JPH0697113A - Vacuum processing device - Google Patents

Abstract

(57) [Summary] [Construction] In order to improve the efficiency of the cleaning work inside the vacuum processing equipment, the installation angle of the side wall of the vacuum container is set to 90 ° or more. It is possible to avoid concentrating on the inside of the container and improve the workability of cleaning the inside of the container. [Effect] By setting the side wall mounting angle to 90 ° or more,
The workability of cleaning inside the container is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus,
In particular, the present invention relates to a vacuum processing apparatus suitable for cleaning workability.

[0002]

2. Description of the Related Art A conventional device is disclosed in, for example, Japanese Patent Laid-Open No. 62-14.
As described in Japanese Patent No. 2791, the side wall of the processing chamber was perpendicular to the bottom plate. That is, as shown in FIG. 2, it has been difficult to perform cleaning for removing foreign matters accumulated at the angle B.

[0003]

In the conventional apparatus, since the side wall mounting angle is θ = 90 °, dust and the like adhering to the side wall portion is accumulated on the lower side corner of the side wall and is difficult to remove. was there.

An object of the present invention is to provide a vacuum processing apparatus for preventing dust attached to and detached from the side wall from being concentrated on a part of the inside of the apparatus and improving the efficiency of the cleaning operation inside the container. Especially.

[0005]

In order to achieve the above object, the side wall attachment angle of the vacuum vessel is set to 90 ° or more, so that when the side wall adhered matter is separated, it is prevented from concentrating on one place of the apparatus. And the workability of cleaning the inside of the container is improved.

[0006]

The function of the present invention will be described below.

[0007] The side wall mounting angle θ, the side wall portion of the vacuum vessel mounted at θ> 90 ° contributes to prevent the accumulated dust or the like from staying between the side wall portion and the bottom surface portion. Further, when cleaning the vacuum container, it is easy to clean from the upper portion, and the dust that has peeled off is easily removed as in the above case.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 schematically shows a vacuum processing apparatus according to the present invention.

In FIG. 1, a buffer chamber b is provided with various processing chambers including an etching chamber, and wafers can pass through the processing chambers by a transfer device (not shown). For example, the etching chamber is provided in a part of the buffer chamber, and during the etching process, the gate valve 3 is raised in the buffer chamber to separate the etching chamber and allow the gas to flow in and exhaust the plasma process. When the processing is completed, the gate valve 3 is lowered and the processed wafer is transferred again into the buffer chamber. Further, the reactive products generated by the etching are accumulated in the etching chamber, but depending on the case, they may be transported in the buffer chamber while being attached to the wafer.
As the number of processed products increases, the number of reactive products in the buffer chamber also increases. Further, when the wafer is transferred, the wafer may be cracked due to the trouble of the apparatus, and in either case, the cleaning of the buffer chamber is required. In general cleaning, cleaning with a vacuum (cleaning machine) and wiping with alcohol are mainly mentioned, but it is not easy to clean the part of B in the case of the conventional structure shown in B of FIG. It was However, as shown in part A of FIG.
Make an angle (θ) of 0 ° or more. The workability of cleaning is improved by making the angle larger than the conventional one.
As the angle (θ) between the bottom plate 5 and the side wall plate 6 exceeds 100 °, the workability is further improved as θ increases.

Of course, the workability of cleaning is further improved by rounding the joint between the bottom plate 5 and the side wall plate 6.

A specific embodiment of the present invention will be described in detail with reference to FIGS.

FIG. 1 is a sectional view showing the structure of a vacuum processing apparatus according to the present invention.

The vacuum processing chamber for processing the object is separated from the atmosphere by the quartz bell jar 1. In addition, the buffer chamber open plate 4, side wall plate 6, bottom plate 5,
Is separated from the atmosphere like the vacuum processing chamber.
The vacuum location is constantly maintained in a depressurized state by vacuum pumps 7 and 8. The object to be processed is placed on the electrode 2 by a transfer device (not shown), and the up / down mechanism 9 for the gate valve is used.
As a result, the gate valve 3 rises, and the bell jar 1 and the gate valve 3 make only the processing chamber independent. A gas is introduced into the processing chamber by a gas introduction mechanism (not shown), and a wafer placed on the electrode is processed by a plasma generation mechanism (not shown).

The superiority of the device having such a configuration will be described in comparison with the configuration of the conventional device shown in FIG.

Conventional Structure In FIG. 2, the dust adhering to the side wall was accumulated at the corner B between the side wall and the bottom of the peeling rear side. By making the joint portion such as the side wall portion and the bottom portion θ> 90 ° and making the joint portion round, it is possible to prevent the dust adhering to the side wall portion from staying in the joint portion when detached or separated. Further, even during the cleaning operation, the peeled material can be removed without accumulating on the bonded portion, so that the workability is improved.

[0016]

As described above, according to the present invention, in the vacuum processing apparatus for processing a semiconductor device, the vacuum processing apparatus having a small amount of dust generation and good cleaning workability can be obtained by the structure in which dust does not stay.

Indirectly, it has the effect of reducing the amount of dust generation that is a problem during semiconductor device processing, and improving the product yield.

Further, it is expected that the cleaning work time can be shortened.

[Brief description of drawings]

FIG. 1 is a sectional view of a vacuum processing apparatus according to an embodiment of the present invention.

FIG. 2 is a structural diagram of a conventional vacuum processing apparatus.

[Explanation of symbols]

1 ... Quartz bell jar, 2 ... Electrode, 3 ... Gate valve, 4
... buffer chamber plate, 5 ... bottom plate, 6 ... side wall plate, 7, 8 ... vacuum pump, 9 ... vertical mechanism for gate valve.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fumio Shimizu 794 Azuma Higashitoyo, Kudamatsu City, Yamaguchi Prefecture Hitachi Ltd. Kasado Plant

Claims (1)

[Claims] 1. A vacuum processing apparatus comprising a vacuum container having a vacuum exhaust hole, wherein a side wall member forming the vacuum container has a wall-to-wall mounting angle of 90 ° or more.