JPH0719953B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0719953B2 JPH0719953B2 JP3258775A JP25877591A JPH0719953B2 JP H0719953 B2 JPH0719953 B2 JP H0719953B2 JP 3258775 A JP3258775 A JP 3258775A JP 25877591 A JP25877591 A JP 25877591A JP H0719953 B2 JPH0719953 B2 JP H0719953B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- solder
- printed wiring
- hole
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、クリームはんだを充填
したスルーホールに、ＩＣなどのリードを有する部品を
挿入しリフローはんだ付けを行うようにしたプリント配
線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board in which a component having a lead such as an IC is inserted into a through hole filled with cream solder for reflow soldering.
【０００２】[0002]
【従来の技術および発明の背景】スルーホールを有する
プリント配線板では、通常リードを有する実装部品のリ
ードは配線板の一方の面からスルーホールに挿入され、
反対の面を溶融はんだ槽に浸漬するフローはんだ付け法
が用いられる。一方実装密度を高めるために、配線板の
両面からリードをスルーホールに挿入しはんだ付けする
ことが行われている。この場合にはフローはんだ付け法
が使えないため、スルーホールにクリームはんだを充填
しておき、このスルーホールにリードを挿入してリフロ
ー炉で加熱し溶融するリフローはんだ付け法が用いられ
ている。2. Description of the Related Art In a printed wiring board having a through hole, a lead of a mounting component usually having a lead is inserted into the through hole from one surface of the wiring board,
A flow soldering method is used in which the opposite side is immersed in a molten solder bath. On the other hand, in order to increase the mounting density, the leads are inserted into the through holes from both sides of the wiring board and soldered. In this case, since the flow soldering method cannot be used, there is used a reflow soldering method in which a through hole is filled with cream solder, leads are inserted into the through hole, and the leads are heated and melted in a reflow furnace.
【０００３】図６は従来の方法の説明図であり、同図
（Ａ）はプリント配線板１のスルーホール２にクリーム
はんだ３を充填した状態を示す。ここにクリームはんだ
３は手動あるいは自動のソルダクリーム印刷機、ディス
ペンサなどを用いて所定の位置に供給される。FIG. 6 is an explanatory view of a conventional method, and FIG. 6 (A) shows a state in which the through hole 2 of the printed wiring board 1 is filled with the cream solder 3. Here, the cream solder 3 is supplied to a predetermined position using a manual or automatic solder cream printing machine, a dispenser, or the like.
【０００４】ここに用いるクリームはんだは、粉末はん
だと、フラックスや有機溶剤等とを均一に混合してペー
スト状にしたものであるから、加熱溶融時にフラックス
や有機溶剤が飛散して容積が減少する。通常その容積は
４０％位減少し、溶融前に比べて６０％位の容積に収縮
する。Since the cream solder used here is a paste in which powdered solder and flux, organic solvent, etc. are uniformly mixed, the flux and organic solvent are scattered during heating and melting, and the volume is reduced. . Usually, the volume decreases by about 40%, and the volume shrinks to about 60% of the volume before melting.
【０００５】このため図６（Ａ）のようにスルーホール
２の中だけにクリームはんだ３を充填した場合には、同
図（Ｂ）のようにリード４を挿入してリフローはんだ付
けした後でははんだ付けが不完全になり、はんだ付けの
信頼性が低くなるという問題が生じる。Therefore, when the cream solder 3 is filled only in the through hole 2 as shown in FIG. 6A, after the lead 4 is inserted and reflow soldering is performed as shown in FIG. 6B. There is a problem that soldering becomes incomplete and reliability of soldering becomes low.
【０００６】そこで図７（Ａ）に示すようにクリームは
んだ３の供給量を増やし、スルーホール２の上面のパッ
ド５の上にクリームはんだ３を盛り上げるように載せる
ことが考えられる。しかしこの場合には、このクリーム
はんだ３がその充填時に流れて隣接する他のスルーホー
ル３のパッドに接触したり、リフロー後にはんだが隣接
するスルーホール３とブリッジを形成するという問題が
生じ易くなる。図７（Ｂ）はこのブリッジ６ができた状
態を示す。Therefore, as shown in FIG. 7 (A), it is conceivable to increase the supply amount of the cream solder 3 and place the cream solder 3 on the pad 5 on the upper surface of the through hole 2 so as to be raised. However, in this case, the problem that the cream solder 3 flows at the time of filling to contact the pad of another adjacent through hole 3 or the solder forms a bridge with the adjacent through hole 3 after the reflow is likely to occur. . FIG. 7B shows a state in which the bridge 6 is formed.
【０００７】[0007]
【発明の目的】本発明はこのような事情に鑑みなされた
ものであり、スルーホールにクリームはんだを充填して
おき、ここにリードを挿入してリフローはんだ付けを行
う場合に、充分な量のクリームはんだを供給してはんだ
付け信頼性を高めると共に、隣接する回路パターンとの
接続も確実に防止することができるプリント配線板を提
供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and when a through hole is filled with cream solder and a lead is inserted into the through hole for reflow soldering, a sufficient amount of An object of the present invention is to provide a printed wiring board that can supply cream solder to improve soldering reliability and reliably prevent connection with an adjacent circuit pattern.
【０００８】[0008]
【発明の構成】本発明によればこの目的は、クリームは
んだを充填したスルーホールに実装部品のリードを挿入
しリフローはんだ付けを行うためのプリント配線板にお
いて、前記スルーホールの一方のパッドに前記クリーム
はんだの流出を防ぐためのはんだ溜め部を設けたことを
特徴とするプリント配線板により達成される。According to the present invention, an object of the present invention is to provide a printed wiring board for reflow soldering by inserting leads of mounting components into through holes filled with cream solder, wherein one pad of the through holes is provided with This is achieved by a printed wiring board having a solder reservoir portion for preventing the outflow of cream solder.
【０００９】[0009]
【実施例】図１は本発明の一実施例の使用状態を示す
図、図２はその一部の拡大断面図、図３（Ａ）はクリー
ムはんだ充填状態を示す断面図、図３（Ｂ）はそのはん
だ付け完了状態を示す断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view showing a usage state of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a part thereof, FIG. 3 (A) is a sectional view showing a cream solder filling state, and FIG. 8A is a cross-sectional view showing a completed soldering state.
【００１０】図１において符号１２はプリント配線板、
１４はリード１６を有する実装部品であり、リード１６
はプリント配線板１２のスルーホール１８にはんだ付け
される。ここにプリント配線板１２には下方からＩＣ２
０が実装される。すなわちこのＩＣ２０のリード２２は
プリント配線板１２のスルーホール１８に下から挿入さ
れる。この結果プリント配線板１２のスルーホール１８
には、上から実装部品１４のリード１６が、下からＩＣ
２０のリード２２がそれぞれ挿入され、はんだ付けされ
るものである。In FIG. 1, reference numeral 12 is a printed wiring board,
Reference numeral 14 is a mounting component having leads 16
Are soldered to the through holes 18 of the printed wiring board 12. The printed wiring board 12 has an IC2 from below.
0 is implemented. That is, the leads 22 of the IC 20 are inserted into the through holes 18 of the printed wiring board 12 from below. As a result, the through hole 18 of the printed wiring board 12
The lead 16 of the mounting component 14 from above and the IC from below.
20 leads 22 are respectively inserted and soldered.
【００１１】ここにプリント配線板１２の上面には、絶
縁性シート２４が接着される。このシート２４はスルー
ホール１８のパッド２６よりも厚いガラス布基材エポキ
シ樹脂などの絶縁板で作られ、各パッド２６の位置にパ
ッド２６と同一寸法の穴２８が形成されている。このた
めパッド２６は図３（Ａ）のようにこの穴２８の底に表
れ、このパッド２６の周囲がこの穴２８の内周壁で囲ま
れる。すなわちこのパッド２６の上面と穴２８の内周面
とではんだ溜め部３０が形成される。An insulating sheet 24 is adhered to the upper surface of the printed wiring board 12 here. The sheet 24 is made of an insulating plate such as a glass cloth base epoxy resin that is thicker than the pads 26 of the through holes 18, and holes 28 having the same dimensions as the pads 26 are formed at the positions of the pads 26. Therefore, the pad 26 appears at the bottom of the hole 28 as shown in FIG. 3A, and the periphery of the pad 26 is surrounded by the inner peripheral wall of the hole 28. That is, the solder reservoir 30 is formed by the upper surface of the pad 26 and the inner peripheral surface of the hole 28.
【００１２】このはんだ溜め部３０およびスルーホール
１８の内部には、図３（Ａ）に示すようにクリームはん
だ３２が充填される。実装部品１４やＩＣ２０のリード
１６、２２はこのクリームはんだ３２内に貫挿され、リ
フローはんだ付けされる。クリームはんだ３０は穴２８
の内周壁に囲まれるから、その充填時に穴２８の外へ流
出せず、またリフロー時にも溶融はんだが穴２８の外へ
流出しない。このため十分な量のクリームはんだ３２を
充填することにより、はんだ付けの信頼性を高めること
ができ、また隣接する回路パターンとの間にはんだのブ
リッジが発生することがない。Cream solder 32 is filled in the solder reservoir 30 and the through hole 18, as shown in FIG. 3 (A). The leads 16 and 22 of the mounting component 14 and the IC 20 are inserted into the cream solder 32 and reflow soldered. Cream solder 30 has holes 28
Since it is surrounded by the inner peripheral wall of No. 2, it does not flow out of the hole 28 at the time of filling, and the molten solder does not flow out of the hole 28 at the time of reflow. Therefore, by filling a sufficient amount of cream solder 32, the reliability of soldering can be improved, and a solder bridge does not occur between adjacent circuit patterns.
【００１３】ここではんだ溜め部３０の容積、換言すれ
ば絶縁性シート２４に必要な厚さを計算により求めてお
く。まず適切なはんだ付けに必要なはんだ量Ｖは Ｖ＝（スルーホール容積）−（リードのスルーホール内
容積） ＋（フィレット体積） である。ここに（フィレット体積）（＝Ｆ）は、クリー
ムはんだのリフロー後にパッド２６上に形成される円錐
形の部分（フィレットという）３４（図３（Ｂ）参照）
の体積であり、Ｆ＝（円錐容積）−（リード体積）とな
る。各部の寸法を図３（Ｂ）に数字で示すものとすれ
ば、 Ｖ＝(0.3)2・π・1.6 −(0.2)2・π・1.6 ＋(1.1/2) 2 ・0.5 ・π・2/3 −(0.2)2・π・0.5 ・ 2 ≒ 0.45mm3 Here, the volume of the solder reservoir 30, that is, the thickness required for the insulating sheet 24 is calculated. First, the amount of solder V required for proper soldering is V = (through-hole volume)-(lead through-hole volume) + (fillet volume). Here, (fillet volume) (= F) is a conical portion (referred to as fillet) 34 formed on the pad 26 after reflow of the cream solder (see FIG. 3B).
And F = (cone volume) − (lead volume). V = (0.3) 2 · π · 1.6 − (0.2) 2 · π · 1.6 + (1.1 / 2) 2 · 0.5 · π · 2 if the dimensions of each part are shown by the numbers in Fig. 3B. / 3 − (0.2) 2・ π ・ 0.5 ・ 2 ≈ 0.45mm 3
【００１４】クリームはんだはリフロー後の体積が約６
０％に減るから、印刷等により供給するクリームはんだ
の量は、Ｖ0 ＝0.45/0.6＝0.75mm3 となる。次にこれだ
けのクリームはんだ量をのせるために必要なシート厚さ
を求める。シート２４の厚さを0.4 mmとすれば、 (0.3) 2 ・π・1.6 ＋(1.1/2) 2・π・(0.4−0.05) ≒ 0.78mm3 となることから、この厚さは約0.4mm とすればよいこと
が解る。またこのシート２４の厚さを変えることにより
供給できるクリームはんだの量を調整することができ
る。The volume of cream solder after reflow is about 6
Since it is reduced to 0%, the amount of cream solder supplied by printing or the like is V 0 = 0.45 / 0.6 = 0.75 mm 3 . Next, find the sheet thickness required to put this amount of cream solder. If the thickness of the sheet 24 is 0.4 mm, (0.3) 2 · π · 1.6 + (1.1 / 2) 2 · π · (0.4-0.05) ≈ 0.78 mm 3 , this thickness is about 0.4 It turns out that mm is enough. The amount of cream solder that can be supplied can be adjusted by changing the thickness of the sheet 24.
【００１５】図４は他の実施例を示す要部断面図であ
る。この実施例はスルーホール１８のパッド２６を囲む
ように例えば絶縁性樹脂の土手３６を設けたものであ
る。この土手３４の内側にはんだ溜め部３０Ａが形成さ
れ、ここにクリームはんだ３２Ａが供給される。この土
手３６は例えばディスペンサや印刷の手法によって供給
することができる。FIG. 4 is a sectional view showing the main part of another embodiment. In this embodiment, a bank 36 of, for example, an insulating resin is provided so as to surround the pad 26 of the through hole 18. A solder reservoir 30A is formed inside the bank 34, and cream solder 32A is supplied to the solder reservoir 30A. The bank 36 can be supplied by, for example, a dispenser or a printing method.
【００１６】図５はさらに他の実施例を示す要部断面図
である。この実施例はスルーホール１８Ｂの上端を円錐
形に拡径し、この円錐形の部分１８ｂをはんだ溜め部３
０Ｂとして、ここにクリームはんだ３２Ｂを充填したも
のである。FIG. 5 is a cross-sectional view of a main part showing still another embodiment. In this embodiment, the upper end of the through hole 18B is enlarged in a conical shape, and the conical portion 18b is formed in the solder reservoir 3
0B is filled with cream solder 32B.
【００１７】[0017]
【発明の効果】本発明は以上のように、スルーホールの
一方のパッドにクリームはんだの流出を防ぐためのはん
だ溜め部を形成したものであるから、クリームはんだの
供給量を増やしても、はんだがパッドから流出して隣接
する電気回路パターンに接続することがなくなる。この
ためはんだ付けの信頼性が向上する。As described above, according to the present invention, the solder reservoir portion for preventing the outflow of the cream solder is formed on one of the pads of the through hole. Therefore, even if the supply amount of the cream solder is increased, the solder Will not flow out of the pad and connect to the adjacent electrical circuit pattern. Therefore, the reliability of soldering is improved.
【図１】本発明の一実施例の使用状態を示す図FIG. 1 is a diagram showing a usage state of an embodiment of the present invention.
【図２】その一部拡大断面図2 is a partially enlarged cross-sectional view of FIG.
【図３（Ａ）】クリームはんだ充填状態を示す図FIG. 3 (A) is a diagram showing a cream solder filling state.
【図３（Ｂ）】はんだ付け状態を示す図FIG. 3B is a diagram showing a soldering state
【図４】他の実施例を示す図FIG. 4 is a diagram showing another embodiment.
【図５】他の実施例を示す図FIG. 5 is a diagram showing another embodiment.
【図６】従来のはんだ付けの説明図FIG. 6 is an explanatory diagram of conventional soldering.
【図７】従来のはんだ付けの説明図FIG. 7 is an explanatory diagram of conventional soldering.
１２ プリント配線板 １４ 実装部品 １６、２２ リード ２０ 実装部品としてのＩＣ ２４ 絶縁性シート ２６ パッド ２８ 穴 ３０、３０Ａ、３０Ｂ はんだ溜め部 ３２、３２Ａ、３２Ｂ クリームはんだ 12 printed wiring board 14 mounting component 16, 22 lead 20 IC as mounting component 24 insulating sheet 26 pad 28 hole 30, 30A, 30B solder reservoir 32, 32A, 32B cream solder
Claims (2)
に実装部品のリードを挿入しリフローはんだ付けを行う
ためのプリント配線板において、前記スルーホールの一
方のパッドに前記クリームはんだの流出を防ぐためのは
んだ溜め部を設けたことを特徴とするプリント配線板。1. A printed wiring board for performing reflow soldering by inserting leads of a mounted component into a through hole filled with cream solder, wherein a solder for preventing the cream solder from flowing out to one pad of the through hole. A printed wiring board having a reservoir portion.
る穴を設けた絶縁性シートをプリント配線板に貼着する
ことにより形成される請求項１のプリント配線板。2. The printed wiring board according to claim 1, wherein the solder reservoir is formed by attaching an insulating sheet having holes corresponding to the pads to the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3258775A JPH0719953B2 (en) | 1991-09-11 | 1991-09-11 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3258775A JPH0719953B2 (en) | 1991-09-11 | 1991-09-11 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0575245A JPH0575245A (en) | 1993-03-26 |
| JPH0719953B2 true JPH0719953B2 (en) | 1995-03-06 |
Family
ID=17324911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3258775A Expired - Fee Related JPH0719953B2 (en) | 1991-09-11 | 1991-09-11 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719953B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100434354C (en) * | 2006-04-07 | 2008-11-19 | 美新半导体（无锡）有限公司 | Wafer-level hermetic packaging process with Y-shaped through-holes |
-
1991
- 1991-09-11 JP JP3258775A patent/JPH0719953B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0575245A (en) | 1993-03-26 |
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Legal Events
| Date | Code | Title | Description |
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