JPH0697338A - Electronic device - Google Patents

Abstract

(57) [Abstract] [Purpose] In a liquid-cooled electronic device, it saves installation space, ensures the same installability as conventional air-cooled electronic devices, shortens the installation work time, and downsizes the pump. Improve reliability against refrigerant leakage or pipe corrosion. [Structure] An electronic circuit housing 1 is configured to have an L-shaped cross section, and a liquid refrigerant cooling housing 2 for cooling a liquid refrigerant is connected and fitted to an electronic circuit housing 1 formed in the L shape by a connecting tool 62. Then, the whole has a rectangular parallelepiped-shaped integral structure. Then, the liquid refrigerant cooling casing 2
The heat exchanger 28, the fan 38, the pump 32, the refrigerant purity maintaining device 32, and other cooling devices for cooling the heat-generating electronic components 20 are housed in the.
The heat-generating electronic component 20 mounted on the substrate 22 is cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention has a heat-generating electronic component,
The present invention relates to an electronic device that cools this heat-generating electronic component using a liquid coolant, and a cooling device that mounts the electronic device.

[0002]

2. Description of the Related Art Conventionally, as a means for cooling an integrated circuit or an integrated circuit unit mounted on a circuit board such as a printed wiring board or a ceramic board, an air cooling system by forced convection has been widely adopted. However, in recent years, due to the increase in the degree of integration of the device itself and the improvement in the mounting density of the device, the heat generation density has become extremely high, and the air-cooling method is no longer sufficient.

Therefore, for example, NEC Technical Report Vol39,
The liquid cooling system as seen in No. 1 (1986), pages 40 to 41, has come to be adopted. A conventional electronic device adopting this liquid cooling method will be described with reference to FIGS. 8 and 9.

As shown in FIG. 8, the electronic device includes a plurality of electronic circuit casings 1 on which various integrated circuits and the like are mounted, and a device 1 for absorbing heat from the integrated circuits and cooling the same. It is composed of a liquid refrigerant cooling case 2 of a table.

In the liquid refrigerant cooling casing 2, as shown in FIG. 9, one of a primary refrigerant circulation line in which CFC as a primary refrigerant circulates and a secondary refrigerant circulation line in which water as a secondary refrigerant circulates And a section are provided.

In the primary refrigerant circulation line, a compressor 10 for compressing CFCs, a condenser 11, a heat exchanger 13 for exchanging heat between CFCs and water, and a CFC piping 1 for connecting them.
2 and are provided.

In the secondary refrigerant circulation line in the liquid refrigerant cooling casing 2, a tank 8 for absorbing a volume change of water, a pump 7 for pumping the water under pressure, and a water pipe 9 for connecting them. And are provided.

As shown in FIG. 9, the electronic circuit housing 1 includes an electronic circuit module 4 having a plurality of integrated circuits provided on a substrate.
It has a cooling jacket 5 for cooling and a water pipe 6 for supplying and discharging water to and from the cooling jacket 5.

The water pipe 6 of the electronic circuit casing 1 and the water pipe 9 of the liquid refrigerant cooling casing 2 are connected to each other by a flexible water pipe 3.

Electronic circuit module 4 with cooling jacket 5
The water that has been heated by exchanging heat with is introduced into the liquid refrigerant cooling casing 2 through the water pipe 6 and the flexible water pipe 3.
In the liquid refrigerant cooling housing 2, the warm water is cooled by exchanging heat with the chlorofluorocarbon in the heat exchanger 13 of the secondary refrigerant circulation line, pressurized by the pump 7, and cooled again by the cooling jacket of the electronic circuit housing 1. Guided within 5.

[0011]

The liquid cooling method is remarkably improved in cooling capacity as compared with the air cooling method, and is suitable for cooling a large electronic device. However, recently,
Since the heat generation density of the small electronic devices has risen and is becoming equivalent to that of the large electronic devices, some of them have adopted the same liquid cooling method as those of the large electronic devices.

However, if the liquid cooling system is adopted in the medium / small electronic device and the electronic circuit housing and the liquid refrigerant cooling housing are separately installed as in the large electronic device, the following problems occur. There is.

(1) Space saving is an important performance factor for small and medium-sized electronic devices that are often installed in general offices. However, the configuration in which the electronic circuit housing and the liquid refrigerant cooling housing are separate bodies is extremely disadvantageous in order to save installation space.

(2) In conventional electronic devices, the air-cooling method by forced convection is often adopted. In the case of this air cooling method, air is cooled by a blower or the like installed in an electronic circuit housing, so that the electronic device is composed of one housing. When a user replaces a conventional air-cooled electronic device with a liquid-cooled electronic device, the layout in the installation room becomes difficult if the electronic circuit housing and the liquid-refrigerant cooling housing are separated. In order to install the pipe between the circuit case and the liquid refrigerant cooling case under the floor, it is necessary to perform floor raising work in the general office. That is, in the configuration in which the electronic circuit housing and the liquid refrigerant cooling housing are separate bodies, it is not possible to maintain the same installability as that of the conventional air-cooled electronic device.

(3) In the construction in which the electronic circuit housing and the liquid refrigerant cooling housing are separate bodies, since piping must be provided between the electronic circuit housing and the liquid refrigerant cooling housing, installation work is required. take time. In particular, when the installation place is a general office, it is desirable to complete the installation work in the shortest possible time, but it takes more time due to the relationship with other office equipment, and the general office becomes dirty.

(4) A pump or the like, which is a liquid refrigerant supply means in the liquid refrigerant cooling housing, has a pipe resistance between the electronic circuit housing and the liquid refrigerant cooling housing. It is necessary to raise the pump, the pump and the like become large, and the running cost also increases.

The present invention has been made by paying attention to such conventional problems, and saves installation space, ensures the same installability as the conventional air-cooled electronic device, shortens the installation work time, and A first object of the present invention is to provide an electronic device that can reduce the size of a pump and a cooling unit suitable for this electronic device.

Further, when the electronic circuit housing and the liquid refrigerant cooling housing are integrated, the following problems must be solved.

(1) When the electronic circuit casing and the liquid refrigerant cooling casing are integrated, it is necessary to devise a method of connecting the casings to secure the strength of the entire integrated structure.

(2) Since the integrated structure is used for the purpose of saving space for installation, it is necessary to make the structure in which the electronic circuit case and the liquid refrigerant cooling case having the smallest floor area are integrated.

(3) When the electronic circuit housing and the liquid refrigerant cooling housing are integrated with each other, if the refrigerant leaks on the liquid refrigerant cooling housing side, the electronic circuit housing is affected.

(4) When the heated air supplied from the heat-generating semiconductor component in the electronic circuit casing mixes with the cooling air supplied to the refrigerant cooling means such as the air-cooling heat exchanger in the liquid refrigerant cooling casing, Cooling performance may be significantly reduced.

The present invention was devised to solve the above problems when the electronic circuit housing and the liquid refrigerant cooling housing are integrated, and ensures the strength of the entire integrated structure.
(EN) Provided is an electronic device capable of further saving the installation space, preventing the refrigerant from flowing into the electronic circuit housing when leaking, and preventing cooling performance from being deteriorated due to mixing of heated air, and a cooling unit suitable for the electronic device. Is the second purpose.

Whether the electronic circuit housing and the liquid-refrigerant cooling housing are installed independently or as an integrated structure,
Generally, there are the following problems in adopting the liquid cooling method.

(1) The structure is simple, the number of parts is small,
It is necessary to provide a liquid refrigerant cooling housing that is inexpensive, requires no complicated control, is low in noise, has good maintainability, and has high cooling performance.

(2) It is necessary to provide a highly reliable liquid-refrigerant cooling housing that is resistant to corrosion of the refrigerant piping and the like.

(3) It is necessary to provide a highly reliable liquid-refrigerant cooling housing provided with a means for treating the liquid-refrigerant supply means such as a pump in case of failure.

(4) It is necessary to provide a highly reliable liquid-refrigerant cooling housing provided with means for preventing freezing of the refrigerant in the piping.

(5) It is necessary to provide a highly reliable liquid refrigerant cooling housing that can take appropriate measures even if a refrigerant leak occurs.

The present invention is also devised to solve the above problems in adopting the liquid cooling system in general, and simplifies the structure, reduces the number of parts, is inexpensive, and does not require complicated control. It is possible to achieve low noise, good maintainability, and improved cooling performance. Furthermore, it is provided with a corrosion prevention means, a means for treating a pump failure, and a refrigerant freezing prevention means,
A third object is to provide a highly reliable electronic device that can take appropriate measures when a refrigerant leaks, and a cooling unit suitable for this electronic device.

[0031]

In order to achieve the above object, an electronic device according to the present invention comprises a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid refrigerant cooling means for cooling the liquid refrigerant, and a cooled liquid refrigerant. An electronic device including a liquid refrigerant supply means for supplying the heat generating semiconductor component to the heat generating semiconductor component, the electronic circuit housing containing the heat generating semiconductor component, etc., the liquid refrigerant cooling means, the liquid refrigerant supply means, etc. It is composed of at least two casings including a liquid refrigerant cooling casing, and has means for connecting and fitting the respective casings and pipes. By connecting and fitting the respective casings and pipes, It is a structure that can be handled as an integral structure.

Here, in order to further reduce the installation space and to secure the strength of the entire integrated structure, the electronic circuit housing is of a stool type structure, and the liquid refrigerant cooling housing is mounted on the stool portion, At least one upper surface of the circuit casing (the seating surface of the stool) and at least one lower surface of the liquid refrigerant cooling casing are coupled and fitted, and at least one side surface of the electronic circuit casing (the back of the stool portion). By connecting and fitting at least one side surface of the liquid refrigerant cooling casing, the whole can be handled as an integral structure.

Further, when a refrigerant leak occurs on the liquid refrigerant cooling housing side, in order to prevent the refrigerant from flowing into the electronic circuit housing, a part or a part of the liquid refrigerant cooling housing is provided between the electronic circuit housing and the liquid refrigerant cooling housing. It is characterized by having a means for partitioning the whole.

In addition to the heat-generating semiconductor component cooled by the liquid refrigerant in the electronic circuit housing, cooling air supply means and air-cooled heat-generating electronic component air-cooled by the cooling air supplied by the cooling air supply means. And are present,
The air heated by the air-cooled heat generating electronic component is mixed with the cooling air supplied to the refrigerant cooling means such as the air-cooled heat exchanger,
In order to prevent the cooling performance from deteriorating, a ventilation air passage for the cooling air supplied to and discharged from the liquid refrigerant cooling means and a ventilation air passage for the cooling air supplied to and discharged from the air-cooling heat generating electronic component are provided. , Are characterized by being independent of each other.

Further, the above-mentioned means for making each ventilation passage independent is realized by a partition plate installed in the vertical direction.

[0036]

Since the electronic circuit housing and the liquid refrigerant cooling housing are connected to each other so that the entire body can be handled as an integrated structure, the installation space can be reduced and the layout in the installation room can be simplified. Further, since the refrigerant pipe is closed inside the housing due to the integrated structure, and liquid cooling is performed, the ease of installation in the conventional air-cooled electronic device is not impaired. Further, since the underfloor piping is not required between the electronic circuit case and the liquid refrigerant cooling case, the installation work time can be shortened and the installation place is not polluted. Further, since the pipe between the electronic circuit housing and the liquid refrigerant cooling housing is short and has a constant length, the capacity of the pump, which is the liquid refrigerant supply means in the liquid refrigerant cooling housing, can be small, and the pump can be downsized. And the running cost can be reduced.

The electronic circuit casing has a stool type structure, the liquid refrigerant cooling casing is mounted on the stool portion, and the electronic circuit casing and the liquid refrigerant cooling casing are connected to each other so that the whole structure can be handled as an integrated structure. Since the configuration is adopted, there is no wasted space in the electronic device, and further space saving can be achieved. Further, since the connection is made on at least two surfaces, a large number of connection points can be provided for each housing, the frames can be directly connected to each other, and the liquid refrigerant cooling housing is mounted on one base called an electronic circuit housing. Depending on what can be shaped,
It is possible to secure the strength of the entire integrated structure.

Between the electronic circuit housing and the liquid refrigerant cooling housing,
Since a means for partitioning part or all of the liquid refrigerant cooling housing is provided so as not to be at least right above the electronic circuit housing, it is possible to prevent electronic leakage when a refrigerant leak occurs on the liquid refrigerant cooling housing side. It is possible to prevent it from flowing into the circuit housing.

In the electronic circuit casing, in addition to the heat-generating semiconductor components cooled by the liquid refrigerant, cooling air supply means and air-cooled heat-generating electronic components air-cooled by the cooling air supplied by the cooling air supply means are provided. When present, the ventilation passage for the cooling air supplied to the liquid refrigerant cooling means and discharged,
An air passage for cooling air supplied to and discharged from the air-cooled heat-generating electronic component is provided independently of each other. Further, since each ventilation passage is made independent by the partition plate installed in the vertical direction, the air heated by the air-cooled heat generating electronic components is mixed with the cooling air supplied to the refrigerant cooling means such as the air-cooled heat exchanger. It is possible to prevent a decrease in cooling performance.

Since the refrigerant cooling means is provided with the finned refrigerant pipe through which the refrigerant passes and the cooling air supply means for passing the cooling air through the finned refrigerant pipe, the structure is simple and the number of parts is small. Further, an expensive and complicated control is not required, and an electronic device with low noise and good maintainability can be provided.

Further, when the refrigerant cooling means is constituted by a refrigeration cycle composed of an evaporator, a compressor, a condenser, etc., a liquid refrigerant cooling housing having high cooling performance can be obtained.

If the cooling means for cooling the cooling medium is a means for cooling the cooling medium through the heat exchanger with cooling water supplied from the outside of the housing, the existing cooling tower water can be used.
A liquid refrigerant cooling device having high cooling performance can be easily provided.

By providing a refrigerant purity maintaining device or the like for removing elution ions and the like in the refrigerant in the refrigerant cooling part, a highly reliable liquid refrigerant cooling device for preventing corrosion of refrigerant pipes and the like is provided. be able to.

In addition, a cooling structure is provided to cool the heat-generating electronic component supplied with a coolant, the cooling structure is provided with a cooling jacket, and the heat-generating electronic component is brought into thermal contact with the cooling jacket. Thus, by using the cooling structure for cooling the heat-generating electronic component, it is possible to provide an electronic device having high cooling capacity and reliability, a simple structure, and good maintainability.

Further, since the heat capacity is large when pure water is used as the refrigerant, it is possible to provide an electronic device having a high heat transport capacity and an excellent cooling performance.

Further, when the refrigerant is a refrigerant in which pure water is mixed with a corrosion inhibitor having an action of suppressing the corrosion of the piping and the like, a liquid refrigerant cooling device having high reliability of corrosion of the refrigerant on the piping and the like is provided. be able to.

Further, when the refrigerant is a refrigerant obtained by mixing pure water with an antifreezing liquid or the like having a function of lowering the freezing point temperature of pure water, a highly reliable liquid refrigerant capable of preventing freezing of the refrigerant in the pipes. It can be a cooling device.

By having a cooling structure supplied with a cooling medium to cool the heat-generating electronic component, the refrigerant is an electrically insulating coolant, and the cooling structure directly contacts the heat-generating electronic component with the electrically insulating coolant. With the cooling structure that cools the heat-generating electronic component, the thermal resistance from the coolant to the heat-generating electronic component can be reduced, so that the cooling structure can have an extremely high cooling performance.

The electronic device has an appropriate mode for the refrigerant leakage detection means for detecting the refrigerant leakage, the refrigerant leakage warning means for issuing an alarm when the refrigerant leakage is detected, and the process or operation being executed in the electronic circuit section. Providing the processing termination means for terminating in step 1 and the refrigerant supply stopping means for stopping the supply of the refrigerant to the electronic circuit portion makes it possible to take appropriate measures even if a refrigerant leak occurs.

[0050]

Embodiments of the present invention will be described below with reference to FIGS.

First, a first embodiment of the electronic device will be described with reference to FIGS.

As shown in FIGS. 1 and 2, the electronic device comprises an electronic circuit housing 1 and a liquid refrigerant cooling housing 2 for cooling the liquid refrigerant. The electronic circuit housing 1 and the liquid refrigerant cooling housing are provided. The body 2 and the body 2 are connected and fitted by a connecting tool 62 so that the whole body can be handled as an integral structure. A caster 63 is attached to the lower part of the housing 1 to make the electronic device movable.

In the electronic circuit housing 1, a plurality of heat-generating electronic components 20 typified by electronic circuit modules are provided on a substrate 22. On the heat-generating electronic component 20, a cooling structure 21 such as a cooling jacket is closely attached to the surface in order to transfer the heat generation to pure water as a refrigerant. The heat-generating electronic component 20 and the cooling structure 21 have a structure in which they are in thermal contact with, for example, high thermal conductivity grease. Flexible refrigerant pipes 23 connecting these are provided between the plurality of cooling structures 21, and the flexible refrigerant pipes 23 located at the upper end portion and the lower end portion are connected to two header pipes 24. The header pipe 24 is
It is connected to two pipes 25 for supplying the refrigerant (lower part) and for discharging the refrigerant (upper part), and is connected to the liquid refrigerant cooling casing 2 side via a pipe joint 26. If the pipe 25 is a flexible pipe, connection work to the pipe joint 26 is facilitated, and the reliability of the joint portion is also improved.

Pure water heated in the electronic circuit casing 1 is sent to the liquid refrigerant cooling casing 2 via the pipe 27 connected to the pipe joint 26, and then heat exchanger 2 for exchanging heat with air.
Sent to 8. The pure water cooled by the heat exchanger 28 is sent via a pipe 29 to a tank 30 for absorbing a volume change due to thermal expansion and contraction of water, and further a pipe 31.
Is sent to the refrigerant supply pump 32 via. As shown in FIG. 2, a liquid refrigerant inlet 72 for supplying the liquid refrigerant is provided in the upper portion of the tank 30. The pure water pressurized by the coolant supply pump 32 is sent again to the cooling structure 21 on the electronic circuit housing 1 side via the pipe 33. Further, a part of the cooling water discharged from the refrigerant supply pump 32 is sent to a refrigerant purity maintaining device 34 such as an ion exchanger and returned to the pump 32 via pipes 36 and 37 in parallel with the main pipe line. There is. Since it is desirable for maintenance management to supply a constant flow rate of pure water to the refrigerant purity maintaining device 34, the constant flow valve 35 is used for the refrigerant purity maintaining device 3.
4 is connected to the upstream side.

The cooling air for cooling the heat exchanger 28 is blown by the two blower fans 38 installed above the heat exchanger 28. The cooling air first enters the electronic circuit housing 1 from the bottom of the electronic circuit housing 1 through the floor air supply port 47,
The drain pan 45 that passes the side of the electronic component 46 and receives water leakage from the liquid refrigerant cooling housing 2 and the liquid refrigerant cooling housing 2
It passes between the guides 44 that guide water leaking from the drain pan 45. Then, the air flow 50 to the liquid refrigerant cooling housing
As shown in FIG.
Guided into the liquid refrigerant cooling enclosure. The cooling air sent to the heat exchanger 28 is also sucked 52 from the side intake 51 provided on the side panel in addition to the intake 48 from the floor intake 47 described above. Regarding the cooling air from the floor intake port 47, there are many advantages such as low-temperature air being obtained in a computer room where the underfloor air conditioning is prepared, but the ventilation passage also has a member such as a drain pan 45 that becomes ventilation resistance. Many. Therefore, if air is also taken in parallel from the side air intake port provided on the side panel near the heat exchanger 28, the overall ventilation resistance is lowered, and the air flow rate of the heat exchanger 28 can be increased. The air 41 supplied to the heat exchanger 28 has dust and debris removed by the filter 40 installed in front of the heat exchanger 28 and is sent to the heat exchanger 28. The heat exchanger 28 is formed of, for example, a finned tube such as a slit fin, and is installed under the two blower fans 38 in close contact with each other. The arrangement of the heat exchanger 28 and the blower fan 38 is a suction type because the fan 38 is located on the downstream side of the flow, and in this case, there is also an advantage that the wind velocity distribution to the heat exchanger 28 becomes uniform. Heat exchanger 28
Then, the air that has exchanged heat with the cooling water and is warmed is sucked into the blower fan 38, then sent to the silencer 39 installed on the blower fan 38, and passes through the exhaust port 43 provided on the ceiling. And is exhausted 42 into the room.

An air-cooled heat-generating electronic component 54, which is cooled by a small blower fan 55, is arranged at the bottom of the electronic circuit housing 1 on the heat-generating electronic component 20 side. Blower fan 55
The cooling air 57 is sucked from the floor intake port 56 to cool the air-cooling heat-generating electronic component 54, and then the exhaust air 60 is exhausted indoors through the exhaust port 59 on the electronic circuit housing 1 side. here,
The ventilation path on the electronic circuit housing 1 side for cooling the air-cooled heat-generating electronic component 54 and the ventilation path on the liquid refrigerant cooling housing 2 side for cooling the heat exchanger 28 are vertically installed in the lower part. Since the partition plate 53 and the upper partition plate 61 are independent of each other, the air heated by the air-cooling heat-generating electronic component 54 does not mix with the air for cooling the heat exchanger 28, and the heat exchanger 28 is cooled. It is possible to prevent deterioration of cooling performance.
Since the lower partition plate 53 and the upper partition plate 61 are installed vertically, each ventilation passage is linearly configured from the floor to the ceiling. If the ventilation passage is configured in this manner, a so-called chimney effect is realized, in which cold air on the floor is sucked in, the heating element is cooled, and warmed air rises and escapes to the ceiling, resulting in an efficient ventilation passage configuration.

As shown in FIG. 3, the electronic circuit housing 1 has a stool type structure in which various components are mounted on a stool type electronic circuit housing frame 73, and a rectangular parallelepiped liquid refrigerant is mounted on the stool portion. The liquid refrigerant cooling housing 2 is mounted on the cooling housing frame 74, and the electronic circuit housing frame 73 and the liquid refrigerant cooling housing frame 74 are connected and fitted together by the plurality of connecting members 62 shown in FIG. Is a structure that can be treated as an integrated structure. Below the electronic circuit housing frame 73, a plurality of casters 63 that support the entire electronic device are installed. The electronic circuit housing 1 and the liquid-refrigerant cooling housing 2 have different manufacturing processes and inspection methods, and thus are manufactured by different equipment and are connected in the final process. The frames are connected in the frame connecting direction indicated by an arrow 81, as shown in FIG. The pipes are connected according to the pipe connecting direction indicated by the arrow 82,
The piping connector 26 on the electronic circuit housing 1 side and the liquid refrigerant cooling housing 2
The side pipe 33 is connected. Further, with such a configuration, the electronic circuit housing 1 and the liquid refrigerant cooling housing 2 can be easily separated or connected, which is very convenient for maintenance and inspection.

In FIG. 3, the upper partition plate 61 attached to the electronic circuit housing 1 side serves to protect the electronic circuit portion 71 from leakage of cooling water in the liquid refrigerant cooling housing 2. The upper partition plate 61 may be attached to the electronic circuit housing 1 side as in this embodiment, or may be of course attached to the liquid refrigerant cooling housing 2 side. Further, since the liquid refrigerant cooling housing 2 is not directly above the electronic circuit portion 71 and is located laterally, when the cooling water leakage occurs on the liquid refrigerant cooling housing 2 side, the electronic circuit portion 71 is formed. It can be prevented from flowing into.

As described above, since the electronic circuit housing 1 and the liquid-refrigerant cooling housing 2 are connected and fitted to each other so that the whole structure can be handled as an integrated structure, it is possible to save the installation space and to save the space in the installation room. The layout is also simple. Further, because of the integrated structure, it is possible to ensure the same installability as that of the conventional air-cooled electronic device, the underfloor piping between the electronic circuit housing 1 and the liquid refrigerant cooling housing 2 is not required, and the installation work time is reduced. The installation location is not polluted. Further, since the pipe between the electronic circuit housing 1 and the liquid refrigerant cooling housing 2 is short and has a constant length, the capacity of the pump 32, which is the liquid refrigerant supply means in the liquid refrigerant cooling housing 2, is small. It is possible to reduce the size of the pump and the running cost.

Since the entire structure can be handled as an integrated structure, there is no wasted space in the electronic device, and further space saving can be achieved. Also, since the connection is made on two sides, there are many connection points for each case, and
Since the frames can be directly connected to each other, the liquid refrigerant cooling housing 2 is mounted on one base called the electronic circuit housing 1, so that the strength of the entire integrated structure can be secured.

Next, a second embodiment of the electronic device will be described with reference to FIG. As shown in FIG. 4, the electronic circuit housing frame 73 of the electronic circuit housing 1 is L from the bottom frame.
It has a stool shape with a protruding back frame. The electronic circuit housing 1 includes an electronic circuit housing frame 73.
In addition, it is a stool type structure with various components mounted,
A rectangular parallelepiped liquid refrigerant cooling casing frame 7 is mounted on the seated portion.
The liquid refrigerant cooling case 2 mounted on the No. 4 is mounted. With such a configuration, the liquid refrigerant cooling housing is connected to the electronic circuit housing 1 by two side surfaces and one bottom surface of the liquid refrigerant cooling housing 2, so that the structural strength of the entire electronic device is increased. Has an advantage over the first embodiment.

Further, when the liquid refrigerant cooling housing 2 can be made smaller than the electronic circuit housing 1, the configuration of this embodiment is more advantageous. Also in this embodiment, as shown in FIG. 4, between the electronic circuit housing 1 and the liquid refrigerant cooling housing 2,
There is an upper partition plate (1) 61 and an upper partition plate (2) 97,
From the leakage of the cooling water in the liquid refrigerant cooling housing 2, the electronic circuit unit 7
It plays the role of protecting 1. Further, below the upper partition plate (1) 61 and the upper partition plate (2) 97 in the electronic circuit housing 1,
A lower partition plate (1) 53 and a lower partition plate (2) 98 are installed. By these lower partition plate and upper partition plate, the ventilation path on the electronic circuit housing 1 side for cooling the air-cooled heat generating electronic component 54 and the liquid refrigerant cooling housing 2 side for cooling the heat exchanger 28 are provided. The ventilation passage is provided as a separate passage to improve the cooling efficiency.

As described above, in the electronic devices described in the first and second embodiments, pure water is used as the refrigerant. Since pure water has a large heat capacity, it is possible to realize an electronic device having a high heat transport capacity and a high cooling capacity. Further, the cooling water cooling section of these embodiments includes an air-cooling heat exchanger 28 made of a cooling water pipe group with cooling fins through which cooling water passes, and the heat exchanger 28 thereof.
Since it is composed of a blower fan 38 for ventilating the cooling air, the structure is simple, the number of parts is small, compact and inexpensive. Further, since complicated control is not required and there is no compressor or the like, the noise is low and the maintainability is good.

The cooling water cooling section includes an evaporator, a compressor,
It may be configured by a refrigeration cycle including a condenser and the like. In this case, it is difficult to make it compact, but the cooling system has high cooling performance and can control the cooling water temperature.

The cooling water cooling unit may be means for cooling the pure water cooling water through the water / water heat exchanger by the cooling water supplied from outside the electronic device. In this case,
Since existing cooling tower water can be used, a cooling system with high cooling performance can be easily achieved.

In the electronic devices described in the first and second embodiments, the liquid refrigerant cooling casing 2 has an ion as a refrigerant purity maintaining device for removing elution ions in the cooling water. Since the exchanger 34 is provided, it is possible to remove dissolved oxygen and the like in the cooling water, which is the main cause of corrosion of the piping members, and to provide a highly reliable cooling system against corrosion of the piping etc. by the cooling water. be able to. This effect is promoted by periodically exchanging the ion exchange resin with which the inside of the ion exchanger is filled.

In addition to the ion exchangers described in the above embodiments, in order to prevent corrosion of pipes and the like due to cooling water, there is an action of suppressing the corrosion of pipes and the like, such as BTA (benzotriazole). You may mix a corrosion inhibitor in pure water.

Further, by using a refrigerant in which pure water is mixed with an antifreezing liquid such as ethylene glycol or propylene glycol, which has the effect of lowering the freezing point temperature of pure water, it is possible to prevent the refrigerant in the pipe from freezing. So
The cooling system can be highly reliable against freezing.

Next, a third embodiment of the electronic device will be described with reference to FIG. As shown in FIG. 5, two pumps 99 and 100 are installed in parallel in the liquid refrigerant cooling housing 2. 99 is a pump in operation, 100 is a pump in stop. In addition, a check valve is installed at the outlet of each pump to prevent the refrigerant from flowing backward when the pump is stopped. In the figure, 1
Reference numeral 01 is an open check valve, and 102 is a closed check valve.

In this way, if one of the plurality of pumps is always stopped and it is possible to switch to another pump that is in operation at any time,
In the unlikely event of a pump failure, the backup pump can be switched to the stopped pump immediately, so that the operation does not stop and the electronic device has high reliability.

Next, the cooling structure 21 such as a cooling jacket mounted on the heat-generating electronic component 20 represented by the electronic circuit module described in the first embodiment will be described with reference to FIG.
Will be described in detail. The heat-generating electronic component 20 typified by an electronic circuit module or the like is electrically connected and mounted on the substrate 22. In the heat-generating electronic component 20, for example, as shown in FIG. 6, a plurality of chips 111 that generate heat are arranged. The heat from the chip 111 is transferred to the surface of the heat-generating electronic component 20 through the flexible contact 110. Further, this heat is passed through the high thermal conductive grease 109 or the high thermal conductive sheet or the like, and the cooling jacket 1
It is transmitted to 03. Cooling water is supplied from the cooling water inlet 104 to the cooling jacket 103 as shown by an arrow 105, and heat of the cooling jacket 103 is generated while the cooling water is passing through the internal jacket flow passage 106. The cooling water is transmitted to the cooling water outlet 107 and the arrow 108
It is discharged as shown in. With the above-described configuration, it is possible to provide a cooling structure having high cooling capacity and reliability, a simple structure, and good maintainability.

The refrigerant described in the above embodiments is a refrigerant mainly containing water, but as another example, if the refrigerant is an electrically insulating refrigerant, it is brought into direct contact with heat-generating electronic components such as chips. Therefore, the thermal resistance from the refrigerant to the heat-generating electronic component such as a chip can be made extremely small, and a cooling structure having an extremely high cooling performance can be obtained.

Next, a fourth embodiment of the electronic device will be described with reference to FIG. It differs from the first embodiment in the following points. That is, in this embodiment, the tank 30 has the refrigerant amount detector 92 for detecting the refrigerant amount, and further, the refrigerant leakage detection signal and the pump stop signal are output from the detected refrigerant amount into the liquid refrigerant cooling casing 2. There are provided a control unit 91 and an alarm unit 94 that issues an alarm when a refrigerant leak detection signal is received.

The refrigerant leak detecting means and the refrigerant decreasing speed detecting means are composed of the refrigerant amount detector 92 and the controller 91, and the refrigerant supply stopping means is composed of the controller 91 and the refrigerant supply pump 32. There is.

The operation when the refrigerant leaks from the refrigerant circulation line will be described. When the refrigerant leaks, the amount of the refrigerant in the refrigerant circulation line sharply decreases and the amount of the refrigerant in the tank 30 also decreases. The refrigerant amount in the tank 30 is sequentially detected by the refrigerant amount detector 92, and the controller 91 is detected via the detection line 93.
Sent to. The controller 91 calculates the refrigerant reduction rate from the detected value, and when the refrigerant reduction rate reaches a specific value,
It recognizes that the refrigerant is leaking and sends a refrigerant leakage detection signal to the alarm device 94 via the alarm line 95. Receiving this, the alarm device 94 issues an alarm to notify the operator of the refrigerant leak. Upon receipt of this alarm, the operator stops the operation of the electronic circuit section or checks the refrigerant for leakage.

If the amount of refrigerant leakage is very large,
That is, when the refrigerant reduction rate is very high, the controller 9
A pump stop signal is output from 1 to the refrigerant supply pump 32 via the pump control line 96, and the refrigerant supply pump 32 stops. Therefore, the refrigerant does not circulate in the refrigerant circulation line, and the influence of leakage can be minimized.

In this embodiment, when the refrigerant leaks, an alarm is issued, and measures such as stopping of the refrigerant supply pump are taken, so that the reliability can be improved as compared with the electronic devices of the other embodiments. .

In this embodiment, the refrigerant supply pump 32 is stopped when the leakage amount of the refrigerant is very large. However, an electromagnetic valve is provided in the refrigerant circulation line, which is used as the controller 9
It may be closed by the instruction of 1.

Further, in the present embodiment, the leakage of the refrigerant is detected from the amount of the refrigerant in the tank 30, but a leakage detector is provided at the bottom of the liquid refrigerant cooling casing 2 so that the leakage of the refrigerant can be directly detected. You can

Further, for example, when a computer is provided in the electronic circuit housing 1, the refrigerant leakage detection signal is output to the CPU in the apparatus, and the CPU receives the signal, whereby the current execution is being performed. The processing may be stored in a recording medium.

The refrigerant amount detector 92 provided in this embodiment is used.
Needless to say, the controller 91 and the alarm 94 may be applied to the other embodiments described above.

[0082]

Since the electronic circuit housing and the liquid refrigerant cooling housing are connected to each other to form an integrated structure, it is possible to save the installation space, simplify the layout in the installation room, and reduce the conventional air cooling. The same installability as that of electronic devices can be secured. In addition, the installation work time can be shortened and the installation place is not polluted. Further, it is possible to reduce the size of the pump and reduce the running cost.

The electronic circuit housing has a stool type structure, the liquid refrigerant cooling housing is mounted on the stool portion, and the electronic circuit housing and the liquid refrigerant cooling housing are connected to each other to form an integrated structure. Therefore, it is possible to further reduce the installation space and secure the strength of the entire integrated structure.

Since the means for partitioning the electronic circuit housing and the liquid refrigerant cooling housing is provided and the liquid refrigerant cooling housing is prevented from being at least directly above the electronic circuit housing, the liquid refrigerant cooling When refrigerant leaks on the housing side, it is possible to prevent the refrigerant from flowing into the electronic circuit housing, and it is possible to eliminate the adverse effect of the integrated structure.

Since the air passage for the cooling air of the liquid-refrigerant cooling means and the air passage for the cooling air of the air-cooling heat-generating electronic parts are provided independently of each other, the air heated by the air-cooling heat-generating electronic parts is cooled by the refrigerant cooling means. Does not mix with the cooling air supplied to
It is possible to prevent deterioration of cooling performance.

Since the cooling means for cooling has a finned cooling medium piping through which the cooling medium passes and cooling air supply means for circulating cooling air through the finned cooling medium piping, the structure is simple and the number of parts is small. The electronic device is compact, inexpensive, requires no complicated control, is low in noise, and has good maintainability.

[0087]

[Brief description of drawings]

FIG. 1 is an overall side perspective view of an electronic device according to a first embodiment.

FIG. 2 is an overall perspective perspective view of the electronic device according to the first embodiment.

FIG. 3 is an overall perspective assembly view of the electronic device of the first embodiment.

FIG. 4 is an overall perspective assembly view of an electronic device according to a second embodiment.

FIG. 5 is an overall side perspective view of an electronic device according to a third embodiment.

FIG. 6 is a detailed cross-sectional view of a cooling structure in the electronic devices of the first, second and third embodiments.

FIG. 7 is an overall side perspective view of an electronic device according to a fourth embodiment.

FIG. 8 is an overall perspective view of a conventional electronic device.

FIG. 9 is an overall side perspective view of a conventional electronic device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic circuit housing, 2 ... Liquid refrigerant cooling housing, 20 ... Exothermic electronic component, 21 ... Cooling structure, 22 ... Substrate, 28 ... Heat exchanger, 30 ... Tank, 32 ... Pump, 34 ... Refrigerant purity maintenance Device, 38 ... Blower fan, 53 ... Lower partition plate, 61 ... Upper partition plate, 62 ... Connector, 73 ... Electronic circuit housing frame, 74 ... Liquid refrigerant cooling housing frame, 91 ... Controller, 9
2 ... Refrigerant amount detector, 94 ... Alarm device, 103 ... Water cooling jacket

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Reference number within the agency FI Technical indication location G06F 1/20 (72) Inventor Toshio Hatada 502 Kintatemachi, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho In-house (72) Inventor Takahiro Oguro 502 Kintate-cho, Tsuchiura-shi, Ibaraki Machinery Research Laboratory, Hiritsu Seisakusho Co., Ltd. ) Inventor Ho Tsukaguchi, 1 Horiyamashita, Horiyamashita, Kanano, Kanagawa Prefecture (72) Inventor Shigeru Koizumi 1 Horiyamashita, Hinoyamashita, Kanano, Kanagawa Prefecture (72) Inventor, Kurihara Kurihara Keiichi 1 Horiyamashita, Sono City, Kanagawa Prefecture

Claims (20)

[Claims] 1. An electronic device comprising a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid-refrigerant cooling means for cooling the liquid refrigerant, and a liquid-refrigerant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. In at least two housings, an electronic circuit housing housing the heat-generating semiconductor component and a liquid refrigerant cooling housing housing the liquid refrigerant cooling means and the liquid refrigerant supply means, and connecting the respective housings. And a unit for connecting the respective casings to each other to form an integrated structure as a whole. 2. An electronic device comprising: a heat-generating semiconductor component cooled by a liquid refrigerant; liquid-coolant cooling means for cooling the liquid refrigerant; and liquid-coolant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. An electronic circuit case for accommodating the heat-generating semiconductor component, and a liquid refrigerant cooling case for accommodating the liquid refrigerant cooling means and the liquid refrigerant supply means. A liquid refrigerant cooling housing is provided with a refrigerant pipe for supplying the refrigerant to the heat-generating semiconductor component or discharging the refrigerant from the heat-generating semiconductor component, and the electronic circuit housing is formed in a stool type, and a seating portion thereof is provided. The liquid refrigerant cooling housing is mounted, at least one upper surface of the electronic circuit housing and at least one lower surface of the liquid refrigerant cooling housing are connected to each other, and at least one of the electronic circuit housings is connected. A surface and at least one side surface of the liquid-refrigerant cooling casing, and the refrigerant pipe provided in the electronic circuit casing and the refrigerant pipe provided in the liquid-refrigerant cooling casing are connected to form an integrated whole. An electronic device having a structure. 3. An electronic device including a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid-refrigerant cooling means for cooling the liquid refrigerant, and a liquid-refrigerant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. An electronic circuit case for accommodating the heat-generating semiconductor component, and a liquid refrigerant cooling case for accommodating the liquid refrigerant cooling means and the liquid refrigerant supply means. A liquid refrigerant cooling housing is provided with a refrigerant pipe for supplying the refrigerant to the heat generating semiconductor component or discharging the refrigerant from the heat generating semiconductor component, and at least one upper surface of the electronic circuit housing and the liquid refrigerant cooling housing. At least one lower surface of the body is connected, at least one side surface of the electronic circuit housing is connected to at least one side surface of the liquid refrigerant cooling housing, and the electronic circuit housing is provided. Serial by connecting the refrigerant pipe provided in the refrigerant pipe and the liquid refrigerant cooling housing, whole an integral structure, the electronic apparatus characterized in that a means for partitioning the said respective housing. 4. An electronic device including a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid-refrigerant cooling means for cooling the liquid refrigerant, and a liquid-refrigerant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. An electronic circuit case for accommodating the heat-generating semiconductor component, and a liquid refrigerant cooling case for accommodating the liquid refrigerant cooling means and the liquid refrigerant supply means. A liquid refrigerant cooling housing is provided with a refrigerant pipe for supplying the refrigerant to the heat generating semiconductor component or discharging the refrigerant from the heat generating semiconductor component, and at least one upper surface of the electronic circuit housing and the liquid refrigerant cooling housing. At least one lower surface of the body is connected, at least one side surface of the electronic circuit housing is connected to at least one side surface of the liquid refrigerant cooling housing, and the electronic circuit housing is provided. The refrigerant pipe and the refrigerant pipe provided in the liquid refrigerant cooling case are connected to each other to form an integral structure, and the cooling air supply means and the cooling air supply means supply the electronic circuit case. An air-cooled heat-generating electronic component that is air-cooled by cooling air is provided, a ventilation passage through which the cooling air is supplied to the liquid refrigerant cooling means and the cooling air is discharged, and a cooling air that is supplied to the air-cooling heat-generating electronic component. An electronic device characterized in that a ventilation path through which air is discharged is provided independently of each other. 5. An electronic device including a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid-refrigerant cooling means for cooling the liquid refrigerant, and a liquid-refrigerant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. An electronic circuit case for accommodating the heat-generating semiconductor component, and a liquid refrigerant cooling case for accommodating the liquid refrigerant cooling means and the liquid refrigerant supply means. A liquid refrigerant cooling housing is provided with a refrigerant pipe for supplying the refrigerant to the heat generating semiconductor component or discharging the refrigerant from the heat generating semiconductor component, and at least one upper surface of the electronic circuit housing and the liquid refrigerant cooling housing. At least one lower surface of the body is connected, at least one side surface of the electronic circuit housing is connected to at least one side surface of the liquid refrigerant cooling housing, and the electronic circuit housing is provided. The refrigerant pipe and the refrigerant pipe provided in the liquid refrigerant cooling casing are connected to each other to form an integral structure, and the cooling air supply unit and the cooling air supply unit supply the electronic circuit casing. An air-cooled heat-generating electronic component that is air-cooled by cooling air is provided, a ventilation passage through which the cooling air is supplied to the liquid refrigerant cooling means and the cooling air is discharged, and a cooling air that is supplied to the air-cooling heat-generating electronic component. An electronic device in which a ventilation path through which air is discharged is independently provided by a partition plate arranged in a vertical direction. 6. An electronic device comprising a heat-generating semiconductor component cooled by a liquid refrigerant, a liquid-refrigerant cooling means for cooling the liquid refrigerant, and a liquid-refrigerant supply means for supplying the cooled liquid refrigerant to the heat-generating semiconductor component. An electronic circuit case for accommodating the heat-generating semiconductor component, and a liquid refrigerant cooling case for accommodating the liquid refrigerant cooling means and the liquid refrigerant supply means. A liquid refrigerant cooling housing is provided with a refrigerant pipe for supplying the refrigerant to the heat generating semiconductor component or discharging the refrigerant from the heat generating semiconductor component, and at least one upper surface of the electronic circuit housing and the liquid refrigerant cooling housing. At least one lower surface of the body is connected, at least one side surface of the electronic circuit housing is connected to at least one side surface of the liquid refrigerant cooling housing, and the electronic circuit housing is provided. The refrigerant pipe and the refrigerant pipe provided in the liquid refrigerant cooling case are connected to each other to form an integral structure, and the liquid refrigerant cooling case is provided by being displaced from directly above the electronic circuit case. An electronic device characterized by the above. 7. The liquid refrigerant cooling means comprises a finned refrigerant pipe through which the refrigerant passes, and cooling air supply means for passing cooling air through the finned refrigerant pipe. 2. The electronic device according to 2. 8. The electronic device according to claim 1, wherein the liquid-refrigerant cooling unit has a refrigeration cycle including an evaporator, a compressor, and a condenser. 9. The electronic device according to claim 1, wherein the liquid refrigerant cooling means includes a heat exchanger that exchanges heat between the liquid refrigerant and cooling water supplied from the outside of the housing. 10. The electronic device according to claim 1, wherein the cooling medium housing is provided with a cooling medium purity maintaining device for removing ions eluted in the cooling medium. 11. The heat-generating electronic component is provided with a cooling structure, the cooling structure is supplied with the cooling medium, the cooling structure is provided with a cooling jacket, and the heat-generating electronic component is thermally provided with the cooling jacket. The electronic device according to claim 1, wherein the heat-generating electronic component is cooled by bringing it into contact with each other. 12. The electronic device according to claim 1, wherein the refrigerant is pure water. 13. The electronic apparatus according to claim 1, wherein the refrigerant is a refrigerant in which a corrosion inhibitor is mixed in pure water. 14. The electronic device according to claim 1, wherein the refrigerant is a refrigerant in which an antifreeze liquid is mixed with pure water. 15. The cooling medium is an electrically insulating cooling medium, and a cooling structure for supplying the cooling medium to the heat-generating electronic component is provided.
An electronic device, wherein the cooling structure is a cooling structure that cools the heat-generating electronic component by directly contacting the heat-generating electronic component with the electrically insulating refrigerant. 16. The refrigerant leakage detecting means for detecting the leakage of the refrigerant, and the refrigerant leakage warning means for issuing an alarm when the leakage of the refrigerant is detected, according to claim 1 or 2. Electronic device. 17. A leak detecting unit for detecting a leak of the refrigerant, and a process ending unit for ending a process or an operation being executed by the heat-generating electronic component in a predetermined mode when the leak of the refrigerant is detected. Claim 1 or 2 characterized by
Electronic device as described. 18. A leak detection means for detecting the leakage of the refrigerant, and a refrigerant supply stopping means for stopping the supply of the refrigerant to the heat generating electronic component when the leakage of the refrigerant is detected. The electronic device according to claim 1 or 2. 19. A leak detecting means for detecting a leak of the refrigerant, a refrigerant leak warning means for issuing an alarm when the leak of the refrigerant is detected, and a leak of the refrigerant are detected in the liquid refrigerant cooling casing. 3. The electronic device according to claim 1, further comprising a refrigerant supply stopping means for stopping the refrigerant supply means. 20. A heat-generating electronic component mounted on a substrate, a cooling structure thermally connected to the heat-generating electronic component, and a coolant supplied to or from the cooling structure above the interior. And a pipe for exhausting the heat generating electronic parts, and an electronic circuit casing in which a heat-generating electronic component and an air-cooling fan for air-cooling the heat-generating electronic component are arranged in the lower part of the inside, and the refrigerant, the atmosphere, and the heat in the upper part of the inside. A heat exchanger to be exchanged and a blower fan for blowing the atmosphere to the heat exchanger are arranged, a pump for circulating a refrigerant is arranged below the inside, and the heat exchanger and the pump for circulating a refrigerant are arranged. An electronic device, comprising: a liquid refrigerant cooling casing that is connected and stores a pipe for supplying the refrigerant to the heat-generating electronic component, wherein the electronic circuit casing has an L-shaped cross-section.
The liquid refrigerant cooling housing is attached to the concave portion of the character, and the pipe end portion on the electronic circuit housing side and the pipe end portion on the liquid refrigerant cooling housing side are connected to form a rectangular parallelepiped shape. Characterized electronic device.