JPH0258331U - - Google Patents

Info

Publication number
JPH0258331U
JPH0258331U JP13832388U JP13832388U JPH0258331U JP H0258331 U JPH0258331 U JP H0258331U JP 13832388 U JP13832388 U JP 13832388U JP 13832388 U JP13832388 U JP 13832388U JP H0258331 U JPH0258331 U JP H0258331U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
removal device
jig
cooling
wafer removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13832388U
Other languages
Japanese (ja)
Other versions
JPH071791Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988138323U priority Critical patent/JPH071791Y2/en
Publication of JPH0258331U publication Critical patent/JPH0258331U/ja
Application granted granted Critical
Publication of JPH071791Y2 publication Critical patent/JPH071791Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の半導体ウエハ取外装置の一実
施例を示す正面図である。 １：密閉カバー、２：ローダ、３：予熱プレー
ト、４：加熱プレート、５：操作窓、６：ウエハ
取出口、９：冷却フレート、１０：アンローダ。 FIG. 1 is a front view showing an embodiment of the semiconductor wafer removal device of the present invention. 1: Airtight cover, 2: Loader, 3: Preheating plate, 4: Heating plate, 5: Operation window, 6: Wafer unloading port, 9: Cooling plate, 10: Unloader.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 研磨用治具に接着された半導体ウエハを取外す
半導体ウエハ取外装置において、前記研磨用治具
を加熱する予熱及び加熱プレートと、前記ウエハ
を取外した後前記治具を冷却する冷却プレートと
、装置全体を密閉して不活性ガスの雰囲気に保持
する密閉カバーと、前記ウエハの取外し作業を外
部より操作する操作部とよりなることを特徴とす
る半導体ウエハ取外装置。 A semiconductor wafer removal device for removing a semiconductor wafer bonded to a polishing jig, comprising a preheating and heating plate for heating the polishing jig, a cooling plate for cooling the jig after removing the wafer, and an apparatus. 1. A semiconductor wafer removal device comprising: an airtight cover that seals the entire body and maintains it in an inert gas atmosphere; and an operating section for operating the wafer removal operation from the outside.
JP1988138323U 1988-10-24 1988-10-24 Semiconductor wafer removing device Expired - Lifetime JPH071791Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (en) 1988-10-24 1988-10-24 Semiconductor wafer removing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (en) 1988-10-24 1988-10-24 Semiconductor wafer removing device

Publications (2)

Publication Number Publication Date
JPH0258331U true JPH0258331U (en) 1990-04-26
JPH071791Y2 JPH071791Y2 (en) 1995-01-18

Family

ID=31400553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988138323U Expired - Lifetime JPH071791Y2 (en) 1988-10-24 1988-10-24 Semiconductor wafer removing device

Country Status (1)

Country Link
JP (1) JPH071791Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081611A1 (en) * 2010-12-14 2012-06-21 住友ベークライト株式会社 Method for processing base material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612735A (en) * 1979-07-10 1981-02-07 Nec Corp Peeling of monocrystalline wafer
JPS56161340U (en) * 1980-04-28 1981-12-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612735A (en) * 1979-07-10 1981-02-07 Nec Corp Peeling of monocrystalline wafer
JPS56161340U (en) * 1980-04-28 1981-12-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081611A1 (en) * 2010-12-14 2012-06-21 住友ベークライト株式会社 Method for processing base material

Also Published As

Publication number Publication date
JPH071791Y2 (en) 1995-01-18

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