JPH0699151A - Tray cleaning device for loading semiconductor devices - Google Patents

Abstract

(57) [Abstract] [Purpose] Dust can be removed easily and efficiently without the need for labor.
Moreover, there is provided a semiconductor device loading tray cleaning device that does not cause deformation of the tray. [Structure] Holding means 4 for holding a tray 3 to be cleaned
And gas spraying means 10, 12, and 14 having a plurality of spray nozzles 10 for spraying gas onto the tray 3, and a plurality of suctions for sucking and discharging dust from the gas spraying surface side of the tray 3. Evacuation means 11, 1 having a nozzle 11
3, 15 and vibrating means 7, 8 for vibrating the holding means 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for cleaning a semiconductor device loading tray after completion of molding in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art In a process of manufacturing an LSI or other semiconductor integrated circuit, after forming a semiconductor element (IC chip), each element and a lead wire are integrally packaged to form a semiconductor device by resin molding. After the completion of molding, such a semiconductor device is mounted on a tray and transferred to an inspection process for various inspections and tests.

An example of such a tray is shown in FIG. The tray 3 is a molded body made of a conductive material such as a resin containing carbon for preventing static electricity. The tray 3 has holes 2 corresponding to the shape of a semiconductor device (not shown) to be mounted.
A number of recesses 20 with 1 are formed. The packaged semiconductor device is mounted in each recess 20 of the tray 3 and conveyed to each inspection device or test device. Since such a tray 3 is loaded into an inspection device or the like while the semiconductor device is mounted, the tray size must always be maintained with high accuracy. The function of the semiconductor element is also affected by fine dust particles, so the dust on the tray must be completely removed.

Such a tray is washed after the inspection is completed or periodically. The conventional IC chip loading tray was washed in ultrapure water using ultrasonic vibration, and was heated at 50 ° C. for about 30 minutes to dry the washed tray.

[0005]

However, in the conventional method for cleaning a semiconductor device loading tray in the above ultrapure water, a heating and drying step is required after cleaning, which requires a lot of labor and processing time. It took a long time. In addition, the tray dimensions may be misaligned while the heating and drying process is repeated, and if such a tray is loaded into the inspection device and the semiconductor device is inspected, the predetermined highly accurate positioning of the tray cannot be achieved. There is a problem that the reliability of the inspection is reduced. In this case, if the temperature is lowered and the tray is dried, the processing time is further extended and the throughput is lowered.

The present invention has been made in view of the above-mentioned drawbacks of the prior art. It is an apparatus for cleaning a tray for loading semiconductor devices, which is capable of easily and efficiently removing dust without a trouble and without causing deformation of the tray. For the purpose of provision.

[0007]

In order to achieve the above object, a semiconductor device loading tray cleaning apparatus according to the present invention comprises:
Holding means for holding the tray to be cleaned, gas blowing means having a plurality of ejection nozzles for blowing gas to the tray, and a plurality of gas suction means for sucking and discharging dust from the gas blowing surface side of the tray. It is provided with a vacuum evacuation means having a suction nozzle and a vibrating means for vibrating the holding means.

In a preferred embodiment, the plurality of ejection nozzles and the plurality of suction nozzles are mounted on the same base frame,
The base frame and the tray are configured to be relatively movable. In a further preferred embodiment, the base frame and the tray are movable relative to each other in both directions parallel and perpendicular to the cleaning surface of the tray. In another preferred embodiment, the jet nozzle has a variable gas spraying direction.

[0009]

The gas is blown onto the tray to be cleaned while vibrating the tray. At the same time, the dust generated from the gas blowing surface of the tray is vacuumed and collected.

[0010]

1 is a perspective view of a semiconductor device loading tray cleaning apparatus according to an embodiment of the present invention. The entire cleaning device is mounted on a base 1 and covered with a cover 2 made of acrylic or the like. The tray 3 (see FIG. 2) to be cleaned is held by the holder 4. The holder 4 is fixed on the first linear table 5. The first linear table 5 can be slid in the left-right direction parallel to the front surface of the tray along the straight guide rail 6 as indicated by an arrow A by operating the manual handle 19. A motor drive may be used instead of the manual handle 19.

The guide rail 6 is fixed on the second linear table 7. The second linear table 7 is slidable along the straight guide rail 8 in the front-rear direction perpendicular to the front surface of the tray as indicated by arrow B. In this embodiment, the second linear table 7 is connected to a motor-driven rotating cam (not shown) and vibrates in the front-rear direction to vibrate the holder 4
And, the tray 3 held by this is vibrated.

A base frame 9 having a large number of nozzles for blowing high pressure air to remove dust is provided at a position facing the tray 3 to be cleaned. The base frame body 9 is arranged horizontally in the left-right direction and is provided with jet nozzles 10 for high-pressure air blow at both ends and a suction nozzle 11 for collecting and exhausting dust at the center, and these jet nozzles 10 and suction nozzles 11 are used as bases. A large number of upper and lower stages are provided on the entire surface of the frame body 9. The ejection nozzles 10 and the suction nozzles 11 are air tubes 12, 13
Are connected to the air supply manifold 14 and the exhaust manifold 15 respectively. The air supply manifold 14 is connected to a compressed air accumulator or compressor (not shown). The exhaust manifold 15 is connected to a vacuum pump (not shown).

It is desirable that the jetting directions of the jet nozzles 10 on the left and right sides are symmetrically inclined in the opposite horizontal directions in the horizontal direction. As a result, the left and right inner wall surfaces and the corners of each recess of the tray can be reliably cleaned by blowing air.
It is desirable that the ejection direction of the ejection nozzle is variable and that it can be adjusted according to the tray to be cleaned. The jetting direction of the nozzle is not limited to be variable in the left-right direction, but may be configured to be changeable in the vertical direction or in the freely rotatable type.

The base frame 9 to which the large number of jet nozzles 10 and suction nozzles 11 are attached is mounted on the third linear table 16. The third linear table 16 is operated by manually rotating the ball screw 18 so that the linear guide rail 1
As shown by an arrow C, it can slide in the front-rear direction at right angles to the front surface of the tray 3. The ball screw 18 may be rotationally driven by a motor.

When using the cleaning apparatus having the above-mentioned structure, the handle 19 is operated to move the first linear table 5,
The tray 3 to be cleaned is arranged at a position facing the base frame 9. Further, by operating the ball screw 18, the base frame body 9 is arranged at a position of the optimum distance from the tray 3 for cleaning. Here, the second linear table 7 is vibrated to vibrate the holder 4 and the tray 3 held by the holder 4. While the tray 3 is vibrating, compressed air is blown onto the tray 3 from the ejection nozzle 10 to scatter dust adhering to the tray. At the same time, the suction nozzle 11 evacuates the front side of the tray to discharge the dust scattered on the front side of the tray.

Instead of moving the tray 3 in the left-right direction, the base frame 9 may be moved in the left-right direction, and air blowing may be performed while moving the base frame 9 in the left-right direction. Further, the base frame body 9 can be configured not only to be movable in the direction parallel to and perpendicular to the tray front surface with respect to the tray 3, but also to be relatively movable in the vertical direction. Further, the vibration direction is not limited to the front-back direction, and may be a structure capable of vibrating in the left-right direction and the vertical direction. Further, rotation vibration or vibration in which each vibration is combined may be applied. With such a structure, a more efficient cleaning effect can be obtained.
Further, the vibration and the horizontal movement of the tray 3 may be alternately performed at different times, and the air blow may be performed while moving the tray 3 left and right.

On the air tubes 12, 13 of the jet nozzle 10 and the suction nozzle 11 or on the manifolds 14, 15 respectively.
A valve may be provided to control the air blowing on and off locally. In addition, the jet nozzle 10 and the suction nozzle 11
The number and the place of arrangement are not limited to the illustrated embodiment, and various arrangements can be made according to the use conditions.

[0018]

As described above, in the present invention, dust is removed by vacuum suction by blowing gas such as compressed air while vibrating the semiconductor loading tray to be cleaned, so that it is simple and inexpensive. With this configuration, dust can be removed efficiently and reliably. Further, unlike the conventional cleaning method using ultrasonic vibration, a heating and drying step is not required, so that the number of working steps is reduced, the processing time is shortened, and the throughput is improved. Furthermore, since it does not perform chemical solution treatment or heat drying,
The deformation of the tray due to the chemical solution or heating is prevented, and the reliability of the inspection and test of the semiconductor device can be always kept high.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device loading tray cleaning device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a semiconductor device loading tray to which the present invention is applied and which is to be cleaned.

[Explanation of symbols]

3; semiconductor device loading tray, 4; holder, 5; first linear table, 6, 8, 17; guide rail, 7; second
Linear table, 9; base frame, 10; jet nozzle, 11
Suction nozzle, 16; third linear table.

Claims (5)

[Claims] 1. A holding means for holding a tray to be cleaned, a gas spraying means having a plurality of spray nozzles for spraying gas onto the tray, and suction and discharge of dust from the gas spraying surface side of the tray. A semiconductor device loading tray cleaning apparatus, comprising: a vacuum exhausting unit having a plurality of suction nozzles for performing the operation, and a vibrating unit for vibrating the holding unit. 2. The plurality of ejection nozzles and the plurality of suction nozzles are mounted on the same base frame, and the base frame and the tray are movable relative to each other.
A tray cleaning device for loading a semiconductor device according to item 1. 3. The tray for loading a semiconductor device according to claim 2, wherein the base frame and the tray are movable relative to each other in both directions parallel and perpendicular to the cleaning surface of the tray. Cleaning device. 4. The semiconductor device loading tray cleaning device according to claim 1, wherein the jet nozzle has a variable gas spraying direction. 5. A tray for loading a semiconductor device, characterized in that a tray to be cleaned is vibrated while being blown with a gas, and at the same time, dust generated from a gas blowing surface of the tray is vacuumed and collected. Cleaning method.