JPH0714943A - Chip carrier - Google Patents
Chip carrierInfo
- Publication number
- JPH0714943A JPH0714943A JP14770093A JP14770093A JPH0714943A JP H0714943 A JPH0714943 A JP H0714943A JP 14770093 A JP14770093 A JP 14770093A JP 14770093 A JP14770093 A JP 14770093A JP H0714943 A JPH0714943 A JP H0714943A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- chip carrier
- mold
- resin
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/865—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 搭載した半導体素子をモールドで封止する際
に、放熱板の放熱面を封止樹脂が被覆せず、放熱性が良
好なモールドパッージ用のチップキャリアを提供する。
【構成】 プリント配線板１に付設された放熱板３を備
えたモールドパッージ用のチップキャリアにおいて、該
放熱板３の露出する放熱面１１の全外周に立ち上げた、
封止樹脂８の流動圧に起因する封止樹脂用金型９の圧力
により、先端がつぶれる突条５を備えている。
(57) [Abstract] [Purpose] To provide a chip carrier for a mold package that has good heat dissipation without sealing the heat dissipation surface of the heat dissipation plate when the mounted semiconductor element is sealed with a mold. To do. In a chip carrier for a mold package provided with a heat dissipation plate 3 attached to a printed wiring board 1, the heat dissipation plate 3 is erected on the entire outer circumference of an exposed heat dissipation surface 11,
The protrusion 5 is provided whose tip is crushed by the pressure of the sealing resin mold 9 caused by the flow pressure of the sealing resin 8.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子を搭載する
ために用いられるモールドパッケージ用のチップキャリ
アに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip carrier for a mold package used for mounting a semiconductor device.
【０００２】[0002]
【従来の技術】図５に示すごとく、プリント配線板１に
付設された放熱板３を備えたモールドパッケージ用のチ
ップキャリアにおいて、放熱板３は、プリント配線板１
の導電回路１０にワイヤボンディングされた半導体素子
７の熱が蓄積するのを防ぐため、放熱する役割を果た
す。従って、一般的には、放熱板３の材料としては、熱
伝導性の良好なアルミニウム、銅及びこれらの合金等の
金属が使用されているが、エポキシ系及びポリイミド系
樹脂等の封止樹脂８をモールドで封止する際、樹脂封止
用金型９と放熱板３との隙間が存在すると、封止樹脂８
が放熱板３の放熱面１１へ流入して放熱面１１を被覆
し、放熱効果が低減する欠点がある。2. Description of the Related Art As shown in FIG. 5, in a chip carrier for a mold package having a heat dissipation plate 3 attached to a printed wiring board 1, the heat dissipation plate 3 is a printed wiring board 1.
In order to prevent the heat of the semiconductor element 7 wire-bonded to the conductive circuit 10 from being accumulated, it plays a role of radiating heat. Therefore, in general, metals such as aluminum, copper and alloys thereof having good thermal conductivity are used as the material of the heat dissipation plate 3, but the sealing resin 8 such as epoxy resin and polyimide resin is used. When a resin is sealed with a mold, if there is a gap between the resin sealing mold 9 and the heat dissipation plate 3, the sealing resin 8
Has a drawback that it flows into the heat radiating surface 11 of the heat radiating plate 3 to cover the heat radiating surface 11 and the heat radiating effect is reduced.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の欠点を
除去するためになされたもので、その目的とするところ
は、搭載された半導体素子７を樹脂封止する際に、放熱
板３の放熱面１１を封止樹脂８が被覆しないモールドパ
ッケージ用のチップキャリアを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in order to eliminate the above-mentioned drawbacks, and an object of the present invention is to remove the heat radiation plate 3 when the mounted semiconductor element 7 is resin-sealed. It is to provide a chip carrier for a mold package in which the heat dissipation surface 11 is not covered with the sealing resin 8.
【０００４】[0004]
【課題を解決するための手段】本発明に係るモールドパ
ッケージ用のチップキャリアは、プリント配線板１に付
設された放熱板３を備えたモールドパッケージ用のチッ
プキャリアにおいて、該放熱板３の露出する放熱面１１
の全外周に立ち上げた、封止樹脂８の流動圧に起因する
樹脂封止用金型９の圧力により、先端がつぶれる突条５
を備えたことを特徴とする。A chip carrier for a mold package according to the present invention is a chip carrier for a mold package provided with a heat dissipation plate 3 attached to a printed wiring board 1, and the heat dissipation plate 3 is exposed. Heat dissipation surface 11
The ridge 5 whose tip is crushed by the pressure of the resin-sealing die 9 caused by the flow pressure of the sealing resin 8 which is erected on the entire outer circumference of
It is characterized by having.
【０００５】[0005]
【作用】本発明によると、樹脂封止時に封止樹脂８の流
動圧に起因する樹脂封止用金型９の圧力により、放熱板
３の突条５の先端がつぶれ、放熱板３の放熱面１１を包
囲する枠５ａが形成され、この枠５ａが堰となり、封止
樹脂８が放熱面１１に流入するのを防止することがで
き、放熱面１１が封止樹脂８に被覆されず露出された状
態になる。According to the present invention, the tip of the ridge 5 of the heat dissipation plate 3 is crushed by the pressure of the resin encapsulation mold 9 caused by the flow pressure of the encapsulation resin 8 during resin encapsulation, and the heat dissipation of the heat dissipation plate 3 is dissipated. A frame 5a surrounding the surface 11 is formed, the frame 5a serves as a weir, and the sealing resin 8 can be prevented from flowing into the heat dissipation surface 11, and the heat dissipation surface 11 is not covered with the sealing resin 8 and exposed. It will be in the state of being.
【０００６】[0006]
【実施例】以下、本発明を実施例によって詳述する。EXAMPLES The present invention will be described in detail below with reference to examples.
【０００７】図１は、本発明の実施例に係るモールドパ
ッケージ用のチップキャリアを例示した斜視図であり、
図２は、図１の断面図である。FIG. 1 is a perspective view illustrating a chip carrier for a mold package according to an embodiment of the present invention,
FIG. 2 is a sectional view of FIG.
【０００８】このモールドパッケージ用のチップキャリ
アは、中央部に貫通した孔１２を備えたプリント配線板
１の導電回路１０にリードフレームのリードで形成され
る接続用端子２が接合してあり、このプリント配線板１
の導電回路１０が形成された面と反対側の面には、前記
の孔１２を閉塞するように放熱板３を接着剤４によって
接着固定してあり、プリント配線板１の孔１２とこの孔
１２を閉塞する放熱板３とによって、半導体素子７を搭
載するための窪み１３が形成される。この接着剤４は、
プリント配線板１からの熱が、放熱板３に良く伝導して
熱を逃がすようにするのが好ましく、熱伝導性を付与し
た熱硬化型接着剤等が適している。放熱板３において前
記の孔１２を閉塞するのに用いた面と反対側にある放熱
面１１を包囲する突条５を放熱板３の全外周に立ち上げ
てある。この突条５は、放熱板３をフープから打ち抜き
で作製する時にバリを発生させて形成してもよく、ある
いは、鋳型を用いて溶融金属を注型で製作する時に形成
したものでもよく、製造方法は、問わない。また、放熱
板３の形状は、直方体であっても、円柱状であってもよ
く、形状は、問わない。また、接続用端子２の形状につ
いても、ガル−ウィング型であっても、Ｊ型であって
も、Ｉ型であってもよく、形状は、問わない。In this chip carrier for a molded package, a connecting terminal 2 formed by a lead of a lead frame is joined to a conductive circuit 10 of a printed wiring board 1 having a hole 12 penetrating in the center thereof. Printed wiring board 1
On the surface opposite to the surface on which the conductive circuit 10 is formed, a heat dissipation plate 3 is adhered and fixed by an adhesive 4 so as to close the hole 12, and the hole 12 of the printed wiring board 1 and this hole The heat dissipation plate 3 that closes 12 forms a recess 13 for mounting the semiconductor element 7. This adhesive 4
It is preferable that the heat from the printed wiring board 1 be well conducted to the heat dissipation plate 3 to escape the heat, and a thermosetting adhesive or the like having heat conductivity is suitable. The ridges 5 surrounding the heat radiating surface 11 on the side opposite to the surface used to close the hole 12 in the heat radiating plate 3 are erected on the entire outer circumference of the heat radiating plate 3. The ridges 5 may be formed by generating burrs when the heat dissipation plate 3 is punched out from the hoop, or may be formed when the molten metal is cast by using a mold. The method does not matter. Further, the shape of the heat dissipation plate 3 may be a rectangular parallelepiped or a column, and the shape is not limited. Further, the shape of the connection terminal 2 may be a gull-wing type, a J type, or an I type, and the shape is not limited.
【０００９】図３に示すごとく、図１、図２のモールド
パッケージ用のチップキャリアの放熱板３に接する半導
体素子７を窪み１３に搭載し、半導体素子７とプリント
配線板１の導電回路１０をボンディングワイヤ６で電気
的に接続したものを樹脂封止用金型９に装着してある。
放熱板３の突条５の尖った先端が、モールドで樹脂封止
をする時に封止樹脂８の流動圧に起因する樹脂封止用金
型９の圧力により、放熱板３の突条５の先端がつぶれ、
放熱板３の放熱面１１を包囲する枠５ａが形成される。
この放熱板３の枠５ａが堰となり、放熱板３の放熱面に
封止樹脂８の流入を防止することができる。As shown in FIG. 3, the semiconductor element 7 in contact with the heat sink 3 of the chip carrier for the mold package shown in FIGS. 1 and 2 is mounted in the recess 13, and the semiconductor element 7 and the conductive circuit 10 of the printed wiring board 1 are connected. Those electrically connected by the bonding wires 6 are mounted on the resin sealing mold 9.
The sharp tip of the ridge 5 of the heat radiating plate 3 causes the ridge 5 of the heat radiating plate 3 to move due to the pressure of the resin-sealing die 9 caused by the fluid pressure of the sealing resin 8 when the resin is sealed with a mold. The tip is crushed,
A frame 5a surrounding the heat dissipation surface 11 of the heat dissipation plate 3 is formed.
The frame 5a of the heat radiating plate 3 serves as a weir to prevent the sealing resin 8 from flowing into the heat radiating surface of the heat radiating plate 3.
【００１０】すなわち、図４に示すごとく、半導体素子
７が封止樹脂８で封止されたモールドパッケージの半導
体装置は、枠５ａで包囲された放熱面１１が封止樹脂８
によって被覆されず、初期の原形を保って露出している
状態になっている。That is, as shown in FIG. 4, in the semiconductor device of the mold package in which the semiconductor element 7 is sealed with the sealing resin 8, the heat dissipation surface 11 surrounded by the frame 5a is the sealing resin 8
It is not covered by and is exposed in the original shape.
【００１１】突条５については、放熱板３の放熱面１１
の全外周に形成され、０．１ｍｍ以上の高さがあること
が好ましい。The ridge 5 has a heat radiating surface 11 of the heat radiating plate 3.
It is preferable that it is formed on the entire outer circumference of the and has a height of 0.1 mm or more.
【００１２】[0012]
【発明の効果】本発明のモールドパッケージ用のチップ
キャリアによると、放熱板３の突条５の尖った先端が、
モールドで樹脂封止をする時に封止樹脂８の流動圧に起
因する樹脂封止用金型９の圧力により、放熱板３の突条
５の先端がつぶれ、放熱板３の放熱面１１を包囲する枠
５ａが形成される。この枠５ａが堰となり、放熱面１１
に封止樹脂８の流入を防止することができ、放熱面１１
が、封止樹脂８によって被覆されず、初期の原形を保っ
て露出した状態になるため、放熱板３の放熱性が良好で
ある。According to the chip carrier for a molded package of the present invention, the sharp tip of the ridge 5 of the heat dissipation plate 3 is
When the resin is sealed by the mold, the pressure of the resin sealing mold 9 caused by the flow pressure of the sealing resin 8 crushes the tip of the protrusion 5 of the heat dissipation plate 3 and surrounds the heat dissipation surface 11 of the heat dissipation plate 3. A frame 5a is formed. This frame 5a serves as a weir, and the heat dissipation surface 11
The sealing resin 8 can be prevented from flowing into the heat radiation surface 11
However, since it is not covered with the sealing resin 8 and is exposed while keeping the original shape, the heat dissipation of the heat dissipation plate 3 is good.
【図１】本発明の実施例に係るモールドパッケージ用の
チップキャリアの斜視図である。FIG. 1 is a perspective view of a chip carrier for a mold package according to an exemplary embodiment of the present invention.
【図２】図１の断面図である。FIG. 2 is a cross-sectional view of FIG.
【図３】図１、図２のモールドパッケージ用のチップキ
ャリアに半導体素子を搭載したものを樹脂封止用金型に
装着した状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state in which a semiconductor element is mounted on the chip carrier for the mold package of FIGS. 1 and 2 and is mounted on a resin sealing mold.
【図４】図１、図２のモールドパッケージ用のチップキ
ャリアを用いた半導体装置の断面図である。FIG. 4 is a cross-sectional view of a semiconductor device using the chip carrier for the mold package of FIGS. 1 and 2.
【図５】従来例に係るモールドパッケージ用のチップキ
ャリアに半導体素子を搭載したものを樹脂封止用金型に
装着した状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state in which a semiconductor device is mounted on a chip carrier for a mold package according to a conventional example and is mounted on a resin sealing mold.
１ プリント配線板 ３ 放熱板 ５ 突条 ５ａ 枠 ８ 封止樹脂 ９ 封止樹脂用金型 １１ 放熱面 DESCRIPTION OF SYMBOLS 1 Printed wiring board 3 Radiating plate 5 Ridges 5a Frame 8 Sealing resin 9 Mold for sealing resin 11 Radiating surface
Claims (1)
えたモールドパッケージ用のチップキャリアにおいて、
該放熱板の露出する放熱面の全外周に立ち上げた、封止
樹脂の流動圧に起因する樹脂封止用金型の圧力により、
先端がつぶれる突条を備えたことを特徴とするモールド
パッケージ用のチップキャリア。1. A chip carrier for a mold package, comprising a heat dissipation plate attached to a printed wiring board,
By the pressure of the resin-sealing die caused by the flow pressure of the sealing resin, which is raised on the entire outer circumference of the exposed heat-dissipating surface of the heat-dissipating plate,
A chip carrier for a molded package, which is provided with a ridge whose tip is crushed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14770093A JP3024886B2 (en) | 1993-06-18 | 1993-06-18 | Chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14770093A JP3024886B2 (en) | 1993-06-18 | 1993-06-18 | Chip carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0714943A true JPH0714943A (en) | 1995-01-17 |
| JP3024886B2 JP3024886B2 (en) | 2000-03-27 |
Family
ID=15436281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14770093A Expired - Fee Related JP3024886B2 (en) | 1993-06-18 | 1993-06-18 | Chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3024886B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136331U (en) * | 1989-04-17 | 1990-11-14 | ||
| JPH04313257A (en) * | 1991-04-10 | 1992-11-05 | Ibiden Co Ltd | Substrate for mounting electronic parts with slug for cooling |
-
1993
- 1993-06-18 JP JP14770093A patent/JP3024886B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136331U (en) * | 1989-04-17 | 1990-11-14 | ||
| JPH04313257A (en) * | 1991-04-10 | 1992-11-05 | Ibiden Co Ltd | Substrate for mounting electronic parts with slug for cooling |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3024886B2 (en) | 2000-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6198163B1 (en) | Thin leadframe-type semiconductor package having heat sink with recess and exposed surface | |
| US6777819B2 (en) | Semiconductor package with flash-proof device | |
| KR100229858B1 (en) | Semiconductor devices | |
| JPH0846104A (en) | Surface mount electronic device and manufacturing method thereof | |
| KR101146973B1 (en) | Package frame and semiconductor package using the same | |
| US6396699B1 (en) | Heat sink with chip die EMC ground interconnect | |
| KR20060136262A (en) | Package frame and semiconductor package using the same | |
| JP4307362B2 (en) | Semiconductor device, lead frame, and lead frame manufacturing method | |
| US20080073763A1 (en) | Semiconductor device and method of manufacturing the same | |
| JPH03174749A (en) | Semiconductor device | |
| JPH0714943A (en) | Chip carrier | |
| JPH0922970A (en) | Electronic components | |
| JPH06112674A (en) | Heat sink for electronic component mounting equipment | |
| JP2690248B2 (en) | Surface mount type semiconductor device | |
| JP2004119610A (en) | Lead frame, resin-encapsulated semiconductor device using the same, and method of manufacturing resin-encapsulated semiconductor device | |
| JPH08181266A (en) | Lead frame and semiconductor device constructed using the same | |
| JP2003017515A (en) | Hybrid integrated circuit device and method of manufacturing the same | |
| JPH0758246A (en) | Semiconductor device and manufacturing method thereof | |
| JP2005150693A (en) | Chip package structure | |
| KR100251889B1 (en) | Semiconductor package | |
| JPH09129812A (en) | Semiconductor device | |
| KR940011796B1 (en) | Semiconductor device | |
| JPH04168753A (en) | Semiconductor device | |
| JP2968704B2 (en) | Semiconductor device | |
| JPH0497554A (en) | High heat dissipation type semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |