JPH069577Y2 - Vehicle rectifier mounting structure - Google Patents

Vehicle rectifier mounting structure

Info

Publication number
JPH069577Y2
JPH069577Y2 JP796388U JP796388U JPH069577Y2 JP H069577 Y2 JPH069577 Y2 JP H069577Y2 JP 796388 U JP796388 U JP 796388U JP 796388 U JP796388 U JP 796388U JP H069577 Y2 JPH069577 Y2 JP H069577Y2
Authority
JP
Japan
Prior art keywords
substrate
rectifier
vehicle
vehicle body
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP796388U
Other languages
Japanese (ja)
Other versions
JPH01113571U (en
Inventor
正樹 天海
信夫 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP796388U priority Critical patent/JPH069577Y2/en
Publication of JPH01113571U publication Critical patent/JPH01113571U/ja
Application granted granted Critical
Publication of JPH069577Y2 publication Critical patent/JPH069577Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Synchronous Machinery (AREA)
  • Motor Or Generator Frames (AREA)

Description

【考案の詳細な説明】 技術分野 本考案は自動二輪車等の車両における整流器の取付構造
に関する。
TECHNICAL FIELD The present invention relates to a rectifier mounting structure in a vehicle such as a motorcycle.

背景技術 車載エンジンが駆動する交流発電機によって発生された
交流電圧を直流に交換する整流回路及び上記発生電圧を
所定電圧に調整する電圧調整回路からなる車両用整流器
は、回路部品中の電力ロスに依って発熱する。
BACKGROUND ART A vehicle rectifier consisting of a rectifier circuit for exchanging AC voltage generated by an AC generator driven by an in-vehicle engine into DC and a voltage adjusting circuit for adjusting the generated voltage to a predetermined voltage is a power loss in circuit components. Therefore, it generates heat.

この熱を効率良く放散させ整流器の過熱を防止した車両
用整流器の取付構造が例えば特開昭60−92179号
公報により公知である。該公報に示された車両用整流器
の取付構造においては、上面が開口した箱状の金属製の
ケースを形成し、その底部に整流器を構成する回路部品
を担持した基板を収容固定し、このケースを熱伝導性の
良好なフレーム等の車体構成部品に面接触状態で取り付
け、整流器から生ずる熱を車体構成部品に効率良く伝達
し得る構成となっており、整流器の過熱が防止されてい
るのである。
A mounting structure for a vehicle rectifier that efficiently dissipates this heat and prevents overheating of the rectifier is known, for example, from Japanese Patent Laid-Open No. 60-92179. In the mounting structure for a vehicle rectifier disclosed in the publication, a box-shaped metal case having an open top is formed, and a board carrying circuit components constituting the rectifier is accommodated and fixed at the bottom of the case. Is attached to a vehicle body component such as a frame having good thermal conductivity in a surface contact state, and the heat generated from the rectifier can be efficiently transmitted to the vehicle body component, thereby preventing overheating of the rectifier. .

しかしながら、上述の構成においては、ケースは底部を
含めて鋳造等により一体成型されていることから、一体
成型後に車体構成部品に接する底部を平滑に仕上げなけ
ればならず、生産性に難があった。
However, in the above configuration, since the case including the bottom portion is integrally molded by casting or the like, the bottom portion contacting the vehicle body component must be finished to be smooth after the integral molding, which is a problem in productivity. .

考案の概要 そこで、本考案は上述の事情に鑑み、生産性に優れ、か
つ、整流器が発する熱を一層効率よく放散できる車両用
整流器の取付構造を提供することを目的としている。
SUMMARY OF THE INVENTION Therefore, in view of the above-mentioned circumstances, the present invention has an object to provide a vehicle rectifier mounting structure which is excellent in productivity and can more efficiently dissipate heat generated by the rectifier.

上述の目的を達成する為、本考案による車両用整流器の
取付構造においては、車両用整流器を構成する回路部品
を主表面にて担持した熱良導体からなる基板を、基板主
表面の周縁部に開口端面にて当接する両端開口筒状壁部
を有する枠部材をもって熱良導体からなる車体構成部材
に対して押圧し、基板の主裏面を車体部材に面接触させ
たことを特徴としている。
In order to achieve the above-mentioned object, in the mounting structure for a vehicle rectifier according to the present invention, a board made of a good thermal conductor carrying circuit components constituting the vehicle rectifier on the main surface is opened at the peripheral portion of the main surface of the board. It is characterized in that the frame member having the tubular wall portions with both ends opening abutting on the end face is pressed against the vehicle body component made of a good heat conductor to bring the main back surface of the substrate into surface contact with the vehicle body member.

実施例 以下、本考案を自動二輪車に適用した実施例について添
付図面を参照しつつ説明する。
Embodiment Hereinafter, an embodiment in which the present invention is applied to a motorcycle will be described with reference to the accompanying drawings.

第1図に示した様に、自動二輪車のシート1の下方等の
比較的風通しが良い位置に、整流器アッセンブリ2を取
り付ける為の台座3が配設されている。台座3は例えば
アルミ合金等の熱良導体から形成され、その外側面は平
滑に仕上げられており、フレーム5に溶接されている。
As shown in FIG. 1, a pedestal 3 for mounting the rectifier assembly 2 is arranged at a relatively well-ventilated position such as below the seat 1 of the motorcycle. The pedestal 3 is formed of a good thermal conductor such as aluminum alloy, and its outer surface is finished to be smooth and welded to the frame 5.

整流器アッセンブリは第2図に示した構造となってい
る。すなわち、整流作用及び電圧調整作用をなすハイブ
リッドIC6、ダイオード7、サイリスタ8、ダイオー
ド10等の回路部品は、銅箔パターン11が表面に形成
された熱良導体たるアルミ絶縁基板12上に担持されて
いる。基板12はその表面及び裏面が予め平滑に仕上げ
られた平板を打抜いて形成され、基板12の銅箔パター
ン11上の所定位置にそれぞれダイオード7、サイリス
タ8、ダイオード10、A端子13及びB端子15が半
田付けされている。基板12の主表面周縁部には枠部材
16が組み付けられる。枠部材16は鋼若しくは硬質プ
ラスチック等の剛性の高い材料から形成され、基板12
の表面に垂直で基板12に担持された回路部品を囲繞し
上面及び底面の開放された両端開口筒状壁部を有してい
る。
The rectifier assembly has the structure shown in FIG. That is, the circuit components such as the hybrid IC 6, the diode 7, the thyristor 8 and the diode 10, which perform the rectifying function and the voltage adjusting function, are carried on the aluminum insulating substrate 12 which is a good heat conductor on which the copper foil pattern 11 is formed. . The board 12 is formed by punching a flat plate whose front surface and back surface are finished in advance, and the diode 7, the thyristor 8, the diode 10, the A terminal 13 and the B terminal are provided at predetermined positions on the copper foil pattern 11 of the board 12, respectively. 15 is soldered. A frame member 16 is attached to the peripheral portion of the main surface of the substrate 12. The frame member 16 is formed of a highly rigid material such as steel or hard plastic, and
It surrounds the circuit components carried on the substrate 12 perpendicularly to the surface of and has a cylindrical wall portion with open upper and lower ends.

この枠部材16を基板12上に載置した後、第3図
(B)に示した様に、筒状壁部内側に樹脂17を流し込
んで回路部品の各端子の先端部が樹脂17によって隠れ
てしまわない程度に一旦モールドし、この上にハイブリ
ッドIC6を載置して樹脂17から突出したダイオード
7、サイリスタ8及びダイオード10の各端子7a,8
a,8b,10aとハイブリッドIC6の端子若しくは
枠部材16に固定されるカプラ18の端子間等の必要な
接続が第3図(A)に示した様に行なわれ、この上に更
に樹脂が流し込まれてハイブリッドIC6及び各端子が
完全に包埋されるようモールドされる。
After mounting the frame member 16 on the substrate 12, as shown in FIG. 3 (B), the resin 17 is poured into the inside of the tubular wall portion so that the tips of the terminals of the circuit component are hidden by the resin 17. Each of the terminals 7a, 8 of the diode 7, the thyristor 8 and the diode 10 which are molded so that they do not get stuck, and the hybrid IC 6 is placed on this and projected from the resin 17
Necessary connections such as a, 8b, 10a and the terminals of the hybrid IC 6 or the terminals of the coupler 18 fixed to the frame member 16 are made as shown in FIG. 3 (A), and the resin is further poured on this. Then, the hybrid IC 6 and each terminal are molded so as to be completely embedded.

図示した様に、枠部材16のフランジ部16a及び基板
12には車体への取り付け用のネジ20が挿通される孔
16b及び12bがそれぞれ穿設されている。一方、車
体フレームに取り付けられた台座3にはネジ20が螺合
するネジ穴が穿設されており、ネジ20を枠部材16及
び基板12の孔16b,12bに挿通してネジ穴に螺合
せしめ締め着けることにより、枠部材16をもって基板
12を台座3に対して押圧せしめることとなり、少なく
とも基板12の回路部品を担持した部分の裏面が台座3
に面接触せしめられるのである。
As shown in the figure, the flange portion 16a of the frame member 16 and the substrate 12 are provided with holes 16b and 12b, respectively, into which the screws 20 for attachment to the vehicle body are inserted. On the other hand, the pedestal 3 attached to the body frame is provided with a screw hole into which the screw 20 is screwed, and the screw 20 is inserted into the holes 16b and 12b of the frame member 16 and the substrate 12 and screwed into the screw hole. By tightly tightening, the board member 12 is pressed against the pedestal 3 by the frame member 16, and at least the back surface of the portion of the board 12 that carries the circuit component is pedestal 3
It is brought into surface contact with.

このように、熱を発生する回路部品を担持した基板12
を直接熱良導体からなる車体部材に面接触させることに
より、各回路部品から生じた熱は熱良導体からなる基板
12を介して速やかに台座3及びフレーム5等の車体部
材に伝達放散され、回路部品の加熱が防止されるのであ
る。
In this way, the substrate 12 carrying the circuit components that generate heat
By directly making surface contact with the vehicle body member made of a good thermal conductor, the heat generated from each circuit component is quickly transferred to and dissipated to the vehicle body member such as the pedestal 3 and the frame 5 through the substrate 12 made of a good thermal conductor. The heating of is prevented.

なお、上述した取付構造をにおいては、枠部材16によ
り基板12を車体部材たる台座3に剛的に押圧するの
で、基板12に設けられた2つの孔12b相互の間隔が
台座3のネジ穴相互間の間隔より大きい為に、若しく
は、回路部品の発熱により基板12が膨張して孔12b
相互の間隔が伸びてネジ穴相互間の間隔より大きくなっ
てしまった為に、第4図(A)に示した様に、基板12
が弯曲し基板12と台座3との間に隙間が生じるような
場合であっても、第4図(B)に示した様に、高剛性の
枠部材16による押圧によってこれを矯正し得、台座3
と基板12との面接触を確保し得るのである。
In the mounting structure described above, the frame member 16 rigidly presses the substrate 12 against the pedestal 3 that is a vehicle body member, so that the distance between the two holes 12b formed in the substrate 12 is different from that between the screw holes of the pedestal 3. The space between the holes 12b is larger than the space between them or the heat generated by the circuit components causes the substrate 12 to expand and the holes 12b.
Since the mutual distance is increased and becomes larger than the distance between the screw holes, as shown in FIG.
Even when the curved surface is curved and a gap is formed between the base plate 12 and the pedestal 3, as shown in FIG. 4 (B), this can be corrected by pressing with the frame member 16 having high rigidity. Pedestal 3
The surface contact between the substrate 12 and the substrate 12 can be ensured.

また、基板12は平板状に形成されているから、基板表
面と直角な方向にはある程度の柔軟性に有する。従っ
て、基板12が接触する台座3等の車体部材の表面を高
い平滑度をもって仕上げずとも基板12と車体部材との
面接触は確保されるので、車体部材側の加工が容易とな
る。
Further, since the substrate 12 is formed in a flat plate shape, it has some flexibility in the direction perpendicular to the substrate surface. Therefore, the surface contact between the substrate 12 and the vehicle body member is ensured without finishing the surface of the vehicle body member such as the pedestal 3 with which the substrate 12 comes into contact with a high degree of smoothness, which facilitates the processing on the vehicle body member side.

なお、車体への整流器アッセンブリの取り付けの際に
は、カプラ18の被水を避ける為カプラ18が枠部材1
6の下方側に位置するよう取り付けることが好ましい。
When the rectifier assembly is attached to the vehicle body, the coupler 18 is used to prevent the coupler 18 from getting wet.
It is preferable to mount it so as to be located on the lower side of 6.

上述した実施例においては、整流器を自動二輪車のシー
ト下方のフレームに溶接した台座に取り付けることとし
ているが、取り付け位置をこの位置に限定するものでは
なく、また、台座を用いることなく断面矩形のフレーム
パイプの外側面に直接基板12を接触させて取り付ける
こととしても良い。
In the embodiment described above, the rectifier is attached to the pedestal welded to the frame below the seat of the motorcycle, but the attachment position is not limited to this position, and the frame having a rectangular cross section without using the pedestal is used. The substrate 12 may be attached by directly contacting the outer surface of the pipe.

考案の効果 以上説明した様に、本考案による車両用整流器の取付構
造においては、車両用整流器を構成する回路部品を主表
面にて担持した熱良導体からなる基板を、基板主表面の
周縁部に開口端面にて当接する両端開口筒状壁部を有す
る枠部材をもって熱良導体からなる車体構成部材に対し
て押圧し、基板の主裏面を車体部材に面接触させた構成
となっているので、従来の取付構造のように一体成型後
にケースの底面を平滑に仕上げる必要がなく生産性に優
れている。また、自己発熱する整流器の回路部品を担持
した熱良導体からなる基板を直接熱良導体からなる車体
部材に接触させることとしているので、発生した熱を効
率良く放散させることができ、整流器の加熱を防止でき
る。
Effect of the Invention As described above, in the mounting structure of the vehicle rectifier according to the present invention, the substrate made of a good heat conductor carrying the circuit components constituting the vehicle rectifier on the main surface is provided on the peripheral portion of the main surface of the substrate. Since a frame member having a cylindrical wall portion with both ends opening that abuts on the opening end surface is pressed against a vehicle body constituent member made of a good heat conductor, the main back surface of the substrate is brought into surface contact with the vehicle body member. It does not require the bottom surface of the case to be smoothed after it is integrally molded, as in the mounting structure of, and has excellent productivity. In addition, since the board made of a good thermal conductor that carries the circuit components of the rectifier that self-heats is brought into direct contact with the car body member made of a good thermal conductor, the generated heat can be dissipated efficiently and the rectifier is prevented from heating. it can.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案による車両用整流器の取付構造が適用さ
れた自動二輪車の側面図、第2図は整流器アッセンブリ
の拡散分解図、第3図(A)は組立途中の整流器アッセ
ンブリの平面図、第3図(B)は第3図(A)のB−B
断面図、第4図(A)は枠部材を用いずに基板を台座に
取り付けた場合の断面図、第4図(B)の枠部材を用い
て基板を台座に押圧した場合の断面図である。 主要部分の符号の説明 3……台座 5……フレーム 6……ハイブリッドIC 7,10……ダイオード 8……サイリスタ 12……基板 16……枠部材
FIG. 1 is a side view of a motorcycle to which a vehicle rectifier mounting structure according to the present invention is applied, FIG. 2 is a diffusion exploded view of a rectifier assembly, and FIG. 3 (A) is a plan view of the rectifier assembly during assembly. FIG. 3 (B) is BB of FIG. 3 (A).
A cross-sectional view, FIG. 4A is a cross-sectional view when the substrate is attached to the pedestal without using a frame member, and a cross-sectional view when the substrate is pressed against the pedestal using the frame member in FIG. 4B. is there. Description of symbols of main parts 3 ... Pedestal 5 ... Frame 6 ... Hybrid IC 7, 10 ... Diode 8 ... Thyristor 12 ... Substrate 16 ... Frame member

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】車載発電機出力を整流して直流電圧を得る
車両用整流器を構成する回路部品を主表面にて担持する
基板を熱良導性絶縁材によって形成し、前記基板主表面
の周縁部に開口端面にて当接する両端開口筒状壁部を有
する枠部材によって前記基板を車体部材に対して押圧し
て前記基板の主裏面を前記車体部材に面接触させたこと
を特徴とする車両用整流器の取付構造。
1. A substrate having a main surface on which a circuit component constituting a vehicle rectifier for rectifying an on-vehicle generator output to obtain a direct current voltage is formed by a heat conductive insulating material, and a peripheral edge of the main surface of the substrate. A vehicle characterized by pressing the substrate against a vehicle body member by a frame member having both-ends open tubular wall portions that abut on the vehicle body at the opening end face to bring the main back surface of the substrate into surface contact with the vehicle body member. Rectifier mounting structure.
JP796388U 1988-01-25 1988-01-25 Vehicle rectifier mounting structure Expired - Lifetime JPH069577Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP796388U JPH069577Y2 (en) 1988-01-25 1988-01-25 Vehicle rectifier mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP796388U JPH069577Y2 (en) 1988-01-25 1988-01-25 Vehicle rectifier mounting structure

Publications (2)

Publication Number Publication Date
JPH01113571U JPH01113571U (en) 1989-07-31
JPH069577Y2 true JPH069577Y2 (en) 1994-03-09

Family

ID=31213419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP796388U Expired - Lifetime JPH069577Y2 (en) 1988-01-25 1988-01-25 Vehicle rectifier mounting structure

Country Status (1)

Country Link
JP (1) JPH069577Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19926756B4 (en) * 1998-06-12 2009-06-10 Shindengen Electric Mfg. Co. Ltd. Electronic circuit device and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19926756B4 (en) * 1998-06-12 2009-06-10 Shindengen Electric Mfg. Co. Ltd. Electronic circuit device and method of manufacturing the same

Also Published As

Publication number Publication date
JPH01113571U (en) 1989-07-31

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