JPH07201540A - Manufacture of square type chip resistor - Google Patents
Manufacture of square type chip resistorInfo
- Publication number
- JPH07201540A JPH07201540A JP5333927A JP33392793A JPH07201540A JP H07201540 A JPH07201540 A JP H07201540A JP 5333927 A JP5333927 A JP 5333927A JP 33392793 A JP33392793 A JP 33392793A JP H07201540 A JPH07201540 A JP H07201540A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductive
- conductive film
- insulating
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000012212 insulator Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000007747 plating Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003279 ceramming Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばプリント配線板
のクロス部分に実装される角形チップ抵抗器の製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rectangular chip resistor mounted on a cross portion of a printed wiring board, for example.
【０００２】[0002]
【従来の技術】従来、この種の角形チップ抵抗器の製造
方法としては、例えば特開平５−２０５９０２号公報に
記載の構成が知られている。2. Description of the Related Art Conventionally, as a method of manufacturing a rectangular chip resistor of this type, a configuration disclosed in, for example, Japanese Patent Laid-Open No. 5-205902 is known.
【０００３】この特開平５−２０５９０２号公報に記載
の角形チップ抵抗器の製造方法は、第１の絶縁板の表面
上に、複数組の酸化ルテニウムの抵抗膜を印刷して乾燥
形成する。そして、各抵抗膜の両端に一部を重ねるよう
に、複数組の内部電極を印刷形成する。In the method of manufacturing a rectangular chip resistor disclosed in Japanese Patent Laid-Open No. 5-205902, a plurality of sets of ruthenium oxide resistance films are printed and dried on the surface of the first insulating plate. Then, a plurality of sets of internal electrodes are formed by printing so as to partially overlap both ends of each resistance film.
【０００４】また、第２の絶縁板を第１の絶縁板の複数
組の抵抗膜を形成した面上に加熱および加圧して接合す
る。そして、この積層絶縁体を適宜切断して仮焼し、内
部に抵抗膜および両端に接続された内部電極を設けた複
合セラミックス基体を備えた半完成抵抗器を複数形成す
る。Further, the second insulating plate is bonded to the surface of the first insulating plate on which a plurality of sets of resistance films are formed by heating and pressurizing. Then, this laminated insulator is appropriately cut and calcined to form a plurality of semi-finished resistors each having a composite ceramic substrate provided with a resistance film and internal electrodes connected to both ends thereof.
【０００５】次に、半完成抵抗器を、バレル研磨機に
て、各稜線部に丸みを形成する。そして、この半完成抵
抗器の両端部に内部電極に接続させて、順次ニッケルメ
ッキ層、半田メッキ層を形成して導電部である外部電極
を形成し、角形チップ抵抗器を形成する。Next, the semi-finished resistor is rounded at each ridge with a barrel grinder. Then, the semi-finished resistors are connected to internal electrodes at both ends thereof, and nickel plating layers and solder plating layers are sequentially formed to form external electrodes which are conductive portions, thereby forming a rectangular chip resistor.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記特
開平５−２０５９０２号公報に記載の角形チップ抵抗器
の製造方法は、積層絶縁体の端面から露出する抵抗膜に
接続された内部電極の面積が小さいため、外部電極とな
るニッケルメッキ層との接続面積が小さく接続力が弱い
という問題がある。However, in the method of manufacturing a rectangular chip resistor described in Japanese Patent Laid-Open No. 5-205902, the area of the internal electrode connected to the resistance film exposed from the end face of the laminated insulator is Since it is small, there is a problem that the connection area with the nickel plating layer that will be the external electrode is small and the connection force is weak.
【０００７】本発明は、上記問題点に鑑みなされたもの
で、積層絶縁体の端面に露出する抵抗膜の面積が増大
し、抵抗膜と導電部との接着の安定性を向上し、信頼性
の高い角形チップ抵抗器の製造方法を提供するものであ
る。The present invention has been made in view of the above problems. The area of the resistance film exposed on the end face of the laminated insulator is increased, the stability of the adhesion between the resistance film and the conductive portion is improved, and the reliability is improved. The present invention provides a method for manufacturing a rectangular chip resistor having a high price.
【０００８】[0008]
【課題を解決するための手段】請求項１記載の角形チッ
プ抵抗器の製造方法は、第１の絶縁板の平面上に複数条
の帯状の抵抗膜を幅方向に間隔を介して略平行に形成
し、この第１の絶縁板の前記抵抗膜を形成した平面上に
長手方向が前記抵抗膜の長手方向に対して略垂直に複数
条の帯状の導電膜を幅方向に間隔を介して略平行に形成
し、前記第１の絶縁板の前記抵抗膜および導電膜を形成
した平面上に第２の絶縁板を重ね合わせて固定してこれ
ら第１および第２の絶縁板にて前記抵抗膜および導電膜
を挟着して積層絶縁体を形成し、この積層絶縁体を前記
抵抗膜の長手方向に対して略垂直に前記導電膜の長手方
向の略中央で切断して細長絶縁片を形成し、この細長絶
縁片の前記導電膜の長手方向に沿った断面が露出する両
側面に導電部を形成し、この細長絶縁片を前記各抵抗膜
間の中間位置からそれぞれチップ状に切断するものであ
る。According to a first aspect of the present invention, there is provided a method for manufacturing a rectangular chip resistor, wherein a plurality of strip-shaped resistive films are arranged on a plane of a first insulating plate and are substantially parallel to each other with a space in the width direction. A plurality of strip-shaped conductive films are formed on the plane of the first insulating plate on which the resistance film is formed, and the longitudinal direction is substantially perpendicular to the longitudinal direction of the resistance film. The second insulating plate is formed in parallel and is fixed on the plane of the first insulating plate on which the resistance film and the conductive film are formed by stacking and fixing the second insulating plate. And a conductive film is sandwiched to form a laminated insulator, and the laminated insulator is cut substantially perpendicularly to the longitudinal direction of the resistance film at substantially the center in the longitudinal direction of the conductive film to form an elongated insulating piece. Then, conductive portions are formed on both side surfaces of the elongated insulating piece where the cross section along the longitudinal direction of the conductive film is exposed. Is for cutting the elongate insulating member, respectively from the intermediate position into chips between each resistive film.
【０００９】請求項２記載の角形チップ抵抗器の製造方
法は、第１の絶縁板の平面上に複数条の帯状に抵抗膜を
幅方向に間隔を介して略平行に形成し、この第１の絶縁
板の前記抵抗膜を形成した平面上の前記抵抗膜の長手方
向の両端側の縁に帯状の縁導電膜を形成するとともに、
この縁抵抗膜より幅寸法が略２倍の幅広導電膜をこの縁
導電膜に幅方向に間隔を介して略平行に複数条形成し、
前記第１の絶縁板の前記抵抗膜、縁導電膜および幅広導
電膜を形成した平面上に第２の絶縁板を重ね合わせて固
定してこれら第１および第２の絶縁板にて前記抵抗膜お
よび導電膜を挟着して積層絶縁体を形成し、この積層絶
縁体を前記幅広導電膜の長手方向の略中央で切断して細
長絶縁片を形成し、この細長絶縁片の前記導電膜の長手
方向に沿った断面が露出する両側面に導電部を形成し、
この細長絶縁片を前記各抵抗膜間の中間位置からそれぞ
れチップ状に切断するものである。According to a second aspect of the present invention, there is provided a method of manufacturing a rectangular chip resistor in which a plurality of strips of resistive film are formed on a plane of a first insulating plate in a width direction with a space therebetween and are substantially parallel to each other. While forming a strip-shaped edge conductive film on the edges of both ends in the longitudinal direction of the resistance film on the plane where the resistance film of the insulating plate is formed,
A plurality of wide conductive films each having a width dimension approximately twice that of the edge resistance film are formed in the edge conductive film in parallel in the width direction with a space therebetween.
The second insulating plate is superposed and fixed on the plane of the first insulating plate on which the resistive film, the edge conductive film and the wide conductive film are formed, and the resistive film is formed by the first and second insulating plates. And sandwiching the conductive film to form a laminated insulator, and cutting the laminated insulator at approximately the center in the longitudinal direction of the wide conductive film to form an elongated insulating piece. Form conductive parts on both side surfaces where the cross section along the longitudinal direction is exposed,
The elongated insulating pieces are cut into chips from the intermediate positions between the resistance films.
【００１０】[0010]
【作用】請求項１記載の角形チップ抵抗器の製造方法
は、第１の絶縁板に形成した帯状の抵抗膜に略垂直に帯
状の導電膜を積層形成し、第１および第２の絶縁板にて
挟着した積層絶縁体を縦横に切断するため、抵抗膜およ
び抵抗膜に連続する導電膜の断面が露出し、抵抗膜と導
電部との接続性が向上するとともに、容易に大量の角形
チップ抵抗器が得られる。In the method of manufacturing a rectangular chip resistor according to the first aspect of the present invention, a strip-shaped conductive film is formed substantially vertically on the strip-shaped resistance film formed on the first insulating plate, and the first and second insulating plates are formed. Since the laminated insulator sandwiched by is cut vertically and horizontally, the cross section of the resistance film and the conductive film continuous to the resistance film is exposed, the connectivity between the resistance film and the conductive part is improved, and a large amount of rectangular A chip resistor is obtained.
【００１１】請求項２記載の角形チップ抵抗器の製造方
法は、帯状の抵抗膜を形成した第１の絶縁板の平面上
に、抵抗膜の長手方向の両端側の縁に帯状の縁導電膜を
形成するとともに、この縁抵抗膜より幅寸法が略２倍の
幅広導電膜をこの縁導電膜に幅方向に間隔を介して略平
行に複数条形成し、幅広導電膜の長手方向の略中央で切
断するため、第１および第２の絶縁板にて挟着した積層
絶縁体を縦横に切断するのみで、抵抗膜と導電部との接
続性が向上する角形チップ抵抗器を切除部分がなく容易
に大量に得られる。According to a second aspect of the present invention, there is provided a method of manufacturing a rectangular chip resistor, wherein strip-shaped edge conductive films are provided on edges of both ends of the resistive film in a longitudinal direction on a plane of the first insulating plate on which the strip-shaped resistive film is formed. And a plurality of wide conductive films having a width dimension approximately twice that of the edge conductive film are formed substantially parallel to the edge conductive film at intervals in the width direction, and the center of the wide conductive film in the longitudinal direction is formed. Since the laminated chip is sandwiched between the first and second insulating plates, it is simply cut vertically and horizontally, and the rectangular chip resistor that improves the connectivity between the resistance film and the conductive portion does not have to be cut away. Easily obtained in large quantities.
【００１２】[0012]
【実施例】以下、本発明の角形チップ抵抗器の製造方法
により製造した一実施例の角形チップ抵抗器を図面を参
照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A square chip resistor manufactured by the method for manufacturing a square chip resistor according to the present invention will be described below with reference to the drawings.
【００１３】図１において、１は角形チップ抵抗器で、
この角形チップ抵抗器１は、絶縁性のセラミック材料板
や合成樹脂板などから略長方形の平板状に形成された一
対の第１および第２の絶縁板２，３が積層されて形成さ
れている。In FIG. 1, reference numeral 1 is a rectangular chip resistor,
The rectangular chip resistor 1 is formed by laminating a pair of first and second insulating plates 2 and 3 which are formed of an insulating ceramic material plate or a synthetic resin plate in a substantially rectangular flat plate shape. .
【００１４】そして、角形チップ抵抗器１には、第１お
よび第２の絶縁板２，３の間に、長手方向に沿って長手
方向を有した帯状の抵抗膜５が略中央に挟着されてい
る。さらに、抵抗膜５の長手方向の両端部には、長手方
向が略垂直方向に直交して導電膜６，６が形成されてい
る。In the rectangular chip resistor 1, a strip-shaped resistance film 5 having a longitudinal direction along the longitudinal direction is sandwiched between the first and second insulating plates 2 and 3 at substantially the center. ing. Further, conductive films 6 and 6 are formed on both ends of the resistance film 5 in the longitudinal direction such that the longitudinal directions thereof are substantially orthogonal to the vertical direction.
【００１５】また、角形チップ抵抗器１の長手方向の両
端部には、ニッケルメッキや半田メッキなどにより導電
部７，７が、抵抗膜５の長手方向の両端部および導電膜
６，６にそれぞれ接触して形成されている。さらに、角
形チップ抵抗器１の長手方向の両端部には、導電部７，
７を覆うようにニッケルメッキや半田メッキなどにより
電極８が形成されている。Further, conductive portions 7, 7 are formed on both ends of the rectangular chip resistor 1 in the longitudinal direction by nickel plating or solder plating, and are formed on both ends of the resistive film 5 in the longitudinal direction and the conductive films 6, 6, respectively. It is formed by contact. Further, at both ends of the rectangular chip resistor 1 in the longitudinal direction, conductive parts 7,
An electrode 8 is formed so as to cover 7 by nickel plating or solder plating.
【００１６】次に、上記角形チップ抵抗器を製造する工
程を図面を参照して説明する。Next, a process of manufacturing the rectangular chip resistor will be described with reference to the drawings.
【００１７】まず、略長方形の平板状の焼成前のセラミ
ックにて、図２に示すように、略長方形の平板状に、第
１の絶縁板２を成形する。First, as shown in FIG. 2, the first insulating plate 2 is formed into a substantially rectangular flat plate by using a substantially rectangular flat plate before being fired.
【００１８】そして、この第１の絶縁板２の平面上に、
図３に示すように、帯状の抵抗膜５，５を、幅方向に間
隔を介して複数条略平行に印刷により形成する。Then, on the plane of the first insulating plate 2,
As shown in FIG. 3, the strip-shaped resistance films 5 and 5 are formed by printing in parallel with a plurality of strips at intervals in the width direction.
【００１９】なお、この抵抗膜５，５の形成の際、抵抗
膜５，５間の距離ａは、第１の絶縁板２の縁から抵抗膜
５の縁までの距離ｂの略２倍（ａ＝２ｂ）の距離となる
ように形成する。When forming the resistance films 5 and 5, the distance a between the resistance films 5 and 5 is approximately twice the distance b from the edge of the first insulating plate 2 to the edge of the resistance film 5 ( It is formed so that the distance is a = 2b).
【００２０】この抵抗膜５の材料としては、第１の絶縁
板２がセラミック材料板の場合には銀、パラジウム、金
またはタングステン、モリブデン、ルテニウム、錫など
の抵抗性物質をガラスや樹脂などに分散させた抵抗ペー
ストとし、第１の絶縁板２が合成樹脂板の場合は、銀や
カーボンなどを抵抗性物質とした合成樹脂抵抗塗料を用
いる。As the material of the resistance film 5, when the first insulating plate 2 is a ceramic material plate, a resistive material such as silver, palladium, gold or tungsten, molybdenum, ruthenium, tin is used as glass or resin. As the dispersed resistance paste, if the first insulating plate 2 is a synthetic resin plate, a synthetic resin resistance paint using a resistance substance such as silver or carbon is used.
【００２１】また、第１の絶縁板２の抵抗膜５，５が形
成された平面上に、図４に示すように、抵抗膜５，５の
長手方向の両端の縁に位置して帯状の縁導電膜6a，6aを
形成するとともに、縁導電膜6a，6a間に、この縁導電膜
6aの幅寸法ｃの略２倍の幅寸法ｄ（ｄ＝２ｃ）の帯状の
幅広導電膜6b，6bを、幅方向に間隔を介して複数条略平
行に印刷により形成する。Further, as shown in FIG. 4, on the flat surface of the first insulating plate 2 on which the resistance films 5 and 5 are formed, strips are formed at the edges of both ends of the resistance films 5 and 5 in the longitudinal direction. The edge conductive films 6a, 6a are formed, and the edge conductive films 6a, 6a are formed between the edge conductive films 6a, 6a.
The strip-shaped wide conductive films 6b, 6b having a width dimension d (d = 2c) that is approximately twice the width dimension c of 6a are formed by printing a plurality of strips substantially parallel to each other at intervals in the width direction.
【００２２】なお、この縁導電膜6aおよび幅広導電膜6b
の材料としては、第１の絶縁板２がセラミック材料板の
場合には銀、パラジウム、金またはタングステン、モリ
ブデンなどの導電性物質をガラスや樹脂などに分散させ
た導電ペーストとし、第１の絶縁板２が合成樹脂板の場
合は、銀などを導電性物質とした合成樹脂抵抗塗料を用
いる。The edge conductive film 6a and the wide conductive film 6b are provided.
When the first insulating plate 2 is a ceramic material plate, the material for the first insulating plate 2 is a conductive paste in which a conductive substance such as silver, palladium, gold or tungsten or molybdenum is dispersed in glass or resin, and When the plate 2 is a synthetic resin plate, a synthetic resin resistance paint using a conductive material such as silver is used.
【００２３】次に、図５に示すように、第１の絶縁板２
の抵抗膜５、縁導電膜6aおよび幅広導電膜6bが形成され
た平面上に、第１の絶縁板２と同じ材質で同平板形状の
第２の絶縁板３を重ね合せ、１５０℃〜２００℃で加熱
して積層絶縁体９を形成する。なお、第１および第２の
絶縁板２，３が合成樹脂板の場合は、接着材で接着す
る。Next, as shown in FIG. 5, the first insulating plate 2
The second insulating plate 3 made of the same material as the first insulating plate 2 and having the same flat plate shape is laid on the flat surface on which the resistive film 5, the edge conductive film 6a, and the wide conductive film 6b are formed, and the temperature is 150 ° C to 200 ° C. The laminated insulator 9 is formed by heating at ℃. When the first and second insulating plates 2 and 3 are synthetic resin plates, they are bonded with an adhesive material.
【００２４】そして、この積層絶縁体９の第２の絶縁板
３の上面に、図５に示すように、各抵抗膜５間の略中央
位置ごとに分割する方向に沿って、Ｖ字状に割り溝10を
形成する。さらに、積層絶縁体９を、幅広導電膜6bの長
手方向の略中央で帯状の抵抗膜５の長手方向を寸断する
方向に切断して、図６に示す細長絶縁片11を形成する。Then, as shown in FIG. 5, on the upper surface of the second insulating plate 3 of the laminated insulator 9, a V-shape is formed along the direction in which the resistance films 5 are divided at substantially central positions. The split groove 10 is formed. Further, the laminated insulator 9 is cut in a direction that cuts the longitudinal direction of the strip-shaped resistance film 5 at approximately the center in the longitudinal direction of the wide conductive film 6b to form the elongated insulating piece 11 shown in FIG.
【００２５】この後、細長絶縁片11を焼成する。なお、
焼成温度は、抵抗膜５、縁導電膜6aおよび幅広導電膜6b
の材料が、銀、パラジウム、金、ルテニウムなどの厚膜
抵抗ペーストの場合には８００℃〜９００℃で焼成し
て、第１および第２の絶縁板２，３を焼結させる。ま
た、抵抗膜５、縁導電膜6aおよび幅広導電膜6bの材料が
タングステン、モリブデンの場合はＮ2 Ｈ2 混合ガス中
で１４００℃〜１６００℃で焼成する。After that, the elongated insulating piece 11 is fired. In addition,
The firing temperature is the resistance film 5, the edge conductive film 6a, and the wide conductive film 6b.
When the material is a thick film resistance paste such as silver, palladium, gold or ruthenium, it is fired at 800 ° C. to 900 ° C. to sinter the first and second insulating plates 2 and 3. When the material of the resistance film 5, the edge conductive film 6a, and the wide conductive film 6b is tungsten or molybdenum, it is fired at 1400 ° C to 1600 ° C in N 2 H 2 mixed gas.
【００２６】なお、セラミック化は高温焼結の方が好ま
しいが、銀、パラジウム、金、ルテニウムなどは、９０
０℃以上では溶融してしまうため、それ以下の温度で焼
成することが好ましい。Although high temperature sintering is preferable for ceramming, silver, palladium, gold, ruthenium, etc. are 90% higher.
Since it melts at 0 ° C. or higher, it is preferable to bake at a temperature lower than that.
【００２７】次に、細長絶縁片11の幅方向の両端面、す
なわち、抵抗膜５の幅方向の断面および導電膜６の断
面、すなわち縁導電膜6aの側面もしくは幅広導電膜6bの
長手方向の断面が露出している面に、導電ペーストまた
は導電塗料を、抵抗膜５および導電膜６、すなわち縁抵
抗膜6aもしくは幅広抵抗膜6bに導通するように塗布し、
焼成または加熱乾燥を施し、図１および図７に示すよう
に、細長絶縁片11の両側面に導電部７，７を形成する。Next, both end faces in the width direction of the elongated insulating piece 11, that is, the cross section in the width direction of the resistance film 5 and the cross section of the conductive film 6, that is, the side face of the edge conductive film 6a or the longitudinal direction of the wide conductive film 6b. A conductive paste or conductive paint is applied to the surface where the cross section is exposed so as to be conductive with the resistance film 5 and the conductive film 6, that is, the edge resistance film 6a or the wide resistance film 6b,
By firing or heating and drying, as shown in FIGS. 1 and 7, conductive portions 7, 7 are formed on both side surfaces of the elongated insulating piece 11.
【００２８】そして、細長絶縁片11を割り溝10の位置か
ら分割し、図８に示すように、長手方向の両端面に導電
部７，７が形成された直方体形状のチップ片12を形成す
る。Then, the elongated insulating piece 11 is divided from the position of the split groove 10 to form a rectangular parallelepiped chip piece 12 having conductive portions 7, 7 formed on both end faces in the longitudinal direction, as shown in FIG. .
【００２９】次に、チップ片12の導電部７，７に、ニッ
ケル電解メッキあるいは半田メッキを施して電極８，８
を形成し、図１に示す角形チップ抵抗器１を形成する。
なお、この電極７，７は、ニッケル電解メッキを施した
後に、さらにこのニッケル電解メッキの表面に半田メッ
キを層状に施して形成してもできる。Next, the conductive portions 7 and 7 of the chip piece 12 are subjected to nickel electrolytic plating or solder plating to form electrodes 8 and 8.
To form the rectangular chip resistor 1 shown in FIG.
The electrodes 7 and 7 may be formed by applying nickel electroplating and then performing solder plating in layers on the surface of the nickel electroplating.
【００３０】上記実施例は、帯状の抵抗膜５を形成した
第１の絶縁板２の平面上に、抵抗膜５の長手方向の両端
側の縁に位置して帯状の縁導電膜6aを形成するととも
に、この縁抵抗膜6aより幅寸法が略２倍幅広の幅広導電
膜6bを、この縁導電膜6aに幅方向に間隔を介して略平行
に複数条形成し、幅広導電膜6bの長手方向の略中央で切
断し、抵抗膜５間の略中央位置ごとに切断するため、第
１および第２の絶縁板２，３にて挟着した積層絶縁体９
を縦横に切断するのみで、角形チップ抵抗器１を切除部
分がなく一挙に大量で容易に形成できる。さらに、抵抗
膜５および抵抗膜５に連続する導電膜６、すなわち縁導
電膜6aおよび幅広導電膜6bの断面が露出するため、単に
絶縁板２，３の平面上に形成した抵抗膜５の断面に比
し、細長絶縁片11に形成する導電部７と導電膜６を介し
た抵抗膜５との接続面積が増大でき、接続が非常に強固
になり、信頼性の高い電極が得られる。In the above-described embodiment, the strip-shaped edge conductive film 6a is formed on the plane of the first insulating plate 2 on which the strip-shaped resistive film 5 is formed, which is located at the edges on both ends in the longitudinal direction of the resistive film 5. In addition, a plurality of wide conductive films 6b each having a width twice as wide as that of the edge resistance film 6a are formed substantially parallel to the edge conductive film 6a at intervals in the width direction, and the length of the wide conductive film 6b is long. The laminated insulator 9 sandwiched between the first and second insulating plates 2 and 3 in order to cut at substantially the center of the direction and to cut at each substantially central position between the resistance films 5.
The rectangular chip resistor 1 can be easily formed in a large amount at once without cutting away only by cutting the chip vertically and horizontally. Furthermore, since the cross sections of the resistance film 5 and the conductive film 6 continuous to the resistance film 5, that is, the edge conductive film 6a and the wide conductive film 6b are exposed, the cross section of the resistance film 5 simply formed on the planes of the insulating plates 2 and 3. In contrast, the connection area between the conductive portion 7 formed on the elongated insulating piece 11 and the resistance film 5 via the conductive film 6 can be increased, the connection becomes very strong, and a highly reliable electrode can be obtained.
【００３１】なお、上記実施例において、必要に応じて
１個のチップ片12に２層以上の抵抗膜５や縁導電膜6a、
幅広導電膜6bを形成することもできる。In the above embodiment, one chip piece 12 may have two or more layers of resistive film 5 and edge conductive film 6a, if necessary.
The wide conductive film 6b can also be formed.
【００３２】また、第１の絶縁板２上に絶縁電膜6aを形
成して説明したが、第１の絶縁板２の縁近傍に各導電膜
6a，6bや抵抗膜５を形成せず、最終的に切り落とすよう
にしてもよい。また、各導電膜6a，6bや抵抗膜５の幅寸
法や厚さ寸法は適宜設定される。Although the insulating film 6a is formed on the first insulating plate 2, the conductive films are formed near the edge of the first insulating plate 2.
It is also possible to cut off finally without forming 6a, 6b and the resistance film 5. The width and thickness of the conductive films 6a and 6b and the resistance film 5 are set appropriately.
【００３３】[0033]
【発明の効果】請求項１記載の角形チップ抵抗器の製造
方法は、第１の絶縁板に形成した帯状の抵抗膜に略垂直
に帯状の導電膜を積層形成し、第１および第２の絶縁板
にて挟着した積層絶縁体を縦横に切断するため、抵抗膜
および抵抗膜に連続する導電膜の断面が露出し、抵抗膜
と導電部との接続性が向上できるとともに、容易に大量
の角形チップ抵抗器を製造できる。According to the first aspect of the present invention, there is provided a method for manufacturing a rectangular chip resistor, wherein a strip-shaped conductive film is laminated substantially perpendicular to a strip-shaped resistive film formed on the first insulating plate, and the first and second strip-shaped conductive films are laminated. Since the laminated insulator sandwiched by the insulating plates is cut vertically and horizontally, the cross section of the resistance film and the conductive film continuous to the resistance film is exposed, and the connectivity between the resistance film and the conductive portion can be improved, and at the same time, a large amount can be easily formed. Of rectangular chip resistors can be manufactured.
【００３４】請求項２記載の角形チップ抵抗器の製造方
法は、帯状の抵抗膜を形成した第１の絶縁板の平面上
に、抵抗膜の長手方向の両端側の縁に帯状の縁導電膜を
形成するとともに、この縁抵抗膜の幅寸法より略２倍の
幅広導電膜を略平行に複数条形成し、幅広導電膜の長手
方向の略中央で切断するため、第１および第２の絶縁板
にて挟着した積層絶縁体を縦横に切断するのみで、抵抗
膜と導電部との接続性が向上した角形チップ抵抗器を切
除部分がなく容易に大量に製造できる。According to a second aspect of the present invention, there is provided a method for manufacturing a rectangular chip resistor, in which a strip-shaped edge conductive film is provided on edges of both ends in the longitudinal direction of the resistive film on the plane of the first insulating plate on which the strip-shaped resistive film is formed. And a plurality of wide conductive films that are about twice as wide as the width of the edge resistance film are formed substantially parallel to each other and cut at substantially the center in the longitudinal direction of the wide conductive film. By simply cutting the laminated insulator sandwiched by the plates in the vertical and horizontal directions, it is possible to easily manufacture a large amount of rectangular chip resistors having improved connectivity between the resistance film and the conductive portion without a cutout portion.
【図１】本発明の角形チップ抵抗器の製造方法により製
造した角形チップ抵抗器の一実施例を示す長手方向の断
面側面図である。FIG. 1 is a longitudinal cross-sectional side view showing an embodiment of a rectangular chip resistor manufactured by a method for manufacturing a rectangular chip resistor according to the present invention.
【図２】同上第１の絶縁板を示す斜視図である。FIG. 2 is a perspective view showing a first insulating plate of the same.
【図３】同上第１の絶縁板上に抵抗膜を形成した状況を
示す斜視図である。FIG. 3 is a perspective view showing a situation in which a resistance film is formed on the first insulating plate.
【図４】同上抵抗膜を形成した第１の絶縁板上に導電膜
を形成した状況を示す斜視図である。FIG. 4 is a perspective view showing a state in which a conductive film is formed on a first insulating plate having a resistance film formed thereon.
【図５】同上第２の絶縁板を重ね合わせた状況の積層絶
縁体を示す斜視図である。FIG. 5 is a perspective view showing a laminated insulator in a state in which a second insulating plate is overlapped with the above.
【図６】同上細長絶縁片を示す斜視図である。FIG. 6 is a perspective view showing the same elongated insulating piece.
【図７】同上細長絶縁片に導電部を形成した状況を示す
平面図である。FIG. 7 is a plan view showing a situation in which a conductive portion is formed on the elongated insulating piece of the above.
【図８】同上チップ片を示す平面図である。FIG. 8 is a plan view showing the same chip piece.
１ 角形チップ抵抗器 ２ 第１の絶縁板 ３ 第２の絶縁板 ５ 抵抗膜 ６ 導電部 6a 縁導電膜 6b 幅広導電膜 ７ 導電部 ９ 積層絶縁体 11 細長絶縁片 1 Rectangular Chip Resistor 2 First Insulating Plate 3 Second Insulating Plate 5 Resistive Film 6 Conductive Part 6a Edge Conductive Film 6b Wide Conductive Film 7 Conductive Part 9 Laminated Insulator 11 Elongated Insulation Piece
Claims (2)
抵抗膜を幅方向に間隔を介して略平行に形成し、 この第１の絶縁板の前記抵抗膜を形成した平面上に長手
方向が前記抵抗膜の長手方向に対して略垂直に複数条の
帯状の導電膜を幅方向に間隔を介して略平行に形成し、 前記第１の絶縁板の前記抵抗膜および導電膜を形成した
平面上に第２の絶縁板を重ね合わせて固定してこれら第
１および第２の絶縁板にて前記抵抗膜および導電膜を挟
着して積層絶縁体を形成し、 この積層絶縁体を前記抵抗膜の長手方向に対して略垂直
に前記導電膜の長手方向の略中央で切断して細長絶縁片
を形成し、 この細長絶縁片の前記導電膜の長手方向に沿った断面が
露出する両側面に導電部を形成し、 この細長絶縁片を前記各抵抗膜間の中間位置からそれぞ
れチップ状に切断することを特徴とする角形チップ抵抗
器の製造方法。1. A plurality of strip-shaped resistive films are formed on a plane of a first insulating plate in a width direction with a space therebetween and are substantially parallel to each other, and on the plane of the first insulating plate on which the resistive film is formed. A plurality of strip-shaped conductive films whose lengthwise direction is substantially perpendicular to the lengthwise direction of the resistance film and which are substantially parallel to each other in the widthwise direction with a space therebetween, and the resistance film and the conductive film of the first insulating plate. A second insulating plate is superposed and fixed on the plane on which the resistance film and the conductive film are sandwiched between the first and second insulating plates to form a laminated insulator, and the laminated insulator is formed. The body is cut substantially perpendicularly to the longitudinal direction of the resistive film at a substantially central portion in the longitudinal direction of the conductive film to form an elongated insulating piece, and the elongated insulating piece has a cross section along the longitudinal direction of the conductive film. Conductive parts are formed on both exposed side surfaces, and these elongated insulating pieces are respectively inserted from the intermediate position between the resistance films. Method for manufacturing a rectangular chip resistor, characterized in that cut into-up form.
抵抗膜を幅方向に間隔を介して略平行に形成し、 この第１の絶縁板の前記抵抗膜を形成した平面上の前記
抵抗膜の長手方向の両端側の縁に帯状の縁導電膜を形成
するとともに、この縁抵抗膜より幅寸法が略２倍の幅広
導電膜をこの縁導電膜に幅方向に間隔を介して略平行に
複数条形成し、 前記第１の絶縁板の前記抵抗膜、縁導電膜および幅広導
電膜を形成した平面上に第２の絶縁板を重ね合わせて固
定してこれら第１および第２の絶縁板にて前記抵抗膜お
よび導電膜を挟着して積層絶縁体を形成し、 この積層絶縁体を前記幅広導電膜の長手方向の略中央で
切断して細長絶縁片を形成し、 この細長絶縁片の前記導電膜の長手方向に沿った断面が
露出する両側面に導電部を形成し、 この細長絶縁片を前記各抵抗膜間の中間位置からそれぞ
れチップ状に切断することを特徴とする角形チップ抵抗
器の製造方法。2. A plurality of strips of resistance film are formed on the plane of the first insulating plate substantially in parallel in the width direction with an interval therebetween, and on the plane of the first insulating plate on which the resistance film is formed. A strip-shaped rim conductive film is formed on both edges of the resistance film in the longitudinal direction, and a wide conductive film having a width dimension approximately twice that of the rim resistance film is formed in the rim conductive film with an interval in the width direction. A plurality of strips are formed substantially parallel to each other, and the second insulating plate is superposed and fixed on the plane of the first insulating plate on which the resistance film, the edge conductive film, and the wide conductive film are formed. The resistance film and the conductive film are sandwiched between two insulating plates to form a laminated insulator, and the laminated insulator is cut at approximately the center in the longitudinal direction of the wide conductive film to form a long insulating piece. Conductive portions are formed on both side surfaces of the elongated insulating piece where the cross section along the longitudinal direction of the conductive film is exposed. Method for manufacturing a rectangular chip resistor, characterized in that cutting the insulating strip, respectively from the intermediate position the chip-like between the respective resistive films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33392793A JP3242247B2 (en) | 1993-12-28 | 1993-12-28 | Manufacturing method of square chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33392793A JP3242247B2 (en) | 1993-12-28 | 1993-12-28 | Manufacturing method of square chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07201540A true JPH07201540A (en) | 1995-08-04 |
| JP3242247B2 JP3242247B2 (en) | 2001-12-25 |
Family
ID=18271530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33392793A Expired - Fee Related JP3242247B2 (en) | 1993-12-28 | 1993-12-28 | Manufacturing method of square chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3242247B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279443A (en) * | 2017-10-25 | 2020-06-12 | Koa株式会社 | Chip resistor and manufacturing method of chip resistor |
-
1993
- 1993-12-28 JP JP33392793A patent/JP3242247B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279443A (en) * | 2017-10-25 | 2020-06-12 | Koa株式会社 | Chip resistor and manufacturing method of chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3242247B2 (en) | 2001-12-25 |
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