JPH07128367A - Method and device for cleaning probe tip of probe card - Google Patents
Method and device for cleaning probe tip of probe cardInfo
- Publication number
- JPH07128367A JPH07128367A JP29453593A JP29453593A JPH07128367A JP H07128367 A JPH07128367 A JP H07128367A JP 29453593 A JP29453593 A JP 29453593A JP 29453593 A JP29453593 A JP 29453593A JP H07128367 A JPH07128367 A JP H07128367A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- tip
- probe card
- cleaning
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 125
- 238000004140 cleaning Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims description 9
- 239000007788 liquid Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003792 electrolyte Substances 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プローブカード用プロ
ーブの先端に付着した砥粒等の異物を洗浄するプローブ
カード用プローブの先端の洗浄方法及び洗浄装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for cleaning the tip of a probe for a probe card for cleaning foreign matters such as abrasive grains attached to the tip of the probe for a probe card.
【０００２】[0002]
【従来の技術】プローブカード用プローブは、プローブ
カードの製造工程を通して種々の異物が付着する。この
異物には、プローブカード用プローブを精度良く保持す
るためのプラスチックの屑、プローブカード用プローブ
を研磨した砥粒や金属屑の他に作業者の手の油、塵芥等
がある。これらの異物が付着したプローブカード用プロ
ーブは、相互に接触して短絡するおそれがある。プロー
ブカード用プローブの短絡は、測定対象物である半導体
集積回路の正確な電気的諸特性の妨げになる。そこで、
従来、プローブカード用プローブに付着した異物は、水
やフロン等の溶媒にプローブカード用プローブを浸漬し
た超音波洗浄によって洗浄されている。2. Description of the Related Art Various foreign substances adhere to a probe for a probe card during the manufacturing process of the probe card. The foreign matters include plastic scraps for accurately holding the probe for probe card, abrasive grains and metal scraps polished from the probe for probe card, oil of the hand of the operator, dust and the like. The probe for a probe card to which these foreign matters adhere may come into contact with each other and short-circuit. The short circuit of the probe for the probe card hinders accurate electrical characteristics of the semiconductor integrated circuit which is the measurement object. Therefore,
Conventionally, foreign matter attached to a probe for a probe card is cleaned by ultrasonic cleaning in which the probe for a probe card is immersed in a solvent such as water or chlorofluorocarbon.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来の超音波洗浄方法には以下のような問題点があ
る。すなわち、プローブカード用プローブの先端に付着
した異物のなかには、強い超音波洗浄を行わなければ洗
浄できないものがある。このような異物を洗浄するため
に、強い超音波洗浄を行うと、プローブカード用プロー
ブの先端が塑性変形して所定の位置からずれることがあ
る。However, the above-mentioned conventional ultrasonic cleaning method has the following problems. That is, some of the foreign substances attached to the tip of the probe for the probe card cannot be cleaned without performing strong ultrasonic cleaning. If strong ultrasonic cleaning is performed in order to clean such foreign matter, the tip of the probe for probe card may be plastically deformed and displaced from a predetermined position.
【０００４】本発明は上記事情に鑑みて創案されたもの
で、プローブカード用プローブの先端を塑性変形させる
ことなく、異物を洗浄することができるプローブカード
用プローブの先端の洗浄方法及び洗浄装置を提供するこ
とを目的としている。The present invention has been devised in view of the above circumstances, and provides a cleaning method and a cleaning device for a tip of a probe for a probe card that can wash foreign matters without plastically deforming the tip of the probe for a probe card. It is intended to be provided.
【０００５】[0005]
【課題を解決するための手段】本発明に係るプローブカ
ード用プローブの先端の洗浄方法は、プローブカード用
プローブの先端に付着した異物を洗浄するプローブカー
ド用プローブの先端の洗浄方法であって、少なくとも電
解質を加えた純水からなる洗浄液に少なくともプローブ
カード用プローブの先端を浸漬するとともに、前記洗浄
液に浸漬した電極と前記プローブカード用プローブとの
間に電圧を印加するようにしている。A method for cleaning the tip of a probe for a probe card according to the present invention is a method for cleaning the tip of a probe for a probe card for cleaning foreign matter adhering to the tip of the probe for a probe card. At least the tip of the probe for a probe card is immersed in a cleaning solution made of pure water containing at least an electrolyte, and a voltage is applied between the electrode immersed in the cleaning solution and the probe for a probe card.
【０００６】本発明に係るプローブカード用プローブの
先端の洗浄装置は、プローブカード用プローブの先端に
付着した異物を洗浄するプローブカード用プローブの先
端の洗浄装置であって、少なくとも電解質を加えた純水
からなる洗浄液と、この洗浄液に浸漬される電極と、前
記洗浄液に少なくとも先端が浸漬されたプローブカード
用プローブと前記電極とに接続される電源とを備えてお
り、プローブカード用プローブと電極との間に電圧を印
加するように構成されている。The probe card probe tip cleaning device according to the present invention is a probe card probe tip cleaning device for cleaning foreign matter adhering to the probe card probe tip, and is a pure device containing at least an electrolyte. A cleaning liquid comprising water, an electrode immersed in the cleaning liquid, a probe card probe having at least its tip immersed in the cleaning liquid, and a power source connected to the electrode, and a probe card probe and an electrode. It is configured to apply a voltage between the two.
【０００７】[0007]
【実施例】図１は本発明に係るプローブカード用プロー
ブの先端の洗浄装置の概略的構成を示す構成図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic diagram showing a schematic structure of a cleaning device for a tip of a probe for a probe card according to the present invention.
【０００８】本実施例に係るプローブカード用プローブ
の先端の洗浄装置は、プローブカード用プローブ５００
の先端５１０に付着した異物を洗浄するプローブカード
用プローブの先端の洗浄装置であって、少なくとも電解
質を加えた純水からなる洗浄液１００と、この洗浄液１
００に浸漬される電極２００と、前記洗浄液１００に少
なくとも先端５１０が浸漬されたプローブカード用プロ
ーブ５００と前記電極２００とに接続される電源３００
とを備えており、プローブカード用プローブ５００と電
極２００との間に電圧を印加するようになっている。The cleaning device for the tip of the probe for a probe card according to this embodiment is a probe card probe 500.
Is a cleaning device for cleaning the foreign matter adhering to the tip 510 of the probe card, which is a cleaning device 100 for cleaning the probe card probe, and the cleaning liquid 100 is made of pure water containing at least electrolyte.
Power source 300 connected to the electrode 200, the electrode 200 to be immersed in the cleaning liquid 100, the probe 500 for the probe card in which at least the tip 510 is immersed in the cleaning liquid 100, and the electrode 200.
And a voltage is applied between the probe 500 for the probe card and the electrode 200.
【０００９】洗浄液１００は、メタノール１００mlに対
して純水９００mlと３％過酸化水素水１mlとを加えたも
のであり、水槽４００に蓄えられている。The cleaning liquid 100 is prepared by adding 900 ml of pure water and 1 ml of 3% hydrogen peroxide solution to 100 ml of methanol and is stored in the water tank 400.
【００１０】電極２００は、例えば白金メッキが施され
たニッケル又はチタン等からなり、前記水槽４００の底
部に設けられている。この電極２００は、電源３００の
陽極３１０に接続される。The electrode 200 is made of, for example, platinum-plated nickel or titanium, and is provided at the bottom of the water tank 400. The electrode 200 is connected to the anode 310 of the power supply 300.
【００１１】一方、電源３００の陰極３２０は、洗浄の
対象物であるプローブカード用プローブ５００に接続さ
れている。かかるプローブカード用プローブ５００は、
その先端５１０が洗浄液１００に浸漬されている。On the other hand, the cathode 320 of the power source 300 is connected to the probe 500 for the probe card which is an object to be cleaned. The probe 500 for such a probe card is
The tip 510 is immersed in the cleaning liquid 100.
【００１２】この状態で、電極２００とプローブカード
用プローブ５００にとの間に約８０Ｖの電圧を印加す
る。すると、プローブカード用プローブ５００の先端５
１０からは、水素が気泡として発生する。この電圧の印
加によって極めて軽度、プローブカード用プローブ５０
０の減量が計測できないレベルの電解研磨をプローブカ
ード用プローブ５００を加えたことになる。In this state, a voltage of about 80 V is applied between the electrode 200 and the probe 500 for the probe card. Then, the tip 5 of the probe 500 for the probe card
From 10, hydrogen is generated as bubbles. By applying this voltage, the probe 50 for the probe card is extremely mild.
This means that the probe card probe 500 was added to the electrolytic polishing at a level where the weight loss of 0 cannot be measured.
【００１３】このような電解研磨によっては、プローブ
カード用プローブ５００を変形させるような物理的外力
が加えられることがないので、プローブカード用プロー
ブ５００の先端５１０が変形することがない。なお、水
素の気泡の発生によって微小な物理的外力は加えられる
が、プローブカード用プローブ５００の先端５１０の変
形をもたらすことはない。By such electropolishing, no physical external force that deforms the probe card probe 500 is applied, and therefore the tip 510 of the probe card probe 500 is not deformed. Although a slight physical external force is applied by the generation of hydrogen bubbles, the tip 510 of the probe 500 for a probe card is not deformed.
【００１４】洗浄が完了したならば、プローブカード用
プローブ５００の先端５１０のメタノールは加熱によっ
て蒸発させる。When the cleaning is completed, the methanol at the tip 510 of the probe for probe card 500 is evaporated by heating.
【００１５】なお、上述した実施例では、洗浄液１００
は、メタノール１００mlに対して純水９００mlと３％過
酸化水素水１mlとを加えたものであるとしたが、これに
限定されるものではない。メタノールは純水に導電性を
与えることを目的とするものであるから、一部電離する
他の物質でもよい。特に、タングステン製のプローブカ
ード用プローブにあってはＫ2 Ｏ等が、モリブデン製の
プローブカード用プローブにあってはリン酸が優れてい
る。なお、この場合には、洗浄が完了した後は純粋で洗
浄してアルカリを除去する。In the above embodiment, the cleaning liquid 100 is used.
In the above description, 900 ml of pure water and 1 ml of 3% hydrogen peroxide solution were added to 100 ml of methanol, but the present invention is not limited to this. Since methanol is intended to give conductivity to pure water, it may be another substance that is partially ionized. Particularly, K 2 O and the like are excellent in the probe card probe made of tungsten, and phosphoric acid is excellent in the probe card probe made of molybdenum. In this case, after the cleaning is completed, the cleaning is performed purely to remove the alkali.
【００１６】[0016]
【発明の効果】本発明に係るプローブカード用プローブ
の先端の洗浄方法及び洗浄装置は、上述したように、プ
ローブカード用プローブの先端に電解研磨を施すことに
よって異物を洗浄するようにしているので、プローブカ
ード用プローブの先端を塑性変形させることがない。As described above, the method and apparatus for cleaning the tip of the probe for the probe card according to the present invention cleans the foreign matter by electrolytically polishing the tip of the probe for the probe card. The tip of the probe for the probe card is not plastically deformed.
【図１】本発明に係るプローブカード用プローブの先端
の洗浄装置の概略的構成を示す構成図である。FIG. 1 is a configuration diagram showing a schematic configuration of a cleaning device for a tip of a probe for a probe card according to the present invention.
１００ 洗浄液 ２００ 電極 ３００ 電源 ５００ プローブカード用プローブ ５１０ （プローブカード用プローブの）先端 100 cleaning liquid 200 electrode 300 power supply 500 probe card probe 510 tip (of probe card probe)
Claims (2)
した異物を洗浄するプローブカード用プローブの先端の
洗浄方法において、少なくとも電解質を加えた純水から
なる洗浄液に少なくともプローブカード用プローブの先
端を浸漬するとともに、前記洗浄液に浸漬した電極と前
記プローブカード用プローブとの間に電圧を印加するこ
とを特徴とするプローブカード用プローブの先端の洗浄
方法。1. A method for cleaning a tip of a probe for a probe card for cleaning foreign matters attached to the tip of the probe for a probe card, wherein at least the tip of the probe for a probe card is immersed in a cleaning solution made of pure water containing at least an electrolyte. At the same time, a voltage is applied between the electrode immersed in the cleaning solution and the probe for probe card, and the method for cleaning the tip of the probe for probe card.
した異物を洗浄するプローブカード用プローブの先端の
洗浄装置において、少なくとも電解質を加えた純水から
なる洗浄液と、この洗浄液に浸漬される電極と、前記洗
浄液に少なくとも先端が浸漬されたプローブカード用プ
ローブと前記電極とに接続される電源とを具備してお
り、プローブカード用プローブと電極との間に電圧を印
加することを特徴とするプローブカード用プローブの先
端の洗浄装置。2. In a cleaning device for a probe card probe tip for cleaning foreign matter attached to the probe card probe tip, a cleaning liquid comprising at least pure water to which an electrolyte is added, and an electrode immersed in the cleaning liquid. A probe card, comprising: a probe for a probe card having at least its tip immersed in the cleaning liquid; and a power supply connected to the electrode, wherein a voltage is applied between the probe for the probe card and the electrode. Cleaning device for the tip of the probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5294535A JPH0827297B2 (en) | 1993-10-29 | 1993-10-29 | Cleaning solution for probe for probe card and cleaning apparatus using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5294535A JPH0827297B2 (en) | 1993-10-29 | 1993-10-29 | Cleaning solution for probe for probe card and cleaning apparatus using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07128367A true JPH07128367A (en) | 1995-05-19 |
| JPH0827297B2 JPH0827297B2 (en) | 1996-03-21 |
Family
ID=17809044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5294535A Expired - Lifetime JPH0827297B2 (en) | 1993-10-29 | 1993-10-29 | Cleaning solution for probe for probe card and cleaning apparatus using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0827297B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002501177A (en) * | 1998-01-02 | 2002-01-15 | インテル・コーポレーション | Method for removing deposited solder from the probe mechanism of a probe card |
| KR100456396B1 (en) * | 2002-09-17 | 2004-11-10 | 삼성전자주식회사 | method for controlling probe tips sanding in semiconductor device testing equipment and sanding control apparatus |
| KR100729235B1 (en) * | 2006-06-01 | 2007-06-15 | 삼성전자주식회사 | Cleaning solution composition for probe card and cleaning method of probe card using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321098A (en) * | 2017-01-18 | 2018-07-24 | 中芯长电半导体（江阴）有限公司 | Cleaning solution, cleaning device and the method for a kind of probe tip for wafer test |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346247A (en) * | 1989-07-14 | 1991-02-27 | Tokyo Electron Ltd | Inspecting device |
-
1993
- 1993-10-29 JP JP5294535A patent/JPH0827297B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346247A (en) * | 1989-07-14 | 1991-02-27 | Tokyo Electron Ltd | Inspecting device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002501177A (en) * | 1998-01-02 | 2002-01-15 | インテル・コーポレーション | Method for removing deposited solder from the probe mechanism of a probe card |
| KR100456396B1 (en) * | 2002-09-17 | 2004-11-10 | 삼성전자주식회사 | method for controlling probe tips sanding in semiconductor device testing equipment and sanding control apparatus |
| KR100729235B1 (en) * | 2006-06-01 | 2007-06-15 | 삼성전자주식회사 | Cleaning solution composition for probe card and cleaning method of probe card using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0827297B2 (en) | 1996-03-21 |
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