JPH07121996B2 - Epoxy resin powder composition - Google Patents
Epoxy resin powder compositionInfo
- Publication number
- JPH07121996B2 JPH07121996B2 JP62108364A JP10836487A JPH07121996B2 JP H07121996 B2 JPH07121996 B2 JP H07121996B2 JP 62108364 A JP62108364 A JP 62108364A JP 10836487 A JP10836487 A JP 10836487A JP H07121996 B2 JPH07121996 B2 JP H07121996B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder composition
- resin powder
- composition
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 32
- 229920000647 polyepoxide Polymers 0.000 title claims description 32
- 239000000203 mixture Substances 0.000 title claims description 25
- 239000000843 powder Substances 0.000 title claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000004088 foaming agent Substances 0.000 claims description 7
- 238000001723 curing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- -1 aliphatic amines Chemical class 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
- 235000019399 azodicarbonamide Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- KXPTYUSZHKUYSM-UHFFFAOYSA-N 1-n,4-n-dimethyl-2,3-dinitrosobenzene-1,4-dicarboxamide Chemical compound CNC(=O)C1=CC=C(C(=O)NC)C(N=O)=C1N=O KXPTYUSZHKUYSM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- BLJHFERYMGMXSC-UHFFFAOYSA-N 3-[3-(hydrazinesulfonyl)phenyl]sulfonylbenzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC(S(=O)(=O)C=2C=C(C=CC=2)S(=O)(=O)NN)=C1 BLJHFERYMGMXSC-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- ALEBYBVYXQTORU-UHFFFAOYSA-N 6-hydrazinyl-6-oxohexanoic acid Chemical compound NNC(=O)CCCCC(O)=O ALEBYBVYXQTORU-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、エポキシ樹脂粉体組成物に関し、より詳しく
は電子部品の封止用材料として優れた特性を発揮するエ
ポキシ樹脂粉体組成物に関する。Description: TECHNICAL FIELD The present invention relates to an epoxy resin powder composition, and more particularly to an epoxy resin powder composition that exhibits excellent properties as a sealing material for electronic parts.
従来技術とその問題点 従来コンデンサー、抵抗、コイル等の電子部品の封止又
は塗装方法として、エポキシ樹脂粉体組成物を使用する
流動浸漬法、静電流動浸漬法、静電スプレー法、いわゆ
る“振りかけ転がし法”等が行なわれている。しかしな
がら、従来技術により得られる硬化塗膜は、硬度が高
く、緻密でありすぎるために、耐ヒートサイクル性及び
クラック性に劣り、従ってピンホール発生を充分に防止
し得ず、電子部品の保護を効果的に行なうことが出来な
い。Conventional technology and its problems Conventional methods for encapsulating or coating electronic parts such as capacitors, resistors and coils are fluidized dipping method using an epoxy resin powder composition, electrostatic fluidized dipping method, electrostatic spraying method, so-called ""Sprinkle rolling method" etc. are performed. However, the cured coating film obtained by the conventional technique has high hardness and is too dense, so that it is inferior in heat cycle resistance and cracking resistance, and therefore pinholes cannot be sufficiently prevented and electronic components are protected. It cannot be done effectively.
問題点を解決するための手段 本発明者は、上記の如き従来技術の問題点に鑑みて種々
研究を重ねた結果、硬化後に多孔質となる新しいタイプ
のエポキシ樹脂粉体組成物が、その様な問題点を実質的
に解消若しくは大幅に軽減し得ることを見出した。すな
わち、本発明は、エポキシ樹脂と硬化剤とを含むエポキ
シ樹脂粉体組成物において、エポキシ樹脂100重量部に
対して発泡剤10〜60重量部を配合したことを特徴とする
エポキシ樹脂粉体組成物を提供するものである。Means for Solving the Problems The present inventor has conducted various studies in view of the problems of the prior art as described above, and as a result, a new type epoxy resin powder composition which becomes porous after curing is It has been found that such problems can be substantially eliminated or significantly reduced. That is, the present invention is an epoxy resin powder composition containing an epoxy resin and a curing agent, wherein the epoxy resin powder composition is characterized by blending 10 to 60 parts by weight of a foaming agent with respect to 100 parts by weight of the epoxy resin. It is to provide things.
本発明で使用するエポキシ樹脂としては、その分子中に
エポキシ基を少くとも２個有する化合物であれば、分子
構造、分子量などの点で特に制限はなく、従来から電子
部品封止用エポキシ樹脂粉体組成物において使用されて
いるものが、すべて使用可能である。エポキシ樹脂の具
体例としては、ビスフェノール型等の芳香族系、シクロ
ヘキサン誘導体等の脂環族系、ノボラック系等が挙げら
れる。The epoxy resin used in the present invention is not particularly limited in terms of molecular structure, molecular weight, etc., as long as it is a compound having at least two epoxy groups in its molecule, and conventionally it is an epoxy resin powder for sealing electronic parts. All that is used in body compositions can be used. Specific examples of the epoxy resin include aromatic type such as bisphenol type, alicyclic type such as cyclohexane derivative, and novolac type.
本発明で使用する硬化剤も、従来から電子部品封止用エ
ポキシ樹脂粉体組成物において使用されているものと何
ら異なるところはない。具体的には、ジエチルアミノプ
ロピルアミン、Ｎ−アミノエチルピペラジン、イソフロ
ンジアミン、メンセンジアミン、キシレンジアミン等の
脂肪族アミン；メタフェニレンジアミン、ジアミノフェ
ニルメタン、ジアミノジフェニルスルホン、3,9−ビス
（３−アミノプロピル）−2,4,8,10−wsorv［〜［5,5］
ウンデカン等の芳香族アミン；無水フタル酸、無水マレ
イン酸、無水ピロメリット酸、無水メチルナリジック
酸、無水クロレンデック酸等の酸無水物；ジシアンアミ
ド、フェニルビグアニド等のアミド類;2−メチルイミダ
ゾール、２−エチル−４メチルイミダゾール、２−ウン
デシルイミダゾール、２−フェニルイミダゾール等のイ
ミダゾール類；コハク酸ヒドラジド、アジピン酸ヒドラ
ジド、イソフタル酸ヒドラジド、サリチル酸ヒドラジド
等のカルボン酸ヒドラジドの如きヒドラジド類；三フッ
化ホウ素−モノエチルアミン、三フッ化ホウ素−ベンジ
ルアミン等のエポキシ樹脂硬化剤が例示される。これら
のうちでも、酸無水物、イミダゾール類、アミド類等が
より好ましい。硬化剤の使用量も、公知のエポキシ樹脂
組成物における量と変りなく、通常エポキシ樹脂重量の
１〜80％程度である。The curing agent used in the present invention is no different from that used in the conventional epoxy resin powder composition for sealing electronic parts. Specifically, aliphatic amines such as diethylaminopropylamine, N-aminoethylpiperazine, isoflondiamine, mensendiamine, xylenediamine; metaphenylenediamine, diaminophenylmethane, diaminodiphenylsulfone, 3,9-bis (3 -Aminopropyl) -2,4,8,10-wsorv [~ [5,5]
Aromatic amines such as undecane; acid anhydrides such as phthalic anhydride, maleic anhydride, pyromellitic anhydride, methylnalidic acid anhydride, chlorendic acid anhydride; amides such as dicyanamide, phenyl biguanide; 2-methylimidazole, 2 -Ethyl-4-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, and other imidazoles; Succinic acid hydrazide, adipic acid hydrazide, isophthalic acid hydrazide, salicylic acid hydrazide, and other hydrazides; boron trifluoride Examples thereof include epoxy resin curing agents such as monoethylamine and boron trifluoride-benzylamine. Among these, acid anhydrides, imidazoles, amides and the like are more preferable. The amount of the curing agent used is no different from the amount in the known epoxy resin composition and is usually about 1 to 80% of the weight of the epoxy resin.
本発明で使用する発泡剤としては、80〜200℃程度の温
度で分解若しくは発泡するものが挙げられる。具体的に
は、2,2′−アゾビスイソブチロニトリル、アゾヘキサ
ヒドロベンゾニトリル、アゾジカルボンアミド、ジアゾ
アミノベンゼン等のアゾ化合物系;N,N′−ジニトロソペ
ンタメチレンテトラミン、N,N′−ジニトロソ−N,N′−
ジニトロソ−N,N′−ジメチルテレフタルアミド等の、
ニトロソ化合物系；ベンゼンスルホニルヒドラジド、ｐ
−トルエンスルホニルヒドラジド、ジフェニルスルホン
−3,3′−ジスルホニルヒドラジド、ジフェニルオキシ
ド−4,4′−ジスルホニルヒドラジド等のスルホニルヒ
ドラジド化合物系；並びにブタン、ノルマルヘキサン炭
化水素を内包する熱膨脹性マイクロカプセル等が例示さ
れる。このような発泡剤の使用量は、発泡剤の種類、エ
ポキシ樹脂組成物の用途及びそれに応じて定まる多孔質
樹脂硬化物の物性等により変り得るが、エポキシ樹脂10
0重量部に対し、通常10〜60重量部程度の範囲内にあ
る。Examples of the foaming agent used in the present invention include those that decompose or foam at a temperature of about 80 to 200 ° C. Specifically, azo compound systems such as 2,2′-azobisisobutyronitrile, azohexahydrobenzonitrile, azodicarbonamide and diazoaminobenzene; N, N′-dinitrosopentamethylenetetramine, N, N ′ -Dinitroso-N, N′-
Such as dinitroso-N, N′-dimethylterephthalamide,
Nitroso compound system; benzenesulfonyl hydrazide, p
-Toluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, diphenyloxide-4,4'-disulfonylhydrazide and other sulfonylhydrazide compound systems; and heat-expandable microcapsules containing butane and normal hexane hydrocarbons Is exemplified. The amount of such a foaming agent used may vary depending on the type of the foaming agent, the use of the epoxy resin composition and the physical properties of the porous resin cured product which is determined accordingly.
It is usually in the range of about 10 to 60 parts by weight with respect to 0 parts by weight.
尚、本発明エポキシ樹脂組成物には、必要に応じ常法に
従って、炭酸カルシウム、水酸化アルミニウム、酸化ア
ルミニウム、石英ガラス粉、ケイ酸アルミニウム、鉄
粉、ポリエチレンパウダー、ポリアミドパウダー等の無
機系及び有機系の充填材；三酸化アンチモン、リン系、
ハロゲン系等の難燃材；酸化チタン、カーボンブラッ
ク、ベンガラ、フタロシアニンブルー、群青等の顔料等
を配合しても良い。Incidentally, the epoxy resin composition of the present invention, if necessary, according to a conventional method, inorganic and organic such as calcium carbonate, aluminum hydroxide, aluminum oxide, quartz glass powder, aluminum silicate, iron powder, polyethylene powder, polyamide powder and the like. Fillers based on antimony trioxide, phosphorus,
Halogen-based flame-retardant materials; pigments such as titanium oxide, carbon black, red iron oxide, phthalocyanine blue, and ultramarine may be mixed.
本発明のエポキシ樹脂粉体組成物は、公知のエポキシ樹
脂粉体組成物と同様の方法で製造される。例えば、所定
の割合の成分を均一に混合し、発泡剤が実質的に分解又
は発泡しない条件下に溶融した状態で押出機から押出し
た後、微粉砕し、分級すれば良い。The epoxy resin powder composition of the present invention is produced by the same method as that of a known epoxy resin powder composition. For example, the components may be uniformly mixed at a predetermined ratio, extruded from the extruder in a molten state under the condition that the foaming agent does not substantially decompose or foam, and then finely pulverized and classified.
更に、本発明エポキシ樹脂粉体組成物は、公知のエポキ
シ樹脂粉体組成物と同様にして使用される。例えば、電
子部品の封止又は被覆に際しては、流動浸漬法、静電流
動浸漬法、静電スプレー法、いわゆる“振りかけ転がし
法”等の手法によれば良い。Furthermore, the epoxy resin powder composition of the present invention is used in the same manner as a known epoxy resin powder composition. For example, when encapsulating or covering electronic components, a fluid immersion method, an electrostatic fluid immersion method, an electrostatic spray method, a so-called "sprinking rolling method", or the like may be used.
本発明エポキシ樹脂粉体組成物を使用する場合には、各
成分の性質及び配合割合等により定まる組成物自体の物
性に応じて、独立気泡或いは連続気泡が形成される場合
があり、又この両者が混在する中間的気泡が形成される
場合もある。従って、必要ならば、発泡後の硬化体をワ
ックス等に浸漬して封孔を行なっても良い。When the epoxy resin powder composition of the present invention is used, closed cells or continuous cells may be formed depending on the physical properties of the composition itself, which are determined by the properties of each component, the mixing ratio, and the like. There may be a case where an intermediate bubble containing a mixture of is formed. Therefore, if necessary, the cured body after foaming may be immersed in wax or the like to seal the hole.
発明の効果 本発明のエポキシ樹脂組成物は、加熱硬化時に発泡して
多孔質化するので、これを電子部品の封止若しくは被覆
用に使用する場合には、電子部品に柔軟性、耐ヒートサ
イクル性、ピンホール防止性を付与する。従って、電子
部品の信頼性が著るしく高められる。EFFECT OF THE INVENTION The epoxy resin composition of the present invention foams and becomes porous at the time of heat curing, and therefore, when it is used for sealing or coating of electronic parts, the electronic parts have flexibility and heat cycle resistance. And pinhole prevention. Therefore, the reliability of the electronic component is significantly improved.
実 施 例 以下に実施例及び比較例を示し、本発明の特徴とすると
ころをより一層明らかにする。Examples Examples and comparative examples will be shown below to further clarify the features of the present invention.
実施例１〜８及び比較例１〜４ 第１表に示す割合で、エポキシ樹脂100重量部に対し硬
化剤、発泡剤及び必要に応じて炭酸カルシウムを配合
し、常温で混合し、粉砕して、エポキシ樹脂粉体組成物
を得た。流動浸漬塗装機を使用して、得られた組成物の
180℃×60秒での発泡性を判定した。結果を第１表に示
す。尚、第１表においては、使用したエポキシ樹脂を○
印により示す。Examples 1 to 8 and Comparative Examples 1 to 4 In a ratio shown in Table 1, a curing agent, a foaming agent and, if necessary, calcium carbonate were mixed with 100 parts by weight of an epoxy resin, mixed at room temperature, and pulverized. An epoxy resin powder composition was obtained. Of the resulting composition using a fluidized dip coater
The foamability at 180 ° C for 60 seconds was evaluated. The results are shown in Table 1. In Table 1, the epoxy resin used is
This is indicated by a mark.
また、得られた粉体組成物を使用して、流動浸漬塗装機
によりJIS2号ばね座金に粉体塗装を行なった後、120℃
で60分間熱風乾燥して硬化及び発泡させた。次いで、該
塗装座金を、液状エポキシ樹脂（エポキシ当量200）と
芳香族アミン硬化剤との混合物に押込み成形した後、10
0℃で120分間硬化させた。かくして得られた硬化体を、
−40℃×30分→140℃×30分を１サイクルとするヒート
サイクルテストに20回供して、その耐久性を調べた。検
体10本中のクラック発生数で示される結果を第１表に示
す。Further, using the obtained powder composition, after performing powder coating on JIS No. 2 spring washer with a fluid immersion coating machine, 120 ° C
It was dried with hot air for 60 minutes to cure and foam. Then, the coating washer was press-molded into a mixture of a liquid epoxy resin (epoxy equivalent: 200) and an aromatic amine curing agent.
Cured at 0 ° C for 120 minutes. The cured product thus obtained is
A heat cycle test was conducted 20 times, one cycle of which is −40 ° C. × 30 minutes → 140 ° C. × 30 minutes, and the durability was examined. The results, which are shown by the number of cracks in 10 specimens, are shown in Table 1.
尚、第１表において、各記号は、以下の事項を示す。In Table 1, each symbol indicates the following items.
（Ｉ）…ビスフェノール型エポキシ樹脂；エポキシ当量
650 （II）…脂環族系エポキシ樹脂；エポキシ当量600 （III）…ノボラック系エポキシ樹脂；エポキシ当量200 （IV）…アゾジカルボンアミド （Ｖ）…N,N′−ジニトロソペンタメチレンテトラミン （VI）…P,P′−オキシビス（ベンゼンスルホニルヒド
ラジド） （VII）…ブタン及びノルマルヘキサンを内包する熱膨
脹性マイクロカプセル （VIII）…２−メチルイミダゾール （IX）…炭酸カルシウム （Ｘ）…発泡性： ◎ 極めて良い △ 良い ● 悪い （XI）…耐久性： ◎ クラックなし △ ５個までクラックあり ● すべてにクラックあり 第１表に示す結果から、本発明の優れた効果が明らかで
ある。(I) ... Bisphenol type epoxy resin; epoxy equivalent
650 (II) ... Alicyclic epoxy resin; Epoxy equivalent 600 (III) ... Novolac epoxy resin; Epoxy equivalent 200 (IV) ... Azodicarbonamide (V) ... N, N'-dinitrosopentamethylenetetramine (VI ) ... P, P'-oxybis (benzenesulfonylhydrazide) (VII) ... Thermally expandable microcapsules containing butane and normal hexane (VIII) ... 2-Methylimidazole (IX) ... Calcium carbonate (X) ... Effervescence: ◎ Very good △ Good ● Poor (XI)… Durability: ◎ No cracks △ Up to 5 cracks ● All cracks From the results shown in Table 1, the excellent effect of the present invention is clear.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金井 洋一 大阪府高槻市道鵜町３丁目58番地 サンユ レジン株式会社内 (72)発明者 川崎 正雄 大阪府高槻市道鵜町３丁目58番地 サンユ レジン株式会社内 (56)参考文献 特開 昭63−154751（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoichi Kanai 3-58, Unomachi, Takatsuki-shi, Osaka Prefecture Sanyu Resin Co., Ltd. (72) Masao Kawasaki 3-58, Unomachi, Takatsuki-shi, Osaka Sanyu Resin Co., Ltd. (56) Reference JP-A-63-154751 (JP, A)
Claims (1)
脂粉体組成物において、エポキシ樹脂100重量部に対し
て発泡剤10〜60重量部を配合したことを特徴とするエポ
キシ樹脂粉体組成物。1. An epoxy resin powder composition containing an epoxy resin and a curing agent, wherein 10 to 60 parts by weight of a foaming agent is mixed with 100 parts by weight of the epoxy resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62108364A JPH07121996B2 (en) | 1987-04-30 | 1987-04-30 | Epoxy resin powder composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62108364A JPH07121996B2 (en) | 1987-04-30 | 1987-04-30 | Epoxy resin powder composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63273652A JPS63273652A (en) | 1988-11-10 |
| JPH07121996B2 true JPH07121996B2 (en) | 1995-12-25 |
Family
ID=14482878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62108364A Expired - Lifetime JPH07121996B2 (en) | 1987-04-30 | 1987-04-30 | Epoxy resin powder composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07121996B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307258C (en) * | 2002-08-09 | 2007-03-28 | 信越化学工业株式会社 | Flame retardant epoxy resin composition, semiconductor encapsulation material using the composition, and resin-encapsulated semiconductor device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103992620A (en) * | 2014-05-29 | 2014-08-20 | 贵州凯科特材料有限公司 | Microcellular foaming epoxy resin matrix material with high performance and preparation method thereof |
| JP7247550B2 (en) * | 2018-11-29 | 2023-03-29 | 住友ベークライト株式会社 | ENCAPSULATING EPOXY RESIN COMPOSITION AND ELECTRONIC DEVICE |
| JP2021155474A (en) * | 2020-03-25 | 2021-10-07 | 住友ベークライト株式会社 | Encapsulating resin composition and electronic device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63154751A (en) * | 1986-12-17 | 1988-06-28 | Nitto Electric Ind Co Ltd | Expandable epoxy resin composition |
-
1987
- 1987-04-30 JP JP62108364A patent/JPH07121996B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307258C (en) * | 2002-08-09 | 2007-03-28 | 信越化学工业株式会社 | Flame retardant epoxy resin composition, semiconductor encapsulation material using the composition, and resin-encapsulated semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63273652A (en) | 1988-11-10 |
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