JPH07114246B2 - High temperature aging method for electronic parts - Google Patents
High temperature aging method for electronic partsInfo
- Publication number
- JPH07114246B2 JPH07114246B2 JP1009316A JP931689A JPH07114246B2 JP H07114246 B2 JPH07114246 B2 JP H07114246B2 JP 1009316 A JP1009316 A JP 1009316A JP 931689 A JP931689 A JP 931689A JP H07114246 B2 JPH07114246 B2 JP H07114246B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- high temperature
- temperature aging
- electronic parts
- aging method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子装置等に使用される電子部品の高温エージ
ング方式に関する。The present invention relates to a high temperature aging method for electronic components used in electronic devices and the like.
従来、電子部品の高温バイアステスト等のエージング方
式には、加熱器による接触方式，高温オーブン方式，あ
るいは冷却路の温度制御方式等がある。Conventionally, as an aging method such as a high temperature bias test for electronic parts, there are a contact method using a heater, a high temperature oven method, a temperature control method of a cooling path, and the like.
上述した従来の高温エージング方式、特に加熱器を電子
部品に接触させ温度制御する方式は加熱ヒーターによる
温度制御であるので、温度制御範囲が広く適正温度に設
定するのが困難である。また、高温オーブン方式も温度
制御のバラツキが大きいという欠点があり特に大電力量
の電子部品には適用しにくい。そして、液体の溶媒を利
用した冷却方式は温度誤差が少ない良好な方式である
が、制御の自由度が狭く簡単に電子部品の回路ジャンク
ション温度を設定できないという欠点がある。The above-mentioned conventional high temperature aging method, in particular, the method of controlling the temperature by bringing the heater into contact with the electronic component is the temperature control by the heating heater, so that it is difficult to set a proper temperature with a wide temperature control range. Further, the high-temperature oven method also has a drawback that the temperature control has a large variation, and it is difficult to apply it to electronic components with a large amount of electric power. Although the cooling method using a liquid solvent is a good method with a small temperature error, it has a drawback that the degree of control is narrow and the circuit junction temperature of the electronic component cannot be easily set.
本発明の電子部品の高温エージング方式は、集積回路を
搭載した回路基板と、冷却路を内蔵し前記回路基板に接
触して熱吸収する冷却プレートと、前記回路基板と前記
冷却プレートとの間に介在し熱伝導を阻害する熱抵抗性
シートとを有し、前記熱抵抗性シートの厚さを任意に選
択するようにより前記集積回路内のジャンクション温度
を制御するようにして構成される。A high-temperature aging method for electronic parts of the present invention is a circuit board on which an integrated circuit is mounted, a cooling plate which has a cooling path built therein, and which absorbs heat by contacting the circuit board, and between the circuit board and the cooling plate. And a heat-resistive sheet interposed between the heat-resistive sheet and the heat-resistant sheet to control the junction temperature in the integrated circuit by arbitrarily selecting the thickness of the heat-resistant sheet.
次に本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す縦断面図である。同図
において冷却プレート１は内部に液体溶媒路を有してお
り、熱放散機構となっている。電子部品２は多層基板３
と集積回路４で構成されており、多層基板３の下部に集
積回路４が半田５で取付けられている。電子部品２の熱
放散面と冷却プレート１の熱吸収面との間に熱伝導の劣
る熱抵抗性シート６があり、これを位置決めしている押
え枠７が電子部品２を保持してボード８に実装される。FIG. 1 is a vertical sectional view showing an embodiment of the present invention. In the figure, the cooling plate 1 has a liquid solvent passage therein, and serves as a heat dissipation mechanism. The electronic component 2 is a multilayer substrate 3
The integrated circuit 4 is attached to the lower part of the multilayer substrate 3 with solder 5. Between the heat dissipation surface of the electronic component 2 and the heat absorption surface of the cooling plate 1, there is a heat resistant sheet 6 having inferior heat conduction, and a holding frame 7 for positioning the same holds the electronic component 2 and holds the board 8 Will be implemented in.
集積回路４における発熱が接合部の半田５を介して多層
基板３に伝わり、熱抵抗性シート６を通して冷却プレー
ト１に熱放散される。このような熱放散系において、熱
抵抗性シート厚さを任意に変更することにより、熱抵抗
を変化させることができる。すなわち電力量の違う多品
種の電子部品を予め実験等でシート厚さによる回路ジャ
ンクション温度特性を算出して個別にシート厚さを決め
ることにより、同一温度条件での高温エージングが可能
となる。The heat generated in the integrated circuit 4 is transmitted to the multilayer substrate 3 via the solder 5 at the joint, and is radiated to the cooling plate 1 through the heat resistant sheet 6. In such a heat dissipation system, the heat resistance can be changed by arbitrarily changing the thickness of the heat resistant sheet. That is, it is possible to perform high temperature aging under the same temperature condition by previously calculating the circuit junction temperature characteristics depending on the sheet thickness and individually determining the sheet thickness for various types of electronic components having different electric power amounts by experiments.
以上説明したように本発明は、電子部品と冷却プレート
との間に熱抵抗性シートを挿入することにより、このシ
ート厚さを任意に設定して熱抵抗を自在に変化させるこ
とができ、集積回路のジャンクション温度をフレキシブ
ルにかつ高精度に保持することができ、効率のよい高温
エージングが可能となる。特に最近のハイパワーの電子
部品の高温エージング方式として最適である。As described above, according to the present invention, by inserting the heat resistant sheet between the electronic component and the cooling plate, the thickness of the sheet can be arbitrarily set to change the heat resistance freely. The junction temperature of the circuit can be flexibly and accurately maintained, and efficient high temperature aging can be performed. Especially, it is most suitable as a high temperature aging method for recent high power electronic parts.
第１図は本発明に一実施例を示す縦断面図である。 １…冷却プレート、２…電子部品、３…多層基板、４…
集積回路、５…半田、６…熱抵抗性シート、７…押え
枠、８…ボード。FIG. 1 is a vertical sectional view showing an embodiment of the present invention. 1 ... Cooling plate, 2 ... Electronic component, 3 ... Multilayer substrate, 4 ...
Integrated circuit, 5 ... Solder, 6 ... Heat resistant sheet, 7 ... Holding frame, 8 ... Board.
Claims (1)
内蔵し前記回路基板に接触して熱吸収する冷却プレート
と、前記回路基板と前記冷却プレートとの間に介在し熱
伝導を阻害する熱抵抗性シートとを有し、前記熱抵抗性
シートの厚さを任意に選択することにより前記集積回路
内のジャンクション温度を制御することを特徴とする電
子部品の高温エージング方式。1. A circuit board on which an integrated circuit is mounted, a cooling plate which has a cooling passage built therein and which contacts the circuit board to absorb heat, and is interposed between the circuit board and the cooling plate to impede heat conduction. And a heat resistant sheet for controlling the junction temperature in the integrated circuit by arbitrarily selecting the thickness of the heat resistant sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1009316A JPH07114246B2 (en) | 1989-01-17 | 1989-01-17 | High temperature aging method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1009316A JPH07114246B2 (en) | 1989-01-17 | 1989-01-17 | High temperature aging method for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02188947A JPH02188947A (en) | 1990-07-25 |
| JPH07114246B2 true JPH07114246B2 (en) | 1995-12-06 |
Family
ID=11717067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1009316A Expired - Lifetime JPH07114246B2 (en) | 1989-01-17 | 1989-01-17 | High temperature aging method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114246B2 (en) |
-
1989
- 1989-01-17 JP JP1009316A patent/JPH07114246B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02188947A (en) | 1990-07-25 |
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