JPH07183155A - Laminated ceramic electronic component and its manufacture - Google Patents
Laminated ceramic electronic component and its manufactureInfo
- Publication number
- JPH07183155A JPH07183155A JP32757093A JP32757093A JPH07183155A JP H07183155 A JPH07183155 A JP H07183155A JP 32757093 A JP32757093 A JP 32757093A JP 32757093 A JP32757093 A JP 32757093A JP H07183155 A JPH07183155 A JP H07183155A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- laminated
- internal electrodes
- electronic component
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002131 composite material Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims description 38
- 239000011230 binding agent Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 abstract description 23
- 238000009413 insulation Methods 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 description 11
- 239000002994 raw material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229910001252 Pd alloy Inorganic materials 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、Pb系複合ペロブスカ
イト型セラミックスを用いて構成されたセラミック積層
電子部品及びその製造方法に関し、特に、セラミックス
内に配置された内部電極が改良されたセラミック積層電
子部品及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic laminated electronic component formed by using Pb-based composite perovskite type ceramics and a method for manufacturing the same, and more particularly, to a ceramic laminated electronic component having improved internal electrodes arranged in the ceramic. The present invention relates to a component and a manufacturing method thereof.
【0002】[0002]
【従来の技術】積層コンデンサや多層基板、積層圧電部
品などでは、内部電極として安価な金属材料を用いるこ
とを可能とする等のために、より低温で焼結し得るセラ
ミック材料が求められている。このような要求に応える
ものとして、Pb系複合ペロブスカイト型セラミックス
が提案されており、このPb系複合ペロブスカイト型セ
ラミックスは低温で焼成し得るだけなく、優れた電気特
性を発揮する。2. Description of the Related Art In multilayer capacitors, multilayer substrates, multilayer piezoelectric components, etc., a ceramic material that can be sintered at a lower temperature is required in order to use an inexpensive metal material as an internal electrode. . In order to meet such requirements, Pb-based composite perovskite-type ceramics have been proposed. The Pb-based composite perovskite-type ceramics not only can be fired at a low temperature, but also exhibit excellent electrical characteristics.
【0003】Pb系複合ペロブスカイト型誘電体セラミ
ックスは、一般式Pb-based composite perovskite-type dielectric ceramics have the general formula
【0004】[0004]
【化1】 [Chemical 1]
【0005】で表される組成を有する。なお、一般式
(1)において、αは、Ca、Sr、Ba、Ag、L
a、Ndのうちの1種以上の原子を示し、xは、0以
上、0.5以下、βはMg、Zn、Ni、Cu、Fe、
Mn及びInのうちの1種以上の原子を、γはNb、
W、Ta、Sbのうちの1種以上の原子を示す。It has a composition represented by: In the general formula (1), α is Ca, Sr, Ba, Ag, L
a represents at least one atom of Nd, x is 0 or more and 0.5 or less, β is Mg, Zn, Ni, Cu, Fe,
One or more atoms of Mn and In, γ is Nb,
At least one atom selected from W, Ta, and Sb is shown.
【0006】上記Pb系複合ペロブスカイト型誘電体セ
ラミックスを得るにあたっては、一般式(1)の組成を
実現するように各原子の酸化物粉末を秤量し、混合す
る。しかる後、混合粉末を乾燥した後、仮焼し、仮焼物
を粉砕することにより原料粉末を得る。さらに、得られ
た原料粉末を乾燥後、樹脂バインダを加え成形し、得ら
れた成形体を焼成する。To obtain the Pb-based composite perovskite-type dielectric ceramic, oxide powders of respective atoms are weighed and mixed so as to realize the composition of the general formula (1). Then, the mixed powder is dried, calcined, and the calcined product is crushed to obtain a raw material powder. Further, after the obtained raw material powder is dried, a resin binder is added and molded, and the obtained molded body is fired.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、上記P
b系複合ペロブスカイト型セラミックスでは、組成中に
鉛を含むため、焼成に際し鉛が飛散する。そこで、飛散
による鉛の減少を補うために、予め上記一般式で示され
る組成に対して過剰に鉛を含有する原料粉末を用意し、
焼結体を製造することが多い。However, the above-mentioned P
Since the b-type composite perovskite ceramics contain lead in the composition, lead scatters during firing. Therefore, in order to compensate for the reduction of lead due to scattering, prepare a raw material powder containing lead in excess with respect to the composition represented by the general formula in advance,
Sintered bodies are often manufactured.
【0008】しかしながら、例えば積層コンデンサで
は、焼結体内において複数の内部電極がセラミック層を
介して重なり合うように配置されている。従って、上記
焼結体を得るにあたっては、内部電極材が未焼成のセラ
ミック層を介して積層されているセラミック積層体を用
意し、該積層体を焼成する。However, in a multilayer capacitor, for example, a plurality of internal electrodes are arranged in the sintered body so as to overlap with each other via the ceramic layer. Therefore, when obtaining the above-mentioned sintered body, a ceramic laminated body in which the internal electrode materials are laminated via the unfired ceramic layer is prepared, and the laminated body is fired.
【0009】ところで、上記焼成に際し、Pbが前述の
ように飛散するが、内部電極がセラミック層を介して積
層されているため、Pbの飛散が内部電極により抑制さ
れる。すなわち、内部電極が壁となって、上記Pbの飛
散を妨げることになる。そのため、得られた焼結体の外
表面付近ではPbの濃度が低く、内部電極間のセラミッ
ク層においてPbが相対的に高濃度で残留し、過剰に添
加されたPbが焼結体内において不均一に存在しがちで
あった。その結果、Pbが過剰に残留している部分にお
いて機械的強度が低下したり、得られた積層コンデンサ
において絶縁抵抗や取得静電容量不良が生じたりし、信
頼性の高い積層コンデンサを得ることができなかった。By the way, during the firing, Pb scatters as described above, but since the internal electrodes are laminated via the ceramic layer, the scattering of Pb is suppressed by the internal electrodes. That is, the internal electrodes serve as walls to prevent the scattering of Pb. Therefore, the concentration of Pb is low near the outer surface of the obtained sintered body, Pb remains in a relatively high concentration in the ceramic layer between the internal electrodes, and the excessively added Pb is not uniform in the sintered body. Tended to exist in. As a result, the mechanical strength is reduced in a portion where Pb is excessively remained, and the obtained multilayer capacitor is defective in insulation resistance and acquired capacitance, and thus it is possible to obtain a highly reliable multilayer capacitor. could not.
【0010】本発明の目的は、Pb系複合ペロブスカイ
ト型セラミックスを用いたセラミック積層電子部品であ
って、過剰のPbの残留が生じ難く、絶縁抵抗不良や機
械的強度の低下が起こり難い、信頼性に優れたセラミッ
ク積層電子部品及びその製造方法を提供することにあ
る。An object of the present invention is a ceramic laminated electronic component using a Pb-based composite perovskite type ceramics, in which excess Pb is not likely to remain, insulation resistance failure and mechanical strength reduction are unlikely to occur, and reliability is improved. An object of the present invention is to provide an excellent ceramic laminated electronic component and a manufacturing method thereof.
【0011】[0011]
【課題を解決するための手段】請求項1に記載の発明
は、Pb系複合ペロブスカイト型セラミックスからなる
焼結体内に、セラミック層を介して複数の内部電極が重
なり合うように配置されている構造を有するセラミック
積層電子部品において、前記内部電極が、空孔率70〜
90%の多孔性層で構成されていることを特徴とする、
セラミック積層電子部品である。The invention according to claim 1 has a structure in which a plurality of internal electrodes are arranged so as to overlap with each other through a ceramic layer in a sintered body made of a Pb-based composite perovskite type ceramics. In the laminated ceramic electronic component, the internal electrode has a porosity of 70 to
Characterized by being composed of 90% porous layer,
It is a ceramic laminated electronic component.
【0012】また、請求項2に記載の発明は、上記請求
項1に記載の発明に係る積層セラミック電子部品の製造
方法であって、金属粉末、セラミック粉末及び樹脂バイ
ンダを含む導電ペーストからなる複数の内部電極がセラ
ミックグリーンシートを介して重なり合うように積層さ
れている積層体を用意する工程と、前記積層体を焼成し
て、セラミックス及び内部電極を焼成する工程とを備え
る。The invention described in claim 2 is the method for manufacturing a laminated ceramic electronic component according to the invention described in claim 1, wherein a plurality of conductive pastes containing metal powder, ceramic powder and resin binder are used. And a step of preparing a laminated body in which the internal electrodes are laminated so as to be overlapped with each other via a ceramic green sheet, and a step of firing the laminated body to fire the ceramics and the internal electrodes.
【0013】上記のように、本発明は、Pb系複合ペロ
ブスカイト型セラミックスを用いたセラミック積層電子
部品及びその製造方法を提供するものであるが、Pb系
複合ペロブスカイト型誘電体セラミックスとは、前述し
た一般式(1)で表される組成を有するものであり、こ
のような組成の具体的な例としては、 Pb(Fe1/3 Nb2/3 )O3 、Pb(Fe
2/3 W1/3 )O3 、Pb(Ni1/ 3 Nb2/3 、Pb(M
g1/2 W1/2 )O3 、Pb(Mn1/3 Nb2/3 )O3 、
Pb(Mg1/3 Ta2/3 )O3 、Pb(Co1/3 Nb
2/3 )O3 、Pb(Co1/2W1/2 )O3 などが挙げら
れ、かつこれらの組成のうち、Pbの一部がBa、C
a、Sr、La、NdまたはAgなどの1種以上の金属
で置き換えられた組成も含まれる。As described above, the present invention provides a ceramic laminated electronic component using the Pb-based composite perovskite-type ceramics and a method for manufacturing the same. The Pb-based composite perovskite-type dielectric ceramics are mentioned above. It has a composition represented by the general formula (1), and specific examples of such a composition include Pb (Fe 1/3 Nb 2/3 ) O 3 and Pb (Fe
2/3 W 1/3) O 3, Pb (Ni 1/3 Nb 2/3, Pb (M
g 1/2 W 1/2 ) O 3 , Pb (Mn 1/3 Nb 2/3 ) O 3 ,
Pb (Mg 1/3 Ta 2/3 ) O 3 , Pb (Co 1/3 Nb
2/3 ) O 3 , Pb (Co 1/2 W 1/2 ) O 3 and the like. Among these compositions, part of Pb is Ba or C.
Also included are compositions substituted with one or more metals such as a, Sr, La, Nd or Ag.
【0014】また、上記Pb系複合ペロブスカイトセラ
ミックスの組成には、誘電特性を高めるために、MnO
2 、MgO、NiO、ZrO2 、CoO、Sb2 O3 ま
たはLa2 Oなどの各種添加物を添加してもよい。In addition, the composition of the Pb-based composite perovskite ceramics contains MnO 2 in order to improve the dielectric properties.
Various additives such as 2 , MgO, NiO, ZrO 2 , CoO, Sb 2 O 3 or La 2 O may be added.
【0015】なお、上記Pb系複合ペロブスカイト型セ
ラミックスの組成は、例示にすぎず、誘電性セラミック
スの他、圧電素子を構成するための圧電セラミックスで
あってもよい。The composition of the Pb-based composite perovskite ceramics is merely an example, and dielectric ceramics and piezoelectric ceramics for forming piezoelectric elements may be used.
【0016】請求項1,2に記載の発明は、上記Pb系
複合ペロブスカイト型セラミックスよりなる焼結体内
に、セラミック層を介して複数の内部電極が重なり合う
ように配置された構造を有するセラミック積層電子部品
及びその製造方法に関するものであるが、請求項1に記
載の発明は、上記のように内部電極が空孔率70〜90
%の多孔性層で構成されていることを特徴とし、請求項
2に記載の発明は、内部電極を、金属粉末、セラミック
粉末及び樹脂バインダを含む導電ペーストからなる複数
の内部電極材を出発材料として用いたことに特徴を有す
る。According to the first and second aspects of the present invention, a ceramic laminated electron having a structure in which a plurality of internal electrodes are arranged so as to overlap each other through a ceramic layer in a sintered body made of the Pb-based composite perovskite type ceramics. The invention according to claim 1 relates to a component and a method for manufacturing the component, and the internal electrode has a porosity of 70 to 90 as described above.
% Of the porous layer, the invention according to claim 2 is characterized in that the internal electrode comprises a plurality of internal electrode materials made of a conductive paste containing a metal powder, a ceramic powder and a resin binder as a starting material. It is characterized by being used as.
【0017】なお、上記空孔率が70%未満の場合に
は、内部電極と外部電極との接合不良が生じたり、目的
とする電気特性、例えば静電容量が得られない。他方、
空孔率が90%を超えると、従来例と同様に、内部電極
が壁となってPbの飛散が抑制され、Pbが不均一に残
留する。従って、上記空孔率は70〜90%の範囲とす
ることが必要である。If the porosity is less than 70%, a defective joint between the internal electrode and the external electrode may occur, or desired electrical characteristics such as capacitance cannot be obtained. On the other hand,
When the porosity exceeds 90%, similarly to the conventional example, the internal electrodes serve as walls to suppress the scattering of Pb, and Pb remains unevenly. Therefore, the porosity needs to be in the range of 70 to 90%.
【0018】請求項2に記載の発明において、上記導電
ペーストに含有される金属粉末としては、従来より内部
電極用導電ペーストを構成するのに用いられている適宜
の金属粉末、例えばAg、Ag−Pd、NiまたはCu
などの金属粉末を用いることができる。In the second aspect of the invention, the metal powder contained in the conductive paste is an appropriate metal powder conventionally used to form a conductive paste for internal electrodes, such as Ag or Ag-. Pd, Ni or Cu
A metal powder such as can be used.
【0019】また上記セラミック粉末は、焼成に際し内
部電極に70〜90%の空孔率で細孔を形成するために
添加されているものであり、該セラミック粉末として
は、上記特定の空孔率範囲を実現し得る限り、適宜の材
料及び粒径からなるものを用いることができる。もっと
も、好ましくは、該セラミック粉末と、内部電極の上下
に位置するセラミック層との密着性を高めるために、並
びにセラミック粉末と上下のセラミック層を構成してい
るセラミックスの焼成温度を近づけるために、上記セラ
ミック粉末としては上下のセラミック層を構成している
Pb系複合ペロブスカイト型セラミックスを用いること
が望ましい。The ceramic powder is added to form pores in the internal electrode with a porosity of 70 to 90% during firing. As the ceramic powder, the specific porosity described above is used. As long as the range can be realized, a material having an appropriate material and particle size can be used. However, preferably, in order to enhance the adhesion between the ceramic powder and the ceramic layers located above and below the internal electrode, and to bring the firing temperatures of the ceramics constituting the ceramic powder and the upper and lower ceramic layers close to each other, As the ceramic powder, it is desirable to use Pb-based composite perovskite-type ceramics that form the upper and lower ceramic layers.
【0020】また、上記導電ペーストに含有される樹脂
バインダとしては、従来より内部電極を構成するのに用
いられている適宜の樹脂バインダ、例えばポリビニルブ
チラールなどを用いることができる。As the resin binder contained in the above-mentioned conductive paste, an appropriate resin binder conventionally used to form an internal electrode, such as polyvinyl butyral, can be used.
【0021】請求項2に記載の発明では、上記導電ペー
ストを用いて内部電極層が構成されており、焼成に際
し、導電ペースト中に上記セラミック粉末が含有されて
いるため、該セラミック粉末による空孔が内部電極層に
形成される。この空孔の内部電極平面積に占める割合、
すなわち上記空孔率が70〜90%となるように、導電
ペースト中に所定量のセラミック粉末が添加される。も
っとも、セラミック粉末の添加割合は、使用する金属粉
末の種類及び粒径、セラミック粉末の種類及び粒径並び
に樹脂バインダの種類や添加割合等によって異なるた
め、一義的には定め得ない。According to the second aspect of the present invention, the internal electrode layer is formed by using the conductive paste, and the ceramic powder is contained in the conductive paste during firing. Are formed on the internal electrode layers. The ratio of these holes to the internal electrode plane area,
That is, a predetermined amount of ceramic powder is added to the conductive paste so that the porosity is 70 to 90%. However, the addition ratio of the ceramic powder differs depending on the type and particle size of the metal powder used, the type and particle size of the ceramic powder, the type and addition ratio of the resin binder, and so cannot be uniquely determined.
【0022】[0022]
【作用及び発明の効果】請求項1に記載の発明では、内
部電極が空孔率70〜90%の多孔性層により構成され
ているため、焼成に際し、Pb系複合ペロブスカイト型
セラミックスからなるセラミック層中の過剰のPbが内
部電極に妨げられず、飛散し得る。すなわち、従来、内
部電極が壁となり、過剰に添加されていたPbの飛散が
妨げられていたために、過剰に添加されたPbが最終的
に焼結体中に不均一に存在するという問題があったのに
対し、請求項1に記載の発明では、上記空孔からPbが
飛散し得るため、焼結体中のPbの濃度が均一に保たれ
る。In the invention described in claim 1, since the internal electrode is composed of the porous layer having the porosity of 70 to 90%, the ceramic layer made of the Pb-based composite perovskite type ceramics is used during firing. Excess Pb in the inside can be scattered without being hindered by the internal electrodes. That is, since the internal electrode serves as a wall in the past to prevent the excessive addition of Pb from scattering, there is a problem that the excessive addition of Pb finally exists unevenly in the sintered body. On the other hand, in the invention described in claim 1, since Pb can be scattered from the pores, the Pb concentration in the sintered body can be kept uniform.
【0023】また、請求項2に記載の発明では、内部電
極を構成するための導電ペーストにセラミック粉末が含
有されており、該セラミック粉末による空孔が形成さ
れ、それによって上記特定の空孔率範囲の内部電極層が
形成される。従って、請求項1に記載の発明の場合と同
様に、Pbが円滑に飛散するため、最終的に得られる焼
結体中におけるPbの濃度のばらつきを低減することが
できる。According to the second aspect of the present invention, the conductive paste for forming the internal electrodes contains ceramic powder, and the ceramic powder forms pores, whereby the specific porosity is increased. A range of internal electrode layers are formed. Therefore, as in the case of the invention described in claim 1, since Pb is smoothly scattered, it is possible to reduce the variation in the concentration of Pb in the finally obtained sintered body.
【0024】よって、請求項1,2に記載の発明によれ
ば、部分的な機械的強度の低下や絶縁抵抗不良などの生
じ難い、信頼性に優れたセラミック積層電子部品を提供
することが可能となる。Therefore, according to the first and second aspects of the present invention, it is possible to provide a highly reliable ceramic laminated electronic component which is unlikely to cause a partial decrease in mechanical strength or a defective insulation resistance. Becomes
【0025】なお、本発明は、積層コンデンサに限ら
ず、内部電極がセラミック層を介して重なり合っている
構造を有する積層圧電共振部品やセラミック多層基板を
はじめとする種々のセラミック積層電子部品に適用する
ことができる。The present invention is not limited to the multilayer capacitor, and is applied to various ceramic multilayer electronic components including a multilayer piezoelectric resonance component and a ceramic multilayer substrate having a structure in which internal electrodes are overlapped with each other with a ceramic layer interposed therebetween. be able to.
【0026】[0026]
【実施例の説明】実施例1 酸化鉛を含むPb系複合ペロブスカイトセラミックスの
原料として、Pb(Mg1/3 Nb2/3 )O3 とPbTi
O3 をモル比で0.96対0.04となるように混合し
てなる粉末を用いた。Description of Examples Example 1 As raw materials for a Pb-based composite perovskite ceramic containing lead oxide, Pb (Mg 1/3 Nb 2/3 ) O 3 and PbTi were used.
A powder obtained by mixing O 3 in a molar ratio of 0.96 to 0.04 was used.
【0027】上記原料粉末に、ポリビニルブチラール系
樹脂バインダと、溶剤としてのエタノールとを加え、ボ
ールミル中において16時間、湿式混合した。得られた
混合物を、ドクターブレート法によりシート状に成形
し、乾燥し、矩形形状に切断し平面形状が矩形のセラミ
ックグリーンシートを得た。Polyvinyl butyral resin binder and ethanol as a solvent were added to the above raw material powder, and wet-mixed in a ball mill for 16 hours. The obtained mixture was formed into a sheet by a doctor blade method, dried, and cut into a rectangular shape to obtain a ceramic green sheet having a rectangular planar shape.
【0028】得られたセラミックグリーンシートの片面
に、銀−パラジウム合金粉末及び樹脂バインダを含む導
電ペーストを印刷し、該導電ペーストよりなる内部電極
の印刷されたセラミックグリーンシートを複数枚積層
し、厚み方向に加圧して積層体を得た。得られた積層体
を、空気中で800〜1000℃の温度で3時間焼成
し、焼結体を得た。得られた焼結体の両端面に外部電極
となるAgペーストを塗布し、700℃で焼き付け、外
部電極を形成した。このようにして図1及び図2に示す
積層コンデンサ1を作製した。図1及び図2において、
積層コンデンサ1は、内部電極3〜7がセラミック層を
介して積層されている焼結体2を有する。なお、8,9
は外部電極を示す。作製した積層コンデンサ1は、幅=
1.6mm、長さ=3.2mm、厚み=1.5mmの大
きさを有するものである。A conductive paste containing silver-palladium alloy powder and a resin binder is printed on one side of the obtained ceramic green sheet, and a plurality of ceramic green sheets having the internal electrodes made of the conductive paste are laminated to form a thick layer. A laminated body was obtained by pressing in the direction. The obtained laminated body was fired in air at a temperature of 800 to 1000 ° C. for 3 hours to obtain a sintered body. An Ag paste to be an external electrode was applied to both end faces of the obtained sintered body and baked at 700 ° C. to form an external electrode. Thus, the multilayer capacitor 1 shown in FIGS. 1 and 2 was produced. 1 and 2,
The monolithic capacitor 1 has a sintered body 2 in which internal electrodes 3 to 7 are laminated via ceramic layers. In addition, 8, 9
Indicates an external electrode. The manufactured multilayer capacitor 1 has a width =
It has a size of 1.6 mm, length = 3.2 mm, and thickness = 1.5 mm.
【0029】なお、上記積層コンデンサを得るにあた
り、銀−パラジウム合金粉末含有導電ペースト中の銀−
パラジウム合金粉末の含有量を種々変化させ、下記の表
1に示すように、種々の空孔率の内部電極を有する試料
番号1〜7の積層コンデンサを得た。In order to obtain the above-mentioned laminated capacitor, the silver in the conductive paste containing silver-palladium alloy powder-
By changing the content of the palladium alloy powder variously, as shown in Table 1 below, multilayer capacitors of sample numbers 1 to 7 having internal electrodes with various porosities were obtained.
【0030】得られた各積層コンデンサについて、静電
容量及び絶縁抵抗を測定した。また、耐湿負荷試験とし
て、70℃及び相対湿度95%の雰囲気中に下記の表1
に示す時間放置した後、32Vの電圧を外部電極間に印
加し、絶縁不良となる割合を求めた。The capacitance and insulation resistance of each of the obtained multilayer capacitors were measured. In addition, as a humidity resistance load test, the following Table 1 was used in an atmosphere of 70 ° C. and 95% relative humidity.
After standing for the time shown in (3), a voltage of 32 V was applied between the external electrodes, and the rate of insulation failure was determined.
【0031】[0031]
【表1】 [Table 1]
【0032】表1から明らかなように、空孔率が70%
未満の内部電極を有する試料番号1,2では、十分な大
きさの静電容量の得られないことがわかる。また、空孔
率が90%を超える試料番号7の積層コンデンサでは、
絶縁抵抗が低く、かつ耐湿負荷試験において絶縁不良品
が生じがちであることがわかる。これに対して、空孔率
が70%〜90%の内部電極を有する試料番号2〜6の
積層コンデンサでは、十分な大きさの静電容量を得るこ
とができ、絶縁抵抗不良や耐湿負荷試験における不良の
発生し難いことがわかる。As is clear from Table 1, the porosity is 70%.
It can be seen that the sample numbers 1 and 2 having the internal electrodes of less than 1 cannot obtain a sufficiently large capacitance. Further, in the laminated capacitor of sample number 7 having a porosity of more than 90%,
It can be seen that the insulation resistance is low and that insulation failure products tend to occur in the moisture resistance load test. On the other hand, in the multilayer capacitors of Sample Nos. 2 to 6 having internal electrodes having a porosity of 70% to 90%, a sufficiently large capacitance can be obtained, and insulation resistance failure and humidity resistance load test are performed. It can be seen that the defect is unlikely to occur.
【0033】実施例2 実施例1と同様にして、実施例1と同じ試料の積層コン
デンサの作製を行った。 Example 2 In the same manner as in Example 1, a laminated capacitor of the same sample as in Example 1 was produced.
【0034】まず、実施例1と同一のPb系複合ペロブ
スカイト型粉末原料を用い、実施例1と同様にしてセラ
ミックグリーンシートを作製した。次に、得られたセラ
ミックグリーンシートの片面に、後述の導電ペーストを
印刷し、実施例1と同様にして積層コンデンサを作製し
た。First, using the same Pb-based composite perovskite powder raw material as in Example 1, a ceramic green sheet was produced in the same manner as in Example 1. Next, a conductive paste described below was printed on one surface of the obtained ceramic green sheet, and a laminated capacitor was produced in the same manner as in Example 1.
【0035】実施例2において使用した導電ペースト
は、銀−パラジウム合金粉末、樹脂バインダ及びセラミ
ック粉末を含有するものであり、このセラミック粉末と
して上記Pb系複合ペロブスカイト型原料粉末と同じも
のを用い、但し、下記の表2に示すように該セラミック
粉末の含有量が異なる複数種の導電ペーストを用意し
た。これらの複数種の導電ペーストを用いて上記方法に
従ってそれぞれ積層コンデンサを作製した。得られた積
層コンデンサにつき、実施例1と同様にして評価した。
結果を下記の表2に示す。The conductive paste used in Example 2 contained silver-palladium alloy powder, resin binder and ceramic powder. The same ceramic powder as the Pb-based composite perovskite type raw material powder was used, provided that As shown in Table 2 below, plural kinds of conductive pastes having different ceramic powder contents were prepared. Using these plural kinds of conductive pastes, laminated capacitors were manufactured according to the above method. The obtained multilayer capacitor was evaluated in the same manner as in Example 1.
The results are shown in Table 2 below.
【0036】また、上記のようにして用意した種々の導
電ペーストを用いて構成された内部電極の空孔率を、ガ
ラス基板上に各導電ペーストをスクリーン印刷し焼き付
けることにより形成された内部電極の空孔率を光学的に
測定することにより求めた。このようにして求めた内部
電極の空孔率を、表2に併せて示す。In addition, the porosity of the internal electrodes formed by using the various conductive pastes prepared as described above is calculated by screen-printing and baking the conductive pastes on the glass substrate. It was determined by optically measuring the porosity. The porosity of the internal electrode thus obtained is also shown in Table 2.
【0037】[0037]
【表2】 [Table 2]
【0038】表2から明らかなように、セラミック粉末
を導電ペースト中に含有していない試料番号11では、
Pbが不均一に分散しているためか、絶縁抵抗が低く、
耐湿負荷試験において不良品がある程度の割合で発生し
がちであった。また、セラミック粉末混合割合が35体
積%の導電ペーストを用いた積層コンデンサ(試料番号
16)では、静電容量が0.87μFと低いことがわか
る。As is clear from Table 2, in the sample No. 11 containing no ceramic powder in the conductive paste,
Insulation resistance is low, probably because Pb is unevenly distributed.
In the moisture resistance load test, defective products were likely to occur to some extent. Further, it can be seen that the capacitance of the multilayer capacitor (Sample No. 16) using the conductive paste with the ceramic powder mixing ratio of 35% by volume is as low as 0.87 μF.
【0039】これに対して、セラミック粉末混合割合が
5体積%〜30体積%であり、従って空孔率が70〜9
0%の範囲とされている試料番号12〜15の積層コン
デンサでは、十分大きな静電容量を得ることができ、か
つ絶縁抵抗不良や耐湿負荷試験における不良が発生しな
いことがわかる。On the other hand, the mixing ratio of the ceramic powder is 5% by volume to 30% by volume, so that the porosity is 70-9.
It can be seen that the multilayer capacitors of Sample Nos. 12 to 15 in which the range is 0% can obtain a sufficiently large electrostatic capacity and do not cause insulation resistance failure or failure in the moisture resistance load test.
【図1】実施例1で作製した積層コンデンサを示す断面
図。FIG. 1 is a cross-sectional view showing a multilayer capacitor manufactured in Example 1.
【図2】図1に示した積層コンデンサの平面断面図。FIG. 2 is a plan sectional view of the multilayer capacitor shown in FIG.
1…積層コンデンサ 2…焼結体 3〜7…内部電極 1 ... Multilayer capacitor 2 ... Sintered body 3-7 ... Internal electrodes
Claims (2)
スからなる焼結体内に、セラミック層を介して複数の内
部電極が重なり合うように配置されている構造を有する
セラミック積層電子部品において、 前記内部電極が、空孔率70〜90%の多孔性層で構成
されていることを特徴とする、セラミック積層電子部
品。1. A ceramic laminated electronic component having a structure in which a plurality of internal electrodes are arranged to overlap each other with a ceramic layer in a sintered body made of Pb-based composite perovskite ceramics, wherein the internal electrodes are empty. A ceramic laminated electronic component comprising a porous layer having a porosity of 70 to 90%.
ンダを含む導電ペーストからなる複数の内部電極がセラ
ミックグリーンシートを介して重なり合うように積層さ
れている積層体を用意する工程と、 前記積層体を焼成して、セラミックス及び内部電極を焼
成する工程とを備える、請求項1に記載のセラミック積
層電子部品の製造方法。2. A step of preparing a laminated body in which a plurality of internal electrodes made of a conductive paste containing a metal powder, a ceramic powder and a resin binder are laminated so as to overlap with each other via a ceramic green sheet, and the laminated body is fired. The method for producing a ceramic laminated electronic component according to claim 1, further comprising the step of firing the ceramics and the internal electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32757093A JPH07183155A (en) | 1993-12-24 | 1993-12-24 | Laminated ceramic electronic component and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32757093A JPH07183155A (en) | 1993-12-24 | 1993-12-24 | Laminated ceramic electronic component and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07183155A true JPH07183155A (en) | 1995-07-21 |
Family
ID=18200545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32757093A Pending JPH07183155A (en) | 1993-12-24 | 1993-12-24 | Laminated ceramic electronic component and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07183155A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244090A (en) * | 2004-02-27 | 2005-09-08 | Kyocera Corp | Multilayer piezoelectric body, piezoelectric actuator and print head |
| WO2006126562A1 (en) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| US20110157766A1 (en) * | 2009-12-24 | 2011-06-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
| JP2012080121A (en) * | 2011-12-20 | 2012-04-19 | Kyocera Corp | Laminated piezoelectric body, piezoelectric actuator, and print head |
-
1993
- 1993-12-24 JP JP32757093A patent/JPH07183155A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244090A (en) * | 2004-02-27 | 2005-09-08 | Kyocera Corp | Multilayer piezoelectric body, piezoelectric actuator and print head |
| WO2006126562A1 (en) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| US7466538B2 (en) | 2005-05-26 | 2008-12-16 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic device |
| US20110157766A1 (en) * | 2009-12-24 | 2011-06-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
| US8233264B2 (en) * | 2009-12-24 | 2012-07-31 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
| JP2012080121A (en) * | 2011-12-20 | 2012-04-19 | Kyocera Corp | Laminated piezoelectric body, piezoelectric actuator, and print head |
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