JPH07202152A - Solid-state imaging device - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a solid-state image pickup device that can be mounted in a small size as small as a solid-state image pickup element chip including a microlens, which does not include the microlens. [Structure] Only for the light receiving area 2 of the solid-state imaging device chip 1 having the light receiving area 2 including the microlens 3,
The sealing member 4 made of a transparent material integrally formed with the frame portion 4a at the lower surface edge is arranged, and a space of 5 μm or more is formed between the surface of the microlens 3 and the lower surface of the sealing member 4 to hermetically seal. Then, a solid-state imaging device with a microlens mounted in a small size is constructed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device having a solid-state image pickup element chip mounted thereon, and more particularly to a solid-state image pickup device having a solid-state image pickup element chip provided with an on-chip microlens.

[0002]

2. Description of the Related Art Conventionally, a solid-state image pickup device chip with a microlens is mounted as follows. That is, as shown in FIG. 8 or FIG. 9, a solid-state image sensor chip 101 having a microlens 102 provided in a light receiving area is die-bonded to a package 103 or a substrate 104 made of ceramic or the like, and a bonding wire 105 is used to form the solid-state image sensor. After a predetermined connection between the chip 101 and the package 103 or the substrate 104, the stepped portion 1 provided at the edge of the package 103
A space is provided between the element chip 101 and the surface of the element chip 101 by using the 03a or the sealing frame 106, and the glass lid 107 is adhered and hermetically sealed to form a solid-state imaging device. In FIG. 8, 108 indicates a lead.

[0003]

By the way, in a solid-state image pickup device chip having a light-receiving area provided with a microlens, if a protective glass or an optical component such as a filter, a lens or a prism is directly adhered to the surface of the light-receiving area, the adhesion will occur. Since there is a problem that the light collecting ability of the microlens is deteriorated due to the refractive index of the agent, when mounting such a solid-state imaging device chip, the entire solid-state imaging device chip must be hermetically sealed as described above. Absent. Therefore, if the entire solid-state imaging element chip is hermetically sealed, the mounting shape becomes large, and it is necessary to carry out small-sized mounting, especially ultra-small mounting such as a solid-state imaging device arranged in a minute portion such as the tip of an electronic endoscope. It was difficult to apply it to the required fields.

Further, since the microlenses provided in the light receiving area of the solid-state image pickup device chip are made of resin such as acrylic resin, the solid-state image pickup device chip is solid-stated at the time of dicing in order to prevent contamination during dicing. The extra work of coating the image sensor wafer with a protective film and peeling the protective film after dicing has been required.

The present invention has been made in order to solve the above problems in a solid-state image pickup device configured by mounting a conventional solid-state image pickup element chip having a microlens. However, it is an object of the present invention to provide a solid-state image pickup device which has substantially the same size as a solid-state image pickup element chip without a microlens and can be mounted in a small size.

[0006]

In order to solve the above problems, the present invention provides an airtight seal made of a transparent member only in the light receiving area of a solid state image pickup device chip having a light receiving area provided with an on-chip microlens. A solid-state imaging device is configured by providing a stop portion.

Since the airtight sealing portion made of a transparent member is provided only in the light-receiving area on the surface of the solid-state image pickup element chip, the mounting size can be reduced, and the solid-state image pickup particularly suitable for an electronic endoscope is possible. The device can be realized. Further, optical parts such as filters, lenses and prisms can be adhered to the surface of the hermetically sealed portion, and the mounting size can be reduced without deteriorating the light collecting ability of the microlenses. Further, in the wafer state of the solid-state imaging device chip, it is possible to collectively provide an airtight sealing portion for all the chips in the light-receiving area, which eliminates the need for a stain prevention process during dicing.

[0008]

EXAMPLES Next, examples will be described. 1A and 1B are a schematic top view and a sectional view showing a first embodiment of a solid-state imaging device according to the present invention. In the figure, reference numeral 1 denotes a solid-state image pickup device chip, and a microlens 3 is provided in a light receiving area 2 of the solid-state image pickup device chip 1 corresponding to each pixel. 4 is glass, quartz, sapphire,
A sealing member made of a transparent material such as a transparent resin, a frame portion 4a is integrally formed on an edge portion of a lower surface, and only the light receiving area 2 of the solid-state imaging device chip 1 is hermetically sealed, In addition, between the front surface of the microlens 3 in the light receiving area 2 and the back surface of the sealing member 4, it is adhered to the front surface of the solid-state imaging element chip 1 so that a space of at least 5 μm or more is formed so that interference fringes do not occur. Has been done. As a method for adhering the sealing member 4 to the surface of the solid-state imaging device chip 1, the bonding area can be reduced by utilizing anodic bonding or ultrasonic bonding, but an adhesive such as epoxy resin may be used. Of course. In FIG. 1A, reference numeral 5 denotes an electrode of the solid-state image sensor chip 1.

In the solid-state image pickup device constructed as described above, since only the light receiving area 2 of the solid-state image pickup element chip is hermetically sealed by the sealing member 4, the light-collecting ability of the microlens 3 is not deteriorated. The size can be reduced.

Next, a second embodiment will be described with reference to FIG. In this embodiment, the sealing member 11 is composed of two members, a flat plate portion 11a and a frame portion 11b which are transparent members. At this time, the frame portion 11b may be formed by using an inorganic material such as ceramic, glass, or silicon, or a metal such as Kovar, 42 alloy, or the like, but the surface of the solid-state imaging element chip 1 is made of resin such as epoxy, phenol, or silicon. May be patterned by printing or photolithographic techniques. Alternatively, the transparent flat plate portion 11a to which the frame portion 11b is bonded by anodic bonding or the like may be bonded to the surface of the solid-state imaging element chip 1.

In this embodiment, since the sealing member is composed of two members, the transparent flat plate portion and the frame portion, each member can be easily processed and the cost can be reduced.

Next, a third embodiment will be described with reference to FIG. This embodiment is similar to the first embodiment shown in FIG.
The solid-state imaging device chip 1 in which only the light receiving area 2 provided with the microlens 3 is hermetically sealed by the transparent sealing member 4 is provided on the substrate 21.
After bonding by direct die bonding to the electrodes of the solid-state imaging device chip 1 and the electrodes of the substrate 21 with bonding wires 22, chips other than the sealing member 4 provided only in the light-receiving area 2 of the solid-state imaging device chip 1 A solid-state imaging device is configured by sealing the surface and the connecting portion by the bonding wire 22 with a sealing resin 23 such as epoxy, phenol, or silicon.

According to this embodiment, it is possible to realize a small-sized mounting of the solid-state image pickup device constituted by adhering the solid-state image pickup element chip to the substrate.

Next, a fourth embodiment will be described with reference to FIG. In this embodiment, an optical component 31 such as an infrared cut filter, an ultraviolet cut filter, a lens and a prism is adhered to the surface of the transparent sealing member 4 in the solid-state imaging device of the third embodiment shown in FIG. Is configured as
According to this embodiment, it is possible to mount the solid-state imaging device, which is configured by mounting the optical component, in a small size.

Next, a fifth embodiment will be described with reference to FIG. In this embodiment, an optical component 41 such as a prism in which a frame portion 41a is integrally formed on an edge portion of a lower surface is provided to the frame portion 41a only for the light receiving area 2 including the microlens 3 of the solid-state image sensor chip 1. Place through and glue. Then, the solid-state image pickup device chip 1 is set in the same manner as in the third embodiment shown in FIG.
After being bonded to the substrate 21 by die bonding and making a predetermined connection with the bonding wire 22, the connection part between the chip surface other than the optical component 41 and the bonding wire 22 is sealed with the sealing resin 23 to form a solid-state imaging device. To do. Also in this embodiment, a space of 5 μm or more is formed between the lower surface of the optical component 41 and the surface of the microlens 3 of the solid-state image sensor chip 1.

In this embodiment, since the optical component itself also serves as the sealing member, it is possible to further reduce the size and thickness of the solid-state image pickup device including the optical component.

Next, a sixth embodiment will be described with reference to FIG. In FIG. 6, reference numeral 51 denotes a solid-state image pickup element chip, and the solid-state image pickup element chip 51 is provided with a recessed portion 52 which is recessed from the surface of the chip, and the recessed portion 52 has a light receiving area 2 provided with the microlens 3. Only formed. Then, a flat plate-shaped sealing member 53 made of a transparent member is arranged on the chip surface and bonded so as to cover the concave portion 52 in which the light receiving area 2 is formed, thereby forming a solid-state imaging device. Also in this embodiment, a space of 5 μm or more is formed between the front surface of the microlens 3 in the light receiving area 2 formed in the recess 52 and the back surface of the flat plate-shaped sealing member (glass lid) 53. It has become.

According to this embodiment, the frame member is not required for the sealing member, so that not only the cost of the sealing member can be reduced, but also the thickness can be further reduced.

Next, a seventh embodiment will be described with reference to FIG. In this embodiment, instead of the flat plate-shaped sealing member 53 in the sixth embodiment shown in FIG. 6, the optical component 31 such as a prism also serves as a sealing member so as to cover the recess 52 of the solid-state imaging element chip 51. Then, the solid-state imaging device is configured by arranging and adhering.

In this embodiment, it is possible to further reduce the size and thickness of the solid-state image pickup device having the optical component.

[0021]

As described above on the basis of the embodiments,
According to the present invention, since the hermetically sealed portion made of the transparent member is provided only in the light receiving area provided with the microlenses on the surface of the solid-state image pickup element chip, it is possible to obtain the solid-state image pickup device having a reduced mounting size. . Also, on the surface of the hermetically sealed part,
An optical component such as a prism can be indirectly adhered to the light receiving area, and the mounting size can be reduced without deteriorating the light collecting ability of the microlens.
Further, in the wafer state of the solid-state imaging device chip, it is possible to collectively provide the light-tight area with the airtight sealing portion for all the chips, and thus, the effect of eliminating the stain prevention process during dicing can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic plan view and a cross-sectional view of a first embodiment of a solid-state imaging device according to the present invention.

FIG. 2 is a sectional view showing a second embodiment.

FIG. 3 is a sectional view showing a third embodiment.

FIG. 4 is a sectional view showing a fourth embodiment.

FIG. 5 is a sectional view showing a fifth embodiment.

FIG. 6 is a sectional view showing a sixth embodiment.

FIG. 7 is a sectional view showing a seventh embodiment.

FIG. 8 is a cross-sectional view showing a configuration example of a mounting manner of a conventional solid-state imaging device.

FIG. 9 is a cross-sectional view showing another configuration example of a mounting manner of a conventional solid-state imaging device.

[Explanation of symbols]

 1 Solid-state imaging device chip 2 Light receiving area 3 Micro lens 4 Sealing member 4a Frame part 5 Electrode 11 Sealing member 11a Flat plate part 11b Frame part 21 Substrate 22 Bonding wire 23 Sealing resin 31 Optical component 32 Adhesive 41 Optical component 41a Frame 51 Solid-state image sensor chip 52 Recess 53 Flat plate-shaped sealing member

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Takashi Nakayama 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Co., Ltd. (72) Kazue Tanaka 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd.

Claims (8)

[Claims] 1. A solid-state image pickup device comprising a hermetically sealed portion made of a transparent member provided only in a light-receiving area of a solid-state image pickup element chip having a light-receiving area provided with an on-chip microlens. 2. The solid-state imaging device according to claim 1, wherein the hermetically sealed portion is composed of a flat plate portion and a frame portion integrally formed with a lower surface edge portion thereof. 3. The solid-state imaging device according to claim 1, wherein the hermetically sealed portion includes a flat plate portion and a frame portion adhered to an edge portion of a lower surface thereof. 4. The solid-state imaging device according to claim 1, wherein the hermetically sealed portion is composed of a transparent optical component and a frame portion integrally formed with an edge portion of a lower surface thereof. 5. The solid-state imaging device according to claim 1, wherein the solid-state imaging device chip has a recess formed on the surface of the chip, and a light-receiving area is formed in the recess. 6. The distance between the front surface of the on-chip microlens in the light receiving area and the back surface of the hermetically sealed portion is at least 5 μm or more, and any one of claims 1 to 5 is provided. Solid-state imaging device. 7. The solid-state image pickup device according to claim 1, wherein the chip surface other than the hermetically sealed portion provided on the solid-state image pickup element chip is resin-sealed. 8. The solid-state imaging device according to claim 1, wherein an optical component is bonded to the surface of the hermetically sealed portion.