JPH07201573A - Inductance element and manufacturing method thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object to provide a resin-based inductance element that has a low inductance value and is less likely to cause signal level attenuation. [Structure] The first electrode 11a is provided on the front surface and the spiral first electrode is provided on the back surface.
First printed wiring board 12 on which conductor patterns 11b are respectively formed, and second conductor pattern 11c having a spiral shape on the surface.
And a second printed wiring board 13 each having a second electrode 11d formed on the back surface thereof, and at least the first printed wiring board 12 and the second printed wiring board 13 are laminated via an insulating layer 15a, The outer peripheral ends of the first electrode 11a and the first conductor pattern 11b, the inner peripheral end of the first conductor pattern 11b and the inner peripheral end of the second conductor pattern 11c, the outer peripheral end of the second conductor pattern 11c, and the second electrode 11d. With the configuration in which they are electrically connected, it is possible to combine the inductance elements 11 with each other, and it is possible to realize a resin-based inductance element having a low inductance value and in which attenuation of the signal level does not easily occur.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency chip-type inductance element used in a variety of electronic equipment, particularly a mobile communication field such as a personal handy horn, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a conventional lead wire has been replaced by a spirally wound inductance element, and a conductor pattern has been spirally formed on a wiring board to provide an inductance function.

For example, the one disclosed in Japanese Patent Laid-Open No. 62-79605 is that, and its configuration is as shown in FIGS. 7 (a) and 7 (b). That is, the spiral conductors 2a to 2d are formed on the substrate by screen printing nickel paste and baking. The spiral electrodes 2 of the wiring boards 1a to 1d thus obtained
Through holes 3 are formed at the inner ends of a to 2d, and through holes 4 are also formed at the outer ends of the spiral conductors 2b and 2c. All of the spiral conductors 2a to 2d are connected in series by the nickel conductor 6 via the through holes 3 and 4.

A lead conductor 5 made of copper for connecting to other circuit components to be formed on the wiring boards 1a and 1d is applied by screen printing and baked to form the end portions of the spiral conductors 2a and 2d. Is connected to the outer end portion of the above, and thereby a large inductance of about 1.5 times is obtained in the same area.

There are many examples in which such an inductance element is formed and used as a chip type inductance element.

[0006]

However, in the above-mentioned conventional ones, a step of applying a nickel paste by screen printing and baking it to form a spiral conductor, and all of the spiral conductor by the nickel conductor through the through hole The steps of connecting the elements in series, the step of depositing a lead conductor made of copper by screen printing, and the step of forming by baking are extremely complicated and the yield is deteriorated.

Further, the purpose thereof is to obtain a large inductance value in a small area, and to form a low inductance element for the mobile communication field (for high frequency) which requires a plurality of low inductance values of 30 nH or less. That is, there is a problem that a large load occurs in the design and manufacturing process.

Further, since the adjacent spiral conductors are overlapped with each other in the stacking direction of the substrates, a capacitor is formed at a portion where the spiral conductors are overlapped with each other, and the signal level is attenuated when used for high frequency. It also had problems.

The present invention solves the above-mentioned conventional problems. When used for mobile communication (for high frequencies), a plurality of low inductance values can be easily realized, and signal level attenuation is less likely to occur. It is an object of the present invention to provide an inductance element that is formed at the same time as manufacturing a printed wiring board of a system.

[0010]

To achieve this object, an inductance element of the present invention comprises a first printed wiring board having a first electrode on the front surface and a spiral first conductor pattern on the back surface, and a surface. And a second printed wiring board having a second electrode formed on the back surface of the second conductor pattern in a spiral shape,
At least the first printed wiring board and the second printed wiring board are laminated via an insulating layer, and the first electrode and the outer peripheral edge of the first conductor pattern, the inner peripheral edge of the first conductor pattern, and the second conductor pattern are laminated. The inner peripheral edge, the outer peripheral edge of the second conductor pattern, and the second electrode are electrically connected.

[0011]

With this configuration, only the first electrode and the second electrode are formed on the front and back of the inductance element, the inductance elements can be combined, and the low inductance value can be set stepwise.

Further, by displacing the first conductor pattern and the second conductor pattern in the stacking direction, it becomes difficult for a capacitor to be formed in the overlapping portion of the first conductor pattern and the second conductor pattern, and even when used for high frequencies, a signal is generated. It is also possible to make the level attenuation less likely to occur.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1A and 1B are an exploded perspective view and a sectional view of an inductance element according to a first embodiment of the present invention, and FIGS. 2 and 3 show a method of manufacturing the inductance element. It is a perspective view and a sectional view.

1, 2 and 3, 11a is the first electrode, 11b is the first conductor pattern, 11c is the second conductor pattern, 11d is the second electrode, 12 is the first printed wiring board, and 13 is Second printed wiring board, 14 is third printed wiring board, 15a is insulating layer, 16a to 16c are through holes, 17a is copper foil, 17b is conductor layer, and 19a to 19d.
Is a master film for production.

The operation of the inductance element configured as described above and the manufacturing method thereof will be described with reference to FIGS. 1, 2 and 3.

First, when the inductance element is formed simultaneously with the production of the printed wiring board, the conductor pattern (not shown) of the resin-based multilayer printed wiring board is used as shown in FIG. 2A using CAD from the circuit diagram. At the same time, a master film for production 19a on which a pair of point-symmetrical L-shaped first electrodes 11a are drawn, and a spiral first conductor pattern 11 having through holes 16a and 16b position indications at the outer and inner peripheral ends.
b, a manufacturing master film 19b, a manufacturing master film 19c having a spiral second conductor pattern 11c having through holes 16b and 16c position indications at its inner and outer peripheral ends, and a pair of point-symmetric L The master film for production 19d on which the character-shaped second electrode 11d is formed is output.

The first electrode 11a and the first conductor pattern 11
b, when the manufacturing master films 19a to 19d on which the second conductor pattern 11c and the second electrode 11d are drawn are overlapped, the adjacent first conductor pattern 11b and the second conductor pattern 11c are displaced from each other, and The first conductor pattern 11b and the second conductor pattern 11c are shown in FIG.
As shown in (b), it is arranged inside a pair of point-symmetrical L-shaped first electrode 11a and second electrode 11d.

Next, a copper foil 17a having a thickness of 18 μm is formed on both sides.
After cutting the laminated glass cloth base material epoxy resin copper clad laminate into a predetermined size, the through holes 16a, the through holes and the reference holes for the printed wiring board are processed using an NC drilling machine. As shown in FIG. 3A, the copper clad laminate having various holes formed therein has a conductor layer of several μm formed by electroless copper plating, and then a conductor layer 17b of about 20 μm formed by electrolytic copper plating.

Next, the manufacturing master film 19b is formed on the first printed wiring board 12 on which the conductor layer 17b is formed.
An etching resist having a predetermined pattern is formed by a means such as a photographic development method or a screen printing method using a mask film or a screen plate manufactured from, and the conductor layer 17b in the non-etched portion is formed by a solution such as cupric chloride.
The copper foil 17a and the copper foil 17a are removed by etching, and after the etching resist is removed, the first conductor pattern 11b is formed on the first printed wiring board 12 as shown in FIG. 3B.

Similarly, as shown in FIG. 3 (c), a glass cloth base material epoxy resin copper clad laminate laminated with copper foil 17a having a thickness of 18 μm on both sides is cut into a predetermined size, and then an NC drilling machine is used. A through hole 16c, a through hole hole for a printed wiring board, and a reference hole are processed by using the copper clad laminate as the second printed wiring board 13, and a conductor layer 17b formed by electroless copper plating and electrolytic copper plating is used. An etching resist having a predetermined pattern is formed by means such as a photo-developing method or a screen printing method using a mask film or a screen plate which is formed to have a thickness of about 20 μm and is manufactured from the manufacturing master film 19c.

After that, the conductor layer 17b and the copper foil 17a in the non-etched portion are removed by etching with a solution of cupric chloride or the like, and after the etching resist is removed, a second layer is formed as shown in FIG. 3 (c). Printed wiring board 13
The second conductor pattern 11c is formed on the.

Next, as shown in FIG. 3 (d), a prepreg forming an insulating layer 15a obtained by impregnating a glass cloth with an epoxy resin and curing the same under a predetermined condition is used as a first conductor pattern of the first printed wiring board 12. 11b and the second conductor pattern 11c of the second printed wiring board 13, and the first printed wiring board 12 and the second printed wiring 12 are pressed and heated by using a means such as a heat press. The boards 13 are laminated and united to obtain a third printed wiring board 14.

Next, the third printed wiring board 14 has an N
Using the C drilling machine, through holes 16b having a predetermined diameter are formed at positions corresponding to the inner peripheral end of the first conductor pattern 11b and the inner peripheral end of the second conductor pattern 11c. In the third printed wiring board 14 having the through holes 16b processed, a conductor layer of several μm is formed by electroless copper plating, and then a conductor layer 17b of about 20 μm is formed by electrolytic copper plating, as shown in FIG. 3 (e). At the same time as the surface of the third printed wiring board 14, the conductor layer 17b is formed on the through hole wall and the non-through hole wall.

Next, the manufacturing master film 19a is formed on the third printed wiring board 14 on which the conductor layer 17b is formed.
Etching resists of the first electrode 11a and the second electrode 11d are formed by means such as a photo-developing method and a screen printing method using a mask film or a screen plate manufactured from 19d and 19d, and a solution such as cupric chloride is used. The conductor layer 17b and the copper foil 17 in the non-etching resist forming portion
After the a is removed by etching and the etching resist is removed, the first electrode 11a and the second electrode 11d are formed on the third printed wiring board 14 as shown in FIG. 3 (f).

Next, the first printed wiring board 14 has the first
A solder resist layer is formed on predetermined portions of the electrodes 11a and the second electrodes 11d and on the surface of the third printed wiring board 14, and after external processing, the solder resist layer is formed in the third printed wiring board 14 as shown in FIG.
The inductance element 11 shown in (a) and (b) is formed.

In the present embodiment, the first conductor pattern 11
When the conductor width of b and the second conductor pattern 11c is 0.05 mm, the conductor gap is 0.05 mm, the number of turns is 3, and the thickness of the third printed wiring board 14 is about 1 to 2 mm, it is 3 to 10 nH. The inductance element 11 having a low inductance value could be realized.

As described above, according to this embodiment, the through holes are formed in the first printed wiring board, the conductor layer is formed on the entire surface of the first printed wiring board, and then the first printed wiring board is formed. After removing a part of the conductor layer on the back surface and forming a spiral first conductor pattern, and after forming a through hole in the second printed wiring board and forming a conductor layer on the entire surface of the second printed wiring board. , One of the conductor layers on the surface of this second printed wiring board
A step of removing a portion to form a spiral second conductor pattern, and forming a prepreg between the first conductor pattern surface of the first printed wiring board and the second conductor pattern surface of the second printed wiring board. A step of forming a third printed wiring board by arranging and laminating, and a step of forming a through hole in the third printed wiring board and then forming a conductor layer on the entire surface of the third printed wiring board. And a step of removing a part of the conductor layer on the front surface of the third printed wiring board and forming a second electrode by removing a part of the conductor layer on the back surface of the third printed wiring board. An inductance element having a low inductance value that can be realized can be realized simultaneously with a resin-based printed wiring board.

(Embodiment 2) A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 is a sectional view showing a method of manufacturing an inductance element showing a second embodiment of the present invention. In FIG. 4, 11a is the first electrode, 11b is the first conductor pattern,
11c is a second conductor pattern, 11d is a second electrode, 12 is a first printed wiring board, 13 is a second printed wiring board,
14 is a third printed wiring board, 15a is an insulating layer, 16b
Is a through hole.

The difference from the structure of the first embodiment is that the through hole 16
The points a and 16c are non-through holes 16d and 16e, and are replaced with conductor layers 17b formed by electroless and electrolytic copper plating, and conductor layers 17c formed by a conductive paste.

The operation of the inductance element configured as described above and the method of manufacturing the same will be described below with reference to FIG.

First, a glass cloth base material epoxy resin copper clad laminate having a thickness of 35 .mu.m laminated on both sides is cut into a predetermined size, and then a reference hole is formed using an NC drilling machine. The copper-clad laminate serving as the first printed wiring board 12 and the second printed wiring board 13 in which the reference holes are processed include the manufacturing master films 19a, 19b of FIG.
An etching resist having a predetermined pattern is formed by means such as a photo-developing method or a screen printing method using a mask film or a screen plate manufactured from 19c and 19d, and the copper in the non-etched portion is removed by a solution such as cupric chloride. After the etching is removed and the etching resist is peeled off, the first electrode 11a and the first conductor pattern 11b are formed on the first printed wiring board 12 as shown in FIG. 4 (a).
Is formed, and the second conductor pattern 11c and the second electrode 11d are formed on the second printed wiring board 13 as shown in FIG. 4B.

Next, a glass cloth is impregnated with an epoxy resin and cured under predetermined conditions to form a prepreg which constitutes the insulating layer 15a. The first conductor pattern 11b of the first printed wiring board 12 and the second printed wiring board 13 are then formed. It is sandwiched between the second conductive pattern 11c and the second conductive pattern 11c of
By pressurizing and heating, the first printed wiring board 12 and the second printed wiring board 13 are laminated and united to obtain a third printed wiring board 14 as shown in FIG. 4C.

Next, an NC drilling machine is used for the third printed wiring board 14 in which the first printed wiring board 12 and the second printed wiring board 13 are laminated and combined, and the inner peripheral end of the first conductor pattern 11b is used. Part and the inner peripheral end of the second conductor pattern 11c have through holes 16b, and the outer peripheral end of the first conductor pattern 11b and the outer peripheral end of the second conductor pattern 11c have non-through holes 16d and 16e. Part and second electrode 11
Processed to part d.

Next, the through holes 16b and the non-through holes 16d and 16e of the third printed wiring board 14 are coated and filled with a silver paste as a conductive paste by means of a screen printing method or the like, and then the predetermined size is obtained. Curing at different temperatures and times, Figure 4
The conductor layer 17c is formed as shown in (d).

The third printed wiring board 14 on which the conductor layer 17c made of silver paste is formed has the first electrode 11a for preventing migration of silver constituting the conductor layer 17c.
A solder resist layer is formed on the surface of the third printed wiring board 14 other than the second electrodes 11d, and an inductance element is formed in the third printed wiring board 14 through external processing.

In the present embodiment, the first conductor pattern 11
When the conductor width of b and the second conductor pattern 11c is 0.05 mm, the conductor gap is 0.05 mm, the number of turns is 3, and the thickness of the third printed wiring board 14 is about 1 to 2 mm, the first implementation It was possible to realize an inductance element having a low inductance value similar to the example.

As described above, according to this embodiment, the step of forming the first electrode on the front surface of the first printed wiring board and the spiral first conductor pattern on the back surface thereof, and the surface of the second printed wiring board Between the step of forming a second electrode on the back surface of the spiral second conductor pattern, and between the first conductor pattern surface of the first printed wiring board and the second conductor pattern surface of the second printed wiring board. A step of forming a third printed wiring board by arranging and laminating a prepreg on the first printed wiring board, and forming a through hole and a non-through hole in the third printed wiring board, and then forming a third printed wiring board on the third printed wiring board. By including a step of filling or applying a conductive paste into the predetermined through holes and non-through holes that have been formed, it is possible to use for high frequency without the need to form a conductor layer by plating a plurality of times. Inductance value An inductance element having can be implemented simultaneously with the printed wiring board of the resin system.

(Embodiment 3) A third embodiment of the present invention will be described below with reference to the drawings.

FIG. 5 is a sectional view showing a method of manufacturing an inductance element showing a third embodiment of the present invention. In FIG. 5, 11a is the first electrode, 11b is the first conductor pattern,
11c is a second conductor pattern, 11d is a second electrode, 16a
˜16c is a through hole, and 17a is a copper foil.

The difference from the configuration of the first embodiment is that the conductor layer 17b formed by copper plating is a conductor layer 17d formed by a filling method of a conductive paste, and the first printed wiring board 1
In place of the copper clad laminate used to form the second and second printed wiring boards 13, a first insulating substrate 12a, a second insulating substrate 12b and a third insulating substrate 12c laminated with a film 12d. By using a combination of the second insulating substrate 12b and the copper foil 17a.
And the point where the first printed wiring board 13b is formed using the first copper-clad insulating substrate 13a after forming the copper foil and the copper foil 17a.
And the first insulating substrate 12a and the first printed wiring board 13b
The second copper-clad insulating substrate 13c is formed by the combination of the second copper-clad insulating substrate 13c and the third insulating substrate 12c, and the second printed wiring board 13d is formed using the second copper-clad insulating substrate 13c.

The operation of the inductance element configured as above and the method of manufacturing the same will be described below with reference to FIG.

First, a first insulating substrate 12a, a second insulating substrate 12b and a third insulating substrate made of a prepreg obtained by impregnating a glass cloth with an epoxy resin and polymerizing the epoxy resin in a semi-cured state. A film made of polyester resin is vacuum laminated on both sides of 12c, and then a through hole 16 having a predetermined diameter is formed by means of NC drilling machine and drill or laser light such as carbon dioxide gas or excimer.
a, 16b and 16c are formed.

Next, predetermined through holes 16a, 16b formed in the first insulating substrate 12a, the second insulating substrate 12b, the third insulating substrate 12c, and the film 12d are formed by means of a screen printing method or the like. 16c is filled or coated with a conductive paste composed of granular copper and epoxy resin to form a conductor layer 17d, and then, as shown in FIG.
As shown in (b), the film 12d is peeled or removed to form the first insulating substrate 12a, the second insulating substrate 12b, and the third insulating substrate 12c.

The film 12d is peeled or removed,
After arranging the copper foils 17a having a thickness of 35 μm on both surfaces of the second insulating substrate 12b on which the conductive layer 17d is formed by filling or applying the conductive paste into the through holes, a predetermined pressure is applied by a vacuum heat press machine or the like. Stacked by temperature and time, Fig. 5
As shown in (c), the first copper-clad insulating substrate 13a is obtained.

Next, the first copper-clad insulating substrate 13a is formed on the first copper-clad insulating substrate 13a by means such as a photo-developing method or a screen printing method using a mask film or a screen plate produced from the production master films 19b and 19c shown in FIG. An etching resist having a predetermined pattern is formed, the exposed copper foil 17a on the non-etching resist forming surface is removed by etching with a solution such as cupric chloride, and the etching resist is peeled off, as shown in FIG. 5 (d). Thus, the first printed wiring board 13b is obtained in which the first conductor pattern 11b, the second conductor pattern 11c, and the conductor layer 17d filled with the conductive paste are formed on the first copper-clad insulating substrate 13a.

Next, the copper foil 17a having a thickness of 35 μm and the first
Insulating board 12a, first printed wiring board 13b, and third
After assembling the insulating substrate 12c and the copper foil 17a as shown in FIG. 5 (e), a pressure of about 2 is applied by a vacuum heat press machine.
Up to 4 × 10 ⁴ Pa and a temperature of 150 to 180 ° C., the layers are laminated while applying pressure and heat, and the second layer is formed as shown in FIG.
Forming a copper clad insulating substrate 13c.

Next, the laminated second copper-clad insulating substrate 13
On c, an etching resist having a predetermined pattern is formed by means such as a photo-developing method or a screen printing method using a mask film or a screen plate produced from the production master films 19a and 19d shown in FIG. The copper foil 17a exposed on the non-etching resist forming surface is removed by etching with a solution of copper or the like, the etching resist is removed, and the first electrode is formed on the second copper clad insulating substrate 13c as shown in FIG. 5 (g). 11a and the second electrode 11d
Thus, the second printed wiring board 13d in which is formed is obtained.

Next, on the second printed wiring board 13d, a solder resist layer is formed on the surface of the second printed wiring board 13d except for the predetermined portions of the first electrode 11a and the second electrode 11d, and after undergoing outer shape processing and the like. , Second printed wiring board 13d
An inductance element is formed inside.

In the present embodiment, the first conductor pattern 11
When the conductor width of b and the second conductor pattern 11c is 0.05 mm, the conductor gap is 0.05 mm, the number of turns is 3, and the thickness of the second printed wiring board 13d is about 1 to 2 mm, the first implementation It was possible to realize an inductance element having a low inductance value similar to the example.

As described above, according to this embodiment, after the adhesive sheet and the film are laminated on both surfaces of the insulating substrate,
A step of forming a through hole, a step of filling or applying a conductive paste into the through hole, peeling the film to form a first insulating substrate and a second insulating substrate, and both surfaces of the second insulating substrate A step of forming a first copper-clad insulating substrate by compressing and laminating copper foil on the copper foil, and etching the copper foil on both surfaces of the first copper-clad insulating substrate to form a spiral first conductor pattern and a second conductor pattern. A step of forming a first printed wiring board having a conductor pattern, compressing and laminating a copper foil, a first insulating substrate, a first printed wiring board, a second insulating substrate and a copper foil, The step of forming the copper-clad insulating substrate and the step of etching the copper foil on both surfaces of the second copper-clad insulating substrate to form the first electrode and the second electrode For high frequency without the need for forming a conductor layer or copper clad laminate An inductance element having a low inductance value that can be used Te can be implemented simultaneously with the printed wiring board of the resin system.

(Embodiment 4) FIG. 6 is a perspective view and a sectional view showing an inductance element body and a method of manufacturing the same according to a fourth embodiment of the present invention.

In FIG. 6, reference numeral 11 is an inductance element having the same configuration as that of FIG. The difference from the configuration of FIG. 1 is that non-through holes 16f are formed in the first electrode 11a and the second electrode 11d, and the inductance element 11 is divided into individual pieces from the third printed wiring board 14, and at the same time as division. The point is that after forming the notch 20 at one corner of the individual piece, the individual inductance element 11 is used as one block and a plurality of pieces are connected by the solder 21 to form the inductance element 22.

The operation of the inductance element constructed as above and the method of manufacturing the same will be described with reference to FIG.

First, as shown in FIG. 6A, the inside of the third printed wiring board in which the non-penetrating holes 16f are formed in predetermined portions of the first electrode 11a and the second electrode 11d of the inductance element 11 is used as a mold or The inductance element 11 is divided using a means such as laser light to form the individual inductance element 11. When forming the individual pieces of the inductance element 11, as shown in FIG. 6B, a notch 20 is formed at one corner of the individual pieces.

Next, the first electrode 11a and the second electrode portion 11d
Into the non-through hole 16f, a spherical solder 21 having a diameter substantially the same as that of the non-through hole 16f and having a volume about twice that of the non-through hole 16f is press-fitted, and as shown in FIG. 6 (b). While arranging the first electrode 11a of the first inductance element and the second electrode 11d of the second inductance element so that their cutouts 20 are in the same direction, and irradiating the spherical solder 21 with laser light, The solder 21 is melted, the first inductance element and the second inductance element are solder-joined, and as shown in FIG.
Form 2.

In this embodiment, the conductor width of the first conductor pattern 11b and the second conductor pattern 11c formed on the third printed wiring board 14 is 0.05 mm, and the conductor gap is 0.
When the number of turns is 05 mm, the number of turns is 3, and the thickness of the third printed wiring board 14 is about 1 to 2 mm, the inductance element 22 having a low inductance value of 7 to 20 nH can be realized.

As described above, according to this embodiment, different low inductance values that can be used for high frequencies can be obtained by making the first electrode and the second electrode of a plurality of inductance elements face each other and connecting them. It is possible to easily realize an inductance element body having

In the first and second embodiments, the copper clad laminates constituting the first printed wiring board and the second printed wiring board are glass cloth epoxy resin copper clad laminates. However, the copper-clad laminate may be a glass non-woven composite copper-clad laminate or a paper-based phenolic resin copper-clad laminate, and the prepreg forming the insulating layer 15a is made of glass cloth impregnated with epoxy resin. However, a bonding sheet made of an adhesive may be used.

Further, in the prepreg constituting the first insulating substrate, the second insulating substrate and the third insulating substrate in the third embodiment, glass cloth is impregnated with epoxy resin and the epoxy resin is semi-cured. I used what was polymerized in the state,
Prepreg is aramid fiber impregnated with epoxy resin,
Impregnate laminated materials and paper base materials with phenolic resin,
An adhesive sheet composed of a phenol butyral resin may be laminated on both sides.

Further, in the first embodiment, the second embodiment and the third embodiment, copper foils having a thickness of 18 μm and 35 μm were used, but the copper foil having a thickness of 9 to 70 μm was used. Although copper foil may be used and the inductance element has a four-layer structure, it is needless to say that the invention is not limited to this.

[0063]

As described above, according to the present invention, the first printed wiring board having the first electrode on the front surface and the spiral first conductor pattern on the back surface, and the spiral second conductor pattern on the front surface are provided. A second printed wiring board having second electrodes formed on the back surface thereof, and at least the first printed wiring board and the second printed wiring board are laminated with an insulating layer interposed between the first printed wiring board and the first electrode. A configuration in which the outer peripheral end of the conductor pattern, the inner peripheral end of the first conductor pattern and the inner peripheral end of the second conductor pattern, the outer peripheral end of the second conductor pattern and the second electrode are electrically connected, respectively, and the first conductor pattern and the first conductor pattern A structure in which two conductor patterns are laminated so as not to overlap each other in the laminating direction, and a plurality of inductance elements each having an inductance element as one block, and the first electrode and the second electrode of adjacent inductance elements are opposed to each other, The configuration of connection enables the combination of each other inductance element can easily realize a plurality of low inductance.

Further, it becomes difficult for capacitors to be formed in the overlapping portions of the first conductor pattern and the second conductor pattern, and the signal level is less likely to be attenuated even when used for high frequencies, and at the same time when the resin-based printed wiring board is manufactured. It is possible to realize an excellent inductance element that can be formed.

[Brief description of drawings]

FIG. 1A is an exploded perspective view of an inductance element according to each embodiment of the present invention. FIG. 1B is a sectional view of the inductance element.

FIG. 2A is a perspective view of a master film in a method for manufacturing an inductance element according to each embodiment of the present invention. FIG. 2B is a top view of a master film in a method for manufacturing the inductance element.

FIG. 3 is a sectional view in each manufacturing process of the inductance element according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view in each manufacturing process of the inductance element according to the second embodiment of the present invention.

FIG. 5 is a cross-sectional view in each manufacturing process of the inductance element according to the third embodiment of the present invention.

FIG. 6 is a perspective view in each manufacturing process of the inductance element according to the fourth embodiment of the present invention.

FIG. 7A is an exploded perspective view of a conventional inductance element, and FIG. 7B is a sectional view of the same inductance element.

[Explanation of symbols]

 11 Inductance Element 11a First Electrode 11b First Conductor Pattern 11c Second Conductor Pattern 11d Second Electrode 12 First Printed Wiring Board 13 Second Printed Wiring Board 14 Third Printed Wiring Board 15a Insulating Layers 16a, 16b, 16c Through hole

Claims (9)

[Claims] 1. A first printed wiring board having a first electrode on the front surface and a spiral first conductor pattern on the back surface, and a first printed wiring board having a spiral second conductor pattern on the front surface and a second electrode on the back surface. Two printed wiring boards, and at least the first
The printed wiring board and the second printed wiring board are laminated with an insulating layer in between, and the first electrode and the outer peripheral edge of the first conductor pattern,
An inductance element, characterized in that the inner peripheral edge of the first conductor pattern and the inner peripheral edge of the second conductor pattern, and the outer peripheral edge of the second conductor pattern and the second electrode are electrically connected, respectively. 2. The inductance element according to claim 1, wherein the first conductor pattern and the second conductor pattern are laminated so as not to overlap each other in the laminating direction. 3. The inductance element according to claim 1, wherein the conductor thickness of the first conductor pattern and the second conductor pattern is larger than the conductor width. 4. A first printed wiring board having a first electrode on the front surface and a spiral first conductor pattern on the back surface, and a first printed wiring board having a spiral second conductor pattern on the front surface and a second electrode on the back surface. Two printed wiring boards, and at least the first
The printed wiring board and the second printed wiring board are laminated with an insulating layer in between, and the first electrode and the outer peripheral edge of the first conductor pattern,
A plurality of elements, each of which is characterized in that the inner peripheral edge of the first conductor pattern and the inner peripheral edge of the second conductor pattern, and the outer peripheral edge of the second conductor pattern and the second electrode are electrically connected, respectively. An inductance element composed of elements, in which the first electrode and the second electrode of the adjacent elements are opposed to each other and connected. 5. The inductance element according to claim 5, wherein each element is connected via solder between the first electrode and the second electrode of the adjacent inductance element. 6. The inductance element according to claim 5, wherein each element is connected between the first electrode and the second electrode of the adjacent inductance element via a conductive adhesive. 7. A spiral shape is formed by forming a through hole in the first printed wiring board, forming a conductor layer on the entire surface of the first printed wiring board, and then removing a part of the conductor layer on the back surface of the first printed wiring board. And the step of forming a through hole in the second printed wiring board to form a conductor layer on the entire surface of the second printed wiring board, and then forming a conductor layer on the surface of the second printed wiring board. A step of removing a part to form a spiral second conductor pattern; and a prepreg between the first conductor pattern surface of the first printed wiring board and the second conductor pattern surface of the second printed wiring board. A step of forming a third printed wiring board by disposing and stacking, and a step of forming a through hole in the third printed wiring board and then forming a conductor layer on the entire surface of the third printed wiring board. , The surface of this third printed wiring board A part of the conductor layer is removed to form a first electrode, and a part of the conductor layer on the back surface is removed to form a second electrode. 8. A step of forming a first electrode on a front surface of a first printed wiring board and a spiral first conductor pattern on a back surface thereof,
A step of forming a spiral second conductor pattern on the front surface of the second printed wiring board and a second electrode on the back surface; and a step of forming the first conductor pattern surface of the first printed wiring board and the second printed wiring board. A step of forming a third printed wiring board by arranging and stacking a prepreg between the second conductor pattern surface and a step of forming a through hole and a non-through hole in the third printed wiring board; And a step of filling or applying a conductive paste into predetermined through holes and non-through holes formed in the third printed wiring board. 9. A step of laminating an adhesive sheet and a film on both sides of an insulating substrate and then forming a through hole, and a step of filling or applying a conductive paste into the through hole of the insulating substrate and then peeling off the film. A step of forming an insulating substrate, a second insulating substrate and a third insulating substrate, and a first step by compressing and laminating copper foil on both surfaces of the second insulating substrate.
Forming a copper-clad insulating substrate, and etching the copper foils on both surfaces of the first copper-clad insulating substrate to form a spiral first surface.
A step of forming a first printed wiring board having a second conductor pattern in a spiral shape on the back surface of the conductor pattern; copper foil, a first insulating substrate, a first printed wiring board, a third insulating substrate and copper A step of forming a second copper-clad insulating substrate by compressing and laminating the foils in this order, and etching the copper foils on both sides of the second copper-clad insulating substrate to form a first electrode on the front surface and a first electrode on the back surface. And a step of forming two electrodes.