropriate DC power source 4.
こうして構成されるスパツタ洗浄部Ａの下側を、処理対
象のストリツプ１は入口側のゴムロール８と出口側の金
属ロール９でガイドされて通過する。金属ロール９はス
リツプリング７を介して接地され、ストリツプ１も金属
ロール９を介して負側電位となる。The strip 1 to be processed passes under the sputter cleaning unit A thus constructed, guided by the rubber roll 8 on the inlet side and the metal roll 9 on the outlet side. The metal roll 9 is grounded via the slip ring 7, and the strip 1 also has a negative potential via the metal roll 9.
一方、誘電加熱部Ｂは上下方向に平行に離間して配置さ
れた誘導加熱用コイル10と、この誘導加熱用コイル10の
対向面に形成された絶縁体11とからなり、この誘導加熱
部Ｂを通るストリツプ１が誘導加熱用コイル10と放電を
起こさないよう絶縁体11で保護しつつストリツプ１の誘
導加熱を行なう。On the other hand, the dielectric heating section B is composed of an induction heating coil 10 which is arranged in parallel in the vertical direction at a distance from each other, and an insulator 11 formed on the opposite surface of the induction heating coil 10. Induction heating of the strip 1 is carried out while the strip 1 passing through is protected by the insulator 11 so as not to cause discharge with the induction heating coil 10.
また、図面では出口側にのみ例示したが、真空装置の出
入口にはストリツプ１のみを挿通するシール部12が設け
られて真空装置内の気密性を維持している。Although only the outlet side is illustrated in the drawing, a seal portion 12 through which only the strip 1 is inserted is provided at the inlet and outlet of the vacuum device to maintain the airtightness inside the vacuum device.
以上の構成において、連続して装置内に搬入されるスト
リツプ１はスパツタ洗浄部Ａにおいてストリツプ１と放
電用陽極２とのグロー放電で20〜100Å程度の酸化層が
イオン衝撃によるスパツタリングを受ける。In the above-described structure, the strip 1 continuously carried into the apparatus receives a glow discharge between the strip 1 and the discharge anode 2 in the sputter cleaning unit A, and the oxide layer of about 20 to 100 Å is subjected to the sputtering due to the ion impact.
真空装置内は放電電流密度を最適にするため、5Torr〜
0.01Torrとし、高いスパツタ効果を得るため、放電電圧
は数百〜2KVとする。In order to optimize the discharge current density in the vacuum device,
The discharge voltage is set to 0.01 Torr, and the discharge voltage is set to several hundred to 2 KV in order to obtain a high spatula effect.
この時、放電電流によりストリツプ１の温度は上昇する
が放電状態の変動等により、放電のみによる昇温は均一
ではなく、温度の調整も困難となる。At this time, the temperature of the strip 1 rises due to the discharge current, but due to fluctuations in the discharge state, etc., the temperature rise due to discharge alone is not uniform, and temperature adjustment becomes difficult.
そこで、スパツタ洗浄部Ａのライン下流側に設けられた
誘導加熱部Ｂにおいて、移動して来るストリツプ１に対
して誘導加熱により不足している熱量を加え、最適温度
に調整する。Therefore, in the induction heating unit B provided on the line downstream side of the sputter cleaning unit A, the amount of heat insufficient due to induction heating is added to the moving strip 1 to adjust the temperature to the optimum temperature.
ストリツプ１の長手方向に磁場をかける誘導加熱は、誘
導電流がストリツプ１の幅方向に流れるため温度が均一
になり、炉の応答性も早く、一定温度のコントロールが
行い易い。In induction heating in which a magnetic field is applied in the longitudinal direction of the strip 1, the induction current flows in the width direction of the strip 1, so that the temperature becomes uniform, the responsiveness of the furnace is fast, and it is easy to control a constant temperature.
また、誘導加熱のみによる昇温では熱容量を大きくする
場合に、高圧・大電流の高周波を真空装置内に導入する
必要があり、困難を伴つたがスパツタ洗浄部Ａと誘導加
熱部Ｂを真空装置内で組み合わせることで解決した。Further, when increasing the heat capacity by only induction heating, it is necessary to introduce high-frequency and high-current high-frequency waves into the vacuum device, which was difficult, but the sputter cleaning unit A and induction heating unit B were connected to the vacuum device. It was solved by combining them within.
この発明による帯板の前処理装置の実施例は以上の通り
であり、次に述べる効果を挙げることができる。The embodiments of the strip pretreatment device according to the present invention are as described above, and the following effects can be obtained.
帯板の前処理において、コンパクトで制御性の良い帯板
の前処理装置を提供できる。In the pretreatment of the strip, it is possible to provide a compact pretreatment device for the strip that has good controllability.
図面はこの発明による帯板の前処理装置の実施例構成図
である。 Ａ……スパツタ洗浄部、Ｂ……誘導加熱部、１……スト
リツプ、２……放電用電極、３……絶縁体、４……直流
電源、５……陰極、６……絶縁体、７……ストリツプリ
ング、8,8′……ゴムロール、９……金属ロール、10…
…誘導加熱用コイル、11……絶縁体、12……シール部。The drawings are block diagrams of an embodiment of a pretreatment device for a strip according to the present invention. A: Sputter cleaning section, B: Induction heating section, 1 ... Strip, 2 ... Discharge electrode, 3 ... Insulator, 4 ... DC power source, 5 ... Cathode, 6 ... Insulator, 7 ...... Stripping, 8,8 '... Rubber roll, 9 ... Metal roll, 10 ...
… Induction heating coil, 11 …… insulator, 12 …… seal part.
Claims (1)
空装置のライン上流側に設けられてグロー放電による被
処理帯板のスパツタ洗浄を行なうスパツタ洗浄部と、 前記真空装置内のライン下流側に設けられ被処理帯板の
誘導加熱を行なう誘導加熱部とを備えた帯板の前処理装
置。1. A pretreatment device for a vacuum processing line, comprising a spatula cleaning section provided on the upstream side of the vacuum device for cleaning the strip to be processed by glow discharge, and a line downstream of the vacuum device. An apparatus for pretreatment of a strip provided with an induction heating unit which is provided on the side and performs induction heating of the strip to be treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14097986A JPH0694588B2 (en) | 1986-06-17 | 1986-06-17 | Strip pretreatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14097986A JPH0694588B2 (en) | 1986-06-17 | 1986-06-17 | Strip pretreatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62297456A JPS62297456A (en) | 1987-12-24 |
| JPH0694588B2 true JPH0694588B2 (en) | 1994-11-24 |
Family
ID=15281302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14097986A Expired - Lifetime JPH0694588B2 (en) | 1986-06-17 | 1986-06-17 | Strip pretreatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0694588B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005020991A1 (en) * | 2005-05-03 | 2006-11-09 | Robert Bosch Gmbh | Method of preparing a reproducible substrate surface involving desputtering (sic) of surface oxide and/or substrate material from its surface and deposition of a surface oxide layer |
| KR102648936B1 (en) * | 2015-08-18 | 2024-03-18 | 타타 스틸 네덜란드 테크날러지 베.뷔. | Method and device for cleaning and coating metal strips |
-
1986
- 1986-06-17 JP JP14097986A patent/JPH0694588B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62297456A (en) | 1987-12-24 |
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