JPH07164286A - Grinding method and device therefor - Google Patents
Grinding method and device thereforInfo
- Publication number
- JPH07164286A JPH07164286A JP31035193A JP31035193A JPH07164286A JP H07164286 A JPH07164286 A JP H07164286A JP 31035193 A JP31035193 A JP 31035193A JP 31035193 A JP31035193 A JP 31035193A JP H07164286 A JPH07164286 A JP H07164286A
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- grinding
- abrasive grains
- working
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、研削加工方法及びその
装置に係り、例えば、脆性材料を加工能率と表面粗さと
を共に両立させて加工することができる研削加工方法及
びその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding method and an apparatus therefor, for example, a grinding method and an apparatus therefor capable of processing a brittle material with both the processing efficiency and the surface roughness.
【０００２】[0002]
【従来の技術】砥石やラップ等によって被加工物を加工
する場合、被加工物の形状精度ばかりでなく表面粗さの
向上も重要となる。一般に、表面粗さは、その加工に使
用される砥粒の粒径に左右されるので、表面粗さの向上
のためには、粒径の小さい砥粒を用いた加工を行えばよ
い。しかし、砥粒径が小さくなると加工に時間がかかる
ようになる。従って、１つの砥石で所望の形状、寸法を
得るための粗加工を行った後に表面粗さ向上のための精
加工を行うような場合、表面粗さ向上を主目的に粒径の
小さい砥粒で加工を行うと、加工能率が悪くなってしま
う。2. Description of the Related Art When processing a workpiece with a grindstone or a lap, it is important to improve not only the shape accuracy of the workpiece but also the surface roughness. In general, the surface roughness depends on the particle size of the abrasive grains used for the processing, and therefore, in order to improve the surface roughness, the processing using the abrasive grains having a small particle size may be performed. However, as the abrasive grain size becomes smaller, it takes more time to process. Therefore, when performing a roughing process for obtaining a desired shape and size with a single grindstone and then performing a fine working process for improving the surface roughness, an abrasive grain having a small grain size is mainly used for improving the surface roughness. If it is processed in, the processing efficiency will deteriorate.
【０００３】そこで、従来では、砥粒径の大きい砥石を
取り付けた砥石軸と、砥粒径が小さい砥石を取付けた砥
石軸を用意し、前者で加工能率の良い粗研削を行い、後
者で表面粗さを良くするための精研削を行うことで、加
工能率と表面粗さの向上を共に実現するようにしてい
た。Therefore, conventionally, a grindstone shaft to which a grindstone with a large abrasive grain size and a grindstone shaft to which a grindstone with a small abrasive grain size is attached are prepared, and the former performs rough grinding with good machining efficiency, and the latter surface By performing fine grinding to improve the roughness, both the processing efficiency and the surface roughness are improved.
【０００４】また、比較的砥粒径の大きい砥石や目の粗
いラップ等を用いた粗加工で形状精度を出した後、表面
粗さ向上を目的とした仕上げ加工としてポリッシング等
によって加工を行っていた。Further, after the shape accuracy is obtained by roughing using a grindstone having a relatively large abrasive grain size or a coarse lap, polishing is carried out as finishing for the purpose of improving the surface roughness. It was
【０００５】[0005]
【発明が解決しようとする課題】しかし、従来の加工方
法では、２つの砥石軸が必要であったり、あるいは、砥
石等による粗加工用とポリッシング用とで２つの装置が
必要であったりするので、装置全体が大型化してしまう
という問題がある。However, in the conventional processing method, two grindstone shafts are required, or two devices are required for rough machining with a grindstone or the like and for polishing. However, there is a problem that the entire device becomes large.
【０００６】そこで、本発明の目的は、装置が大型化す
ることなく加工能率と表面粗さとを共に向上させること
のできる研削加工方法及びその装置を提供することにあ
る。Therefore, an object of the present invention is to provide a grinding method and an apparatus thereof capable of improving both the working efficiency and the surface roughness without increasing the size of the apparatus.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の発明で
は、導電性を有する砥石によって被加工物の表面を研削
する研削加工方法において、前記砥石の表面に第１の加
工液を供給しながら第１の研削を行い、この第１の研削
の後に帯電した超微細砥粒が均一に分散している第２の
加工液を前記砥石表面に供給しながら第２の研削を行
い、少なくともこの第２の研削時に前記砥石表面に対向
して配設された電極を前記超微細砥粒と同じ極性に帯電
させると共に前記砥石を前記超微細砥粒と反対の極性に
帯電させることで前記目的を達成する。According to a first aspect of the present invention, there is provided a grinding method for grinding a surface of an object to be processed by an electrically conductive grindstone while supplying a first working liquid to the surface of the grindstone. The first grinding is performed, and the second grinding is performed while supplying the second machining liquid in which the charged ultrafine abrasive grains are uniformly dispersed after the first grinding, and the second grinding is performed. The above object is achieved by charging the electrode, which is disposed opposite to the surface of the grindstone, to the same polarity as that of the ultrafine abrasive grains at the time of grinding 2, and also charging the grindstone to the opposite polarity to the ultrafine abrasive grains. To do.
【０００８】請求項２記載の発明では、導電性を有する
砥石によって被加工物の表面を研削する研削加工装置
に、前記砥石の表面に対向して配設された電極と、この
電極と前記砥石とを互いに反対の極性に帯電させる電圧
印加手段と、第１の加工液と、前記砥石と反対の極性に
帯電した超微細砥粒が均一に分散している第２の加工液
のどちらか一方を選択して前記砥石表面に供給する加工
液供給手段とを具備させて前記目的を達成する。According to a second aspect of the present invention, in a grinding apparatus that grinds the surface of a workpiece with an electrically conductive grindstone, an electrode disposed opposite to the surface of the grindstone, the electrode and the grindstone. Either one of a voltage application means for electrically charging the opposite polarity to each other, a first working fluid, and a second working fluid in which ultrafine abrasive grains charged to the opposite polarity to the grindstone are uniformly dispersed. And a working liquid supply means for supplying the selected surface to the surface of the grindstone.
【０００９】請求項３記載の発明では、請求項１及び２
記載の研削加工方法及びその装置において、前記第１及
び第２の加工液をＰＨ値が８〜１２のケミカルタイプの
研削液とし、第２の加工液に分散している前記超微細砥
粒をシリカ砥粒としたことで前記目的を達成する。According to the third aspect of the invention, the first and second aspects are provided.
In the grinding method and the apparatus therefor, the first and second working liquids are chemical type grinding liquids having a PH value of 8 to 12, and the ultrafine abrasive grains dispersed in the second working liquid are used. The above object is achieved by using silica abrasive grains.
【００１０】請求項４記載の発明では、請求項１及び２
記載の研削加工方法及びその装置において、前記第２の
加工液を、水酸化カリウム溶液に前記超微細砥粒として
シリカ砥粒を混入したものとしたことで前記目的を達成
する。According to the invention of claim 4, the inventions of claims 1 and 2
In the grinding method and the apparatus therefor, the above-mentioned object is achieved by using the potassium hydroxide solution mixed with silica abrasive grains as the ultrafine abrasive grains in the second machining liquid.
【００１１】[0011]
【作用】請求項２記載の研削加工装置では、加工液供給
手段が、第１の加工液を砥石表面に供給することで、粗
研削が行なわれる。そして、電圧印加手段が砥石と電極
とを互いに反対の極性に印加し、更に、加工液供給手段
が第１の加工液の代わりに第２の加工液を供給すること
で、砥石表面に超微細砥粒が吸着し、この超微細砥粒に
よる精研削が行われる。In the grinding apparatus according to the second aspect of the invention, the roughing is performed by the working fluid supply means supplying the first working fluid to the surface of the grindstone. Then, the voltage applying means applies the grindstone and the electrode to polarities opposite to each other, and further, the machining fluid supply means supplies the second machining fluid instead of the first machining fluid, so that the surface of the grindstone is superfine. Abrasive grains are adsorbed, and fine grinding is performed by the ultrafine abrasive grains.
【００１２】[0012]
【実施例】以下、本発明の研削加工装置における一実施
例を図１ないし図２を参照して詳細に説明する。図１
は、研削加工装置の主要構成を表したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the grinding apparatus of the present invention will be described in detail below with reference to FIGS. Figure 1
Shows the main configuration of the grinding apparatus.
【００１３】研削加工装置は、図示しないモータによっ
て図においてａ方向に回転駆動される砥石軸１１と、こ
の砥石軸１１に取り付けられた円筒砥石１２を備えてい
る。砥石軸１１は、図示しない切り込み装置によって図
においてｂ方向に移動されるようになっており、これに
より、レシプロテーブル１４上に固定された被加工物１
６に円筒砥石１２が切り込まれるようになっている。な
お、切り込み装置は、レシプロテーブル１４側に設けて
もよい。また、本実施例においては、円筒砥石１２とし
て鋳鉄ボンドのダイヤモンド砥石を使用し、被加工物１
６は、珪素（Ｓｉ）である。The grinding apparatus includes a grindstone shaft 11 which is driven to rotate in the direction a by a motor (not shown), and a cylindrical grindstone 12 attached to the grindstone shaft 11. The grindstone shaft 11 is adapted to be moved in the b direction in the drawing by a cutting device (not shown), whereby the work piece 1 fixed on the reciprocating table 14 is processed.
The cylindrical grindstone 12 is cut into the groove 6. The cutting device may be provided on the reciprocating table 14 side. Further, in this embodiment, a cast iron bonded diamond grindstone is used as the cylindrical grindstone 12, and the workpiece 1
6 is silicon (Si).
【００１４】また、研削加工装置は、円筒砥石１２の外
周面に対して所定の間隔を置いて配設されるドレス電極
１８と、砥石軸１１に取り付けられた砥石側電極１９と
を備えている。これらの電極１８、１９には、それぞれ
電源装置２０の−端子と＋端子が接続され、ドレス電極
１８が陰極として、円筒砥石１２を含めた砥石側電極１
９側が陽極として印加されるようになっている。Further, the grinding apparatus is provided with a dress electrode 18 arranged at a predetermined distance from the outer peripheral surface of the cylindrical grindstone 12, and a grindstone side electrode 19 attached to the grindstone shaft 11. . The negative terminals and the positive terminals of the power supply device 20 are connected to these electrodes 18 and 19, respectively. The dress electrode 18 serves as a cathode, and the grindstone-side electrode 1 including the cylindrical grindstone 12 is connected.
The 9 side is applied as an anode.
【００１５】ドレス電極１８には、複数の加工液供給穴
２２が形成されており、この加工液供給穴２２には、配
管２６が接続されている。また、この配管２６は、継手
部材２８によって、バルブ３３、３４をそれぞれ有する
２つの配管３０、３１に接続されており、この配管３
０、３１はポンプ３５、３６に接続されている。A plurality of working liquid supply holes 22 are formed in the dress electrode 18, and pipes 26 are connected to the working liquid supply holes 22. The pipe 26 is connected to two pipes 30 and 31 having valves 33 and 34, respectively, by a joint member 28.
0 and 31 are connected to pumps 35 and 36.
【００１６】ポンプ３５は、第１加工液タンク３７に貯
蔵された第１の加工液３９を、ポンプ３６は、第２加工
液タンク４０に貯蔵された第２の加工液４１をそれぞれ
汲み上げて配管２６、更には加工液供給穴２２へと供給
するようになっている。第１の加工液３９としては、Ｐ
Ｈ値が８〜１２程度のケミカルタイプ研削液や水酸化カ
リウム溶液を使用し、このケミカルタイプ研削液や水酸
化カリウム溶液に粒径が１μｍ以下のシリカ砥粒を均一
に分散させたものを第２の加工液４１として使用する。
なお、シリカ砥粒は、ケミカルタイプの研削液や水酸化
カリウム溶液中では、負に帯電している。The pump 35 pumps up the first working fluid 39 stored in the first working fluid tank 37, and the pump 36 pumps up the second working fluid 41 stored in the second working fluid tank 40. 26, and further to the machining liquid supply hole 22. As the first working liquid 39, P
A chemical type grinding fluid or potassium hydroxide solution with an H value of about 8 to 12 is used, and a silica abrasive grain with a particle size of 1 μm or less is uniformly dispersed in this chemical type grinding fluid or potassium hydroxide solution. It is used as the processing liquid 41 of No. 2.
The silica abrasive grains are negatively charged in a chemical type grinding liquid or a potassium hydroxide solution.
【００１７】次に、このように構成された実施例の動作
について説明する。先ず、砥石軸１１を回転させると共
に、バルブ３３を開け、ポンプ３５を駆動させて第１の
加工液３９をドレス電極１８の加工液供給穴２２へと供
給する。そして、矢印Ａで示すようにレシプロテーブル
１４を往復動させ、更に、電源装置２０によって電極１
８、１９に電圧を印加して、円筒砥石１２とドレス電極
１８との間に電場を形成する。Next, the operation of the embodiment thus constructed will be described. First, the grindstone shaft 11 is rotated, the valve 33 is opened, and the pump 35 is driven to supply the first machining liquid 39 to the machining liquid supply hole 22 of the dress electrode 18. Then, the reciprocating table 14 is reciprocated as shown by an arrow A, and further, the power source device 20 causes the electrode 1 to move.
A voltage is applied to 8 and 19 to form an electric field between the cylindrical grindstone 12 and the dress electrode 18.
【００１８】次に、図示しない切り込み装置によって円
筒砥石１２を比較的深い砥石切り込み量で被加工物１６
へと切り込ませて粗研削を行う。図２は、図１における
Ｂ部を拡大して表したものであり、（Ａ）は、粗研削時
における加工状態を表したものである。Next, the cylindrical grindstone 12 is cut with a relatively deep grindstone cutting amount by a cutting device (not shown).
And perform rough grinding. FIG. 2 is an enlarged view of portion B in FIG. 1, and FIG. 2A is a view showing a processing state during rough grinding.
【００１９】（Ａ）に示すように、粗研削時には、円筒
砥石１２のダイヤモンド砥粒４５が被加工物１６表面に
大きく切り込まれる。このような粗研削時においては、
被加工物１６の研削面に残留応力や加工変質層が残り、
表面粗さは悪くなるが、砥石切り込み量に応じた早い速
度で研削が行われるので、加工能率の良い加工が行われ
る。As shown in (A), the diamond abrasive grains 45 of the cylindrical grindstone 12 are largely cut into the surface of the workpiece 16 during the rough grinding. During such rough grinding,
Residual stress and work-affected layers remain on the ground surface of the work piece 16,
Although the surface roughness is poor, the grinding is performed at a high speed according to the cutting amount of the grindstone, so that the processing with high processing efficiency is performed.
【００２０】この時ドレス電極１８と砥石軸１１の間の
隙間には、第１の加工液３９が流れ込んでいるので、ド
レス電極１８に面した円筒砥石１２の外周面では、第１
の加工液３９による電気分解で砥石のボンドが溶出し、
いわゆる電解インプロセスドレシングが行われる。At this time, the first working liquid 39 is flowing into the gap between the dressing electrode 18 and the grindstone shaft 11, so that the first grinding liquid 39 flows on the outer peripheral surface of the cylindrical grindstone 12 facing the dressing electrode 18.
The bond of the grindstone is eluted by electrolysis with the machining liquid 39 of
So-called electrolytic in-process dressing is performed.
【００２１】粗研削による被加工物１６の形状修正が終
了したら、被加工物１６の表面粗さを仕上げる精研削に
入る。まず、ポンプ３５の駆動を停止させると共にバル
ブ３３を閉じる。そして、ポンプ３６を駆動させてバル
ブ３４を開き、供給穴２２へとシリカ砥粒が混入された
第２の加工液４１を供給する。これにより、円筒砥石１
２の外周面は、第２の加工液３１で浸され、シリカ砥粒
が分散している加工液がＰＨ値８〜１２であるとシリカ
砥粒は負に帯電しているので、この負に帯電しているシ
リカ砥粒が、電極１８、１９による印加で陽極となって
いるこの円筒砥石１２外周面に吸着する。When the shape correction of the work piece 16 by the rough grinding is completed, the fine grinding for finishing the surface roughness of the work piece 16 is started. First, the drive of the pump 35 is stopped and the valve 33 is closed. Then, the pump 36 is driven to open the valve 34, and the second machining liquid 41 containing silica abrasive grains is supplied to the supply hole 22. As a result, the cylindrical grindstone 1
The outer peripheral surface of No. 2 is soaked with the second working liquid 31, and if the working liquid in which the silica abrasive grains are dispersed has a PH value of 8 to 12, the silica abrasive grains are negatively charged. The charged silica abrasive grains are attracted to the outer peripheral surface of the cylindrical grindstone 12 which is an anode when applied by the electrodes 18 and 19.
【００２２】一方、被加工物１６表面にも、円筒砥石１
２の回転に伴って第２の加工液４１が供給される。図２
の（Ｂ）は、この仕上げ加工時での図１のＢ部における
加工状態を表したものである。On the other hand, the cylindrical grindstone 1 is also formed on the surface of the workpiece 16.
The second working liquid 41 is supplied with the rotation of 2. Figure 2
(B) shows the processing state at the portion B in FIG. 1 at the time of this finishing processing.
【００２３】（Ｂ）に示すように、円筒砥石１２の外周
面には、シリカ砥粒４７がダイヤモンド砥粒４５を被覆
するように層となって吸着している。従って、このシリ
カ砥粒４７が、回転する円筒砥石１２によって押圧され
ながら被加工物１６表面を転動することで、研磨加工が
行われる。As shown in (B), silica abrasive grains 47 are adsorbed as a layer on the outer peripheral surface of the cylindrical grindstone 12 so as to cover the diamond abrasive grains 45. Therefore, the silica abrasive grains 47 roll on the surface of the workpiece 16 while being pressed by the rotating cylindrical grindstone 12, whereby polishing is performed.
【００２４】また、第２の加工液４１が水酸化カリウム
（ＫＯＨ）で被加工物１６が珪素（Ｓｉ）であると、こ
の時珪素（Ｓｉ）である被加工物１６の表面には、第２
の加工液４１の水酸化カリウム（ＫＯＨ）との反応によ
り水和膜（Ｋ2 ＳｉＯ3 ）４９が生成している。そこ
で、本実施例では、図示しない切り込み装置による切り
込み速度をこの水和膜の成長速度（数ｎｍ／ｍｉｎ）と
等しくなるように遅くして、生成される水和膜のみを取
り除くようにする。すなわち、シリカ砥粒４２による機
械的除去作用と、加工液と被加工物間の化学反応を利用
した化学的除去作用を併用したメカノケミカルポリッシ
ングを行う。When the second working liquid 41 is potassium hydroxide (KOH) and the work piece 16 is silicon (Si), the surface of the work piece 16 which is silicon (Si) at this time is Two
A hydrated film (K 2 SiO 3 ) 49 is formed by the reaction of the processing liquid 41 with potassium hydroxide (KOH). Therefore, in the present embodiment, the cutting speed by a cutting device (not shown) is made slow so as to be equal to the growth rate (several nm / min) of the hydrated film, and only the hydrated film formed is removed. That is, mechanochemical polishing is carried out in which the mechanical removal action by the silica abrasive grains 42 and the chemical removal action utilizing the chemical reaction between the working liquid and the workpiece are used together.
【００２５】以上の加工工程が全て終了したら、電源装
置２０による電極１８、１９の印加を解き、円筒砥石１
２を高速回転（例えば、３０００ｒｐｍ以上）させ、円
筒砥石１２表面に付着しているシリカ砥粒４７を遠心力
によって飛散させる。これにより、シリカ砥粒４７の除
去が行われ、次工程において再び粗研削を行うことが可
能となる。When all the above processing steps are completed, the application of the electrodes 18 and 19 by the power supply device 20 is released, and the cylindrical grindstone 1
2 is rotated at high speed (for example, 3000 rpm or more), and the silica abrasive grains 47 attached to the surface of the cylindrical grindstone 12 are scattered by centrifugal force. As a result, the silica abrasive grains 47 are removed, and rough grinding can be performed again in the next step.
【００２６】以上説明したように、本実施例では、超微
粒のシリカ砥粒が混入された水酸化カリウム水溶液を用
いたメカノケミカルポリッシングによって、被加工物１
６表面に生成する水和膜のみを除去するようにしている
ので、加工変質層の少ない、もしくはない加工を行うこ
とができ、シリカ砥粒によって加工が行われるので、加
工面は、数ｎｍＲｍａｘ程度の極めて良い表面粗さとな
る。また、残留応力が残らないので、加工面下での結晶
性もよい。As described above, in this embodiment, the workpiece 1 is processed by the mechanochemical polishing using the potassium hydroxide aqueous solution in which the ultrafine silica abrasive grains are mixed.
6 Since only the hydrated film formed on the surface is removed, it is possible to perform processing with little or no work-affected layer, and since the work is performed with silica abrasive grains, the work surface has a surface area of several nm Rmax. The surface roughness is extremely good. Further, since residual stress does not remain, the crystallinity under the processed surface is good.
【００２７】なお、以上の実施例では、ドレス電極１８
に形成した加工液供給穴２２から円筒砥石１２表面に加
工液３９、４１を供給するようにしていたが、円筒砥石
１２の外周面に対して開口する加工液ノズルをドレス電
極１８に並設し、これに配管２６を接続することで、ノ
ズルから第１と第２の加工液を供給するようにしてもよ
い。また、各加工液３９、４１毎にノズル、配管等を設
けて、第１と第２の加工液の供給路を別々にしてもよ
い。In the above embodiments, the dress electrode 18 is used.
Although the machining liquids 39 and 41 were supplied to the surface of the cylindrical grindstone 12 through the machining liquid supply hole 22 formed in the above, a machining liquid nozzle that opens to the outer peripheral surface of the cylindrical grindstone 12 is provided in parallel with the dress electrode 18. By connecting the pipe 26 to this, the first and second working liquids may be supplied from the nozzle. Further, nozzles, pipes, etc. may be provided for each of the machining liquids 39 and 41, and the supply paths for the first and second machining liquids may be separated.
【００２８】また、以上の実施例では、円筒砥石１２表
面に供給する加工液の種類を、２つのバルブ３７、３８
の開閉によって切り換えるようにしていたが、継手部材
２８の代わりに、配管３０と配管３１のいずれか一方を
配管２６側へと連通させる切り換え弁を設けて、これに
より加工液の切り換えを行うようにしてもよい。Further, in the above embodiments, the types of the working fluid supplied to the surface of the cylindrical grindstone 12 are set to the two valves 37 and 38.
However, instead of the joint member 28, a switching valve that connects one of the pipe 30 and the pipe 31 to the pipe 26 side is provided, and the machining fluid is switched by this. May be.
【００２９】以上の実施例では、第２の加工液４１とし
て水酸化カリウム溶液を使用したが、例えば、ガラスで
なる被加工物を加工する場合には、加工液としてＰＨ値
８〜１２のケミカルタイプ研削液を使用する等、被加工
物の材質に応じた他のケミカルタイプの加工液を使用し
てもよい。また、加工液中で帯電する超微細砥粒として
シリカ砥粒を使用したが、他の超微細砥粒であってもよ
い。In the above embodiments, the potassium hydroxide solution was used as the second working liquid 41. However, for example, when processing a workpiece made of glass, a chemical having a PH value of 8 to 12 is used as the working liquid. Other chemical type machining fluids may be used depending on the material of the workpiece, such as a type grinding fluid. Further, although silica abrasive grains are used as the ultrafine abrasive grains charged in the working liquid, other ultrafine abrasive grains may be used.
【００３０】また、以上の実施例では、導電性を有する
砥石として、鋳鉄ボンドとダイヤモンド砥粒でなる円筒
砥石１２を使用したが、他の結合材と砥粒を用いた砥石
でもよく、更に、他の形状の砥石、例えば、カップ砥石
でもよい。また、以上の実施例では、粗研削を電解イン
プロセスドレッシング研削法によって行ったが、他のド
レッシング法を用いて粗研削を行ってもよい。Further, in the above embodiments, the cylindrical grindstone 12 made of cast iron bond and diamond abrasive grains was used as the electrically conductive grindstone, but a grindstone using other binder and abrasive grains may be used. It may be a grindstone having another shape, for example, a cup grindstone. Further, in the above embodiments, the rough grinding was performed by the electrolytic in-process dressing grinding method, but the rough grinding may be performed by using another dressing method.
【００３１】バルブ３３、３４の代わりに電磁弁を用い
て加工液の切り換えを自動的に行うようにしてもよい。An electromagnetic valve may be used instead of the valves 33 and 34 to automatically switch the working fluid.
【００３２】[0032]
【発明の効果】本発明の研削加工方法及びその装置によ
れば、粗研削と精研削を１つの砥石で行うことができる
ので、装置が大型化することなく加工能率と表面粗さと
を共に向上させることができる。According to the grinding method and the apparatus thereof of the present invention, since the rough grinding and the fine grinding can be performed by one grindstone, both the working efficiency and the surface roughness can be improved without increasing the size of the apparatus. Can be made.
【００３３】また、請求項４記載の発明によれば、珪素
でなる被加工物を研削加工する場合、第２の加工液供給
時に加工物表面に水和膜が生成され、この水和膜がシリ
カ砥粒によって加工されるので、上記効果に加え、表面
粗さが極めて良くなるという効果を奏することができ
る。According to the fourth aspect of the invention, when a workpiece made of silicon is ground, a hydrated film is formed on the surface of the workpiece when the second working liquid is supplied, and this hydrated film is formed. Since it is processed with silica abrasive grains, in addition to the above effects, it is possible to obtain an effect that the surface roughness is extremely improved.
【図１】本発明の一実施例による研削加工装置の主要構
成を示した説明図である。FIG. 1 is an explanatory diagram showing a main configuration of a grinding apparatus according to an embodiment of the present invention.
【図２】図１におけるＢ部の拡大図である。FIG. 2 is an enlarged view of a B part in FIG.
１１ 砥石軸 １２ 円筒砥石 １４ レシプロテーブル １６ 被加工物 １８ ドレス電極 １９ 砥石側電極 ２０ 電源装置 ２２ 加工液供給穴 ２６、３０、３１ 配管 ２８ 継手部材 ３３、３４ バルブ ３５、３６ ポンプ ３７ 第１加工液タンク ３９ 第１の加工液 ４０ 第２加工液タンク ４１ 第２の加工液 ４５ ダイヤモンド砥粒 ４７ シリカ砥粒 ４９ 水和膜 11 Grindstone Shaft 12 Cylindrical Grindstone 14 Reciprocating Table 16 Workpiece 18 Dressing Electrode 19 Grindstone Side Electrode 20 Power Supply Device 22 Working Fluid Supply Hole 26, 30, 31 Piping 28 Joint Member 33, 34 Valve 35, 36 Pump 37 First Working Fluid Tank 39 First Working Liquid 40 Second Working Liquid Tank 41 Second Working Liquid 45 Diamond Abrasive Grains 47 Silica Abrasive Grains 49 Hydrated Film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２４Ｂ 7/02 37/00 Ｆ Ｈ 53/00 Ｄ 57/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location B24B 7/02 37/00 F H 53/00 D 57/02
Claims (4)
表面を研削する研削加工方法であって、 前記砥石の表面に第１の加工液を供給しながら第１の研
削を行い、 この第１の研削後に、帯電した超微細砥粒が均一に分散
している第２の加工液を前記砥石表面に供給しながら第
２の研削を行い、 少なくともこの第２の研削時に、前記砥石表面に対向し
て配設された電極を前記超微細砥粒と同じ極性に帯電さ
せると共に、前記砥石を前記超微細砥粒と反対の極性に
帯電させることを特徴とする研削加工方法。1. A grinding method for grinding a surface of an object to be processed with an electrically conductive grindstone, wherein the first grinding is performed while supplying a first working liquid to the surface of the grindstone. After the grinding, the second grinding is performed while supplying the second machining liquid in which the charged ultrafine abrasive grains are uniformly dispersed to the surface of the grindstone, and the grindstone surface is opposed at least during the second grinding. The grinding method is characterized in that the electrode thus arranged is charged to the same polarity as the ultrafine abrasive grains and the grindstone is charged to the opposite polarity to the ultrafine abrasive grains.
表面を研削する研削加工装置であって、 前記砥石の表面に対向して配設された電極と、 この電極と前記砥石とを、互いに反対の極性に帯電させ
る電圧印加手段と、 第１の加工液と、前記砥石と反対の極性に帯電した超微
細砥粒が均一に分散している第２の加工液の、どちらか
一方を選択して前記砥石表面に供給する加工液供給手段
とを具備することを特徴とする研削加工装置。2. A grinding apparatus for grinding the surface of a work piece by means of an electrically conductive grindstone, wherein an electrode disposed facing the surface of the grindstone, the electrode and the grindstone are mutually Select one of a voltage applying means for charging to the opposite polarity, a first working fluid, and a second working fluid in which ultrafine abrasive grains charged to the opposite polarity to the grindstone are uniformly dispersed. And a processing liquid supply means for supplying the surface of the grindstone.
〜１２のケミカルタイプの研削液とし、 第２の加工液に分散している前記超微細砥粒をシリカ砥
粒としたことを特徴とする請求項１及び２記載の研削加
工方法及びその装置。3. The PH value of the first and second working fluids is 8
3. The grinding method and apparatus according to claim 1 or 2, wherein the chemical type grinding liquid of Nos. 12 to 12 is used, and the ultrafine abrasive grains dispersed in the second working liquid are silica abrasive grains.
液に前記超微細砥粒としてシリカ砥粒を混入したもので
あることを特徴とする請求項１及び２記載の研削加工方
法及びその装置。4. The grinding method according to claim 1 or 2, wherein the second working liquid is a potassium hydroxide solution mixed with silica abrasive particles as the ultrafine abrasive particles. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31035193A JPH07164286A (en) | 1993-12-10 | 1993-12-10 | Grinding method and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31035193A JPH07164286A (en) | 1993-12-10 | 1993-12-10 | Grinding method and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07164286A true JPH07164286A (en) | 1995-06-27 |
Family
ID=18004195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31035193A Pending JPH07164286A (en) | 1993-12-10 | 1993-12-10 | Grinding method and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07164286A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6250992B1 (en) * | 1997-04-08 | 2001-06-26 | Olympus Optical Co., Ltd. | Mirror grinding method and glass lens |
| JP2011200994A (en) * | 2010-03-26 | 2011-10-13 | Fujifilm Corp | Grinding device and method |
| JP2014000644A (en) * | 2012-06-19 | 2014-01-09 | Disco Abrasive Syst Ltd | Liquid mixture supply system |
| CN104759717A (en) * | 2015-04-07 | 2015-07-08 | 海安欣凯富机械科技有限公司 | Finishing machining method for metal rotation surface based on dual-peak pulse current and electrochemical machinery |
| CN109746836A (en) * | 2019-02-26 | 2019-05-14 | 中国工程物理研究院激光聚变研究中心 | Optics Ultra-precision Turning grinding fluid intelligent monitoring alarm device and method |
| CN111958069A (en) * | 2020-08-06 | 2020-11-20 | 深圳大学 | Method and device for grinding micro-groove on surface by electric spark |
-
1993
- 1993-12-10 JP JP31035193A patent/JPH07164286A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6250992B1 (en) * | 1997-04-08 | 2001-06-26 | Olympus Optical Co., Ltd. | Mirror grinding method and glass lens |
| JP2011200994A (en) * | 2010-03-26 | 2011-10-13 | Fujifilm Corp | Grinding device and method |
| JP2014000644A (en) * | 2012-06-19 | 2014-01-09 | Disco Abrasive Syst Ltd | Liquid mixture supply system |
| CN104759717A (en) * | 2015-04-07 | 2015-07-08 | 海安欣凯富机械科技有限公司 | Finishing machining method for metal rotation surface based on dual-peak pulse current and electrochemical machinery |
| CN104759717B (en) * | 2015-04-07 | 2018-12-28 | 海安欣凯富机械科技有限公司 | The polishing processing method in the metallic rotary face based on double peak pulse current electrochemical copolymerization machinery |
| CN109746836A (en) * | 2019-02-26 | 2019-05-14 | 中国工程物理研究院激光聚变研究中心 | Optics Ultra-precision Turning grinding fluid intelligent monitoring alarm device and method |
| CN109746836B (en) * | 2019-02-26 | 2024-04-19 | 中国工程物理研究院激光聚变研究中心 | Intelligent monitoring and alarming device and method for optical ultra-precision machining grinding fluid |
| CN111958069A (en) * | 2020-08-06 | 2020-11-20 | 深圳大学 | Method and device for grinding micro-groove on surface by electric spark |
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