JPH07100320B2 - Substrate dividing device - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention has a field of application of a board dividing device for dividing into individual circuit boards, and in particular, a series of dividing systems from removal of a protective frame to individual circuit boards. Regarding

(Background of the Invention) In general, a circuit board used in an electronic device is used by printing a plurality of identical conductive patterns on a single board body and then individually dividing the printed board. In recent years, attention has been paid to an automatic dividing device that automatically divides a substrate body to improve productivity (see: Japanese Utility Model Laid-Open No. 57-147008 "Substrate dividing device") (prior art). FIG. 3 is a diagram showing a conventional example of this type of substrate dividing apparatus.

The substrate body 1 is made of, for example, a rectangular ceramic material,
It is divided into individual circuit boards 3 by vertical and horizontal cutting lines 2a and 2b. Normally, the frame 4 is provided with the protection frame 4 by the cutting line 2c on the outer periphery of the substrate body 1 to form the framed substrate body 5 (FIG. 5A). The substrate dividing device 6 includes the first and second endless belts 7 and 8. Is composed of a first and a second transport system which are respectively stretched on the rotating shafts (9, 10) and (11, 12). The first and second transport systems abut one side of the endless belts 7 and 8 and rotate in opposite directions to form a transport path for the substrate body 1. Then, rotary shafts 13, 14, and 15 having triangular vertices as axes are formed at the abutting portions of the first and second endless belts 7 and 8, respectively, and a step portion that bends the path of the conveying path is provided. The configuration is shown in FIG. 5 (b).

Then, after removing the protective frame 4 of the substrate body 1, individual circuit boards 3 are obtained by this substrate dividing device. That is, the substrate body 1 is pressed and sandwiched between the endless belts 7 and 8 to advance the transport path, and the rotary shafts 13 and 1 in the stepped portion
The pressing forces of 4 and 15 act on the cutting line 2a, and the substrate body 1 is divided into columns (hereinafter referred to as substrate columns 16) and sent out. next,
The cutting line 2b of the board array 16 is made parallel to the rotating shafts 13, 14, 15 to advance the conveyance path, and the circuit board 3 is obtained by dividing from the cutting line 2b.

(Disadvantage of Prior Art) However, in such a structure, the protective frame 4 must be removed before the substrate body 1 is put into the substrate dividing device 6. Further, since it has to be divided again after dividing it into the substrate array 16, workability cannot be avoided. In addition, since the substrate body 1 is pressed against both sides of the endless belt by sandwiching it, there is no escape of stress. For example, when the cutting line 2 advances obliquely to the rotating shafts 12, 13 and 14, the pressing force is applied to the cutting line 2. There is a possibility that the circuit board 3 may be smashed and may be crushed. Furthermore, since the endless belts 7 and 8 are generally made of a hard material, the reliability of the division of the substrate body 1 on which, for example, an IC chip or another chip element (not shown) is mounted is not reliable.
Further, particularly in the case of a board body on which a chip element is mounted and a conductive path is formed, the circuit board is divided regardless of whether each circuit board is good or bad (for example, poor conduction). However, there is a problem in that selection after division is troublesome even if the above is added.

(Object of the Invention) It is an object of the present invention to provide a board dividing apparatus which is excellent in productivity by automating division from removal of a protective frame of a framed substrate to individual circuit boards.

(Solution) According to the present invention, a framed substrate body in which cutting lines are formed in vertical and horizontal directions and a protective frame is provided on an outer periphery is stacked and housed in a substrate supply unit and delivered, and the framed substrate delivered from the substrate supply unit. The body protection frame is collectively separated and removed by the substrate frame removing unit to form a substrate body, and the substrate body transferred from the substrate frame removing unit is divided along the horizontal cutting line by the substrate horizontal dividing unit to form a row substrate. As a body, the row substrate transferred from the board horizontal dividing section is divided along the vertical cutting line by the board vertical dividing section into individual circuit boards, and the quality of the circuit board is determined by the board selecting section. The choice is the solution. An embodiment of the present invention will be described below.

(Embodiment) FIG. 1 is a schematic plan view of a substrate dividing apparatus for explaining an embodiment of the present invention. The same parts as those in the previous embodiment will be designated by the same reference numerals.

The substrate dividing device 20 includes a substrate supply unit 30 and a substrate frame removing unit 40.
, The first transfer section 60, the substrate lateral dividing section 70, and the substrate row sending section 90
The substrate vertical division unit 100, the second transfer unit 110, and the detection mechanism unit 12
0, a third transfer section 130, and a substrate storage section 140.

The substrate supply unit 30 includes a storage box 31 and a push-out mechanism 32 having a structure not shown. The storage box 31 has the above-mentioned cutting lines 2a, 2b, 2c.
The framed substrate bodies 5 are stacked and stored, and the pushing mechanism 32 is a storage box.
The framed substrate 5 is supplied to the substrate frame removing unit 40 from the bottom of 31.

As shown in FIG. 2, the substrate frame removing section 40 is a divided support tool.
41, a positioning arm 42, and a pressing mechanism 43. The split support 41 is attached to the base 44, and the main body support is attached to the central portion.
45, and four divided bodies 46 are arranged on the outer periphery thereof. The base 44 is attached to the fixed base 47. The split body 46 is a columnar body having protrusions 48 on both ends, and the protrusions 48 are fitted and held in the grooves of a pair of support members 49 provided on one end side of each edge of the base 44. . Then, the protective frame 4 is projected from the outer periphery (top line) of the divided body 46 and the framed substrate 5 is placed on the main body support 45. The positioning arms 42 (a and b) are provided on the sides of the base 44 that intersect at right angles, and align the framed substrate 5 sent from the substrate supply unit 30 on the split support 41. The pressing mechanism 43 is a support
It is composed of 50, a movable body 51, a pressing plate 52, and a pressing tool 53. Support
The reference numeral 50 stands on one end of the fixed base 47 having a substantially inverted L shape. The movable body 51 penetrates the tip portion of the support body 50 and moves up and down by, for example, a hydraulic mechanism (not shown). The pressing plate 52 is made of a transparent acrylic plate or the like, and is attached to the lower end side of the movable body 51.
The pressing tools 53 are provided at the corners of the lower surface of the pressing plate 52 with the tips having the same leg length being arcuate. Then, by vertically moving the movable body 51, the pressing tool 53 is stopped against the outer periphery of the divided body 46, and the protective frame 4 of the framed substrate body 5 is separated and removed.

The first transfer unit 60 is arranged between the substrate frame removing unit 40 and the substrate horizontal split unit 70, and has a base 61 on which a movable arm 62 that reciprocates between the two is attached. The movable arm 62 is provided with a vacuum suction tool (not shown) at its tip, and the substrate main body 1 from which the protective frame 4 has been separated and removed is transferred from the substrate frame removing section 40 to the substrate horizontal dividing section 70.

The board horizontal dividing section 70 is composed of a main body conveying path 71 and a row dividing mechanism 72 (see FIG. 3). The main body conveyance path 71 is composed of an endless belt 73 that rotates intermittently by a mechanism (not shown), and conveyance frames 74 (a, b) are attached to both sides of the endless belt 73. And the first transfer section
The substrate main body 1 transferred by 60 is, for example, one of the transfer frames 74
Position it at a and transport it to the dividing mechanism. Row division mechanism 7
Reference numeral 2 is composed of first, second and third rotating shafts 75, 76, 77 and pressing rings 78, 79, 80, 81. The first, second and third rotary shafts 75, 76, 77 are centered on the respective vertices of a triangle, and the first rotary shaft 75 is located inside the endless belt, and the second, third rotary shafts 76,
77 is located outside. The rotary shafts 75, 76, 77 are located in the second, first, and third order in the transport direction of the substrate body 1, and the distance w between the second and third rotary shafts is the cutting line of the substrate body 1. It is set to be larger than the interval d of and smaller than 2d. Each of the pressing rings 78, 79, 80, 81 is made of an elastic material such as rubber and is attached to both ends of the second and third rotating shafts. Third
The pressing rings 80, 81 of the rotating shaft 77 are set so that one end side is larger than the other end side diameter. The outer circumference of the pressing ring 80 is arranged so as to be located below the extension of the transport surface. And the third rotating shaft 77
The pressing ring 80 concentrates the external force on the vertical cutting line 2a of the substrate body 1 and divides it into the substrate rows 16.

The board array delivery section 90 is arranged on the tip side of the main body conveyance path 71 of the board horizontal division section 70 and has a push-out mechanism 91 (not shown) such as hydraulic pressure. Then, the delivery rod 92 of the pushing mechanism is connected to the main body conveyance path 71.
The substrate array 16 which is arranged orthogonally to and is conveyed in a divided manner is sent to the substrate vertical dividing unit 100.

The substrate vertical dividing unit 100 is composed of an array conveying path 101 and a vertical dividing unit 102 (see FIG. 4). The row transport path 101 is composed of an endless belt 103 that rotates intermittently by a mechanism (not shown), has transport frames 104 (a, b) on both sides thereof, and is arranged orthogonal to the main body transport path 71. The one (outer) transport frame 104a extends on the main-body transport path 71. Then, the substrate array 16 is arranged in the transport frame 10.
4a is used for positioning and is delivered onto the column transport path 101 and further transported to the vertical splitting mechanism 102 side. The vertical dividing mechanism 102 includes first, second and third rotating shafts 105, 106 and 107 and pressing rings 108 and 109 fitted to these. The first, second, and third rotation shafts 105, 106, and 107 are centered on the respective vertices of a triangle as described above, and the first rotation shaft 105 is located inside the endless belt 103, and the second and third rotation shafts. 106 and 107 are arranged on the outside. The rotary shafts 105, 106, 107 are located in the order of the second, first, and third in order to transfer the substrate body, and the distance w ′ between the second and third rotary shafts corresponds to the cutting line of the substrate body. It is set to be larger than the interval d'and smaller than 2d '. Each of the pressing rings 108 and 109 is made of an elastic body, and has second and third rotating shafts 106 and 1.
It is attached to the center of 07. The lower end of the outer circumference of the pressing ring 109 is arranged so as to be located below the extension of the conveying surface. And
The pressing ring 109 concentrates an external force on the cutting line 2b of the board array 1 to divide the circuit board 3 into individual circuit boards 3. Second transfer section 110
Is disposed between the substrate vertical split section 100 and the detection mechanism section 120, and is provided with a movable arm 112 that reciprocates between the base table 111 and the third transfer section 130. The movable arm 112 has a vacuum suction tool (not shown) attached to its tip. Then, the individual circuit boards 3 that have been conveyed are vertically separated by a vacuum suction tool.
Transfer from 100 to the detection mechanism unit 120.

The detection mechanism section 120 is provided with an optical reading device 122 having a mechanism (not shown) on the detection base 121. The detection base 121 is composed of, for example, a conveyor that operates intermittently, and moves and fixes the circuit board 3 transferred from the board vertical dividing unit 100 to the optical reading device 122, and further, the third transfer unit 130.
Transfer to the side. The optical reading device 122 includes, for example, each circuit board 3
The defective product is removed from the conveyer by detecting and selecting a good or bad marker, such as a poor continuity, which is applied to the framed substrate before division.

The third transfer unit 130 is arranged between the detection mechanism unit 120 and the substrate storage unit 140, and the movable base 131 having a vacuum suction tool is provided on the above-mentioned base 111 so as to reciprocate between them. Then, the good circuit boards 3 selected by the detection mechanism section 120 are transferred to the board storage section 140.

The substrate storage unit 140 includes a substrate pedestal 141, a fourth transfer unit 142, and a storage case 1.
It consists of 43 and a conveyor 144. The board pedestal 141 is, for example, an intermittent operation conveyor, and sequentially moves the circuit boards 3 transferred from the inspection mechanism section 120. The fourth transfer section 142 is the base 1
45 is provided with movable arms 146 and 147 for driving in the X and Y directions,
Each is equipped with a vacuum suction tool. The storage 143 includes first and second chambers, and a first mechanism 148 is provided by a lift mechanism (not shown).
An empty tray 150 is stacked in the second chamber 149, and a stored tray 151 is stacked in the second chamber 149. The transport conveyor 144 is arranged below the storage 143. Then, the empty tray 150 lifted down from the first chamber 148 is transferred to the pedestal 141 side, and the fourth transfer unit 142
After the circuit board 3 is vertically and horizontally accommodated in the empty tray 150, the circuit board 3 is inverted and transferred, and the accommodated tray is lifted up in the second chamber. The operation of each unit is controlled in series by a signal from the operation unit 150 or the like.

Therefore, in the board dividing apparatus having such a configuration, the protection frame 4 is removed along the cutting lines 2a, 2b, 2c of the framed board body 5, the board row body 16 and the circuit board 3 are divided, and defective products are Removal,
Work such as housing the circuit board 3 is automated and continuously performed to improve productivity. Then, in this embodiment,
One of the pressure rings 80, 81 attached to the third rotating shaft 77 of 70
Since a large value is applied, an external force is particularly applied to one end side of the substrate body to cause brittle fracture along the cutting line 2a. Therefore, as compared with, for example, a case where the endless belt is sandwiched and divided between the endless belts, it is possible to prevent the portion other than the cutting line 2a from being crushed without applying an unreasonable external force to one end side. Since the pressing ring is made of an elastic body so as not to come into contact with the entire surface of the substrate body 1, deterioration of characteristics before and after the division is prevented even when a chip element is mounted, for example.

(Other Matters) Although the pressing rings 80 and 81 are attached to the third rotating shaft 77 of the substrate horizontal dividing portion 70 in the above embodiment, the pressing ring 81 on the other end side may be omitted. . Although the diameter of one of the pressing rings 80 and 81 is increased, the diameter of both may be made the same to increase the elasticity of the other 81.
The external force may be particularly applied to one side so that the other side 81 has a free end. Further, the substrate dividing device and the substrate frame removing device in the present invention have been already proposed by the present applicant.
Based on 62-198928, 62-267446, and 62-269087, refer to them when necessary.

(Effects of the Invention) The present invention stacks and stores a framed substrate body in which cutting lines are formed in the vertical and horizontal directions and a protective frame is provided on the outer periphery in a substrate supply unit, and the frame is sent from the substrate supply unit in the previous period. The protective frame of the substrate body is collectively separated and removed by the substrate frame removing unit to form a substrate body, and the substrate body transferred from the substrate frame removing unit is divided by the substrate horizontal dividing unit along a horizontal cutting line to form a row. As a board body, the row board body transferred from the board horizontal division portion is divided along the vertical cutting line by the board vertical division portion into individual circuit boards, and the quality of the circuit board is judged by the board selection portion. Since it has been selected as described above, it is possible to provide a board dividing device having excellent productivity by automating the division from the removal of the protective frame of the framed board body to the individual circuit boards, and the practical effect thereof is great.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a board dividing apparatus for explaining an embodiment of the present invention, FIG. 2 is a view of the board frame removing section, and FIG.
FIG. 4 is a diagram of a main portion of the substrate horizontal split portion, and FIG. 4 is a diagram of a main portion of the substrate vertical split portion. FIG. 5 is a diagram of a substrate dividing device for explaining a conventional example, FIG. 5A is a plan view of a framed substrate, and FIG. 5B is a diagram of the substrate dividing device. 30 ... Substrate supply unit, 40 ... Substrate frame removal unit, 60 ... First transfer unit, 70 ... Substrate horizontal division unit, 90 ... Substrate array delivery unit, 100 ...
... Board vertical division section, 110 ... Second transfer section, 120 ... Detection mechanism section, 130 ... Third transfer section, 140 ... Board storage section.

Claims (1)

[Claims] 1. A board dividing device for dividing a plurality of framed board bodies having a board main body having vertical and horizontal cut lines and a protective frame around the outer circumference of the board main body into individual circuit boards, wherein the plurality of framed boards are provided. A substrate supply unit for accommodating and accommodating the substrates in a stacked manner and sequentially delivering the substrates to the next step, and a framed substrate body delivered from the substrate supply unit is faced on a split support and the protection frame is provided from the outer periphery of the split support. Four frame holders are provided on the outer periphery of the pressure plate that is projected, held and fixed, and moves in the vertical direction, and the tip of the pressure plate protrudes downward. And a substrate horizontal dividing unit that divides the substrate body transferred from the substrate frame removing unit through three rotating bodies to obtain row substrate bodies by dividing the substrate body along the horizontal cutting line. , The horizontal transferred from the board horizontal dividing section A substrate vertical splitting unit for splitting the row substrate through the three rotating bodies to obtain individual circuit boards by splitting along the vertical cutting line of the horizontal substrate, and transfer from the vertical substrate splitting unit For each individual circuit board
A board dividing device, comprising: a detection mechanism unit that detects a defective / non-defective marker provided in advance on the circuit board and removes a defective product.