JPH07145357A - Heat release sheet and release method - Google Patents

Heat release sheet and release method

Info

Publication number
JPH07145357A
JPH07145357A JP5319064A JP31906493A JPH07145357A JP H07145357 A JPH07145357 A JP H07145357A JP 5319064 A JP5319064 A JP 5319064A JP 31906493 A JP31906493 A JP 31906493A JP H07145357 A JPH07145357 A JP H07145357A
Authority
JP
Japan
Prior art keywords
pressure
adherend
sensitive adhesive
adhesive layer
foaming agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5319064A
Other languages
Japanese (ja)
Inventor
Michio Umeda
道夫 梅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP5319064A priority Critical patent/JPH07145357A/en
Publication of JPH07145357A publication Critical patent/JPH07145357A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

(57)【要約】 【目的】 冷却固化による再接着等の問題を生じずに任
意な時に接着状態を糊残りなく容易に解けて、分離後に
被着体を洗浄処理する必要がない接着手段を得ること。 【構成】 高周波で誘導加熱される基材(1)の片面又
は両面に、加熱により発泡及び/又は膨張する発泡剤を
含有する感圧接着層(2)を有する加熱剥離シート、及
び高周波で誘導加熱される被着体に接着した発泡剤含有
の感圧接着層を、前記被着体の誘導加熱下に発泡及び/
又は膨張処理したのち被着体と分離する剥離方法。 【効果】 誘導加熱による短時間処理で発泡処理できて
加熱後の任意な時に被着体の損傷なく分離作業を遂行で
きる。
(57) [Abstract] [Purpose] A bonding means that does not require re-bonding due to cooling and solidification and can easily dissolve the bonded state without adhesive residue at any time and does not require cleaning treatment of the adherend after separation. To get. A heat-peelable sheet having a pressure-sensitive adhesive layer (2) containing a foaming agent that expands and / or expands by heating on one or both sides of a base material (1) that is induction-heated with high frequency, and induction with high frequency. A pressure-sensitive adhesive layer containing a foaming agent adhered to an adherend to be heated is foamed and / or expanded under induction heating of the adherend.
Alternatively, a peeling method of separating from the adherend after the expansion treatment. [Effect] The foaming process can be performed in a short time by induction heating, and the separation work can be performed at any time after heating without damaging the adherend.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、誘導加熱方式で任意な
時に感圧接着層の接着力を低下ないし喪失させて接着状
態を解くことができる加熱剥離シート及び剥離方法に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat release sheet and a release method capable of releasing the adhesive state by reducing or losing the adhesive force of a pressure sensitive adhesive layer at any time by an induction heating method.

【0002】[0002]

【従来の技術】資源等の再利用や、研磨、切断等の加工
時に仮着固定した被加工物の加工後における容易分離の
達成による工程の省人化ないし自動化などの観点より、
接着状態を容易に解くことができる接着手段が求められ
ている。
2. Description of the Related Art From the standpoint of labor saving and automation of the process by reusing resources and achieving easy separation after processing of a workpiece temporarily fixed and fixed during processing such as polishing and cutting,
There is a demand for a bonding means that can easily release the bonded state.

【0003】従来、かかる目的に適用しうる接着手段と
しては、熱可塑性樹脂に磁性体の粉末を含有させてなる
ホットメルト接着剤が知られていた。(特開平4−93
381号公報)。この接着剤は、含有の磁性粉に基づく
誘導加熱でメルト化させ、それによる接着力の低下で被
着体等の接着状態を容易に解きうるようにしたものであ
る。
Conventionally, as an adhesive means applicable to such a purpose, a hot melt adhesive made of a thermoplastic resin containing magnetic powder is known. (JP-A-4-93
No. 381). This adhesive is melted by induction heating based on the contained magnetic powder so that the adhesive state of the adherend and the like can be easily released by the decrease in the adhesive force.

【0004】しかしながら、前記のホットメルト接着剤
による接着状態の分離は、かかる接着剤の溶融軟化によ
る凝集状態の破壊であるため、そのホットメルト接着剤
の残骸が被着体に付着した状態で残り(糊残り)、それ
を洗浄するなどして除去する必要がある問題点があり、
またホットメルト接着剤が冷却固化して再接着しないよ
う加熱処理の直後に接着状態を解く必要がある問題点も
あった。
However, since the separation of the adhesive state by the hot melt adhesive is the destruction of the agglomerated state by the melting and softening of the adhesive, the debris of the hot melt adhesive remains on the adherend. (Adhesive residue), there is a problem that it needs to be removed by washing,
In addition, there is a problem that it is necessary to release the bonding state immediately after the heat treatment so that the hot melt adhesive does not solidify by cooling and re-bonding.

【0005】[0005]

【発明が解決しようとする課題】本発明は、冷却固化に
よる再接着等の問題を生じずに任意な時に接着状態を糊
残りなく容易に解くことができ、従って分離後に被着体
を洗浄処理する必要がない接着手段の開発を課題とす
る。
DISCLOSURE OF THE INVENTION The present invention can easily remove the adhesive state without adhesive residue at any time without causing problems such as re-adhesion due to cooling and solidification, and therefore, the adherend is washed after separation. The problem is to develop a bonding means that does not need to be applied.

【0006】[0006]

【課題を解決するための手段】本発明は、高周波で誘導
加熱される基材の片面又は両面に、加熱により発泡及び
/又は膨張する発泡剤を含有する感圧接着層を有するこ
とを特徴とする加熱剥離シート、及び高周波で誘導加熱
される被着体に接着した発泡剤含有の感圧接着層を、前
記被着体の誘導加熱下に発泡及び/又は膨張処理したの
ち被着体と分離することを特徴とする剥離方法を提供す
るものである。
The present invention is characterized in that a pressure-sensitive adhesive layer containing a foaming agent that expands and / or expands by heating is provided on one or both sides of a base material that is induction-heated with high frequency. The heat-release sheet and the pressure-sensitive adhesive layer containing a foaming agent adhered to an adherend that is induction heated at high frequency are foamed and / or expanded under the induction heating of the adherend, and then separated from the adherend. The present invention provides a peeling method characterized by:

【0007】[0007]

【作用】感圧接着層に発泡剤を含有させて基材又は被着
体の高周波による誘導加熱を介しその感圧接着層を加熱
することにより、含有の発泡剤が発泡及び/又は膨張し
て感圧接着層の接着力が低下ないし喪失し、これにより
被着体と感圧接着層を容易に分離することができる。ま
たその場合に感圧接着層の接着力が復元することがな
く、冷却はむしろ接着力の低下に有利に作用するので時
間的拘束なく任意な時に分離作業を遂行することができ
る。さらに感圧接着層の発泡及び/又は膨張処理による
接着力の低下等は、接着面積の減少に基づくもので感圧
接着層は一体性を維持しているので分離の際に糊残りも
生じにくく、被着体の洗浄等を省略することができる。
By including a foaming agent in the pressure-sensitive adhesive layer and heating the pressure-sensitive adhesive layer through induction heating of the substrate or the adherend by high frequency, the foaming agent contained expands and / or expands. The adhesive force of the pressure-sensitive adhesive layer is reduced or lost, whereby the adherend and the pressure-sensitive adhesive layer can be easily separated. Further, in that case, the adhesive force of the pressure-sensitive adhesive layer is not restored, and the cooling rather acts to reduce the adhesive force, so that the separating operation can be performed at any time without any time constraint. Furthermore, the decrease in adhesive strength due to foaming and / or expansion of the pressure-sensitive adhesive layer is due to the decrease in the adhesive area, and since the pressure-sensitive adhesive layer maintains its integrity, adhesive residue is less likely to occur during separation. It is possible to omit washing of the adherend.

【0008】[0008]

【実施例】本発明の加熱剥離シートは、高周波で誘導加
熱される基材の片面又は両面に、加熱により発泡及び/
又は膨張する発泡剤を含有する感圧接着層を有するもの
である。その例を図1、図2に示した。1が基材、2,
3が感圧接着層である。
EXAMPLE A heat-peelable sheet of the present invention is formed by foaming and / or foaming by heating on one or both sides of a base material that is induction-heated by high frequency
Alternatively, it has a pressure-sensitive adhesive layer containing an expanding foaming agent. Examples thereof are shown in FIGS. 1 and 2. 1 is the base material, 2,
3 is a pressure sensitive adhesive layer.

【0009】高周波で誘導加熱される基材としては、例
えば鉄、ニッケル、銅、アルミニウム、チタン、亜鉛、
錫の如き単体を主成分とするもの、SUS340等のス
テンレス鋼やパーマロイの如き合金、フェライトの如き
金属酸化物、鉄・コバルトの如きアモルファス合金など
の種々の導電体や磁性体からなるものを用いることがで
きる。
Examples of the base material which is induction-heated by high frequency include iron, nickel, copper, aluminum, titanium, zinc,
Use of various conductors or magnetic materials such as tin as a main component, stainless steel such as SUS340, alloys such as permalloy, metal oxides such as ferrite, amorphous alloys such as iron and cobalt. be able to.

【0010】基材は、通例1〜500μm厚、就中3〜
100μm厚のシート状物からなるが、その場合に導電
体や磁性体を具備する形態は任意である。ちなみにその
形態としては、箔からなる単層形態、ベース層に箔や蒸
着膜等からなる導電体層や磁性体層を有するラミネート
形態、ベース層に導電粉や磁性粉を分散させた含有形
態、ベース層に導電粉や磁性粉を分散含有する層を塗布
した重畳形態、前記の導電粉等を繊維状物で置換したも
のなどが例示できる。磁性体又は導電体は、2種以上を
用いてもよく、それらを併用してもよい。また基材は、
ネット状や多孔質状、不織布状等の感圧接着層の芯材や
支持材等として適宜な形態で用いることができる。
The substrate is usually 1 to 500 μm thick, especially 3 to
It is made of a sheet-like material having a thickness of 100 μm, but in that case, a form including a conductor or a magnetic substance is arbitrary. By the way, as its form, a single-layer form made of foil, a laminate form having a conductor layer or a magnetic layer made of a foil, a vapor deposition film or the like in the base layer, a contained form in which conductive powder or magnetic powder is dispersed in the base layer, Examples thereof include a superposed form in which a layer containing conductive powder or magnetic powder dispersed therein is applied to the base layer, and a form in which the conductive powder or the like is replaced with a fibrous material. Two or more kinds of magnetic materials or conductive materials may be used, or they may be used in combination. The base material is
It can be used in an appropriate form as a core material or a support material of a pressure-sensitive adhesive layer having a net shape, a porous shape, a non-woven shape, or the like.

【0011】なお前記のベース層としては、例えば紙や
布、不織布の如き繊維加工物、プラスチックないしゴム
状の弾性を示すポリマーのフィルムないし発泡フィル
ム、あるいはそれらのプラスチックラミネート体、プラ
スチック同士の積層体などの感圧接着層等の支持母体と
なりうる適宜な薄葉体を用いうる。
The base layer may be, for example, a processed fiber product such as paper, cloth, or non-woven fabric, a plastic or rubber-like polymer film or foamed film, or a plastic laminate or a laminate of these plastics. An appropriate thin sheet that can serve as a supporting base material such as a pressure-sensitive adhesive layer may be used.

【0012】感圧接着層を形成するための感圧接着剤と
しては、ゴム系感圧接着剤、アクリル系感圧接着剤、ス
チレン・共役ジエンブロック共重合体系感圧接着剤、シ
リコーン系感圧接着剤などの適宜なものを用いることが
でき、紫外線硬化型のものなども用いうる(特開昭56
−61468号公報、特開昭61−174857号公
報、特開昭63−17981号公報)。
The pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer includes a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a styrene / conjugated diene block copolymer-based pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive. An appropriate adhesive or the like can be used, and an ultraviolet curable adhesive or the like can also be used (JP-A-56).
No. 61468, JP 61-174857, and JP 63-17981).

【0013】また、融点が約200℃以下等の熱溶融性
樹脂を含有してクリープ性を改善したものや、常温では
接着力が小さくて加熱により充分な接着力が発現するよ
うにした熱時感圧接着剤なども用いうる(特公昭56−
13040号公報、特公平2−50146号公報、特開
昭56−13040号公報)。なお感圧接着剤は、必要
に応じて架橋剤、粘着性付与剤、可塑剤、充填剤、老化
防止剤などの適宜な添加剤を配合したものであってもよ
い。
[0013] Further, those which contain a heat-melting resin having a melting point of about 200 ° C or less to improve the creep property, and those which have a low adhesive strength at room temperature and exhibit sufficient adhesive strength by heating. A pressure sensitive adhesive or the like can also be used (Japanese Patent Publication No. 56-
13040, Japanese Patent Publication No. 2-50146, and Japanese Patent Laid-Open No. 56-13040). The pressure-sensitive adhesive may be a mixture of appropriate additives such as a cross-linking agent, a tackifier, a plasticizer, a filler and an anti-aging agent, if necessary.

【0014】より具体的には例えば、天然ゴムや各種の
合成ゴムをベースポリマーとするゴム系感圧接着剤、メ
チル基、エチル基、プロピル基、ブチル基、2−エチル
ヘキシル基、イソオクチル基、イソノニル基、イソデシ
ル基、ドデシル基、ラウリル基、トリデシル基、ペンタ
デシル基、ヘキサデシル基、ヘプタデシル基、オクタデ
シル基、ノナデシル基、エイコシル基の如き通例、炭素
数が20以下のアルキル基を有するアクリル酸やメタク
リル酸の如きアクリル酸系のアルキルエステル、ヒドロ
キシエチル基、ヒドロキシプロピル基、グリシジル基の
如き官能基含有基を有するアクリル酸やメタクリル酸等
のエステル、アクリル酸、メタクリル酸、イタコン酸、
N−メチロールアクリルアミド、アクリロニトリル、メ
タクリロニトリル、酢酸ビニル、スチレン、イソプレ
ン、ブタジエン、イソブチレン、ビニルエーテルなどを
成分とするアクリル系ポリマーをベースポリマーとする
アクリル系感圧接着剤などがあげられる
More specifically, for example, a rubber-based pressure-sensitive adhesive containing natural rubber or various synthetic rubbers as a base polymer, methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl. Group, isodecyl group, dodecyl group, lauryl group, tridecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl group, usually acrylic acid or methacrylic acid having an alkyl group having 20 or less carbon atoms Acrylic acid-based alkyl ester such as, hydroxyethyl group, hydroxypropyl group, ester such as acrylic acid or methacrylic acid having a functional group-containing group such as glycidyl group, acrylic acid, methacrylic acid, itaconic acid,
Acrylic pressure-sensitive adhesives based on acrylic polymers containing N-methylolacrylamide, acrylonitrile, methacrylonitrile, vinyl acetate, styrene, isoprene, butadiene, isobutylene, vinyl ether, etc.

【0015】感圧接着剤は、被着体に対する接着強度等
の使用目的に応じて適宜に選択使用され、加熱により発
泡及び/又は膨張する感圧接着層は、その感圧接着剤に
発泡剤を配合することで形成することができる。
The pressure-sensitive adhesive is appropriately selected and used according to the purpose of use such as the adhesive strength to an adherend, and the pressure-sensitive adhesive layer that foams and / or expands by heating has a foaming agent added to the pressure-sensitive adhesive. Can be formed by blending.

【0016】発泡剤としては、上記の目的を達成できる
種々のものを用いることができる。従って例えば、熱時
感圧接着剤を用いた場合には、その接着剤の接着処理温
度よりも高温で発泡及び/又は膨張する発泡剤が用いら
れる。用いうる発泡剤の例としては、炭酸アンモニウ
ム、炭酸水素アンモニウム、炭酸水素ナトリウム、亜硝
酸アンモニウム、水素化ホウ素ナトリウム、アジド類な
どの分解型の無機系発泡剤があげられる。
As the foaming agent, various kinds of foaming agents that can achieve the above objects can be used. Therefore, for example, when a heat-sensitive pressure-sensitive adhesive is used, a foaming agent that foams and / or expands at a temperature higher than the bonding treatment temperature of the adhesive is used. Examples of foaming agents that can be used include decomposition-type inorganic foaming agents such as ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azides.

【0017】またアゾ系化合物などの有機系発泡剤も用
いうる。その例としては、トリクロロモノフルオロメタ
ンやジクロロモノフルオロメタンの如きフッ化アルカ
ン、アゾビスイソブチロニトリルやアゾジカルボンアミ
ド、バリウムアゾジカルボキシレートの如きアゾ系化合
物、パラトルエンスルホニルヒドラジドやジフェニルス
ルホン−3,3'−ジスルホニルヒドラジド、4,4'−
オキシビス(ベンゼンスルホニルヒドラジド)、アリル
ビス(スルホニルヒドラジド)の如きヒドラジン系化合
物、ρ−トルイレンスルホニルセミカルバジドや4,
4'−オキシビス(ベンゼンスルホニルセミカルバジ
ド)の如きセミカルバジド系化合物、5−モルホリル−
1,2,3,4−チアトリアゾールの如きトリアゾール
系化合物、N,N'−ジニトロソペンタメチレンテトラ
ミンやN,N'−ジメチル−N,N'−ジニトロソテレフ
タルアミドの如きN−ニトロソ系化合物、その他の低沸
点化合物などがあげられる。
An organic foaming agent such as an azo compound may also be used. Examples thereof include fluorinated alkanes such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile and azodicarbonamide, barium azodicarboxylate, paratoluenesulfonyl hydrazide and diphenyl sulfone-. 3,3'-disulfonyl hydrazide, 4,4'-
Hydrazine compounds such as oxybis (benzenesulfonylhydrazide) and allylbis (sulfonylhydrazide), ρ-toluylenesulfonyl semicarbazide and 4,
Semicarbazide compounds such as 4'-oxybis (benzenesulfonyl semicarbazide), 5-morpholyl-
Triazole compounds such as 1,2,3,4-thiatriazole, N-nitroso compounds such as N, N'-dinitrosopentamethylenetetramine and N, N'-dimethyl-N, N'-dinitrosoterephthalamide , Other low boiling point compounds, and the like.

【0018】さらに本発明においては発泡剤として、例
えばイソブタン、プロパン、ペンタンの如く容易にガス
化して熱膨張性を示す適宜な物質をコアセルベーション
法や界面重合法等で殻形成物質内に内包させた熱膨張性
微粒子も用いることができる。用いる熱膨張性微粒子の
平均粒径は、1〜50μmが一般的である。
Further, in the present invention, as a foaming agent, for example, a suitable substance such as isobutane, propane, and pentane, which is easily gasified and exhibits thermal expansion properties, is included in the shell-forming substance by a coacervation method, an interfacial polymerization method, or the like. Heat-expandable fine particles can also be used. The average particle diameter of the heat-expandable fine particles used is generally 1 to 50 μm.

【0019】なお熱膨脹性微粒子を形成する殻形成物質
としては、例えば塩化ビニリデン−アクリロニトリル共
重合体、ポリビニルアルコール、ポリビニルブチラー
ル、ポリメチルメタクリレート、ポリアクリロニトリ
ル、ポリ塩化ビニリデン、ポリスルホンなどが一般的で
あるが、本発明においては熱溶融性物質や熱膨張で破壊
する物質などからなっていればよい。
As the shell-forming substance forming the heat-expandable fine particles, for example, vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, etc. are generally used. In the present invention, it may be made of a heat-meltable substance or a substance that is destroyed by thermal expansion.

【0020】感圧接着層における発泡剤の含有割合は、
目的とする接着強度の低下程度等に応じて適宜に決定さ
れるが、一般には10重量%以上、就中15〜95重量
%、特に20〜80重量%とされる。感圧接着層の発泡
倍率は、被着体の表面形状や材質等により適宜に決定さ
れるが、一般には1.5〜100倍程度の発泡倍率とな
るように設計することが好ましい。
The content ratio of the foaming agent in the pressure-sensitive adhesive layer is
Although it is appropriately determined depending on the degree of reduction in the adhesive strength, etc., it is generally 10% by weight or more, preferably 15 to 95% by weight, particularly 20 to 80% by weight. The expansion ratio of the pressure-sensitive adhesive layer is appropriately determined depending on the surface shape, material, etc. of the adherend, but it is generally preferable to design the expansion ratio to be about 1.5 to 100 times.

【0021】発泡剤含有の感圧接着層の形成は、基材へ
の塗工方式やセパレータ上に形成したものの基材への移
着方式などの従来の粘着テープの形成方式に準じた方式
で行うことができる。感圧接着層はベタ状に設けること
もできるし、例えばグラビア印刷方式やスクリーン印刷
方式等でパターン塗工して点状や線状等の部分的に設け
ることもできる。感圧接着層の厚さは、被着体の表面形
状や材質等により適宜に決定されるが、一般には1〜5
00μm、就中5〜100μmとされる。
The pressure-sensitive adhesive layer containing a foaming agent is formed according to a conventional method for forming an adhesive tape, such as a coating method on a base material or a transfer method of a material formed on a separator but transferred to a base material. It can be carried out. The pressure-sensitive adhesive layer may be provided in a solid shape, or may be partially applied in a dot shape or a line shape by pattern coating by, for example, a gravure printing method or a screen printing method. The thickness of the pressure-sensitive adhesive layer is appropriately determined depending on the surface shape and material of the adherend, but generally 1 to 5
The thickness is 00 μm, especially 5 to 100 μm.

【0022】本発明においては図2に例示した如く、感
圧接着層を発泡剤を含有して熱膨張しうる層31と発泡
剤を含有しない層32の重畳層として形成することもで
きる。重畳形態の感圧接着層3は、被着体に接着させる
発泡剤を含有しない層の接着強度を容易に制御できる利
点を有している。
In the present invention, as illustrated in FIG. 2, the pressure-sensitive adhesive layer may be formed as a superposed layer of a layer 31 containing a foaming agent and capable of thermal expansion and a layer 32 containing no foaming agent. The pressure-sensitive adhesive layer 3 in the overlapping form has an advantage that the adhesive strength of the layer containing no foaming agent to be adhered to the adherend can be easily controlled.

【0023】重畳形態の感圧接着層における発泡剤含有
層は、上記した発泡剤含有の感圧接着層に準じて形成し
てもよいし、発泡剤と結合剤の混合層として形成しても
よい。その結合剤としては、発泡剤の発泡及び/又は膨
張を許容するゴム系や樹脂系等の一般に知られるポリマ
ー類、好ましくは発泡剤の発泡及び/又は膨張を可及的
に拘束しないものが用いられる。
The foaming agent-containing layer in the pressure-sensitive adhesive layer in the overlapping form may be formed according to the above-mentioned foaming agent-containing pressure-sensitive adhesive layer, or may be formed as a mixed layer of the foaming agent and the binder. Good. As the binder, a generally known polymer such as a rubber-based or resin-based polymer that allows foaming and / or expansion of the foaming agent, preferably one that does not restrain foaming and / or expansion of the foaming agent as much as possible. To be

【0024】前記の発泡剤と結合剤との混合層は、被着
体に接着した感圧接着層を任意な時に被着体より剥離す
る際に、その加熱発泡処理で感圧接着層の表面に体積変
化を与えて被着体との接着面積を減少させ、被着体より
簡単に剥離できるようにする。かかる混合層は、感圧接
着剤に代えて結合剤を用いることにより形成でき、その
厚さや発泡剤の含有割合等については、上記した発泡剤
含有の感圧接着層に準じることができる。
The mixed layer of the foaming agent and the binder is formed by heating and foaming the surface of the pressure-sensitive adhesive layer when the pressure-sensitive adhesive layer adhered to the adherend is peeled from the adherend at any time. The volume is changed to reduce the area of adhesion to the adherend, so that it can be easily peeled from the adherend. Such a mixed layer can be formed by using a binder instead of the pressure-sensitive adhesive, and the thickness, the content ratio of the foaming agent and the like can be similar to those of the foaming agent-containing pressure-sensitive adhesive layer described above.

【0025】重畳形態の感圧接着層における発泡剤を含
有しない層は、発泡剤を配合しない感圧接着剤を用いて
上記した発泡剤含有の感圧接着層に準じて形成すること
ができる。発泡剤を含有しない層の厚さは、被着体と発
泡剤含有層との距離を可及的に近くして剥離性を向上さ
せる点より薄いほど好ましく、形成作業性や被着体への
接着性等を考慮すると約0.1〜50μm、就中0.5
〜5μmが好ましい。
The layer containing no foaming agent in the pressure-sensitive adhesive layer in the superposed form can be formed by using a pressure-sensitive adhesive containing no foaming agent in the same manner as the above-mentioned pressure-sensitive adhesive layer containing a foaming agent. The thickness of the layer containing no foaming agent is preferably as thin as possible from the point of improving the releasability by making the distance between the adherend and the foaming agent-containing layer as close as possible. Considering adhesion, etc., about 0.1-50 μm, especially 0.5
˜5 μm is preferred.

【0026】本発明の加熱剥離シートは、接着時には被
着体に強固に接着でき、接着状態を解きたいときには図
3に例示の如く、基材1の高周波による誘導加熱を介し
感圧接着層の中の発泡剤を発泡及び/又は膨張させる加
熱発泡処理21で被着体4より容易に剥離ないし分離で
きるものである。かかる加熱剥離シートは、耐熱性等に
乏しい被着体にも用いうる利点などがある。
The heat release sheet of the present invention can be firmly adhered to an adherend at the time of adhesion, and when it is desired to release the adhered state, as shown in FIG. 3, the pressure sensitive adhesive layer of the substrate 1 is subjected to induction heating by high frequency. It can be easily peeled off or separated from the adherend 4 by the heat foaming treatment 21 for foaming and / or expanding the foaming agent therein. Such a heat release sheet has an advantage that it can be used for an adherend having poor heat resistance.

【0027】一方、本発明の剥離方法は、被着体が導電
体や磁性体などの高周波で誘導加熱できるものである場
合、上記の加熱剥離シートにおける感圧接着層に準じた
発泡剤含有の感圧接着層を介して被着体等の所定の接着
状態を形成し、その後、被着体の高周波による誘導加熱
下に感圧接着層中の発泡剤を発泡及び/又は膨張させる
加熱発泡処理で被着体より容易に剥離ないし分離できる
ものである。従ってこの場合、発泡剤含有の感圧接着層
は、塗布タイプの接着剤として適用することもできる
し、プラスチックフィルム等の適宜な薄葉体からなる支
持基材に付設された接着シートとして適用することもで
き、その際に両面接着シートなどとしても適用すること
ができる。
On the other hand, in the peeling method of the present invention, when the adherend can be induction-heated with a high frequency such as a conductor or a magnetic substance, a foaming agent containing a pressure-sensitive adhesive layer in the above heat-peelable sheet is contained. A heat-foaming treatment for forming a predetermined adhered state of an adherend or the like through a pressure-sensitive adhesive layer and then foaming and / or expanding the foaming agent in the pressure-sensitive adhesive layer under induction heating of the adherend with high frequency. It can be easily peeled off or separated from the adherend. Therefore, in this case, the pressure-sensitive adhesive layer containing a foaming agent can be applied as a coating type adhesive, or as an adhesive sheet attached to a supporting substrate made of an appropriate thin film such as a plastic film. In that case, it can be applied as a double-sided adhesive sheet or the like.

【0028】本発明の加熱剥離シート又は剥離方法の好
ましい用途ないし使用方法は、被着体を所定期間接着し
たのち接着目的達成後、その接着状態を解くことが要求
される、あるいは望まれる用途である。ちなみにその例
としては、2体以上の物品、例えばポリマーからなる物
品と金属、繊維又は紙等からなる物品とのリサイクルを
目的とした接着複合物の形成、各種の電気装置又は電子
装置やディスプレイ装置等の組立工程における部品の搬
送用や仮止め用等のキャリヤテープや仮止め材又は固定
材、金属板やプラスチック板、ガラス板等の汚染損傷防
止を目的とした表面保護材やマスキング材、半導体ウエ
ハを研磨、切断する際等の仮止め材又は固定材などの用
途があげられる。
The heat release sheet or the release method of the present invention is preferably used or used in such a manner that the adherends are adhered for a predetermined period of time and then the adhesion state is released after the adhesion purpose is achieved. is there. Incidentally, examples thereof include formation of an adhesive composite for recycling two or more articles, for example, an article made of a polymer and an article made of metal, fiber, paper, or the like, various electric devices or electronic devices, and display devices. Carrier tapes for transportation and temporary fixing of parts in the assembly process such as etc., temporary fixing materials or fixing materials, surface protection materials and masking materials for preventing contamination damage of metal plates, plastic plates, glass plates, etc., semiconductors It can be used as a temporary fixing material or a fixing material when polishing or cutting a wafer.

【0029】実施例1 アクリル酸エチル50部(重量部、以下同じ)とアクリ
ル酸ブチル50部とアクリル酸2−ヒドロキシエチル1
部の共重合体(重量平均分子量約60万)からなるベー
スポリマー100部、ポリウレタン系架橋剤5部、及び
熱膨張性微粒子(平均粒径15μm、比重1.01)3
0部を添加混合したトルエン溶液をセパレータ上に塗布
し乾燥させて厚さ50μmの感圧接着層を形成し、その
20mm角の感圧接着層を用いて2枚のアルミニウム板
(厚さ1mm、幅25mm、長さ100mm)を接着して剪断
試験片を形成し、その接着部分を誘導加熱装置(出力6
00W、周波数45KHz)にて5秒間誘導加熱して加
熱発泡処理させた。前記において誘導加熱の前後におけ
る試験片の剪断接着力を調べた(引張速度50mm/
分)。結果を表1に示した。
Example 1 50 parts of ethyl acrylate (parts by weight, the same applies hereinafter), 50 parts of butyl acrylate and 2-hydroxyethyl acrylate 1
100 parts of a base polymer consisting of 1 part of a copolymer (weight average molecular weight of about 600,000), 5 parts of a polyurethane cross-linking agent, and heat-expandable fine particles (average particle size 15 μm, specific gravity 1.01) 3
Toluene solution containing 0 parts added and mixed is coated on a separator and dried to form a pressure-sensitive adhesive layer having a thickness of 50 μm. Using the 20 mm square pressure-sensitive adhesive layer, two aluminum plates (thickness 1 mm, A shear test piece is formed by adhering a width of 25 mm and a length of 100 mm, and the adhering portion is an induction heating device (output 6).
Induction heating was performed at 00 W and a frequency of 45 kHz for 5 seconds to heat-foam. In the above, the shear adhesive strength of the test piece before and after induction heating was examined (pulling speed 50 mm /
Minutes). The results are shown in Table 1.

【0030】実施例2 実施例1で得たセパレータ上の感圧接着層を厚さ50μ
mのアルミニウム箔の両面に移着してラミネートし、加
熱剥離シートを得た。次にその20mm角の加熱剥離シー
トを用いて2枚のABS(厚さ3mm、幅25mm、長さ1
00mm)を接着して剪断試験片を形成し、その接着部分
を実施例1に準じて加熱発泡処理させ、試験片の剪断接
着力を調べた。結果を表1に示した。
Example 2 The pressure-sensitive adhesive layer on the separator obtained in Example 1 was 50 μm thick.
It was transferred to both sides of an aluminum foil of m and laminated to obtain a heat release sheet. Next, using the 20 mm square heat release sheet, two ABSs (thickness 3 mm, width 25 mm, length 1
00 mm) was adhered to form a shear test piece, and the bonded portion was subjected to heat-foaming treatment according to Example 1, and the shear adhesive strength of the test piece was examined. The results are shown in Table 1.

【0031】[0031]

【表1】 [Table 1]

【0032】実施例1,2に準じて剪断試験片を形成し
て加熱発泡処理させたのち、アルミニウム板又はABS
板の1枚を剥離して分離したのち、他の各1枚より加熱
処理後の感圧接着層を剥離し、得られたアルミニウム板
又はABS板の各2枚を目視観察したところいずれの場
合にも糊残り(感圧接着層片)は認められなかった。
Shear test pieces were formed in accordance with Examples 1 and 2 and subjected to a heat-foaming treatment, and then an aluminum plate or ABS.
After peeling and separating one of the plates, the pressure-sensitive adhesive layer after heat treatment was peeled off from the other one, and each of the two obtained aluminum plates or ABS plates was visually observed. No adhesive residue (pressure-sensitive adhesive layer piece) was observed.

【0033】[0033]

【発明の効果】本発明によれば、誘導加熱による短時間
処理で発泡処理できて感圧接着層を介した接着状態を被
着体の損傷なく容易に解くことができて、その分離作業
を加熱後の任意な時に遂行でき、しかも分離の際に糊残
りも防止できて被着体の洗浄等を省略することができ
る。
According to the present invention, the foaming treatment can be performed in a short time by induction heating, and the adhesion state via the pressure-sensitive adhesive layer can be easily released without damaging the adherend, and the separation work can be performed. It can be performed at any time after heating, and adhesive residue can be prevented during separation, so that washing of the adherend can be omitted.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例の断面図。FIG. 1 is a sectional view of an example.

【図2】他の実施例の断面図。FIG. 2 is a sectional view of another embodiment.

【図3】加熱発泡処理状態の説明図。FIG. 3 is an explanatory view of a heating and foaming treatment state.

【符号説明】[Explanation of symbols]

1:基材 2,3:感圧接着層 21:加熱発泡処理状態 31:発泡剤を含有する層 32:発泡剤を含有しない層 4:被着体 1: Substrate 2, 3: Pressure-sensitive adhesive layer 21: Heat-foaming treatment state 31: Layer containing a foaming agent 32: Layer not containing a foaming agent 4: Adherend

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 高周波で誘導加熱される基材の片面又は
両面に、加熱により発泡及び/又は膨張する発泡剤を含
有する感圧接着層を有することを特徴とする加熱剥離シ
ート。
1. A heat-peelable sheet having a pressure-sensitive adhesive layer containing a foaming agent that expands and / or expands by heating, on one or both sides of a base material that is induction-heated with high frequency.
【請求項2】 基材が導電体層若しくは磁性体層を有
し、又は/及び導電粉若しくは磁性粉を含有するもので
ある請求項1に記載の加熱剥離シート。
2. The heat release sheet according to claim 1, wherein the substrate has a conductor layer or a magnetic layer, and / or contains a conductive powder or a magnetic powder.
【請求項3】 高周波で誘導加熱される被着体に接着し
た発泡剤含有の感圧接着層を、前記被着体の誘導加熱下
に発泡及び/又は膨張処理したのち被着体と分離するこ
とを特徴とする剥離方法。
3. A pressure-sensitive adhesive layer containing a foaming agent, which adheres to an adherend that is induction heated at high frequency, is foamed and / or expanded under induction heating of the adherend, and then separated from the adherend. A peeling method characterized by the above.
JP5319064A 1993-11-24 1993-11-24 Heat release sheet and release method Pending JPH07145357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5319064A JPH07145357A (en) 1993-11-24 1993-11-24 Heat release sheet and release method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5319064A JPH07145357A (en) 1993-11-24 1993-11-24 Heat release sheet and release method

Publications (1)

Publication Number Publication Date
JPH07145357A true JPH07145357A (en) 1995-06-06

Family

ID=18106102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5319064A Pending JPH07145357A (en) 1993-11-24 1993-11-24 Heat release sheet and release method

Country Status (1)

Country Link
JP (1) JPH07145357A (en)

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WO2009054108A1 (en) * 2007-10-22 2009-04-30 Nitto Denko Corporation Thermal expansion type removable acrylic pressure-sensitive adhesive tape or sheet and method of removal
JP2010106193A (en) * 2008-10-31 2010-05-13 Tokyo Institute Of Technology Adhesive sheet, structure and method for peeling structure
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