JPH071791Y2 - Semiconductor wafer removing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a semiconductor wafer removing device, and more particularly to a wafer removing device for stably removing a wafer bonded to a polishing jig.

[Prior Art] When polishing a wafer, wax is applied to a flat jig and the wafer is pasted onto it. When pasting, the jig is placed on a heating plate and the wax is applied in a molten state. To do.

In this case, the temperature required for melting the wax is usually 40 ° C. or higher, but in order to raise the temperature of the heating plate in a short time, the surface temperature of the plate is set to 100 ° C. or higher.

After mirror-finishing the attached wafer, heat the jig again,
The wax is melted and the wafer is removed to prepare for the next step.

[Problems to be Solved by the Invention] As described above, a wafer that is mirror-polished is melted with wax and removed from the jig. In this case, a wafer heated to a high temperature in the atmosphere is oxidized by moisture absorption during cooling. It will be in a state where it is easy to be affected.

When oxidation occurs on the mirror surface of the wafer, the etching is not uniform and microscopic unevenness is formed on the surface.

MOCVD (Metal Organic CVD) and MBE (Molecular Beam Ep)
When high-precision surface finishing is required as in the growth technology, it is necessary to extremely reduce the oxidation of the wafer, and it is extremely important to take measures to prevent oxidation during the wafer removal work. When removing the wafer, a method of peeling off the wafer that is in close contact with the jig by using a thin tool with a sharp tip is used, and there is a dislike that the quality cannot be sufficiently guaranteed.

It is an object of the present invention to provide a semiconductor wafer removing device that prevents surface oxidation that occurs when removing a bonded wafer.

[Means for Solving the Problems] The present invention is a semiconductor wafer removing device for removing a semiconductor wafer adhered to a polishing jig with wax, and the whole device is hermetically sealed and an inert gas such as nitrogen gas is provided inside. A sealing cover to be filled, a loader that automatically stores and carries out the polishing jig to which the wafer is attached, a preheating plate that preheats the polishing jig carried out by the loader, and a preheating plate A heating plate that removes the wafer by heating the polishing jig that has been sent to bring the wax into a substantially molten state, and a sealing cover that enables the removal operation of the wafer to be shut off from the outside air. An operation window with operation gloves, which is provided on the side surface and allows an operator to put his / her hand in and remove the wafer from the top of the glove, and the closet so that the removed wafer can be taken out. A wafer take-out port provided on a side surface of the closed cover, an elevator and a traverse machine for lowering or moving the polishing jig loaded on the loader toward the preheating plate, and a polishing jig for removing the wafer. A semiconductor wafer removing device comprising a cooling plate for cooling the tool and an unloader for storing the cooled polishing jig is used to achieve the object by preventing surface oxidation during wafer removal. Is measuring.

[Operation] In the semiconductor wafer removing apparatus of the present invention, when the wafer is removed from the polishing jig, the wafer is manipulated and removed from the outside in the atmosphere of the inert gas to prevent the surface from being oxidized. The wafer can be removed without exposing it to the atmosphere, and the wafer can be stably taken out without oxidation.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing an embodiment of the semiconductor wafer removing apparatus of the present invention.

In the figure, 1 is a hermetic cover for hermetically sealing the entire apparatus and filling the inside with an inert gas such as nitrogen gas, 2 is a loader for accommodating and automatically unloading a jig to which a wafer is attached, 3 is a loader 2 Preheating plate to preheat the jig carried out by
Reference numeral 4 is a heating plate for heating the jig sent from the preheating plate 3 to bring the wafer into a detached state, and 5 is an operation window with operation gloves for shutting off the wafer removal operation from the outside air, 6
Is a wafer outlet for taking out the removed wafer, and 7 and 8 are for lowering the jig loaded on the loader 2 or the spare plate 3.
An elevating machine and a traversing machine for moving in the direction of, a cooling plate 9 for cooling the jig whose wafer has been removed, and an unloader 10 for storing the cooled jig.

The jig sent from the loader 2 by the elevator 7 and the traverse machine 8 is preheated by the preheating plate 3 for a set time, and is sent to the next heating plate 4 in a state where the wax is substantially melted, and the wax is sufficiently melted here. In this state, the wafer removing operation is performed.

In this case, since the inside of the apparatus is filled with nitrogen gas or the like by the hermetically closed cover 1, the operator removes the wafer from above the glove by putting the operator's hand into the operation glove through the operation window 5 of the operation unit. All operations are performed in a state of being shielded from the outside air.

The removed wafer is taken out from the take-out port 6.

The jig that has been removed is cooled by the cooling plate 9 and then stored in the unloader 10.

As described above, in this embodiment, when the wafer is removed from the jig,
Since it can be performed in an inert gas such as nitrogen gas, the wafer can be stably operated without being oxidized.

[Effect of the Invention] As described above, according to the present invention, the following effects can be obtained.

(1) When the wafer bonded to the polishing jig is removed, it can be stably removed without causing surface oxidation.

(2) The work efficiency can be improved by automatically carrying out the carry-out process after the jig is housed in the device.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the semiconductor wafer removing apparatus of the present invention. 1: Airtight cover, 2: Loader, 3: Preheating plate, 4: Heating plate, 5: Operation window, 6: Wafer outlet, 9: Cooling plate, 1
0: unloader.

Claims (1)

[Scope of utility model registration request] 1. A semiconductor wafer removing device for removing a semiconductor wafer adhered to a polishing jig with wax, and a sealing cover for sealing the entire device and filling the interior with an inert gas such as nitrogen gas; A loader for accommodating a polishing jig attached with and automatically unloading it, a preheating plate for preheating the polishing jig carried out by the loader, and the polishing jig sent from the preheating plate A heating plate that heats the wax to a state in which the wax is substantially melted to remove the wafer, and a wafer provided on the side surface of the hermetic cover so that the wafer can be removed from the atmosphere by an operator. An operation window with operation gloves that allows the user to remove the wafer from the top of the glove, and the side surface of the hermetic cover that allows the removed wafer to be taken out. An evacuation port, an elevator and a traverse machine for lowering or moving the polishing jig loaded on the loader in the direction of a preheating plate, and a cooling plate for cooling the polishing jig from which the wafer has been removed, A semiconductor wafer removing device, comprising: an unloader that accommodates the cooled polishing jig.