JPH0697092A - Holding means for board - Google Patents
Holding means for boardInfo
- Publication number
- JPH0697092A JPH0697092A JP26969592A JP26969592A JPH0697092A JP H0697092 A JPH0697092 A JP H0697092A JP 26969592 A JP26969592 A JP 26969592A JP 26969592 A JP26969592 A JP 26969592A JP H0697092 A JPH0697092 A JP H0697092A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- flexible
- flexible substrate
- supporting
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 123
- 238000000034 method Methods 0.000 description 14
- 239000007787 solid Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の利用分野】本発明は可撓性を持つ基板材料上に
被膜形成等の処理を行う際の基板を保持する手段に関す
る。特に固体基板に代わって可撓性を持つ有機フィルム
を使用して太陽電池等を形成する際に必要となる基板保
持手段に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a means for holding a substrate during processing such as film formation on a flexible substrate material. In particular, the present invention relates to a substrate holding means required when forming a solar cell or the like using a flexible organic film instead of a solid substrate.
【０００２】[0002]
【従来の技術】電子・電気部品等の小型化、薄型化さら
には軽量化への市場の要求が高まり、これら部品を構成
する材料も多種多様なものが使用され始めている。太陽
電池等の光電変換装置もこの例外ではなく、様々な仕様
の装置が提案されている。この中で、基板材料として可
撓性（フレキシブル）を持つ有機フィルムや金属薄板を
使った薄型で軽量のものが、他の電気製品、産業機械製
品等への応用を前提として、注目されはじめている。2. Description of the Related Art There is an increasing demand in the market for miniaturization, thinning, and weight reduction of electronic / electrical parts and the like, and a wide variety of materials are being used to form these parts. Photoelectric conversion devices such as solar cells are no exception to this, and devices with various specifications have been proposed. Among these, thin and lightweight products that use flexible organic films and thin metal plates as substrate materials have begun to be noticed on the assumption that they are applied to other electrical products, industrial machinery products, etc. .
【０００３】従来では、このような可撓性を持つ材料を
基板材料として光電変換装置を作製する場合は基板のハ
ンドリングが問題となっていた。特に、化学的気相法等
によってこの基板上に半導体被膜等を形成する場合に基
板の可撓性が問題となる。そのため、このような基板を
使用する際には、その生産設備を他の固体基板を使用す
る際とは異なり、特別に基板を保持する手段が必要とさ
れていた。Conventionally, when a photoelectric conversion device is manufactured using such a flexible material as a substrate material, handling of the substrate has been a problem. In particular, when forming a semiconductor film or the like on this substrate by a chemical vapor deposition method or the like, the flexibility of the substrate becomes a problem. Therefore, when such a substrate is used, unlike the case where other solid substrates are used in the production equipment, a means for holding the substrate is particularly required.
【０００４】この保持する方法としては、ロール・ツー
・ロールと呼ばれる方式が一般に広く利用されていた。
このロール・ツー・ロール方式とは、可撓性基板をロー
ルに巻いた状態から引き出して、基板処理装置あるいは
基板処理室に可撓性基板を供給し、処理を行なった後に
再びロールに巻き取る方式の基板の保持および供給手段
のことである。A method called roll-to-roll has generally been widely used as a method of holding this.
In this roll-to-roll method, a flexible substrate is pulled out from a rolled state, the flexible substrate is supplied to a substrate processing apparatus or a substrate processing chamber, and after processing, the flexible substrate is wound again on a roll. Type substrate holding and supplying means.
【０００５】[0005]
【発明が解決しようとする課題】前述のようなロール・
ツー・ロール方式を採用する場合、一般的な固体基板を
使用した作製装置を使用することはできず、新たにこの
方式専用の装置および生産ラインを設ける必要がある。
製品のコストを考慮した場合、生産設備投資は極力少な
く抑える必要があるため、基板の種類が異なっても、共
通の製造設備で生産できることが好ましい。[Problems to be Solved by the Invention]
When the two-roll method is adopted, a general manufacturing apparatus using a solid substrate cannot be used, and it is necessary to newly provide an apparatus and a production line dedicated to this method.
Considering the cost of the product, it is necessary to keep the investment in production equipment as low as possible. Therefore, it is preferable that the production can be performed with the same production equipment even if the types of substrates are different.
【０００６】逆に、固体基板と同じ製造設備を使用しよ
うとした場合、可撓性基板を所定の寸法に切断し、基板
支持板に張りつけたり、固体基板上に樹脂層を形成し
て、被膜形成等の処理を行なった後に固体基板より樹脂
層を剥がして、フィルム化する等の方法が考えられる
が、何れの場合も基板ハンドリングに難点があり、非常
に作業性が悪かった。On the contrary, when it is attempted to use the same manufacturing equipment as the solid substrate, the flexible substrate is cut into a predetermined size and attached to a substrate supporting plate, or a resin layer is formed on the solid substrate to form a film. Although a method of peeling the resin layer from the solid substrate to form a film after the treatment such as forming is conceivable, in each case, there was a difficulty in handling the substrate and the workability was extremely poor.
【０００７】さらにまた、半導体膜をこれら基板上に形
成する場合には、被形成基板を加熱する必要がある。前
述のように可撓性基板を所定の基板寸法に切断して利用
する場合、この加熱処理によって、可撓性基板に反りや
カールが発生し、裏面への成膜や基板の反りのため、膜
の剥離等が発生する問題があった。Furthermore, when forming a semiconductor film on these substrates, it is necessary to heat the substrate to be formed. As described above, when the flexible substrate is cut to a predetermined substrate size and used, the heat treatment causes warping or curling of the flexible substrate, which causes film formation on the back surface or warpage of the substrate. There is a problem that peeling of the film occurs.
【０００８】また、ロール・ツー・ロール方式にて、複
数の基板処理を連続して行なう際には、基板が各処理領
域に渡って繋がっているために、各処理間の十分な遮蔽
を行なうことができず、不純物の混入等の問題により、
性能および信頼性の低下という問題が発生していた。Further, when a plurality of substrates are continuously processed by the roll-to-roll method, since the substrates are connected over the respective processing regions, sufficient shielding between the respective processes is performed. Because of problems such as contamination of impurities,
There has been a problem of reduced performance and reliability.
【０００９】[0009]
【課題を解決するための手段】本発明は上記課題を解決
するものであり、可撓性基板を一般的な固体基板と同様
に扱えるような、基板保持手段を提供するものである。
可撓性を持つ基板の少なくとも一部を一対の支持枠によ
り挟持して可撓性基板を前記支持枠により保持し、前記
支持枠と可撓性基板とを一体物して扱い、基板のハンド
リング等を行なうことで固体基板と同様の扱いをするも
のである。SUMMARY OF THE INVENTION The present invention solves the above problems and provides a substrate holding means that can handle a flexible substrate in the same manner as a general solid substrate.
At least a part of a flexible substrate is sandwiched by a pair of support frames to hold the flexible substrate by the support frame, and the support frame and the flexible substrate are handled as an integrated body for handling the substrate. The same treatment as the solid substrate is performed by performing the above.
【００１０】また、２枚の可撓性を持つ基板を重ね合わ
せ、その一部を一対の支持枠により挟持して可撓性基板
を前記支持枠により保持し、前記支持枠と可撓性基板と
を一体物して扱い、基板のハンドリング等を行なうこと
で一般的な固体基板と同様に扱えるような、基板保持手
段である。Further, two flexible substrates are superposed, a part of them is sandwiched by a pair of support frames to hold the flexible substrate by the support frame, and the support frame and the flexible substrate are held. It is a substrate holding means that can be handled in the same manner as a general solid substrate by handling and as a unit and handling the substrate.
【００１１】可撓性の基板の少なくとも一部を支持枠に
より保持する方法としては、図２にその部分の拡大概略
図を示している。図２（Ａ）は一対の支持枠によって、
２枚の重ね合わさった可撓性基板を保持している例であ
る。可撓性基板１に孔をあけその孔に対応する部分に支
持枠の一方２１からピン２３を通して、可撓性基板１と
支持枠２１との位置を合わせ、他方の支持枠２２と一方
の挟み板２１とを螺子あるいはクランプ等で固定して、
可撓性基板を挟持する方法を示している。As a method of holding at least a part of a flexible substrate by a support frame, FIG. 2 shows an enlarged schematic view of that part. FIG. 2A shows a pair of support frames,
This is an example of holding two superposed flexible substrates. A hole is formed in the flexible substrate 1 and a pin 23 is inserted from one of the support frames 21 to a portion corresponding to the hole, the flexible substrate 1 and the support frame 21 are aligned with each other, and the other support frame 22 and one of the sandwiches are sandwiched. Fix the plate 21 with screws or clamps,
A method of sandwiching a flexible substrate is shown.
【００１２】図２（Ｂ）は２つの支持枠２１、２２に各
々対応する位置に凹部２５あるいは凸部２６を設け、可
撓性基板１と支持枠２１、２２との位置を合わせ、両方
の挟み板で挟み込み、これらをクランプ２７等で固定し
て、可撓性基板を挟持する方法を示している。上記
（Ａ）および（Ｂ）は何れも支持枠の一部分のみを拡大
して記載したが、実際には基板の周囲付近を全て支持枠
で固定している。In FIG. 2B, a concave portion 25 or a convex portion 26 is provided at a position corresponding to each of the two support frames 21 and 22, and the flexible substrate 1 and the support frames 21 and 22 are aligned with each other. A method is shown in which a flexible board is sandwiched by sandwiching the sandwiching plates and fixing them with a clamp 27 or the like. In both (A) and (B), only a part of the support frame is enlarged and described, but in reality, the periphery of the substrate is entirely fixed by the support frame.
【００１３】図２（Ｃ）は２つの支持枠２１、２２のあ
いだに挟まれる２枚の可撓性基板間に背面板２８を設け
た例である。このようにした場合、支持枠２１および２
２は可撓性基板の外形と相似の形状をしている必要はな
く、その一部のみを押さえるようになっていればよい。
例えば、基板の外形が４角形の場合、この支持枠は一方
の面で２本の棒状のものであってもよい。この場合に
は、支持枠２１および２２により可撓性基板１が背面板
２８に固定されていると表現することもできる。FIG. 2C shows an example in which a back plate 28 is provided between two flexible substrates sandwiched between the two support frames 21 and 22. In this case, the support frames 21 and 2
2 does not need to have a shape similar to the outer shape of the flexible substrate, and it suffices to hold only a part of it.
For example, when the substrate has a quadrangular outer shape, the support frame may have two rods on one surface. In this case, it can be said that the flexible substrate 1 is fixed to the back plate 28 by the support frames 21 and 22.
【００１４】上記のような可撓性基板の保持方法以外に
も様々な構造が使用可能である。また、通常使用される
可撓性基板の外形は４角形が使用されるこのような場
合、できるだけ、４角形と相似の形状の支持枠で挟持
し、さらにこの支持枠内に処理が施される部分に該当す
る窓が形成されていればよい。しかしながら特にこの構
成に限定されることなく、広い面にわたって基板に張力
を与えることができるものであれば、その他の構成でも
構わない。当然ながら、基板の外形は４辺形に限定され
ることはない。Various structures can be used other than the method of holding the flexible substrate as described above. In addition, in the case where the outer shape of the flexible substrate that is normally used is a quadrangle, in such a case, it is sandwiched between support frames having a shape similar to that of the quadrangle as much as possible, and further processing is performed in this support frame. It suffices if a window corresponding to the portion is formed. However, the structure is not particularly limited to this, and any other structure may be used as long as the substrate can be tensioned over a wide surface. Of course, the outer shape of the substrate is not limited to the quadrilateral.
【００１５】このような構成の基板支持枠２は従来の固
体基板と全く同様にあつかうことが可能である。例え
ば、バッチ式の基板処理を行なう場合には、図３に示す
ような、基板コンテナー３中にこの可撓性基板１を保持
した基板支持枠２を複数枚並べて、鯉基板の場合と全く
同様に処理することができる。そのため、処理装置も固
体基板の場合と同様のものを共通に使用することができ
る。The substrate supporting frame 2 having such a structure can be used in exactly the same manner as a conventional solid substrate. For example, when performing batch type substrate processing, a plurality of substrate supporting frames 2 holding the flexible substrate 1 are arranged in a substrate container 3 as shown in FIG. Can be processed. Therefore, the same processing apparatus as that for the solid substrate can be commonly used.
【００１６】この基板支持枠の材質としては、金属、有
機樹脂あるいはセラミックス等のほぼどのような材料で
も使用可能であるが、基板を保持した後に行われる処
理、あるいは保管の雰囲気によって、この支持部が変
形、損傷あるいは溶解されないような材料を選んで使用
することが好ましい。特に加熱あるいは低温での処理
等、可撓性基板が伸縮するような状況下で使用する場合
には、できるだけ基板と同じかあるいは基板とよく似た
傾向を示す材料を選ぶことが好ましい。例えば、可撓性
基板が有機樹脂の場合は支持枠の材料として、同じ有機
樹脂である、弗素樹脂の材料を使用する等の配慮があれ
ばより基板保持の状態を良好に行うことができる。しか
しながら、加熱処理が低温であり、基板の伸縮の程度が
少ない場合にはステンレス等の金属でも十分使用でき、
こちらのほうが、工作性に富んでおり、生産の立場から
は良好な基板支持枠である。As the material of the substrate supporting frame, almost any material such as metal, organic resin or ceramics can be used. However, depending on the atmosphere to be carried out after the substrate is held or stored, the supporting portion can be used. It is preferable to select and use a material that does not deform, damage, or dissolve. Especially when used in a situation in which the flexible substrate expands and contracts, such as heating or low-temperature treatment, it is preferable to select a material that exhibits the same tendency as the substrate or a similar tendency to the substrate as much as possible. For example, when the flexible substrate is an organic resin, the substrate can be held more favorably if consideration is given to using the same organic resin or a fluororesin material as the material of the support frame. However, when the heat treatment is performed at a low temperature and the expansion and contraction of the substrate is small, even a metal such as stainless steel can be sufficiently used,
This is more workable and is a good substrate support frame from a production standpoint.
【００１７】[0017]
『実施例１』 図１に本実施例の基板保持手段を示す。
厚さ２００μｍで２００ｍｍ×２６０ｍｍの寸法のＰＥ
Ｔフィルムを可撓性の基板１として、これを２枚重合わ
せて、支持枠２に保持してある。この保持方法は図２の
（Ａ）の方法を採用して、固定してある。この支持枠２
は窓４があけられており、この窓の部分から可撓性基板
が露出しており、基板処理等が施される。この支持枠２
の材料はテトラフルオロエチレン樹脂で構成し、３００
℃程度の温度までは加熱処理可能となっている。Example 1 FIG. 1 shows a substrate holding means of this example.
PE with a thickness of 200 μm and dimensions of 200 mm x 260 mm
A T-film is used as a flexible substrate 1, two of them are superposed and held on a support frame 2. This holding method is fixed by using the method shown in FIG. This support frame 2
The window 4 is opened, the flexible substrate is exposed from this window portion, and substrate processing or the like is performed. This support frame 2
The material is composed of tetrafluoroethylene resin, 300
Heat treatment is possible up to a temperature of about ℃.
【００１８】このような支持枠２で固定された可撓性基
板１を図３のような基板コンテナー３に５枚装着し、一
度に１０枚の可撓性基板１を処理することが出来た。こ
のように、基板支持枠２がコンテナー３によって、一定
の位置に固定され、基板の間隔を一定に保持すること
で、従来の固体基板同様の扱いで基板の移動、搬送およ
び処理を行うことができる。Five flexible substrates 1 fixed by such a supporting frame 2 were mounted in a substrate container 3 as shown in FIG. 3, and 10 flexible substrates 1 could be processed at a time. . In this way, the substrate support frame 2 is fixed at a fixed position by the container 3 and the distance between the substrates is kept constant, so that the substrate can be moved, transported and processed in the same manner as a conventional solid substrate. it can.
【００１９】『実施例２』図２に本実施例の基板保持手
段を示す。厚さ２５０μｍで２００ｍｍ×２６０ｍｍの
寸法のＰＥＴフィルムを可撓性の基板１として、これを
２枚、背面板２８の両面に重ね合わせている。この保持
方法は図２の（Ｂ）の方法を採用して、固定してある。[Second Embodiment] FIG. 2 shows a substrate holding means of the present embodiment. A PET film having a thickness of 250 μm and a size of 200 mm × 260 mm is used as the flexible substrate 1, and two pieces of the PET film are laminated on both surfaces of the back plate 28. This holding method is fixed by adopting the method of FIG. 2 (B).
【００２０】このように背面板２８に可撓性基板１を重
ね合わせた場合、この基板と背面板とを押さえる支持枠
２１および２２は可撓性基板１の外形周囲を全て押さえ
る必要は無く、基板のたわみが発生しなけば、すくなく
とも一部分をおさえるだけでよい。本実施例では、四角
形の基板に対して、３辺を押さえるためにコの字型の支
持枠２１および２２を使用し、背面板に可撓性基板を固
定した。When the flexible substrate 1 is superposed on the back plate 28 as described above, it is not necessary for the support frames 21 and 22 for holding this substrate and the back plate to hold the entire outer periphery of the flexible substrate 1. If the board does not bend, at least a part of it will be suppressed. In the present embodiment, the U-shaped support frames 21 and 22 are used to press the three sides of the rectangular substrate, and the flexible substrate is fixed to the back plate.
【００２１】本実施例の場合、基板のハンドリングは実
施例１とはことなり、基板支持枠を固定して行なうので
はなく、背面板２８を固定して行なう事になる、そのた
め、図３のような基板コンテナー３に固定するさいに
は、基板コンテナー側に一対の爪を設けこの爪によって
構成される溝に背面板２８を挿入することで、可撓性基
板を保持することができる。In the case of this embodiment, unlike the first embodiment, the handling of the substrate is performed by fixing the back plate 28 instead of fixing the substrate supporting frame. Therefore, in FIG. When fixing to such a substrate container 3, a flexible substrate can be held by providing a pair of claws on the substrate container side and inserting the back plate 28 into the groove formed by these claws.
【００２２】[0022]
【発明の効果】本発明により、基板支持部を固定するだ
けで、可撓性基板はそり、曲げまたはたわみのない状態
で保持できるようになり、従来から使用されていた固体
基板と同様の基板搬送、処理を行うことができ、製造設
備の共通化ができるようになった。According to the present invention, the flexible substrate can be held without warping, bending or bending by simply fixing the substrate supporting portion, and a substrate similar to the solid substrate conventionally used can be obtained. It can be transported and processed, and the manufacturing equipment can be shared.
【図１】本発明の基板保持手段の一例を示すFIG. 1 shows an example of a substrate holding means of the present invention.
【図２】本発明の基板保持手段の他の例を示すFIG. 2 shows another example of the substrate holding means of the present invention.
【図３】本発明の基板保持手段の応用例を示す。FIG. 3 shows an application example of the substrate holding means of the present invention.
フロントページの続き (72)発明者 篠原 久人 東京都中央区日本橋一丁目13番１号 ティ ーディーケイ株式会社内 (72)発明者 阿部 雅芳 東京都中央区日本橋一丁目13番１号 ティ ーディーケイ株式会社内Front Page Continuation (72) Inventor Hisato Shinohara 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Masayoshi Abe 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation Within
Claims (3)
の支持枠により挟持して可撓性基板を前記支持枠により
保持し、前記支持枠と可撓性基板とを一体物して扱い、
基板のハンドリング等を行なうことを特徴とする基板の
保持手段。1. A flexible substrate is sandwiched between a pair of supporting frames to hold the flexible substrate by the supporting frame, and the supporting frame and the flexible substrate are integrally formed. Treat
A substrate holding means for handling a substrate and the like.
方は前記可撓性基板の被処理面積以上の大きさの窓を有
する事を特徴とする基板の保持手段。2. The substrate holding means according to claim 1, wherein at least one of the supporting frames has a window having a size larger than an area to be processed of the flexible substrate.
の一部を一対の支持枠により挟持して可撓性基板を前記
支持枠により保持し、前記支持枠と可撓性基板とを一体
物して扱い、基板のハンドリング等を行なうことを特徴
とする基板の保持手段。3. A flexible substrate is overlapped with two flexible substrates, a part of which is sandwiched by a pair of support frames to hold the flexible substrate by the support frame, and the support frame and the flexible substrate. A substrate holding means characterized in that the substrate and the like are handled as a single body to handle the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26969592A JP3126828B2 (en) | 1992-09-11 | 1992-09-11 | Method for holding substrate and method for manufacturing photoelectric conversion device using the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26969592A JP3126828B2 (en) | 1992-09-11 | 1992-09-11 | Method for holding substrate and method for manufacturing photoelectric conversion device using the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0697092A true JPH0697092A (en) | 1994-04-08 |
| JP3126828B2 JP3126828B2 (en) | 2001-01-22 |
Family
ID=17475905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26969592A Expired - Lifetime JP3126828B2 (en) | 1992-09-11 | 1992-09-11 | Method for holding substrate and method for manufacturing photoelectric conversion device using the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3126828B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010126793A (en) * | 2008-11-28 | 2010-06-10 | Toppan Printing Co Ltd | Method and apparatus for forming film |
| US7834451B2 (en) | 2005-08-31 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Film tray for fabricating flexible display |
| CN104465668A (en) * | 2014-12-02 | 2015-03-25 | 昆山国显光电有限公司 | Flexible display device and manufacturing method thereof |
-
1992
- 1992-09-11 JP JP26969592A patent/JP3126828B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7834451B2 (en) | 2005-08-31 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Film tray for fabricating flexible display |
| JP2010126793A (en) * | 2008-11-28 | 2010-06-10 | Toppan Printing Co Ltd | Method and apparatus for forming film |
| CN104465668A (en) * | 2014-12-02 | 2015-03-25 | 昆山国显光电有限公司 | Flexible display device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3126828B2 (en) | 2001-01-22 |
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