JPH0713038A - Optical package - Google Patents

Abstract

(57) [Summary] [Composition] An optical package in which a convex portion is provided on the lid, and the convex portion presses the optical fiber when the mounting body and the lid are integrated. [Effect] Since the positioning of the optical fiber in the V groove is performed not only by the adhesive but also by the pressing by the convex portion, the positioning of the optical fiber becomes reliable.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric system circuit formed on one surface, electrically coupled to the electric system circuit on the other surface, and converting an optical signal into an electric signal or an electric signal into an optical signal. The present invention relates to an optical package for connecting an optical integrated circuit chip on which an optical element for converting into a signal is formed and an optical fiber.

[0002]

2. Description of the Related Art In a conventional optical package, as shown in a perspective view of FIG. 3, a V groove 23 for mounting an optical fiber (not shown) and an optical integrated circuit chip (not shown) are connected. After the mounting body 21 having the lead pins 24 and the lid body 22 for covering the upper surface of the mounting body 21, the optical integrated circuit chip is mounted in the mounting body 21, and the optical fiber is placed in the V groove 23. There is a configuration in which the mounting body 21 and the lid body 22 are integrated by an adhesive agent or the like, and at the same time, the optical fiber is fixed in the V groove 23 (see Japanese Utility Model Laid-Open No. 61-176512).

[0003]

However, as shown in FIG.
In this case, when the mounting body 21 and the lid body 22 are integrated to prevent oxidation and deterioration of the optical integrated circuit chip, a fluid not containing oxygen is mixed into the inside of the optical package to completely seal the package. , It is necessary to use an optical fiber whose diameter is completely stored in the V groove. From this, the optical fiber is V
There is a problem that the optical fiber cannot be surely positioned because it can be delicately moved in the groove 23 and the optical fiber is fixed only by the adhesive.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a mounting body for mounting an optical integrated circuit chip and having a groove for mounting an optical fiber, In an optical package including a lid that covers an upper surface of the mounting body, by providing a protrusion on the lid, the protrusion forms an optical fiber in a groove when the mounting body and the lid are integrated. It is an optical package that is pressed.

[0005]

According to the present invention, by providing the lid with the projection, the projection presses the optical fiber in the groove when the mounting body and the lid are integrated.

[0006]

EXAMPLES Examples of the present invention will be described below. 1 and 2 show two embodiments of the present invention, in which the same members are designated by the same reference numerals. FIG. 1 is a structure showing a first embodiment of the present invention. As shown in the perspective view of FIG. 1A, an optical package includes a mounting body 1 for mounting an optical integrated circuit chip (not shown) and a mounting body 1. It is composed of a lid body 2 that covers the body 1 from above. The mounting body 1 is provided with a V groove 3 for mounting an optical fiber (not shown) and a lead pin 4 for connecting an electric signal of the optical integrated circuit chip to the outside, and the lid body 2 is a mounting body. The convex portion 5 is provided at a position corresponding to the V groove 3 of 1.

In the above optical package, the optical fiber is formed into the V groove 3.
After mounting in the inside, the mounting body 1 and the lid body 2 are manufactured by integrating them with an adhesive, and at the same time, the optical fiber is also fixed by the adhesive, and the convex portion 5 enters the V groove 3 at the same time. As shown in the side view of FIG. 1B, the convex portion 5 presses the optical fiber B. As a result, the optical fiber B is positioned by both the adhesive and the pressing of the convex portion 5, so that the optical fiber B can be reliably positioned. Further, by aligning the convex portion 5 and the V groove 3, it is possible to completely prevent the lid body 2 from being displaced in the vertical direction of the V groove 3 after the mounting body 1 and the lid body 2 are integrated.

Although the V-groove 3 is used as the groove in the above embodiment, any shape may be used as long as the optical fiber can be placed and the depth and width are larger than the diameter of the optical fiber. When a surface emitting chip is used as the optical integrated circuit chip, the optical signal from the optical fiber is supplied to a fixed position on the upper surface of the optical integrated circuit chip, or the signal from the optical integrated circuit chip is emitted from the upper surface. Therefore, as shown in the bottom view of FIG. 1 (c), the surface of the lid body 2 that comes into contact with the mounting body 1 is
The optical path conversion element 6 for changing the optical path such as a concave lens or a hologram may be provided. Further, the convex portion 5 enters the V groove 3 and, when pressing the optical fiber, the mounting body 1
Any shape may be used as long as there is no gap between the cover 2 and the lid 2, and the shape is such that the optical fiber is positioned.

FIG. 2 shows the structure of a second embodiment of the present invention. As shown in FIG. 2, an L-shaped mounting body 1 and a lid body 2 are provided.
Is an optical package in which the optical integrated circuit chip A and the optical fiber B are installed in the gap 7 formed when both are integrated, and after fixing the optical integrated circuit chip A and the optical fiber B to the mounting body 1. When the mounting body 1 and the lid body 2 are integrated, the optical fiber B can be pressed by both L-shaped convex portions 5.

[0010]

As described above, according to the optical package of the present invention, by providing the convex portion on the lid, the convex portion presses the optical fiber when the mounting body and the lid are integrated, and V Since the positioning of the optical fiber in the groove is performed not only by the adhesive but also by pressing by the convex portion, it is possible to provide the optical package in which the positioning of the optical fiber is reliable.

[Brief description of drawings]

1A and 1B show a first embodiment of the present invention, FIG. 1A is a schematic perspective view, FIG. 1B is a schematic side view, and FIG. 1C is a bottom view of a lid.

FIG. 2 is a schematic perspective view showing a second embodiment of the present invention.

FIG. 3 is a schematic perspective view showing a conventional optical package.

[Explanation of symbols]

 1, 21: Mounted body 2, 22: Lid body 3, 23: V groove 4, 24: Lead pin 5: Convex part 6: Optical path conversion element 7: Gap A: Optical integrated circuit chip B: Optical fiber

Claims (1)

[Claims] 1. An optical package comprising a mounting body for mounting an optical integrated circuit chip and having a groove for mounting an optical fiber, and a lid body for covering an upper surface of the mounting body, wherein a convex portion is formed on the lid body. The optical package, wherein the convex portion presses the optical fiber in the groove when the mounting body and the lid body are integrated with each other.