JPH0714934A - Cap-sealed electronic component and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To provide a cap-sealed electronic component that functions as a highly reliable surface-mountable electronic component that enables compactness or high-density mounting, and a manufacturing method thereof. To aim. [Structure] A circuit board 7 from which an external connection terminal 7a surface is led to one main surface side via an edge portion, a component element mounted on the other main surface of the circuit board 7, and another circuit board 7 A cap-sealing type electronic component, which comprises a sealing cap 9 for sealing a component element, the opening edge of which is sealed on the main surface with an insulating adhesive, and the sealing cap 9 is insulated. The opening edge of the sealing opening by the conductive adhesive is concavely deformed inward in the lead-out corresponding region of each external connection terminal 7a led out to the one main surface side, and the outside due to the outflow of the insulating adhesive to be sealed. A structure that prevents contamination of the surface of the connection terminal 7a is adopted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cap-sealed electronic component capable of high-density surface mounting and a method of manufacturing the same.

[0002]

2. Description of the Related Art As is well known, required component elements such as bare chip ICs are mounted and mounted on the surface of a circuit board, and these bare chip ICs are electrically connected to a wiring circuit by wire bonding or the like. In order to protect the mounted bare chip IC etc. from the external atmosphere,
Cap-encapsulated electronic components that are hermetically sealed with a sealing cap are widely used in various electronic devices as circuit components that make electronic (electrical) circuits compact or can be attached to and detached from the base substrate. Have been used for. By the way, in this type of cap-encapsulated electronic component, in order to further reduce the mounting area of the base substrate, in other words, to enable higher-density mounting or downsizing of the mounted circuit device, the structure shown in FIG. There is also known a cap-encapsulated electronic component having a structure in which a partial structure is shown in cross section. In FIG. 5, reference numeral 1 denotes a circuit board having external connection terminals 1a which are insulated and separated from each other along an end face, and 2 denotes a chip capacitor 2a and a bare chip IC mounted on the other main surface of the circuit board 1.
Component elements such as 2b and 3 are openings edge 3a on the surface of the circuit board 1.
Is a sealing cap that seals the component element 2 by bonding and sealing with an insulating adhesive 4 such as an epoxy resin. In the case of the cap-sealed electronic component 5,
As shown in the cross-sectional view of the main part configuration in FIG. 6, since it can be surface-mounted on the connected portion 6a on the surface of the base substrate 6, the mounting area (mounting area) is reduced, in other words, the mounting area of the component element 2 is further secured. Is possible.

[0003]

However, the structure of the cap-sealed electronic component has the following inconvenient problems. That is, in order to secure the mounting area of the component element 2, it is desirable to adopt a configuration in which the opening edge 3a of the sealing cap 3 is bonded and sealed at the peripheral edge of the surface of the circuit board 1 as much as possible. On the other hand, in the case of adopting such a configuration, as shown in a plan view and a sectional view of a main part configuration in FIGS. 7 (a) and 7 (b), the insulation used for joining and sealing the sealing cap 3 is used. Connection terminal in which the conductive adhesive flows out to a region other than the surfaces to be joined, is arranged at the peripheral portion of the surface of the circuit board 1 (for example, along the end face), and is separated and insulated from each other and is led to the rear surface side. It is often observed that the surface 1a is covered and the electrical connection to the surface 6 of the base substrate is hindered. Also, the cap-encapsulated electronic component is mounted on the surface of the base substrate 6.
Even if the positioning at the time of placement or the confirmation of the soldering state is performed visually (from the top surface), the bonding / sealing area of the sealing cap 3 and the lead-out surface of the external connection terminal 1a overlap each other. There is also the inconvenience that it is difficult to apply visual inspection, which is a relatively simple means.

The present invention has been made in view of the above circumstances, and is capable of compacting or high-density mounting and functions as a highly reliable surface-mounting electronic component, and its manufacture. The purpose is to provide a method.

[0005]

SUMMARY OF THE INVENTION A cap-sealed electronic component according to the present invention is a circuit board in which an external connection terminal surface is led out to one main surface side via an edge portion, and another main surface of the circuit board. And a sealing cap for sealing the component element, the opening edge of which is sealed with an insulating adhesive on the other main surface of the circuit board. The sealing opening edge of the cap with the insulating adhesive is concavely deformed inward in the lead-out corresponding region of each external connection terminal led out to the one main surface side, and the insulating adhesive for sealing flows out. By adopting a configuration that prevents contamination of the external connection terminal surface due to, or at least one of the inner peripheral surface and the outer peripheral surface of the sealing opening end edge by the insulating adhesive of the sealing cap,
In addition, at least the outflow-corresponding region of the external connection terminal is provided with the outflow / escape portion of the sealing insulating adhesive to prevent contamination of the external connection terminal surface.

Also, in the method of manufacturing a cap-sealed electronic component according to the present invention, the component element is mounted on the other main surface of the circuit board from which the external connection terminal surface is led out to the one main surface side through the edge portion. And the surface of the circuit board on which the component element is mounted, the opening edge of the sealing cap that seals the mounting area of the component element is bonded / sealed to the circuit board surface via the insulating adhesive layer. And a step of forming an opening edge portion of the sealing cap, which is previously concavely deformed inward in a lead-out corresponding region of each external connection terminal led out to the one main surface side, The external connection terminal surface is prevented from being contaminated by the outflow of the insulating adhesive during the sealing step, or at least one of the inner peripheral surface and the outer peripheral surface of the opening end edge of the sealing cap is formed. , And at least in the area corresponding to the lead-out of the external connection terminal Attached to leave processing stepped, relief outflow of insulating adhesive during the sealing step to the processing unit, characterized in that to prevent contamination of the external connection terminal surface.

In the present invention, the external connection terminal surface is led out from the other main surface of the circuit board to the one main surface (rear surface) side. In the peripheral end surface of the circuit board, a semi-through hole type region is appropriately provided, It is preferable to arrange the external connection terminal layer along the concave surface in terms of workability, compactness, and securing the mounting area. However, through holes are appropriately provided in the peripheral portion of the circuit board, and the inner wall surface of the through hole is formed. The external connection terminal layer may be arranged in the.

[0008]

According to the above-described structure or structure and manufacturing means of the present invention, it is led out to the back surface side through the opening edge of the sealing cap for sealing the required component element and the edge of the circuit board. Since each external connection terminal area is locally separated from each other so as not to overlap with each other, the edge of the opening of the sealing cap is bonded / sealed to the surface of the circuit board via the insulating adhesive layer. Even in such a case, the outflow of the insulating adhesive can easily avoid or eliminate the coating and contamination of each external connection terminal layer. Further, the fear of occurrence of electrical connection failure due to coating and contamination of each external connection terminal layer by the insulating adhesive is completely eliminated, and reliable electrical connection and mounting can be achieved. On the other hand, on the other hand, the external connection terminal area and the edge of the sealing cap opening are locally separated so that they do not overlap, so visual observation after soldering to the base substrate surface is easy. You can do it. That is, it is possible to provide a highly reliable, high-density surface-mountable and compact cap-sealed electronic component without a complicated manufacturing process and with a high yield.

[0009]

Embodiments of the present invention will be described below with reference to FIGS.

Embodiment 1 FIG. 1 is a plan view showing an example of a structure of a main part of a cap-sealed electronic component according to this embodiment, and FIG. 2 is a cross-sectional view thereof, in which 7 is an end portion. Circuit board from which the surface of the external connection terminal 7a is led out to one main surface side, 8 is a component element mounted on the other main surface of the circuit board 7, and 9 is an opening edge 9a on the other main surface of the circuit board 7. Is sealed with an insulating adhesive 10 and a sealing cap for sealing the component element 8 is provided.

The cap-sealing type electronic component according to the present invention is characterized in that, in the above-described basic structure, the sealing / capping structure of the sealing cap 9 to the surface of the circuit board 7 is formed. That is, the sealing opening edge 9a of the sealing cap 9
In the sealing part structure of the circuit board 7 in which the sealing opening end edge 9a is joined and sealed via the insulating adhesive 10 layer, the end surface is provided on the one main surface (back surface) side of the circuit board 7. The area of the sealing opening edge 9a corresponding to each external connection terminal 7a led out along the recessed surface 7b is deformed in advance in a recessed manner corresponding to the recessed surface 7b of the end surface of the circuit board 7. Make up the composition. In addition, as described above, when the sealing opening edge 9a of the sealing cap 9 and the surface of the circuit board 7 are joined and sealed, the insulating adhesive 10 and the recesses provided on the surface to be joined and sealed are recessed. By separating the external connection terminals 7a led out along the surface 7b from each other, the external connection terminals 7a due to the outflow of the insulating adhesive 10 for sealing.
It has a structure capable of preventing surface contamination or coating.

That is, along the end face of the circuit board 7, the surface of the external connection terminal 7a led out to the back surface side is prevented from being contaminated and covered, and required reliable electrical connection / mounting can be performed on the base substrate surface. It is one.

Next, an example of manufacturing the cap-sealed electronic component having the above structure will be described.

First, there is prepared a circuit board 7 having a recessed portion on an end surface thereof, which is integrally disposed on the recessed surface and has an external connection terminal led out to one main surface (back surface) side. Circuit board 7
The required component element 8 is mounted and mounted in a predetermined area on the other main surface. Next, on the surface of the circuit board 7 on which the component element 8 is mounted, an insulating adhesive, for example, an epoxy resin adhesive 10 is applied and adhered so as to surround the mounting area of the component element 8. The insulating adhesive 10 is applied and adhered according to the shape of the opening edge 9a of the sealing cap 9 for sealing the mounted component element 8. Here, the shape of the opening edge 9a of the sealing cap 9 is such that the sealing opening edge 9a region corresponding to each external connection terminal 7a led out along the concave surface 7b of the end surface of the circuit board 7 is It is configured so as to be concavely deformed corresponding to the concave surface 7b.

The opening edge 9a of the sealing cap 9 is aligned and arranged on the mounting surface of the component element 8 of the circuit board 7, and the surface of the circuit board 7 is sealed via the insulating adhesive 10 layer. The opening edge 9a of the cap 9 is joined and sealed. In the joining / sealing process of the sealing cap 9, the opening end edge portion 9a of the sealing cap 9 is integrally arranged in the concave surface of the end surface of the circuit board 7 and led out. Since the region corresponding to is deformed inwardly in advance,
It is possible to easily or reliably avoid contamination / covering of the surface of the external connection terminal 7a due to the outflow of the insulating adhesive 10 during the sealing step. That is, it prevents (avoids) the contamination / covering of the surface of the external connection terminal 7a led out to the back surface side along the end surface of the circuit board 7.
We were able to manufacture a cap-encapsulated electronic component that enables the required highly reliable electrical connection and mounting on the base substrate surface with good yield.

In the above embodiment, the circuit board 7 has the recessed portion 7b on the end face, and the external connection terminal is integrally disposed on the recessed face and led out to the one main surface (back surface) side. Although the circuit board provided with 7a was used, even if a circuit board having a configuration in which a through hole is formed near the edge portion of the circuit board and the external connection terminal 7a is arranged on the inner wall surface of the through hole, the mounting area is A cap-encapsulated electronic component that functions in almost the same manner except that it is slightly reduced is obtained.

Embodiment 2 FIGS. 3 and 4 are sectional views respectively showing structural examples of different main parts of a cap-sealed electronic component according to this embodiment, in which 11 is one main surface with an edge portion interposed therebetween. Side is a circuit board from which the surface of the external connection terminal 11a is led out, 12 is a component element mounted on the other main surface of the circuit board 11, and 13 is an insulating adhesive bonding of the opening edge 13a to the other main surface of the circuit board 11. A sealing cap that is sealed with an agent 14 and surrounds and seals the component element 12.

The cap-encapsulating electronic component according to the present invention is characterized in that, in the above-mentioned basic configuration, the sealing / capping structure of the sealing cap 13 is bonded to the surface of the circuit board 11. That is, the sealing opening edge 13a of the sealing cap 13
And the circuit board 11 in which the sealing opening end edge 13a is joined and sealed through the insulating adhesive 14 layer, the sealing opening end of the sealing cap 13 that is joined and sealed in the circuit board 11 A structure in which the insulating insulating adhesive outflow / relief part 13b is previously installed on at least one of the inner peripheral surface and the outer peripheral surface of the edge 13a by processing such as stepping or tapering ing. Further, as described above, the sealing cap 13
In bonding / sealing the sealing opening edge 13a of the and the surface of the circuit board 11, the insulating adhesive is preliminarily applied to the bonding / sealing surface area.
The outflow / escape portion 13b of 14 is provided to prevent the insulating adhesive 14 from being contaminated or coated on the surface of each external connection terminal 11a. That is, it is led out to the back surface side along the end surface of the circuit board 11 and the external connection terminal 11a.
The surface is prevented from being contaminated and covered, and the required highly reliable electrical connection / mounting is possible on the base substrate surface.

Next, a manufacturing example of the cap-sealed electronic component having the above structure will be described.

First, a circuit board 11 provided with external connection terminals, which are arranged on the end faces so as to be insulated and separated from each other, and which are led out to one main surface (rear surface) side, is prepared. The required component element 12 is mounted and mounted on. Next, on the surface of the circuit board 11 on which the component element 12 is mounted, an insulating adhesive, for example, an epoxy resin adhesive 14 is applied and adhered so as to surround the mounting area of the component element 12. On the other hand, the opening end edge 13a of the sealing cap 13 that seals the mounted component element 12 is an area corresponding to at least the external connection terminal 11a from which the end surface of the circuit board 11 is led out, and the inner peripheral surface and / or A part of the outer peripheral surface is cut off by, for example, stepped or tapered processing, and the adhesive outflow / escape part 13b
It is configured with. Here, the sealing cap 13
Of course, the opening end edge 13a of the above may be, for example, stepped or tapered. The circuit board 11
Opening edge 1 of the sealing cap 13 on the mounting surface of the component 12
3a is aligned and arranged, and the opening edge 13a of the sealing cap 13 is joined and sealed to the surface of the circuit board 11 via the insulating adhesive 14 layer. In the step of joining and sealing the sealing cap 13, the opening edge 13a of the sealing cap 13 is formed.
Is at least integrally arranged on the end surface of the circuit board 11, and the adhesive outflow / escape portion 13b is pre-installed on the inner peripheral surface and / or the outer peripheral surface of the region corresponding to the led external connection terminal 11a. Therefore, the insulating adhesive 14 that has flowed out during the joining / sealing step is easily stored / retained in this portion, and the contamination / covering of the surface of the external connection terminal 7a can be easily or reliably avoided. In other words, it can prevent (avoid) the contamination and coating of the external connection terminal 11a surface that is led out to the back side along the end surface of the circuit board 11, and enables the required highly reliable electrical connection and mounting on the base board surface. It was possible to manufacture the cap-encapsulated electronic component described above with a high yield. In the above embodiment, as the circuit board 11, the circuit board provided with the external connection terminals 11a integrally arranged on the end surface and led out to the one main surface (rear surface) side is used. A through hole is formed near the part, and external connection terminals are formed on the inner wall surface of this through hole.
Even if the circuit board having the structure in which 11a is arranged is used, a cap-sealed electronic component that functions in almost the same manner is obtained except that the mounting area is slightly reduced.

[0021]

As described above, according to the cap-sealed electronic component and the method for manufacturing the same according to the present invention, the insulating adhesive for bonding and sealing the sealing cap flows out to the jointed portion. Since it can be easily and surely prevented or avoided, the insulating bonding of the external connection terminal surface, which is led to the back surface side at the edge, is close to the area where the sealing cap is joined and sealed. There is no contamination or coating with the agent. That is, in the cap-sealed electronic component according to the present invention, since each external connection terminal surface led out to the back surface side is clean and has good electrical connectivity, when surface mounted, A reliable electrical connection or mounting can always be achieved.

Thus, the cap-sealed electronic component according to the present invention brings many practical advantages in securing a mounting area and in the construction of a highly reliable high-density mounting circuit device. It can be said that the manufacturing method according to (1) can provide the cap-sealed electronic component having such characteristics easily and with a high yield.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a main part structure of a cap-sealed electronic component according to the present invention.

FIG. 2 is a sectional view showing an example of a main part structure of a cap-sealed electronic component according to the present invention.

FIG. 3 is a cross-sectional view showing another structural example of the main part of the cap-sealed electronic component according to the present invention.

FIG. 4 is a cross-sectional view showing still another example of the main part structure of the cap-sealed electronic component according to the present invention.

FIG. 5 is a cross-sectional view showing a structural example of a main part of a conventional cap-sealed electronic component.

FIG. 6 is a cross-sectional view showing the main structure of a conventional cap-sealed electronic component mounted on the surface of a base substrate.

FIG. 7 shows another structural example of a main part of a conventional cap-sealed electronic component, where (a) is a plan view and (b) is a sectional view.

[Explanation of symbols]

1, 7, 11 ... Circuit boards 1a, 7a, 11a ... External connection terminals 2, 8, 12 ... Component element 2a ... Chip capacitor
2b ... Bare chip IC 3, 9, 13 ... Sealing cap
3a, 9a, 13a ... Opening edge 4,10, 14 ... Insulating adhesive 5 ... Cap-sealed electronic component 6 ... Base substrate 6a ... Connected part 7b ... Recessed surface 13b ... Adhesive outflow / stain Department

Claims (4)

[Claims] 1. A circuit board in which an external connection terminal surface is led out to one main surface side via an edge portion, a component element mounted on the other main surface of the circuit board, and the other main surface of the circuit board. A sealing cap for sealing the component element, the opening edge of which is sealed with an insulating adhesive, and the sealing opening edge of the sealing cap with the insulating adhesive is mainly The external connection terminals that are led to the surface side are concavely deformed inward in the lead-out corresponding region, and the external connection terminal surface is prevented from being contaminated due to the outflow of the insulating adhesive that seals. Characteristic Cap-encapsulated electronic component. 2. A step of mounting a component element on the other main surface of the circuit board from which the external connection terminal surface is led out on the one main surface side through the edge portion, and a step of mounting the component element on the circuit board. A step of connecting / sealing an opening edge of a sealing cap for sealing a mounting area of the component element to a circuit board surface via an insulating adhesive layer. The opening edge portion is previously concavely deformed inward in the lead-out corresponding region of each external connection terminal led out to the one main surface side, and external connection is made by the outflow of the insulating adhesive during the sealing step. A method for manufacturing a cap-encapsulated electronic component, which prevents contamination of a terminal surface. 3. A circuit board in which an external connection terminal surface is led out to one main surface side via an edge portion, a component element mounted on the other main surface of the circuit board, and the other main surface of the circuit board. An opening edge is sealed with an insulating adhesive, and a sealing cap for sealing a component element is provided, wherein the sealing cap is sealed with an insulating adhesive The outflow / escape portion of the sealing insulating adhesive is provided on at least one of the outer peripheral surface and the outer peripheral surface, and at least in the area corresponding to the lead-out of the external connecting terminal to prevent contamination of the external connecting terminal surface. A cap-sealed electronic component having a configuration. 4. A step of mounting a component element on the other main surface of the circuit board from which the external connection terminal surface is led out to the one main surface side through the edge portion, and a step of mounting the component element on the surface of the circuit board. A step of connecting / sealing an opening edge of a sealing cap for sealing a mounting area of the component element to a circuit board surface via an insulating adhesive layer. At least one of the inner peripheral surface and the outer peripheral surface of the opening edge, and at least the area corresponding to the lead-out of the external connection terminal is tapered or stepped in advance, and the insulating bonding during the sealing step is performed. A method for manufacturing a cap-sealed electronic component, characterized in that the outflow of an agent is released to a processed portion to prevent contamination of the external connection terminal surface.