JPH0712936U - Contact pressure measuring device for socket contacts - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a measuring device capable of easily measuring the contact pressure of a socket contact pin with respect to an electrode part of an electric component in a state close to an actual use state. [Structure] Two flexible sheets, each of which is provided with an elastic thin resistor on top of a conductor and at least one of which is arranged on the surface in a pattern in which a gap is changed, are brought into contact with each other. As described above, the detection unit is formed by bonding them together, and the detection unit is fixed to a jig made in the same shape as the electric component and attached to the socket.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention provides a contact pressure measuring device for a socket contact, particularly a contact pin contact pressure of an IC socket for connecting an electric component such as an IC package to an external circuit in a state close to an actual use state. It relates to a measuring instrument for measuring.

[0002]

[Prior art]

 In the case of IC sockets for inspecting electric parts such as IC packages, when the contact pressure between the contact pin and the electrode part of the electric part changes, the electric resistance between the contact pin and the electrode part of the electric part changes. Therefore, it is an important issue to accurately measure the contact pressure between the contact pin and the electrode part of the electric component, since it may affect the inspection result.

Conventionally, as an example of the method for measuring the contact pressure, instead of the lead of the IC package, a material similar to the lead is brought into contact with the contact pin, and in this state, a material similar to the lead is used. There has been a method of measuring the strength of the contact pressure by pulling out from the inside of the IC socket and measuring the pulling force at this time. However, with this method, the actual contact pressure cannot be known, and only the strength of the contact pressure can be comparatively measured between IC sockets under the same conditions.

As another method, a so-called strain generating body is brought into contact with the contact pin instead of the electrode portion of the electric component, and this strain generating body is deformed by the contact pressure by the contact pin, and the strain is generated by this deformation. The material that is connected to the body and transfers the deformation amount to the outside of the IC socket moves, and this movement amount is detected by the movement amount detector installed outside the IC socket, and the above contact pressure is detected. There was a way to measure. However, in this method, since the flexure element has to be mounted in the IC socket, the size and shape of the flexure element is limited by the shape of the IC socket, and the deformation of the flexure element cannot be applied outside the IC socket. Since the shape of the substance to be transmitted was also limited, it was difficult to measure the contact pressure accurately. In particular, the IC sockets having different shapes have different measurement accuracy, which is very inconvenient.

[0005]

[Problems to be solved by the device]

 If any type of IC socket can easily measure the actual contact pressure between the contact pin and the electrode part of the electric component, the quality control of the IC socket can be facilitated and the inspection of the electric component such as the IC package can be prevented. The number can be reduced, and the design becomes easy when designing a new IC socket.

An object of the present invention is to provide a measuring instrument capable of easily and accurately measuring the actual contact pressure between the contact pin and the electrode part of an electric component of various IC sockets.

[0007]

[Means for Solving the Problems]

 The measuring device of the present invention is made up of two flexible sheets each having a pattern of elastic electrode portions each having a thin resistor provided on the upper portion of the sheet, and the resistors are attached so that the resistors contact each other to form a detecting portion. At least one of the flexible sheets is provided with a plurality of the above electrode parts in a pattern such that the spacing changes, and this detection part is placed in the mounting part of the electrical component, and the electrode part is electrically connected. The contact area is changed by contacting the contact pin instead of the electrode part of the component, and the contact pressure of the contact pin causes the electrode part to elastically deform, and the upper resistors that are in contact with each other stick to each other. The electric resistance of this portion changes, and the above contact pressure is measured by electrically detecting the change of the electric resistance. Further, the above-mentioned detection part is fixed in the IC socket by attaching it to a jig having a positioning pin having substantially the same shape as the electric parts of the IC socket to be measured, through a hole provided in the detection part, Fixing is done by mounting this jig on the IC socket.

[0008]

[Function] Since the detecting portion is composed of a flexible sheet, it can be mounted in any kind of IC socket by changing the fixing jig, and at least one flexible sheet has a certain number of intervals. By arranging the electrode parts so that the contact pins are arranged differently, it is possible to cope with IC sockets having different contact pin arrangement intervals.

[0009]

【Example】

 FIG. 1 is a plan view showing an example of a probe of an IC socket contact pressure measuring device according to the present invention. In the figure, 1 is a detection part, 2 is a connector, 3 is a wiring part connecting the detection part 1 and the connector 2, and 4 is a hole used for positioning and fixing the detection part 1. The detection unit 1 is configured by bonding two flexible sheets to each other, and one sheet has a plurality of elongated plural thin conductors provided with elasticity on top of conductors, as shown in FIG. The electrode portions 5a are arranged such that the distance between the electrode portions 5a gradually increases toward the tip of the detection portion 1. On the other sheet, as shown in FIG. Similarly, in the case of this embodiment, three wide electrode portions 5b provided with thin resistors are arranged. Then, the detection unit 1 overlaps the sheet shown in FIG. 2 and the sheet shown in FIG. 3 by contacting each of the electrode portions 5b at a portion where the intervals of the electrode portions 5a are changed in a mutually orthogonal manner. It is pasted and made like. The detecting unit 1 is already known in Japanese Patent Publication No. 62-502665, Japanese Patent Publication No. 3-501221, and the like. The connector 2 is connected to a device having a circuit (not shown) for detecting a change in electric resistance between the electrode portions 5a and 5b. The circuit device is configured to sequentially electrically scan the plurality of electrode portions 5a and automatically measure the resistance value of each electrode portion 5a to show the contact resistance.

With the above-described structure, when the electrode portion 5a is pressed, the electrode portions 5a and 5b are elastically deformed, and the surface of the resistors that are in contact with each other corresponding to the pressing force contact each other. The degree of adhesion improves. That is, since the surface of the resistor is not subjected to any special treatment, it has fine irregularities. Therefore, if the adhesion is improved, the contact area between the resistors is increased. When the electric current concentrates on a small contact portion, the electric resistance increases, that is, the so-called concentrated resistance increases. Therefore, as the contact area increases, the lumped resistance decreases and the electrical resistance in this part decreases. The pressing force applied to each of the electrode portions 5a can be measured by sequentially electrically detecting the amount of decrease in the electric resistance one by one for each electrode portion 5a.

Next, an actual usage method will be described. FIG. 4 is a perspective view showing an example of an IC socket for a so-called flat IC package, and FIG. 5 is a perspective view showing an example of a fixing jig for fixing the probe shown in FIG. In the figure, 6 is a contact pin that is embedded in the IC socket, 7 is an opening 7a for releasing heat generated from the IC package, and the lead of the IC package is a contact part of the contact pin 6. A cover 8 having a pressing portion 7b for pressing against it, 8 is a mounting portion having the same shape as the IC package mounted in the IC socket shown in FIG. 4, and 9 is a hole of the probe shown in FIG. 4 is a plurality of pins that can be inserted.

First, the wiring portion 3 of the probe shown in FIG. 1 is passed through the opening 7 a of the IC socket shown in FIG. 4, and then the pin 9 of the fixing jig shown in FIG. By inserting, the probe shown in FIG. 1 is fixed on the mounting portion 8 of the fixing jig. Then, when the fixing jig is attached in the same manner as the IC package is attached to the IC socket shown in FIG. 4, each electrode portion 5a comes to be located on the contact portion of the contact pin 6. That is, the pin 9 of the fixing jig can fix the detecting portion 1 so that the electrode portion 5 a portion arranged at an interval matching the interval of the contact pin 6 is on the contact portion of the contact pin 6. It is provided in the position.

When the cover 7 is closed in this state, the pressing portion 7b presses the electrode portion 5a against the contact portion of the contact pin 6, and the same state as when the IC package is mounted in the IC socket can be obtained. At this time, if the entire thickness of the electrode portions 5a and 5b is set to be substantially the same as the lead pin of the IC package, the force received by the electrode portion 5a is measured by the above-described method, so that the IC package The contact pressure between the lead and the contact portion of the contact pin 6 can be known.

Further, if the pin 9 inserted into the hole 4 of the probe is changed, the same measurement can be performed on all the contact pins 6 implanted on one side of the IC socket. Furthermore, if the direction of the fixing jig is changed, the same measurement can be performed on the contact pins 6 on all sides of the IC socket. For an IC socket in which a rectangular IC package is mounted, the pins 9 may be provided on two sides of the fixing jig. In the case of the IC socket shown in FIG. 4, since there is a bridge 7c for reinforcement in the center of the opening 7a of the cover, if the wiring part 3 is bent in advance as shown in FIG. It is easy to insert the detector 1 into the IC socket, and there is no hindrance to measurement.

When the electrode portion 5a near the tip of the detection portion 1 is not used, the detection portion 1 may be cut off from the electrode portion 5a of the unused portion. In this way, the tip portion of the unused detection unit 1 does not get in the way, and in the case of a small IC socket, the probe can be easily attached. Of course, the detection unit 1 is constructed by contacting the electrode portions 5a and 5b of the two sheets so as to overlap each other, so that even if the tip of the detection unit 1 is cut, the probe will not be energized. There is no such thing. Further, the electrode portion 5b may be provided only in the portion corresponding to the step portion where the interval between the electrode portions 5a is the smallest.

FIG. 7 shows another embodiment of the arrangement pattern of the electrode parts 5 provided in the detection part 1 of the probe. In this case, the electrode portions 5 are provided in a grid pattern, and the electrode portions 5c forming one stripe have the intervals between the electrode portions 5c changed in the middle. On the other hand, the electrode portions 5d forming the other stripe are all arranged at the same intervals, and only the endmost electrode portion 5d 'is formed wide. The detection unit 1 is configured by superposing the two electrode units 5c, 5d and 5d '. The probe detection unit 1 may be configured as described above, and any one of the electrode units 5c and 5d may be used to correspond to various IC sockets provided with contact pins 6 having different intervals. Furthermore, the electrode portion 5d 'can be used to measure an IC socket having a contact pin with a special shape.

In the case of the detection unit shown in FIG. 7, the electrode portion 5c has changed the spacing only once in the middle, and the spacing 5d has not changed at all, but of course, the spacing between the electrode portions 5c and 5d has changed. The conversion may be changed more complicatedly depending on the purpose of use.

In the above embodiment, only the IC socket of the type in which the pressing portion 7b of the cover presses the leads of the IC package has been described, but the present invention is not limited to this, and the fixing jig can be changed. It can also be applied to other IC sockets. Further, even for an IC socket having contact pins arranged at intervals of an integral multiple of the intervals of the electrodes 5a, 5c, 5d, by using only some of all the electrodes 5a, 5c, 5d, It is possible to measure. Furthermore, in the above-described embodiment, the portions of the electrode portions 5 that come into contact with the contact portions of the contact pins 6 are arranged in parallel on the surface of the flexible sheet, but in some cases, the electrode portions 5 are arranged radially. They may be provided or arranged in an arc shape.

[0019]

[Effect of device]

 As described above, in the contact pressure measuring device for socket contacts of the present invention, since the detector is composed of a flexible sheet, it is possible to correspond to various kinds of IC sockets by exchanging the fixing jig. Also, because the electrode part is provided in the detection part as a pattern with varying intervals, it is compatible with various sockets with different contact pin intervals, and if applied to an IC socket, the actual IC Since the measurement can be performed in a state very close to the usage state of the socket, a highly reliable contact pressure measurement value can be obtained.

Moreover, the detector is positioned and fixed on the fixing jig by the holes provided on the detector and the pins provided on the fixing jig, so that the detector can be positioned on the fixing jig. It's easy.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a probe according to the present invention.

FIG. 2 is a partially enlarged view showing an electrode portion arranged on one sheet which constitutes a detection portion of the probe shown in FIG.

FIG. 3 is a partially enlarged cross-sectional view showing an electrode portion arranged on a sheet different from the sheet shown in FIG. 2 of the detection portion of the probe shown in FIG.

FIG. 4 is a perspective view showing an example of an IC socket.

5 is a perspective view showing an example of a fixing jig for fixing the probe shown in FIG. 1. FIG.

FIG. 6 is a partially enlarged view showing another example of the shape of the wiring portion of the probe according to the present invention.

FIG. 7 is a partially enlarged view showing another example of the pattern of the electrode part arranged in the detection part of the probe according to the present invention.

[Explanation of symbols]

 1 Detection Section 2 Connector 3 Wiring Section 4 Hole 5 Electrode Section 6 Contact Pin 7 Cover 8 Mounting Section 9 Pin

Claims (2)

[Scope of utility model registration request] 1. A flexible two sheet having an electrode portion provided with an elastic thin resistor on an upper surface of a conductor is disposed on a surface of the conductor so that the resistors come into contact with each other and overlap each other. Part, and the contact area between the resistors changes due to elastic deformation of the electrode part when a pressing force is applied to the detection part, and the pressing force is detected by electrically detecting the amount of change in the contact area. In a contact pressure measuring device for measuring the above, at least one of the flexible sheets is provided with a plurality of electrode portions, and a fixing jig having the same shape as an electric component mounted in a socket for measuring the detecting portion is provided. When fixed and when the fixing jig is mounted on the socket, the plurality of electrode portions are arranged so as to match the intervals between the contact pins of the socket, or at intervals of several intervals. When the fixing jig is mounted on the socket, the contact areas of the plurality of electrode portions are changed by being positioned and pressed on the contact portions of the contact pins of the socket. A contact pressure measuring device for a socket contact, which measures a contact pressure between a pin and an electrode portion of the electric component. 2. The plurality of electrode portions of the flexible sheet of the detection portion are formed in a pattern in which intervals are changed, and pins provided in the fixing jig are provided in holes provided in the detection portion. 2. An IC socket according to claim 1, wherein the IC socket is formed so that it can be inserted, and the detection part can be positioned and fixed to the fixing jig at different positions where the distance between the electrode parts changes. Contact pressure measuring instrument.