JPH07201718A - Heat treatment apparatus and heat treatment method - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The contact area between the mounting table on which the substrate is mounted and the substrate is reduced to reduce the peeling electrification phenomenon when the substrate is transported from the mounting table and to reduce the amount of fine dust. In addition to preventing adhesion, it is also possible to prevent damage to the element due to discharge, etc., to improve product yield, and to prevent misalignment, damage, and drop of the board when delivering it, and to perform uniform heat treatment. I do. In a heat treatment apparatus for mounting a substrate and controlling the temperature of the substrate, a mounting table 60 for mounting the substrate, and a heating element 62 for supplying heat to the substrate via the mounting table 60,
A support pin 70 for supporting the substrate is provided, and a groove 71 is provided on the surface of the mounting table 60.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus and a heat treatment method.

[0002]

2. Description of the Related Art Generally, in the manufacturing process of semiconductor devices and LCDs, a photoresist is applied to a silicon substrate or an LCD substrate (glass substrate), and a circuit pattern or the like is reduced by using a photolithography technique and transferred to the photoresist. Then, a series of processes for developing this is performed.

Since the processing apparatus in the above manufacturing process is installed and used in a clean room in which purified air is downflowed from above, the inside of the loading / unloading mechanism and the processing mechanism unit constituting this processing apparatus are compared. LC which is an object to be processed in a relatively low humidity atmosphere
Since the D substrate (hereinafter simply referred to as the substrate) is glass in terms of electric conductivity, the substrate is easily charged during the processing.

[0004]

However, when the substrate is charged and static electricity is generated, fine dust adheres to the surface of the substrate, which not only lowers the product yield, but also
There is a problem that substrate contamination occurs. In addition, there is a problem in that the static electricity charged on the substrate causes discharge during the transportation of the substrate, the element formed on the substrate surface is destroyed by the discharge, and precision instruments such as sensors malfunction. Furthermore, there is a risk that the substrate may be attracted to the mounting table or the like by static electricity, and the substrate may be displaced, broken, or dropped when the substrate is delivered.
There is also a problem that it interferes with the continuous processing of the substrate.

The present invention has been made in view of the above circumstances, and an object thereof is a peeling electrification phenomenon when a substrate is conveyed from a mounting table by reducing a contact area between the mounting table on which the substrate is mounted and the substrate. To prevent the adhesion of fine dust and to prevent the destruction of elements due to electric discharge to improve the product yield, and also to prevent the misalignment, damage, and drop of the board during the delivery of the board. An object of the present invention is to provide a heat treatment apparatus and a heat treatment method capable of preventing the heat treatment and performing uniform heat treatment.

[0006]

According to a first aspect of the present invention, in a heat treatment apparatus on which a target object is placed and the temperature of the target object is controlled, a mounting table on which the target object is mounted, and the mounting table. It is characterized in that it comprises a heating element for supplying heat to the object to be processed through the above, and a supporting means for supporting the object to be processed, and the surface of the mounting table is constituted by a rough surface.

According to a second aspect of the present invention, in a heat treatment apparatus that mounts an object to be processed and controls the temperature of the object to be processed, a mounting table on which the object to be processed is mounted, and an object to be processed through the mounting table. It is characterized in that it is provided with a heating element for supplying heat to the substrate and a supporting means for supporting the object to be treated, and that the surface of the mounting table is subjected to a tough lam treatment.

According to a third aspect of the present invention, in a heat treatment apparatus that mounts an object to be processed and controls the temperature of the object to be processed, a mounting table on which the object to be processed is mounted, and an object to be processed through the mounting table. A heating element for supplying heat to the object and a supporting means for supporting the object to be processed, and a groove is provided on the surface of the mounting table to reduce the contact area between the surface of the mounting table and the object to be processed. Characterize.

According to a fourth aspect of the present invention, when the object to be processed is mounted and the temperature of the object to be processed is controlled, the mounting table on which the object to be processed is mounted, and the object to be processed are heated via the mounting table. It is characterized in that the contact area between the surface of the mounting table and the object to be treated is reduced and the heat treatment is performed uniformly by the heating element for supplying the heat treatment and the support for supporting the object to be treated.

[0010]

According to the present invention, the surface of the mounting table is made rough, or toughened, or provided with a groove.
By reducing the contact area between the object to be processed and the mounting table, it is possible to prevent generation of static electricity due to peeling charging.

[0011]

Embodiments of the present invention will be described in detail below with reference to the drawings. When performing such processing, the processing system shown in FIG. 1 is used. This system includes a loader section 40 for loading and unloading a substrate G as an object to be processed,
A brush cleaning device 42 for cleaning the substrate G with a brush;
Water washing device 44 for washing water with high pressure jet water
An adhesion treatment device 46 for hydrophobicizing the surface of the substrate G, a cooling treatment device 48 for cooling the substrate G to a predetermined temperature, a resist coating device 50 for coating a resist liquid on the surface of the substrate G, and a resist liquid coating device. Heat treatment apparatus 5 for pre-baking or post-baking by heating the substrate G before and after
2 and the resist removing device 54 for removing the resist on the peripheral portion of the substrate G, the developing device 55 and the like are assembled to improve the work efficiency.

Further, the respective processing units are stacked in multiple stages, for example, the resist processing units 50 are arranged in upper and lower two stages (not shown) to reduce the installation area and effectively use the space in the clean room. A filter is provided above the processing system to prevent particles from adhering to each processing device and substrate G in the processing system.

A substrate transfer path 56 is provided along the longitudinal direction in the central portion of the processing system configured as described above, and the substrate transfer path 56 has the central extension portion 5.
Divided by 7. This extension part 57 is removable and has the effect of facilitating maintenance of the processing system. The devices 40 to 54 are arranged on the substrate transfer path 56 with their front sides facing each other, and a substrate transfer mechanism 58 for transferring the substrate G to and from the devices 40 to 54 is movably provided along the substrate transfer path 56. Has been. This substrate transfer mechanism 58
Has an arm 59 for holding the substrate G by vacuum suction or the like. For example, two arms 59 are arranged above and below, the support base is provided in a U-shaped double structure, and it can be independently moved to the substrate mounting position of each of the devices 40 to 54 by the moving mechanism. There is.

In the resist coating and developing apparatus, for example, the substrate G is taken out one by one from a cassette (not shown), which stores the unprocessed substrate G provided in the loader section 40, and the brush cleaning device 42 and the jet water are sequentially provided. Cleaning device 44, adhesion processing device 46, cooling processing device 48, resist coating device 50, resist removing device 54, heat treatment device 52 for pre-baking, exposure device (not shown), developing device 55, heat treatment device 52 for post-baking. The processed substrate G is transported to the substrate and processed, and the processed substrate G is stored in a cassette (not shown) provided in the loader unit 40.

In the above resist coating and developing apparatus,
Adjacent brush cleaning device 42 and jet water cleaning device 4
4, and resist coating device 50 and resist removing device 54
Since the substrate G is transferred between the adjacent processing apparatuses independently of the substrate transfer mechanism 58 that moves along the substrate transfer path 56, throughput is increased and work efficiency is increased, and the substrate transfer mechanism is also increased. Substrate G being transferred by 58
It is also very effective in preventing damage to the substrate and preventing contamination of the substrate transport path 56 and the like.

Next, the case where the processing apparatus of the present invention is applied to the heat processing apparatus used in the resist coating and developing apparatus for the LCD substrate shown in FIG. 1 will be described. 2 is a schematic perspective view of a heat treatment apparatus according to an embodiment of the present invention, FIGS. 3 and 4 are cross-sectional views of the heat treatment apparatus of FIG. 2, and FIG. 5 is a cross-sectional view of essential parts of the heat treatment apparatus of FIG. Has been done.

The heat treatment device 52 is provided as a block body in which a plurality of heat treatment devices 52 facing the substrate transport path 56 and having an opening 52A are stacked in multiple stages.
And a plurality of blocks are arranged in parallel.

Then, each heat treatment apparatus 52 supplies heat to the substrate G via the mounting table 60 on which the substrate G is mounted and the mounting table 60, as shown in FIGS. 2, 3 and 4, for example. A heating element 62 having a built-in heater, a cover member 66 arranged to form a processing space 64 above the substrate G and exhausting gas generated during the heat treatment, a mounting table 60 and the heating element 62. A main portion is configured by the support pins 70 that pass the substrate G above the mounting table 60 by vertically inserting the plurality of through holes 68.

In this case, the mounting table 60 is formed of a rectangular aluminum alloy plate having good thermal conductivity,
The surface of the mounting table 60 is roughened by performing the tough ram treatment with the aluminum oxide film and providing the groove 71. On the other hand, the heating element 62 is configured by embedding a heater inside a plate made of an aluminum alloy having substantially the same plane size as the mounting table 60.

In the heat treatment device 52 shown in FIG.
By fixing the support pin 70 side, the mounting table 60 and the heating element 62 can be moved by the piston 74 of the lifting cylinder 72,
The support pins 70 are made to appear and disappear on the mounting table 60. On the other hand, in the heat treatment device 52 shown in FIG. 4, the mounting table 60 and the heating element 62 are fixed, and the support pin 70 is connected to the piston 78 of the cylinder 76 so that the mounting table 60 can be retracted. Note that, in FIG. 4, a cylindrical shutter 80 is arranged so as to be able to move up and down on the outer peripheral portion of the mounting table 60. This shutter 80 includes a shutter raising / lowering cylinder 82.
Of the processing space 64 is connected to the piston 84 of FIG.

As shown in FIG. 6, spacers 85 for avoiding contact between the substrate G and the mounting table 60 are provided on the upper surface of the mounting table 60 along the periphery of the mounting position of the substrate G. . The spacer 85 is made of a flat oval ceramic plate piece, and a mounting screw 86 is inserted into a through hole formed at one end of the spacer 85, and the mounting screw 86 is screwed into a screw hole 87 formed on the upper surface of the mounting table 60. It is mounted on the mounting table 60 by. Note that FIG. 6 shows an example in which the grooves 71 are concentrically provided as a second embodiment.

Next, the operation of the heat treatment device 52 configured as described above will be described. First, as shown in FIG. 2, the mounting table 60 is moved by the transfer arm 59 of the transfer mechanism 58.
The substrate G conveyed above is transferred to the raised support pins 70 and is placed on the spacers 85 on the upper surface of the mounting table 60 by the lowering of the support pins 70. Next, a shutter (not shown) is driven to partition the processing unit from the outside. In the processing section, heat from the heating element 62 is transferred to the mounting table 60,
It is transmitted from the upper surface of the mounting table 60 to the substrate G. In this case, the heat transfer from the heating element 62 to the mounting table 60 is achieved by the heat conduction by direct contact between the aluminum alloys having good thermal conductivity, so that the heat transfer efficiency is extremely good, and the heat transfer efficiency of the mounting table 60 is high. Since it is formed through the entire contact surface between the lower surface and the upper surface of the heating element 62, the entire mounting table 60 is uniformly heated. Therefore, the temperature distribution of the heat transferred from the heating element 62 to the substrate G via the mounting table 60 becomes uniform, and the substrate G is uniformly heat-treated. When mounting the mounting table 60, a good thermal conductor such as silicon grease may be applied to the lower surface of the mounting table 60 so that a good thermal conductor is interposed between the mounting table 60 and the heating element 62.

The substrate G that has been heat-treated has support pins 70.
Is lifted away from the mounting table 60. At this time, if the surface of the mounting table 60 is smooth, the substrate G made of glass that is easily charged is charged with static electricity due to peeling charging from the surface of the mounting table 60, and tends to be attracted to the surface of the mounting table 60. As a result, the substrate G may be displaced, damaged, or dropped, but since the groove 71 is provided on the surface of the mounting table 60 within the range of maintaining the temperature uniformity, the substrate G is supported by the support pins 7.
The mounting table 60 does not become charged with static electricity due to the rise of 0.
Can be more separated.

The groove 71 is not limited to the parallel line shape and the concentric circle shape shown in the first and second embodiments, but may be a spiral shape or the like as long as the temperature of the surface of the mounting table 60 is kept uniform. It does not matter even if it is a form. Further, since the purpose is to make the surface rough, the shape of the surface may be provided with holes or projections may be provided as long as the surface of the mounting table 60 maintains the temperature uniformity. Alternatively, it may have another shape.

Further, supplying N2 gas or the like from a gas supply source (not shown) through the gap between the through-hole 68 and the support pin 70 is also effective in preventing generation of static electricity due to peeling charging. Further, an ion supply source is provided in the heat treatment device 52, and ions are ion-supported from the electrode protruding from the lower surface of the emitter bar (not shown) installed in the cover member 66 on the mounting table 60 by the support pins 70. You may make it irradiate. In particular, in the case of such a heat treatment device 52, charging becomes easier, and after the heat treatment, the mounting table 6
When the substrate G is supported and lifted by the support pins 70 from 0, the substrate G tilts or is discharged when being sucked by the mounting table 60, and thus the substrate to be processed is configured by such a configuration. Removing static electricity charged before and after the G treatment is also effective in preventing static electricity from occurring.

In the above embodiments, the case where the object to be processed is the LCD substrate has been described, but the object to be processed is not necessarily limited to the LCD substrate, and can be applied to, for example, a semiconductor substrate which is similarly heat-treated. Is.

In the above embodiment, the case where the processing apparatus is applied to the resist coating / developing apparatus has been described, but it is needless to say that the present invention can be applied to an apparatus for performing etching liquid coating processing or magnetic liquid coating processing, for example. is there.

[0028]

According to the present invention, the surface of the mounting table is made rough, or the tough ram treatment is performed, or the groove is provided, and the contact area between the object to be processed and the mounting table is reduced. It is possible to prevent the occurrence of heat generation, and to uniformly perform the heat treatment without causing damage or destruction of the object to be processed due to the peeling electrification phenomenon when the object to be processed placed on the mounting table is conveyed. It is also possible to prevent particles from adhering to the object to be processed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a processing system to which a processing apparatus of the present invention is applied.

FIG. 2 is a schematic perspective view of an embodiment of the processing apparatus of the present invention.

3 is a cross-sectional view of the heat treatment apparatus of FIG.

FIG. 4 is a sectional view of the heat treatment apparatus of FIG.

FIG. 5 is a cross-sectional view of essential parts of the processing apparatus of the present invention.

FIG. 6 is a plan view of an essential part showing another embodiment of the processing apparatus of the present invention.

[Explanation of symbols]

 G substrate 52 heat treatment device 59 arm 60 mounting table 62 heating element 66 cover member 68 through hole 70 support pin 71 groove 85 spacer

Claims (4)

[Claims] 1. In a heat treatment apparatus for mounting an object to be processed and controlling the temperature of the object to be processed, a mounting table on which the object to be processed is mounted, and heat is supplied to the object to be processed through the mounting table. A heat treatment apparatus comprising a heating element and a supporting means for supporting an object to be processed, wherein the surface of the mounting table is a rough surface. 2. A heat treatment apparatus which mounts an object to be processed and controls the temperature of the object to be processed, and a mounting table on which the object to be processed is mounted, and heat is supplied to the object to be processed through the mounting table. A heat treatment apparatus comprising a heating element and a supporting means for supporting an object to be processed, wherein the surface of the mounting table is subjected to a tough lam treatment. 3. A heat treatment apparatus which mounts an object to be processed and controls the temperature of the object to be processed, and a mounting table on which the object to be processed is mounted, and heat is supplied to the object to be processed through the mounting table. A heat treatment apparatus comprising a heating element and a support means for supporting the object to be processed, wherein a groove is provided on the surface of the table to reduce the contact area between the surface of the table and the object to be processed. . 4. A mounting table on which the object to be processed is mounted when mounting the object to be processed and controlling the temperature of the object to be processed, and a heating element for supplying heat to the object to be processed through the mounting table. And a support for supporting the object to be processed, wherein the contact area between the surface of the mounting table and the object to be processed is reduced and the heat treatment is performed uniformly.