JPH069592Y2 - Inverter device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an inverter device, and more particularly to a device using a plurality of switching elements of a main circuit side by side.

(Prior Art) Conventionally, as a switching element of a main circuit in an inverter device, a thyristor and a power transistor (GTR, MOS-
FET) etc. are used. Recently, module elements, such as power transistors, which have a plurality of packages in one package have been used. And conventionally, modularized element element (6IN1 type with 6 pieces)
However, with the increase in capacity, one modularized element cannot satisfy the function sufficiently, and a plurality of elements are used in parallel. At that time, the number of control signal terminals, input terminals, and output terminals is increased by the number of parallel connections. Therefore, if connections are carefully taken and the lengths of the respective wirings are not made uniform, signal imbalance may occur, or the increased number may result in weakness in noise.

For example, when using a MOS-FET for the switching element and using three module elements of 4 pieces (4IN1 type) to connect in parallel to double the current capacity, it was modularized as a heat sink in the past. Device (hereafter MOS-FET
(Represented by) is attached with three screws 3. The respective input terminals, output terminals, and control signal terminals are wired at the Faston terminals, or the wiring is directly soldered to the terminals. Then, as shown in FIG. 4, the substrate 10b and the MO
The S-FET2 is wired and attached. In this case, the mounting structure is as shown in FIG. 4 so that the wiring is as short as possible.
It should be wide between T and. When working further, the number of wires is increased by the number of times MOS = FET2,
(7 pieces x 3 pieces = 21 pieces for 3 MOS-FETs) Assembly is difficult and time-consuming. Then, as the number of wirings increases, there is a problem that it is more susceptible to noise.

Another example is Japanese Utility Model Laid-Open No. 60-167379, which discloses that after mounting a semiconductor product that requires heat dissipation on a printed wiring board and integrating them as shown in FIG. There is a structure that is fixed to the box. This is done by soldering a semiconductor that requires heat dissipation directly to the control circuit board.This is possible for semiconductor products with a small current capacity, but it has a large current capacity and is connected in parallel. When the capacitance is increased, it is very difficult to solder it to the control circuit board, and it is easily affected by noise due to a large current, and the control signal may malfunction to damage the element. In addition, a portion having a large current capacity needs to have a large pattern area and a large insulation distance, so that this portion occupies a large proportion of the area of the control circuit board. Therefore, it is necessary to increase the area of the entire substrate, which has a drawback that the entire inverter device becomes large.

(Problems to be Solved by the Invention) As described above, the above-mentioned two methods have a drawback that they are susceptible to noise due to an increase in wiring and an increase in current, which may cause damage to the element due to malfunction. Further, there is a demand for miniaturization when carrying or grounding, but this is difficult due to the large number of wirings or the expansion of the substrate area accompanying the increase in current capacity.

It is therefore an object of the present invention to provide an inverter device having a structure that is resistant to noise and can be downsized.

[Structure of the Invention] (Means for Solving the Problems) That is, according to the present invention, a plurality of modularized elements having an input terminal, an output terminal, and a control signal terminal are connected in parallel to exchange direct current with alternating current. In the inverter device, a through hole for inserting the input terminal and the output terminal is provided on the modularized element, and a through hole provided in a portion corresponding to a mounting screw of the modularized element for a control signal. It is characterized in that a board on which the circuit of (1) is printed is attached, and the control signal to each element is paralleled by the circuit on this board.

(Operation) In the case of such a configuration, the control signal becomes shorter, the number of lines also decreases, and the signal imbalance is eliminated by adjusting the length of the control signal pattern on the substrate to be uniform. , It is also strong against noise. Further, the input terminal and the output terminal, which have a large amount of current, are not provided on the substrate and are separately wired by forming holes, whereby the substrate area can be reduced, the influence of noise on the control signal can be eliminated, and the size can be reduced.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
In the figure, three MOS-FETs 2 are attached to the heat sink with screws 3, and holes for screw attachment, input terminals {(+) (-)}, and output terminals {(U), ( V),
(W)} is attached to the board having a hole together with the hole. This board 7 is provided with 10 gate drive signal lines (GU, GV,
GW, SU, SV, SW, GX, GY, GZ, S-) are connected to each other, and the wiring printed on the substrate 7 serves as a parallel signal.
In addition, this board 7 has 7 through-hole processed holes so that the gate signal terminals of each MOS-FET 2 can be fitted. Are connected.

FIG. 2 is a sectional view of FIG. 3 shows the configuration of the entire inverter device in which the control circuit board 10 is attached to the heat sink 1 via the spacer 9 in FIG.

This embodiment is an inverter device in which three MOS-FETs (4IN1 type) are used in parallel and the current capacity of the MOS-FET is doubled. Therefore, since the gate signal of each MOS-FET is seven, the total of three gate signals is 21.
However, by adopting the board according to the present invention, when the minimum necessary 10 pieces are taken out from the control circuit board 10 and connected to the connector on the board 7, the printed wiring of the board 7 causes the following signals to be applied to each gate signal terminal. Each signal line will be connected to. (GU → GU1, GU2, GV → GV
1 ・ GV2, GW → GW1 ・ GW2, SU → SU1 ・ S
U2, SV → SV1, SV2, GX → GX1, GX2,
GY → GY1 ・ GY2, GZ → GZ1 ・ GZ2, S- →
S- (U) / S- (V) / S- (W) Next, the distance between the control circuit board 10b and the MOS-FET 2 is set near the center of the board 10b in order to shorten the wiring of the conventional gate signal. Since the gate signal was taken, it was necessary to make it wide for the work. However, by adopting the substrate 7, the wiring for the gate signal is connected to the end of the substrate 7 as shown in FIG. Control circuit board 10b
It becomes possible to remarkably narrow the distance between the MOS-FET2 and the MOS-FET2. Therefore, the number of wires from the control circuit board 10b is reduced, and the wire length is shortened. Further, since the imbalance of the wiring length is eliminated by adjusting the pattern on the substrate 7, it becomes extremely resistant to noise.

In addition, the portions of the input terminals (+) (-) and the output terminals (U) (V) (W) through which a large amount of current flows are provided in the board 7 together with the holes for screwing. It has nothing to do with the above and can prevent the influence of noise due to this. The area of the substrate is very small because it is only the wiring of the gate signal.
In addition to shortening the interval of T2, it can be made very compact.

Furthermore, the control circuit board 10b and the MOS-FE are the same as before.
Since it is not necessary to wire many gate signals in a narrow space with T2, workability is also improved. Moreover, since the connector is attached to the end of the substrate T, the MOS-FET 2 is attached to the heat sink 1.
3 are mounted, the substrate 7 is mounted thereon, and the input terminals (+) (-) and the output terminals (U) (V) (W) are wired. After that, the control circuit board 10 is inserted through the spacer.
If a and 10b are attached and finally the control circuit board 10b and the board 7 are wired by the connector, the workability is greatly improved. When performing further inspection and repair, the control circuit part,
It is very easy to disassemble into MOS-FET parts.

In the above-described embodiment, the case of the MOS-FET has been described, but the same can be said for the GTR in addition to the MOS-FET.

If the number of elements connected in parallel is increased, the current capacity will double and
However, even in such a case, the number of connections with the control circuit board 10 can be reduced to ten, which is the same minimum, and the constants of the control circuit can be slightly changed. Though conceivable, the same effect can be obtained. Further, since the substrate is used effectively, it is possible to mount components on this substrate to achieve miniaturization.

[Advantage of the Invention] According to the present invention, when a plurality of modularized elements are arranged in parallel and connected in parallel, only the input signal, the output terminal, and the wiring for the control signal having holes for screw mounting are printed. Since the board is directly attached, the influence of noise on the control signal due to large current is eliminated, the number of signal lines is reduced and the length is shortened, and the imbalance of wiring can be adjusted on the printed board, further reducing noise. Can be strong,
It is possible to prevent damage to the element.

[Brief description of drawings]

FIG. 1 is a view showing a mounting state of a substrate according to the present invention and a plurality of arranged module elements, FIG. 2 is a sectional view of FIG. 1, FIG. 3 is a partial view of an essential part of FIG. Fig. 4 is a diagram corresponding to Fig. 2 of the conventional example, Fig. 5 is another element mounting structure diagram of the conventional example, and Fig. 6 is a circuit diagram when three 4IN1 type MOS-FETs are used in parallel connection. Indicates. 1 ... Heat sink, 2 ... Modular element, 3 ... Screw, 4 ... Faston terminal, 5 ... Input / output wiring, 6 ... Control signal wiring, 7 ... Board using control signal wiring, 8 ... Connector, 9 ... Spacer, 10 ... Control circuit board.

Claims (1)

[Scope of utility model registration request] 1. An inverter device for exchanging direct current into alternating current using a plurality of modularized elements having an input terminal, an output terminal and a control signal terminal connected in parallel, wherein the input terminal is provided on the modularized element. And a through hole through which the output terminal is inserted and a through hole provided in a portion corresponding to the mounting screw of the modularized element, and a circuit on which a circuit for a control signal is printed is attached. An inverter device characterized in that control signals to each element are arranged in parallel.