JPH07190736A - Method and apparatus for measuring height of solder fillet - Google Patents
Method and apparatus for measuring height of solder filletInfo
- Publication number
- JPH07190736A JPH07190736A JP5333390A JP33339093A JPH07190736A JP H07190736 A JPH07190736 A JP H07190736A JP 5333390 A JP5333390 A JP 5333390A JP 33339093 A JP33339093 A JP 33339093A JP H07190736 A JPH07190736 A JP H07190736A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solder fillet
- height
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measurement Of Optical Distance (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品をプリント基
板に電気的に固定する半田フィレット部の高さを測定す
る方法と装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for measuring the height of a solder fillet portion for electrically fixing an electric component to a printed circuit board.
【０００２】[0002]
【従来の技術】従来、プリント配線基板に実装した部品
の半田付けの光学的検査方法として特開平２−２１６０
０５号公報に示されるものが提案されている。これはプ
リント基板に実装された部品の電極または端部の半田付
け部にスリット光を照射し、該半田付け部の散乱光を用
い、半田付け状態を検査する方法であった。2. Description of the Related Art Conventionally, as an optical inspection method for soldering a component mounted on a printed wiring board, Japanese Patent Laid-Open No. 2160/1990.
The one shown in Japanese Patent Publication No. 05 has been proposed. This is a method of irradiating a slit light to an electrode or a soldering portion of an end of a component mounted on a printed circuit board and using a scattered light of the soldering portion to inspect a soldering state.
【０００３】また、回路基板の半田フィレット形状を自
動的に検査する形状検査装置として特開平２−８３４０
３号公報に示されるものが提案されており、これは円弧
状の投影光像を照射し、その散乱光によりフィレット形
状の適否を判断していた。A shape inspection device for automatically inspecting the solder fillet shape of a circuit board is disclosed in Japanese Patent Application Laid-Open No. 2-8340.
No. 3, which has been proposed, radiates an arc-shaped projection light image, and judges the suitability of the fillet shape by the scattered light.
【０００４】また、半田フィレット部の高さを測る方法
としては、ダイヤルゲ−ジを用いるなどあるが、人間の
手作業に依るものであり、バラツキが生じるものであ
る。As a method of measuring the height of the solder fillet portion, there is a method of using a dial gauge, but this is due to manual work of a person and causes variations.
【０００５】[0005]
【発明が解決しようとする課題】ところが上記に示した
方法及び装置は、光学的検査方法としては、半田付け状
態や半田フィレット形状のみを検査するものであり、半
田フィレット部の高さを測定する装置は提供されていな
かった。また、半田フィレット部の高さの計測に関して
は、人間の手作業に依るものであり誤差が大きい。しか
し、半田付けの品質保証として半田付けの強度を確保す
るには、半田付けフィレット部の高さの数値化が要望さ
れている。However, the above-described method and apparatus are optical inspection methods that inspect only the soldering state and the solder fillet shape, and measure the height of the solder fillet portion. No equipment was provided. Further, the measurement of the height of the solder fillet portion depends on a manual work of a human, and the error is large. However, in order to ensure the strength of soldering as a quality assurance of soldering, it is required to digitize the height of the soldering fillet portion.
【０００６】本発明は、上記の問題点を解決した半田付
けフィレット部の高さの測定方法および装置を提供する
ことを目的とするものである。It is an object of the present invention to provide a method and apparatus for measuring the height of a soldering fillet portion, which solves the above problems.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明の構成は、半田付けされた電気部品を備えたプ
リント基板の半田接合面に直線スリットレーザー光を照
射し、この照射された直線スリットレーザー光が前記半
田接合面に描く半田フィレット部上の曲線の頂点と前記
プリント基板上の直線との間の距離を計測することで三
角測量方式により半田フィレット部の高さを算出するこ
とを特徴とする。In order to solve the above-mentioned problems, the structure of the present invention is such that a linear slit laser beam is applied to the solder joint surface of a printed circuit board having a soldered electric component, and this is applied. Calculating the height of the solder fillet portion by triangulation by measuring the distance between the vertex of the curve on the solder fillet portion drawn by the linear slit laser light on the solder joint surface and the straight line on the printed circuit board. Is characterized by.
【０００８】[0008]
【作用】本発明は上記の構成により、モニター上で半田
付け状態を観察しながらデジタル的に半田付けフィレッ
ト部の高さを数値化し、半田付けの評価基準として良否
判定が可能となる。With the above arrangement, the present invention makes it possible to digitally digitize the height of the soldering fillet portion while observing the soldering state on the monitor, and to judge whether the soldering fillet is good or bad.
【０００９】[0009]
【実施例】以下、本発明の一実施例について、図面を参
照しながら説明する。図１は本発明の一実施例である半
田フィレット部の高さの測定方法を示す概略図である。
１は電気部品が半田付けされたプリント基板、２はプリ
ント基板１の半田フィレット部、３は直線レーザスリッ
ト光発振装置１３から半田フィレット部２に対して照射
された直線レーザスリット光、４はデジタルスケ−ル発
振装置、１２は直線レ−ザ−スリット光３の観察用カメ
ラ、１８はモニタ−である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing a method for measuring the height of a solder fillet portion which is an embodiment of the present invention.
Reference numeral 1 is a printed circuit board to which electric parts are soldered, 2 is a solder fillet portion of the printed circuit board 1, 3 is a linear laser slit light emitted from the linear laser slit light oscillation device 13 to the solder fillet portion 2, and 4 is a digital A scale oscillator, 12 is a camera for observing the linear laser slit light 3, and 18 is a monitor.
【００１０】水平に設置されたプリント基板１の半田フ
ィレット部２に対して、直線レ−ザ−スリット光発振装
置１３から直線レ−ザ−スリット光３が斜め方向から照
射される。この状態は上方の観察用カメラ１２で撮像さ
れ、モニタ−１８で見ることができる。このモニタ−１
８に映しだされた映像に対して、デジタルスケ−ル発振
装置４を用いて、２本のカ−ソル５を映し出す。半田フ
ィレット部２の測定箇所に照射した直線レ−ザ−スリッ
ト光３を移動させる。直線レ−ザ−スリット光３は半田
フィレット部２に曲線部分７と直線部分８の軌跡とを描
く。さらにこの曲線部分７の頂点９と直線部分８との間
の距離ｗをデジタルスケ−ル発振装置４により発振され
るカ−ソル５により測定する。特にレ−ザ−スリット光
の照射角度がプリント基板に対して４５度であるとする
と、直角二等辺三角形の性質によりこの測った距離ｗが
レ−ザ−スリット光を照射した半田フィレット部２の高
さとなる。A linear laser-slit light oscillating device 13 radiates a linear laser-slit light 3 obliquely to a solder fillet portion 2 of a printed circuit board 1 installed horizontally. This state is captured by the observation camera 12 above and can be viewed on the monitor-18. This monitor-1
Using the digital scale oscillating device 4, two cursors 5 are projected on the image projected on the screen 8. The linear laser slit light 3 applied to the measurement point of the solder fillet portion 2 is moved. The linear laser slit light 3 draws a locus of a curved portion 7 and a linear portion 8 on the solder fillet portion 2. Further, the distance w between the apex 9 of the curved portion 7 and the straight portion 8 is measured by the cursor 5 oscillated by the digital scale oscillator 4. Especially, if the irradiation angle of the laser slit light is 45 degrees with respect to the printed circuit board, this measured distance w is due to the property of the isosceles right triangle, so that the measured distance w of the solder fillet portion 2 irradiated with the laser slit light. It will be high.
【００１１】なお、レ−ザ−スリット光のプリント基板
に対する照射角度は４５度以外でも半田フィレット部の
高さは三角測量方式を用いて同様に測定することができ
る。The height of the solder fillet portion can be similarly measured using the triangulation method even when the irradiation angle of the laser slit light to the printed circuit board is other than 45 degrees.
【００１２】次に、本実施例の半田フィレット部の高さ
の測定装置について図を用いて説明する。図２は本発明
の一実施例における斜視図である。図２において、６は
直線レ−ザ−スリット光発振装置１３を移動させて直進
レ−ザ−スリット光３を平行に移動させるためのつま
み、１０は二方向に移動させることができるＸＹテ−ブ
ル、１１はプリント基板１を水平に保持するためのプリ
ント基板保持治具、１２は観察用カメラ、１８はモニタ
−である。Next, a device for measuring the height of the solder fillet portion of this embodiment will be described with reference to the drawings. FIG. 2 is a perspective view of an embodiment of the present invention. In FIG. 2, 6 is a knob for moving the linear laser-slit light oscillating device 13 to move the rectilinear laser-slit light 3 in parallel, and 10 is an XY table which can be moved in two directions. Reference numeral 11 denotes a printed board holding jig for holding the printed board 1 horizontally, 12 an observation camera, and 18 a monitor.
【００１３】この装置を用いて前述したように、プリン
ト基板をプリント基板保持治具１１で水平に保持し、半
田フィレット部２の高さを測定することができる。この
装置では２０マイクロメ−タ−の精度が得られる。As described above, the height of the solder fillet portion 2 can be measured by holding the printed circuit board horizontally by the printed circuit board holding jig 11 using this apparatus. With this device, an accuracy of 20 micrometers can be obtained.
【００１４】次に本実施例の半田フィレット部の高さの
測定装置で用いられたプリント基板保持治具１１につい
て図３を用いて説明する。Next, the printed board holding jig 11 used in the solder fillet height measuring apparatus of this embodiment will be described with reference to FIG.
【００１５】１４はプリント基板１の外枠を保持するた
めの保持レ−ル、１５はプリント基板１を下方から保持
し、プリント基板１の備えた電気部品との接触をさける
ために脚部にマグネット部１５ａを備えたバックアップ
ピン、１６は中間部に樹脂製ダボ１７を有し、先端部に
レ−ルと嵌合する突起部１９を備え、さらに片方が軸支
された支持金具である。Reference numeral 14 is a holding rail for holding the outer frame of the printed circuit board 1, and 15 is a leg portion for holding the printed circuit board 1 from below and for avoiding contact with electric parts provided on the printed circuit board 1. The backup pin 16 is provided with a magnet portion 15a, and the reference numeral 16 is a support fitting having a resin dowel 17 in the middle portion, a projection portion 19 to be fitted with a rail at the tip portion, and one end of which is pivotally supported.
【００１６】プリント基板１の外枠を保持レ−ル１４で
保持し、バックアップピン１５で支持し、さらに片方が
軸支された支持金具１７を回転させて突起部１９を保持
レ−ル１４と嵌合することによりプリント基板１を挟持
するようにして水平に保持する。The outer frame of the printed circuit board 1 is held by a holding rail 14 and is supported by a backup pin 15, and a support metal fitting 17 whose one end is pivotally supported is rotated to hold the protrusion 19 as a holding rail 14. The printed circuit board 1 is held horizontally by sandwiching it.
【００１７】[0017]
【発明の効果】本発明は、半田フィレット部の高さを高
精度に測定でき、さらに数値化することにより、プリン
ト基板半田付け工程における半田付け基準及び製品の市
場に於ける半田付けの保証として活用できる。As described above, the present invention can measure the height of the solder fillet portion with high accuracy and further digitize it to provide a standard of soldering in the soldering process of the printed circuit board and a guarantee of soldering in the market of the product. Can be utilized.
【図１】本発明の一実施例における半田フィレット部の
高さ測定方法を示す概略図FIG. 1 is a schematic diagram showing a method for measuring the height of a solder fillet portion in one embodiment of the present invention.
【図２】本発明の一実施例における半田フィレット部の
高さ測定装置の斜視図FIG. 2 is a perspective view of a height measuring device for a solder fillet portion according to an embodiment of the present invention.
【図３】本発明の一実施例におけるプリント基板保持治
具の斜視図FIG. 3 is a perspective view of a printed board holding jig according to an embodiment of the present invention.
１ プリント基板 ２ 半田フィレット部 ３ 直線レーザースリット光 ４ デジタルスケ−ル発振装置 ５ カーソル ６ つまみ ７ 曲線部分 ８ 直線部分 ９ 曲線部の頂点 １０ ＸＹテーブル １１ プリント基板平行支持治具 １２ 観察用カメラ １３ 直線レーザースリット光発振装置 １４ 保持レール １５ バックアップピン １５ａ マグネット部 １６ 支持金具 １７ 樹脂整ダボ １８ モニター １９ 突起部 1 Printed Circuit Board 2 Solder Fillet Section 3 Linear Laser Slit Light 4 Digital Scale Oscillator 5 Cursor 6 Knob 7 Curved Section 8 Linear Section 9 Curved Point 10 XY Table 11 Printed Circuit Board Parallel Support Jig 12 Observation Camera 13 Linear Laser slit light oscillation device 14 Holding rail 15 Backup pin 15a Magnet part 16 Support metal fitting 17 Resin dowel 18 Monitor 19 Protrusion part
Claims (3)
ト基板の半田接合面に直線スリットレーザー光を照射
し、この照射された直線スリットレーザー光が前記半田
接合面に描く半田フィレット部における曲線の頂点と前
記プリント基板上における直線との間の距離を計測する
ことで三角測量方式により半田フィレット部の高さを算
出することを特徴とする半田フィレット部の高さ測定方
法。1. A linear slit laser beam is irradiated onto a solder joint surface of a printed circuit board having a soldered electric component, and the irradiated linear slit laser light is a curve of a solder fillet portion drawn on the solder joint surface. A method for measuring the height of a solder fillet portion, wherein the height of the solder fillet portion is calculated by a triangulation method by measuring the distance between the apex and a straight line on the printed circuit board.
リント基板保持治具と、前記プリント基板保持治具を載
せて２方向に移動させるためのＸＹテ−ブルと、半田付
けされた電気部品を備えた前記プリント基板の半田接合
面に直線スリットレーザー光を照射するレーザー光発振
器と、前記プリント基板の半田フィレット部を撮像する
ためのカメラと、それを映し出すモニタ−と、撮像され
た前記半田フィレット部における曲線の頂点と前記プリ
ント基板上における直線との間の距離を測定するための
測定手段と、三角測量方式により距離を算出する手段か
ら構成され、前記プリント基板に半田付けされた電気部
品の半田フィレット部の高さを測定することを特徴とす
る半田フィレット部の高さ測定装置。2. A printed circuit board holding jig for horizontally holding the printed circuit board, an XY table for mounting the printed circuit board holding jig and moving it in two directions, and a soldered electric component. A laser light oscillator for irradiating the solder joint surface of the printed board with a linear slit laser beam, a camera for imaging the solder fillet portion of the printed board, a monitor for projecting the camera, and the imaged solder fillet. Measuring means for measuring the distance between the apex of the curve in the section and the straight line on the printed circuit board, and means for calculating the distance by the triangulation method, of the electrical components soldered to the printed circuit board. An apparatus for measuring the height of a solder fillet portion, which measures the height of a solder fillet portion.
の外枠を保持するための保持レールと、前記プリント基
板を下方から支持し電気部品との接触を避けることを可
能とした脚部にマグネット部を有するバックアップピン
と、中間部に樹脂製ダボを備え、一方が前記保持レ−ル
に軸支され、もう一方が前記保持レ−ルと篏合する突起
部を有する支持金具から構成され、前記プリント基板の
外枠を前記保持レ−ルで保持し、バックアップピンで下
方から支持し、前記支持金具の突起部が前記保持レ−ル
と篏合することにより前記プリント基板を水平に保持す
ることを特徴とする請求項２記載の半田フィレット部の
高さ測定装置。3. The printed circuit board holding jig includes a holding rail for holding an outer frame of the printed circuit board, and a magnet on a leg portion which supports the printed circuit board from below and can avoid contact with an electric component. A backup pin having a portion and a resin dowel in the middle portion, one of which is pivotally supported by the holding rail, and the other of which is a support metal fitting having a projection portion which is fitted with the holding rail, An outer frame of the printed circuit board is held by the holding rail, supported by a backup pin from below, and the protruding portion of the supporting metal fitting is fitted to the holding rail to hold the printed circuit board horizontally. The solder fillet height measuring device according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5333390A JPH07190736A (en) | 1993-12-27 | 1993-12-27 | Method and apparatus for measuring height of solder fillet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5333390A JPH07190736A (en) | 1993-12-27 | 1993-12-27 | Method and apparatus for measuring height of solder fillet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07190736A true JPH07190736A (en) | 1995-07-28 |
Family
ID=18265587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5333390A Pending JPH07190736A (en) | 1993-12-27 | 1993-12-27 | Method and apparatus for measuring height of solder fillet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07190736A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002535606A (en) * | 1999-01-18 | 2002-10-22 | マイデータ オートメーション アクチボラグ | Method and apparatus for inspecting an object |
-
1993
- 1993-12-27 JP JP5333390A patent/JPH07190736A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002535606A (en) * | 1999-01-18 | 2002-10-22 | マイデータ オートメーション アクチボラグ | Method and apparatus for inspecting an object |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2751435B2 (en) | Inspection method for soldering condition of electronic components | |
| US5134665A (en) | Apparatus and method of inspecting solder printing | |
| WO2021079541A1 (en) | Appearance inspection device and defect inspection method | |
| JPH07190736A (en) | Method and apparatus for measuring height of solder fillet | |
| KR20220071620A (en) | Printed assembly circuit board assembly inspection device | |
| JPH07113534B2 (en) | Precision contour visual measurement method and device | |
| JP3657768B2 (en) | X-ray transmission inspection equipment | |
| JP2013092508A (en) | Appearance inspection device | |
| JP2000022326A (en) | Apparatus and method for inspecting solder | |
| JP3203397B2 (en) | Soldering condition inspection device and soldering condition inspection method | |
| JP2560462B2 (en) | Film thickness measuring device | |
| JP3492707B2 (en) | Measuring method of height distribution and volume of cream solder part | |
| JP2002029033A (en) | Method of creating inspection data for print inspection device | |
| JP2000246865A (en) | Print screen height adjustment jig | |
| JP3054513B2 (en) | Method for detecting lead lift of electronic components | |
| JP2008041758A (en) | Flux transfer state inspection method and apparatus | |
| JP2517966Y2 (en) | Portable angle measuring device | |
| JPH0455708A (en) | Substrate-height measuring circuit of visual inspections apparatus for mounting substrate | |
| JP2021067538A (en) | Visual inspection device and visual inspection method | |
| JP2929770B2 (en) | Solder shape inspection method | |
| JPH052163B2 (en) | ||
| JPH02110306A (en) | Detection of observation position and device therefor | |
| JP2002333308A (en) | Bump height inspection method and inspection apparatus | |
| JPH01265143A (en) | Inspection device for solder state | |
| JPH051905A (en) | Inspection method for soldering of electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070910 Year of fee payment: 8 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20080910 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080910 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |