JPH07201923A - Bonding method and apparatus - Google Patents

Abstract

(57) [Abstract] [Purpose] To securely bond two electronic components [Configuration] The connection terminal 22 of the printed wiring board 21 and the outer lead 25 of the TAB board 23 are superposed on each other on the stage 11 via solder. , The overlapped portion is pressed by a strained linear deformable pressing member 13,
In this state, the hot air of the air heater 27 is blown onto the solder through the outer lead holes 24, and the connection terminals 22 and the outer leads 25 are bonded via the solder. In this case, since the strained linear pressing member 13 can be deformed, even if the printed wiring board 21 or the TAB board 23 is warped or the parallelism and the flatness are bad, it is necessary to cope with this. Therefore, the printed wiring board 2
1 and the TAB substrate 23 can be reliably bonded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method and apparatus for bonding two electronic components to each other.

[0002]

2. Description of the Related Art When two electronic components such as a printed wiring board and a TAB board are bonded to each other, a bonding apparatus as shown in FIG. 4 (A) may be used. This bonding apparatus includes a stage 1 and a holding block 2 arranged on the stage 1 so as to be vertically movable. The holding block 2 is formed of metal, resin, or the like into a rectangular plate shape, and is movable up and down by driving a driving source (not shown). Note that, as shown in FIG. 4A, the joining portion of the TAB substrate 3 is composed of a plurality of outer leads 5 spanning the outer lead hole 4. On the other hand, although not shown, the joint portion of the printed wiring board 6 is composed of a plurality of connection terminals formed on the printed wiring board 6 corresponding to the outer leads 5 of the TAB board 3.

Next, a bonding method for bonding the printed wiring board and the TAB board to each other using a bonding apparatus will be described with reference to FIG. 4 (A). First, the printed wiring board 6 is arranged at a predetermined location on the upper surface of the stage 1, and then the outer leads 5 of the TAB board 3 are aligned and arranged on the upper surfaces of the connection terminals of the printed wiring board 6. In this case, the connection terminals of the printed wiring board 6 and the outer leads 5 of the TAB board 3
Solder (not shown) is applied to either one of them in advance. Next, the pressing block 2 is moved up and down by driving the driving source, the predetermined upper surface of the TAB board 3 is pressed by the lower surface of the pressing block 2, and the TAB board 3 is pressed by the upper surface of the printed wiring board 6. Then, in this state, hot air of an air heater (not shown) is blown to the solder portion through the outer lead hole 4 to heat the solder. As a result, the solder is melted, and then cooled and solidified, so that the connection terminals of the printed wiring board 6 and the outer leads 5 of the TAB board 3 are bonded to each other via the solder.
In this case, the rectangular plate-shaped pressing block 2 for pressing the TAB substrate 3 needs to have a certain thickness. Therefore, when the outer lead 5 portion of the TAB substrate 3 is directly pressed by the holding block 2, the holding block 2 blocks the outer lead hole 4 and hot air cannot be blown to the solder portion. That is, the solder portion is heated via the pressing block 2, and the heating efficiency is deteriorated.
Further, since the holding block 2 is formed in a rectangular plate shape, the holding block 2 occupies the space above the TAB substrate 3 and interferes with the bonding work, resulting in poor workability. Therefore, the holding block 2 holds the portion of the TAB substrate 3 apart from the portion of the outer lead hole 4.

[0004]

However, as shown in FIG.
As shown in (B), when the TAB substrate 3 is warped, the corners thereof float and the TAB substrate 3 cannot be reliably bonded to the upper surface of the printed wiring board 6, resulting in defective bonding. There was a problem. On the other hand, FIG.
As shown in FIG. 5A, when the lower surface of the presser block 2 has poor parallelism, or as shown in FIG.
Even if the flatness of the lower surface is poor, the TAB substrate 3 cannot be reliably bonded to the upper surface of the printed wiring board 6, resulting in a problem of defective bonding. An object of the present invention is to provide a bonding method and apparatus that can reliably bond two electronic components.

[0005]

SUMMARY OF THE INVENTION According to the present invention, bonding portions of two electronic components are superposed on each other, and the superposed portions are pressed and bonded by a strained linear deformable pressing member. Is.

[0006]

According to the present invention, since the strained linear pressing member is deformable, the electronic component may be warped,
Even if the parallelism or the flatness is poor, this can be dealt with, and thus the two electronic components can be reliably bonded.

[0007]

1 to 3 show respective steps of a bonding method in an embodiment of the present invention.
Therefore, in order to describe the bonding method with reference to these figures in order, first, the bonding apparatus used in this bonding method will be described. This bonding apparatus includes a stage 11, a support member 12 arranged on the stage 11 so as to be vertically movable, and a holding member 13 stretched on a lower end portion of the support member 12. The support member 12 has side surfaces opposed to each other at a predetermined distance, has an upper surface between upper end portions of both side surfaces, and is formed in a side surface U shape. The support member 12 can be moved up and down by driving a drive source such as an air cylinder (not shown). The pressing member 13 is formed in a linear shape from metal, glass, or the like, and both ends thereof are attached between the lower ends of both side surfaces of the supporting member 12 so as to be strained and deformable.

Next, a bonding method for bonding, for example, a printed wiring board and a TAB board using this bonding apparatus will be described. here,
The joint portion of the printed wiring board 21 is the printed wiring board 2
It is a plurality of connection terminals 22 formed at one predetermined location. Further, the joining portion of the TAB substrate 23 is a plurality of outer leads 25 laid over the outer lead hole 24 formed at a predetermined position, and corresponds to the connection terminal 22 of the printed wiring board 21. Then, in order to bond the bonding portions to each other, first, as shown in FIGS. 1A and 1B, the printed wiring board 21 is arranged at a predetermined position on the stage 11. In this case, paste-like solder (not shown) is previously applied on the connection terminals 22 by printing or the like. Next, the TAB board 23 is arranged on the printed wiring board 21. In this case, the outer leads 25 of the TAB board 23 are aligned with the connection terminals 22 of the printed wiring board 21. Next, the pressing member 13 is aligned and arranged above the TAB substrate 23.
An anisotropic conductive adhesive or the like may be applied on the connection terminals 22 of the printed wiring board 21 instead of solder.

Next, the pressing member 13 is moved up and down by driving a driving source such as an air cylinder to press the pressing member 13 against a predetermined upper surface of the TAB substrate 23 as shown in FIG. TA on the connection terminal 22 of the substrate 21
The outer lead 25 of the B board 23 is pressed down. And
In this state, the hot air of the air heater 27 as shown in FIG. 1B is blown to the solder portion through the outer lead holes 24 to heat the solder. The temperature of hot air is 300 to 4
The temperature is about 00 ° C. As a result, the solder is melted, and then cooled and solidified, so that the connection terminals 22 of the printed wiring board 21 and the outer leads 2 of the TAB board 23 are melted.
5 and 5 are bonded to each other via solder. In this case, since the tensioned pressing member 13 is deformed according to the upper surface of the TAB substrate 23, even if the TAB substrate 23 is warped or has a poor flatness, the two substrates 21, 23 are surely bonded. It Also, as shown in FIG.
Even if the pressing member 13 and the substrates 21 and 23 have poor parallelism, the pressing member 13 is deformed according to the upper surface of the TAB substrate 23, so that the substrates 21 and 23 can be reliably bonded.
Further, since the pressing member 13 is formed in a linear shape, T
It does not occupy the space above the AB substrate 23, does not interfere with the heating work, and does not impair the workability. Further, since the pressing member 13 is formed in a linear shape, it does not block the outer lead holes 24, and even if the hot air of the air heater 27 is hit, the heat loss is small and the heating efficiency is not impaired.

As described above, in the bonding method of this embodiment, since the strained linear pressing member 13 can be deformed, the printed wiring board 21 and the TAB board 23 are warped, the parallelism and the flatness are flattened. If it is bad, it can be dealt with, and therefore both boards 21, 2
3 can be surely bonded. Moreover, the pressing member 13 does not interfere with the heating work and does not easily lose heat, so that workability and heating efficiency are not impaired.

Although the pressing member 13 has a linear shape in the embodiment, it may have a band shape as long as it can be deformed in a tensioned linear shape.

[0012]

As described above, according to the present invention, since the strained linear pressing member can be deformed, the electronic component may be warped or the parallelism and flatness may be poor. This can also be dealt with, and thus the two electronic components can be reliably bonded. Moreover, since the pressing member does not interfere with the heating work and heat is less likely to be lost, workability and heating efficiency are not impaired.

[Brief description of drawings]

FIG. 1A is a perspective view shown for explaining a bonding method in an embodiment of the present invention, and FIG.
Sectional drawing which followed the XX line of (A).

FIG. 2 is a sectional view shown for explaining a state in which a pressing member is pressed against a TAB substrate.

FIG. 3 is a cross-sectional view shown for explaining a case where the pressing member and the TAB substrate have poor parallelism.

4A is a perspective view shown for explaining a conventional bonding method, and FIG. 4B is a perspective view shown for explaining a defect when a TAB substrate has a warp.

FIG. 5A is a sectional view for explaining a defect when the pressing block has poor parallelism, and FIG. 5B is a sectional view for explaining a defect when the pressing block has poor flatness.

[Explanation of symbols]

 11 Stage 12 Supporting Member 13 Holding Member 21 Printed Wiring Board (Electronic Component) 22 Connection Terminal (Joining Part) 23 TAB Board (Electronic Part) 25 Outer Lead (Joining Part)

Claims (2)

[Claims] 1. A bonding method, characterized in that the respective joint portions of two electronic components are superposed on each other, and the superposed portions are pressed and bonded by a strained linear deformable pressing member. 2. A stage in which two electronic components are arranged with their respective joints being overlapped with each other, and a strained linear deformable holding member which is arranged so as to be vertically movable on the stage. A bonding apparatus, characterized by comprising: a pressing member for pressing the overlapped portion of the two electronic components arranged on the stage with the pressing member.