JPH0714910A - Workpiece transfer plate - Google Patents

Abstract

(57) [Abstract] [Purpose] Shortens the processing time in the process of producing the workpiece holder, does not require advanced processing technology, reduces production costs, and easily removes particles adhering to the surface. . [Structure] An inner step 3 is formed on the free end side of the plate body 1 in accordance with the shape of the orientation flat of the wafer.
The workpiece holders 3a and 3b are installed so that the plate is perpendicular to the plate center line 5, and on the support side of the plate body 1, an inner step 3 is formed on the plate center line 5 according to the circular shape of the outer periphery of the wafer. On the other hand, the workpiece holders 3c and 3d are installed so as to be perpendicular to the line 6 of the direction θ passing through the center.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mainly used for transferring an object to be processed which is a wafer such as silicon in a semiconductor manufacturing apparatus.
The present invention relates to an object transfer plate of an object transfer device used for transfer.

[0002]

2. Description of the Related Art First, a vertical diffusion CVD apparatus, which is one of the semiconductor manufacturing apparatuses using an object transfer plate, will be described as an example. FIG. 3 is a perspective view showing the configuration of an example of a vertical diffusion CVD apparatus. The main body 11 includes a heating furnace 12, an object holding means, for example, a cassette shelf 13, a control device 14 for controlling the operation of the apparatus, a boat 15 for mounting an object to be treated, for example, the wafer 10, and a boat 15. Heating furnace 12
A boat elevating / lowering device 18 to be loaded into the inside, an object storage means such as a cassette 16 for storing a wafer, and a wafer 1
0 from the cassette 16 on the cassette shelf 13 to the boat 15
It has an object transfer device 17 for transferring and transferring to and from, and a transfer device lifting mechanism 19 for moving the object transfer device 17 in the vertical direction.

The object transfer plate is attached to the object transfer device 17. The object transfer device 17 is
As shown in FIG. 4, a rotating portion 23 for rotating the main body, a plate mounting portion 22 for moving in the lateral direction (X-axis direction in the drawing),
It is configured to have a workpiece transfer plate 21 attached to the plate attachment portion 22. Next, the specific structure of the conventional plate will be described with reference to FIG. The plate body 30 is
It is mainly made of quartz or a material such as SiC. Therefore, the precise processing requires time and high skill. The plate body has a contact portion 34 that comes into direct contact with the object to be processed, and a non-contact portion that does not come into direct contact with the object to be processed and is thinner than the contact portion 34 by 0.1 mm in the example shown in FIG. 35 and the outer periphery of the object to be processed, and the object to be processed falls from the plate body 30, or
It has a structure having a protrusion 32 for preventing the plate from being displaced and a vent hole 31 for facilitating separation of the object to be processed from the plate body 30.

In the above-mentioned conventional structure, the wafer transfer operation will be described by taking the case where the wafer 10 stored in the cassette 16 is transferred and transferred to the boat 15. The object transfer device 17 moves up and down by the transfer device lifting mechanism 19. Plate attachment portion 22 of the workpiece transfer device 17
Is directed toward the wafer in the cassette 16 by its rotating part 23. At the position where the plate main body 30 constituting the workpiece transfer plate 21 faces the wafer, the workpiece transfer plate 21 having the support 36 attached to the plate mounting portion 22 moves in the cassette direction, and the plate body 30 moves to the wafer. It is inserted between 10 without contact. In the object transfer device 17, the plate body 30 has the wafer 1
It rises as it touches 0. At this time, the wafer 1 is actually
Only the contact portion 34 of the plate body 30 is in contact with 0, and the outer periphery of the wafer 10 is the protrusion 3 of the plate body 30.
It stays within 2. The plate mounting portion 22 of the workpiece transfer device 17 in which the wafer 10 is placed on the plate body 30 takes out the wafer 10 from the cassette 16, that is, moves to the original position. The object transfer device 17 on which the wafer 10 is placed is rotated 180 degrees by the rotating part 23, and the plate body 30 faces the boat 15. A groove in which the wafer 10 on the plate body 30 of the workpiece transport device 17 is mounted with the wafer 10 of the boat 15 by the transfer machine lifting mechanism 19.
Alternatively, the object transfer device 17 is moved up and down to a position suitable for the protrusion. The plate mounting portion 22 of the processing object transfer device 17 and the processing object transfer plate 21 attached to the plate mounting part 22.
Moves to the boat side and mounts the wafer 10 in the boat 15. The object transfer device 17 is moved down by the transfer device elevating mechanism 19 as far as the wafer 10 is separated from the plate body 30, the plate mounting portion 22 is returned to the original position, and the wafer 10 is transferred from the cassette 16 to the boat. Is complete.

[0005]

In the above-mentioned conventional object transfer plate, the contact portion 3 of the plate body 30 is used.
4. The shapes of the non-contact portion 35 and the protruding portion 32 are complicated, it takes a long processing time in the manufacturing process, and not only advanced technology is required to perform processing according to the processing tolerance, but also complicated surface shape Therefore, if particles (fine dust) adhere to the surface, it is difficult to remove them.

[0006]

In order to solve the above problems, the plate of the present invention has a stepped portion 3 for holding an object to be treated in a desired direction at a required position of the plate body 1 to be treated. .. is provided. In other words, the plate of the present invention is the plate body 1
And the support 2 for adjusting the thickness when directly attached to the plate attachment portion (22 in FIG. 4) and the plate body 1 are not brought into direct contact with each other and hold the object to be processed and fall during transportation, or A plate for a workpiece transfer device having workpiece holders 3a, 3b ... Having a step 3 for preventing deviation and a vent hole 4 provided so that the workpiece and the plate body 1 are easily separated from each other. Is.

[0007]

With such a structure, the workpiece holders 3a, 3b, ... Can be made into a simple shape, the processing time in the production process can be shortened, and at the same time, an advanced processing technique can be applied. It is not necessary, the production cost can be reduced, and since the surface shape is simple, even if particles adhere to the surface, they can be easily removed.

[0008]

1 (A) and 1 (B) are a plan view and a magnified view taken along the line AA of the plate of one embodiment of the plate of the present invention, respectively. In the present embodiment, the workpiece holders 3a to 3 are provided.
There are four pieces of d, and two pieces of the free end side and the support side of the plate body 1 are two pieces 3a, 3b and 3c, 3d, respectively. The two workpiece holding portions 3a, 3b on the free end side are matched with the orientation flat shape of the wafer held by the holding portions 3a, 3b so that the inner step 3 is perpendicular to the plate center line 5. is set up. In addition, the two holding parts 3c and 3d on the support side are the holding parts 3c.
According to the circular shape of the outer circumference of the wafer held by c and 3d, the inner step 3 is installed so as to be perpendicular to the line 6 of the direction θ passing through the center with respect to the plate center line 5.

The method for installing the workpiece holders 3a to 3d is as follows.
Adhesion, welding, etc. are not particularly limited, and the support 2 may be attached by a plate attachment method or the like. By configuring the workpiece transport plate according to the present embodiment as described above, the shapes of the four workpiece holders 3a to 3d can be simplified and the processing time in the production process can be shortened. In addition, it does not require advanced processing technology, can reduce production costs, and has a simple surface shape, so even if particles adhere to the surface, it can be easily removed. Become. Further, since the workpiece holders 3a to 3d have a simple shape, the plate body 1 may be thickened in advance and processed into the regular shape.

[0010]

As described above, according to the present invention, the workpiece holders 3a, 3b ... Having the step 3 for holding the workpiece in the desired orientation are provided at the required positions of the plate body 1. By providing the workpiece holders 3a, 3b ..., the shape of the holders 3a, 3b ... Can be simplified, the processing time in the manufacturing process can be shortened, and high processing technology is not required, so that the manufacturing cost can be reduced. Can be reduced, and since the surface shape is simple, even if particles adhere to the surface, they can be easily removed. Further, it is possible to provide a high-performance semiconductor manufacturing apparatus in which the yield of processing the object to be processed is improved.

[Brief description of drawings]

FIG. 1 (A) and FIG. 1 (B) are each one of the plate of the present invention.
It is the top view which shows the structure of an Example, and its AA line arrow enlarged view.

2A and 2B are respectively a plan view and a magnified view taken along the line AA of the conventional plate showing the configuration of one example.

FIG. 3 is a perspective view showing the configuration of an example of a vertical diffusion CVD apparatus.

FIG. 4 is a perspective view showing a configuration of an example of a workpiece transfer device to which a conventional plate and a plate of the present invention are applied.

[Explanation of symbols]

 1 Plate Main Body 2 Support 3 Steps 3a to 3d Workpiece Holding Portion 4 Vent Hole 5 Plate Center Line 6 Line with Direction θ Passing through Center

Claims (1)

[Claims] 1. An object holding part (3a, 3b ...) Having a step (3) for holding an object in a desired direction is provided at a required position of a plate body (1). An object-carrying plate for processing.