JPH07210846A - Magnetic head device and manufacturing method thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] A magnetic head device configured to connect a head coil terminal of a magnetic head to a connection substrate via a gimbal or a base, and a manufacturing method thereof, wherein a coil protruding to the back side of the connection substrate. The length of the terminal is suppressed and the height of the back surface is eliminated to reduce the thickness. [Structure] Coil terminals 108A and 10 of a magnetic head 100 mounted on the front side of a gimbal or base 105.
9A is inserted into the back side of the gimbal or the base 105, the land pattern 116 is patterned, and the connection substrate (FPC) 114 having the through holes 117 or the grooves 128 in the land pattern 116 is opposed to the land pattern 116 side, and The coil terminal 108A or 109A is inserted through the hole 117 or the groove 128 and fixed to the back side of the gimbal or the base 105, and the coil terminal 10 is inserted from the back side of the FPC 114.
The 8A and 109A and the land pattern 116 are bonded to each other so that the coil terminals 108A and 109A do not protrude from the rear surface of the FPC 114.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device for a floppy disk and a method of manufacturing the magnetic head device, and more particularly to a magnetic head device and a coil terminal in which a magnetic head coil terminal is joined to a printed board via a gimbal or the like. The present invention relates to a method of manufacturing a magnetic head for bonding to a printed circuit board.

[0002]

2. Description of the Related Art Various types of magnetic heads have been proposed for use in conventional magnetic head devices for floppy disks. For example, a magnetic head 100 shown in FIGS. 7A to 7D and 8A to 8C is known. There is. 7A-D and 8A
7C show the steps of assembling the magnetic head for the floppy disk. As shown in FIG. 7D, three core legs 101L and 1L into which a recording / reproducing coil and an erasing bobbin can be inserted on the back surface.
01R, 101C are planted, and the front and rear of the front core 101 on which the magnetic gap g ₁ for recording and reproducing and the magnetic gap g ₂ for erasing are formed as shown in FIG. A head core 104 is formed in which the front and rear sliders 102 and 103 for ensuring the characteristics are sandwiched. Front and rear sliders 102 and 10
3 also has three core legs.

With respect to the head core 104, as shown in FIG. 7C, the hollow portions of a recording / reproducing head coil 108 and an erasing head coil 109 in which coils are wound around a rectangular hollow bobbin are respectively provided on the left leg 101L of the head core 104 and the hollow portion. Insert it in the right leg 101R. The recording / reproducing head coil 108 and the erasing head coil 109 are provided with coil terminals 10 via terminal plates provided on the left and right upper surfaces of the rectangular hollow bobbin.
8A and 109A have been planted and derived.

Next, the recording / reproducing head coil 108 and the erasing head coil 109 are placed in a rectangular hollow bobbin as shown in FIG.
The E-shaped back core 110 and the U-shaped leaf spring 1 shown in B
11 are superposed to form a closed magnetic circuit for each gap g ₁ and g ₂ .

A magnetic head portion 112, in which the parts shown in FIGS. 7B, 7C, and 7D except the magnetic shield member 107 shown in FIG. 7A are sub-assembled, is arranged on the gimbal 105 shown in FIG. 8A. The gimbal 105 is made of a spring material such as stainless steel or phosphor bronze, and is a square-shaped rectangular frame portion 105A having a substantially rectangular plane, and a first rectangular gimbal plate 105B rigidized only in the Y-Y axis, First gimbal plate 105B
On the other hand, the magnetic head portion 11 rigidized only in the X-X axis
The second gimbal plate 105C has a substantially rectangular shape to which 2 is attached.

That is, the magnetic head portion 112 is positioned at a predetermined position on the second gimbal plate 105C of the above-mentioned gimbal 105. That is, the magnetic head 10 shown in FIG. 8B.
The magnetic head portion 112 of 0 except the magnetic shield member 107 is temporarily fixed with an instant adhesive. Further, these magnetic head portions 112 are attached to the front and rear sliders 102 for reinforcing the adhesive strength.
After the UV curable resin 106 is applied over the side wall surfaces of the magnetic head portions 112 and 103, the back core side of the magnetic head portion 112, and the second gimbal plate 105C, the front and rear sliders 10 are formed.
The magnetic shield member 107 having a rectangular shape and a substantially rectangular shape shown in FIG. 7A is covered on the outer circumferences of 2 and 103 to form the magnetic head 100 shown in FIGS. 8B and 9, and the gimbal 105 is formed together with the magnetic shield member 107. It will be fixed. FIG. 8C shows the magnetic head 10 on the gimbal 105 in this way.
Fig. 9 shows the gimbal 10 in which the upper part is attached with 0 fixed.
5 is a view showing a mounting state of the magnetic head 100 as viewed from the lower side of FIG.

The first and second gimbals 105 to which the magnetic head 100 is attached as shown in FIGS.
The signal supply connection printed circuit board is soldered to the coil terminal 108A of the recording / reproducing magnetic head coil 108 and the coil terminal 109A of the erasing head coil 109 which are projected from the gap between the gimbal plates 105B and 105C. As this connecting board, a flexible printed board (hereinafter referred to as FPC) 114 formed in a substantially V shape as shown in FIG. 10A is used.

The FPC 114 has a wiring pattern 115 and a land pattern 116 printed on the surface of a flexible synthetic resin sheet (film base) having a high insulating property. Both ends of the FPC 114 formed in a dogleg shape are formed into first and second end portions having a substantially square shape in a plane, and the first end portion 114A has a connecting conductor pattern 11 formed therein.
5, a conductor land pattern 116 is formed at the terminal end of the through hole 11 for joining with the coil terminals 108A and 109A.
7 is worn. The second terminal portion 114B serves as a plug of the connecting conductor pattern 115 connected to the land pattern 116 and is connected to the signal supply source. FPC like this
An enlarged portion B of FIG. 10A of 114 is shown in FIG. 10B.

The land pattern 116 and the wiring pattern 115 side of the FPC 114 are placed upwards with respect to the film base of the FPC 114 as shown in FIG. 10B, and the coil terminals 108A and 1 projected from the gimbal 105 as shown in FIG. 10C.
09A is inserted through the through hole 117, and the FPC 114 is attached to the gimbal 105 with the double-sided adhesive tape 119 (see FIG. 11D).

Next, the coil terminal 1 protruding from the through hole 117
As shown in FIG. 10D, solder 118 is soldered from the upper side of 08A and 109A to join the land pattern 116 and the coil terminals 108A and 109A.

Further, as shown in FIGS. 11A to 11D, a cover layer 120 made of an insulating sheet or the like as shown in FIG. 11A is attached onto the pattern 115 from above so that the magnetic head device is completed. Let Incidentally, FIG.
D is a DD arrow view of the FPC 114 of FIG. 11C.

In the magnetic head device 100, the gaps g ₁ and g ₂ of the magnetic head shown in FIG. The magnetic head 100 moves in the radial direction (seek direction) of the floppy disk by rotating the floppy disk by bringing the surface 113 into contact with the surface of the floppy disk rotatably housed in the cartridge. It is operated so that the information signal is recorded / reproduced and recorded / erased on / from the floppy disk.

[0013]

FIG. 12A is a side view showing an assembled state in which a part of the magnetic head device described in the above-mentioned conventional structure is shown in cross section. That is, in FIG. 12A, the coil terminals 108A and 109A of the recording / reproducing head coil 108 and the erasing head coil 109 of the magnetic head portion 112 of the magnetic head 100 excluding the magnetic shield member 107.
Penetrates the gimbal 105 and FPC 114,
The land pattern 116 of the film base of C114 is projected to the upper surface side where the print is formed through the through hole 117, and the coil terminals 108A and 109A and the land pattern 116 are soldered and fixed by the solder 118, and a signal is supplied to the coil. However, as the floppy disk drive becomes smaller and thinner, the head core height H of the magnetic head 100 becomes thinner and the height of the back surface from the back surface of the gimbal 105 on the opposite side of the magnetic head portion 112 with respect to the gimbal 105 increases. Also, h ₁ tends to be kept as low as possible to reduce the overall thickness.

As a method of soldering the FPC 114 to the first conventional thin magnetic head section as described above, as shown in FIG. 12B, the through hole 117 is formed by penetrating the gimbal 105 and further forming the land pattern 116 of the FPC 114. The coil terminal 108A or 109A penetrating through is formed to have a projection length L sufficiently long from the surface of the land pattern 116 so that a sufficient solder allowance 121 can be secured. Therefore, the back surface height h ₁ is bonded solder 118 is a sufficiently coil terminals 108A and 109A and the lands 116, back surface height h ₁ to take a sufficient reliability of solder margin 121 as rise in soldering is It will be determined by the size of the solder allowance 121. The gap G between the surface of the gimbal 105 and the coil terminal plate is 0.1 m.
It is about m.

The simplest method for lowering the back surface height h ₁ is to set the terminal height of the coil terminals 108A and 109A, that is, the protrusion length L to L, as shown in the enlarged view of the coil terminal portion in FIG. 12C. back by the ₁ of like short height h _1>
It can be considered to lower it like h ₂ .

However, with this structure, the back surface height can be made low as h ₁ > h ₂ and the soldering can be performed by the FPC 114 as in the conventional method.
The workability is good because it can be performed from the print pattern side, but there is a problem in that the solder margin 121 becomes short, so that the solder sticking is bad and the reliability of the soldered portion after joining is reduced.

As shown in FIG. 13, the land pattern 116 of the FPC 114 is placed on the lower side of the gimbal 105 and the FPC 1 is placed between the coil terminal plates of the gimbal 105 and the recording / reproducing head coil 108 or the erasing head coil 109.
14 and the coil pattern 108A or 109A and the land pattern 116 which are protruded from between the first and second gimbal plates 105B and 105C of the gimbal 105.
If it is improved so as to be joined by solder 118 (in this case, the gap between the terminal board and the FPC 114, G ₁ is 0.1
The solder allowance 121 can be long and the reliability of soldering can be improved, and the height of the back surface can be reduced as h ₁ > h ₃ but the gimbal is based on the magnetic head core as in the past. There is a problem that the step of sequentially stacking the FPCs 114 on the back side (upper side) of 105 cannot be taken, and the work at the time of soldering is difficult to perform and the workability is deteriorated.

Further, as shown in the enlarged side sectional view of the main part of FIG. 14A and the perspective view of FIG. 14B, coil terminals 108A and 109A are provided on the mounting surface side of the recording / reproducing head coil 108 and the erasing head coil 109 of the gimbal 105. It is also conceivable to provide a soldering part.

That is, the FPC 114 is adhered to the front side (lower side) of the gimbal 105 with the land pattern 116 on the upper side, and the magnetic head portion 112 having the recording / reproducing head coil 108 and the erasing head coil 109 on the upper side of the FPC 114. Is mounted, and the coil terminals 108A and 109A of these head coils are led out from the lateral side of the coil bobbin, and these coil terminals 108A and 109A are placed.
Is soldered on the land pattern 116 with solder 118. In the case of FIG. 14B, the first end portion 114A of the FPC 114 has a U-shaped cutout portion, and the magnetic head 100 is mounted on the cutout portion, that is, the gimbal 105.

When the coil terminals 108A and 109A are soldered to the land pattern 116 by the above-described soldering method, the back surface height h ₁ can be made zero, and the reliability of soldering is as shown in FIG. 14B. In addition, since the solder allowance 121 can be taken longer, the workability can be extremely deteriorated. That is, when performing the soldering work, it is necessary to turn the magnetic head 100 inside out so that the gaps g ₁ and g ₂ can be seen, and there is a problem that the work cannot be performed from one direction. Further, as shown in FIG. There was a problem that the iron tip hits the coil and the flux smoke 123 for solder stains the front core.

The present invention provides a magnetic head device and a method of manufacturing the magnetic head device, which solves the above problems. The object of the present invention is to provide a coil terminal projecting from the back surface of the base or gimbal with a height of the back surface of the coil terminal. It is an object of the present invention to provide a magnetic head device which is zero and can be thinned, and a manufacturing method thereof.

Another object of the present invention is that the method of manufacturing a magnetic head is a method of manufacturing a magnetic head device capable of sequentially assembling components from the same direction as in the conventional method, and thus the workability of assembly is extremely good and soldering is performed. An object of the present invention is to provide a magnetic head device and a method for manufacturing the same, which work can be performed in the same manner as in the past.

Still another object of the present invention is to prevent the smoke due to the solder flux from reaching the core, coil wire and the like,
(EN) Provided are a magnetic head which can be easily wiped off and a manufacturing method thereof.

Still another object of the present invention is that the workability at the time of assembling the magnetic head and soldering is extremely good, the solder after soldering is also firmly joined, and the reliability at the time of soldering is great, and the height of the back surface is high. It is intended to obtain a magnetic head device which can be made thin and has a manufacturing method thereof, which is substantially zero.

[0025]

A magnetic head device of the present invention has a head coil 108 as shown in FIG.
In a magnetic head device in which the magnetic head 100 having the bases and 109 is arranged on the base or the gimbal 105, coil terminals 108A and 109A of the head coils 108 and 109 projected through the base or the gimbal 105
Land 11 of the pattern of the connecting substrate 114 connected to
6 is attached to the base or gimbal 105 side.

As shown in FIG. 5, the method of manufacturing the magnetic head device of the present invention uses the coil terminals 108A and 109A of the magnetic head 100 as the base or gimbal 10.
5 and the coil terminals 108A and 109
Land pattern 11 of connection substrate 114 connected to A
6 is disposed so as to face the base or gimbal 105, and the coil terminals 108A and 109A are inserted into the through holes 117 or grooves provided in the lands 116 to such an extent that the tips of the coil terminals 108A and 109A do not project; The soldering process is performed from the side opposite to the through hole 117 or the groove provided in the coil and the terminals 108A and 109A of the coil and the land 116 are joined.

[0027]

In the magnetic head device of the present invention, the connecting substrate 114 is connected to the coil terminals 108A and 109A of the magnetic head 100 projected through the base or gimbal 105.
Since the land pattern 116 is attached to the base or gimbal 105 side, the coil terminals 108A and 109A projecting from the base or gimbal 105 and the connection substrate 114 arranged on the back side of the magnetic head 100.
It is possible to obtain a magnetic head device in which the backside height h ₁ of the above can be suppressed to substantially zero and which can be made compact and thin.

Further, according to the method of manufacturing the magnetic head device of the present invention, the coil terminals 108A and 1A of the magnetic head 100 are provided.
09A is projected from the back side of the base or gimbal 105, the land 116 is patterned, and the land 11
6, the land 1 of the connection substrate 114 in which the through hole 117 is formed
16 on the base or gimbal 105 side, the coil terminals 108A and 109A are inserted into the through holes 117, and the land 110 and the coil terminals 108 are inserted from the back side of the connection substrate 114.
Since A and 109A are joined together, a method of manufacturing a magnetic head device in which workability and reliability during soldering are significantly improved can be obtained.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a magnetic head device and a method of manufacturing the same according to the present invention will be described below in detail with reference to FIGS. The parts corresponding to those of the conventional configuration described with reference to FIGS. 7 to 14 are designated by the same reference numerals, and the duplicate description will be omitted. Prior to describing the configuration of the present example with reference to FIGS. 1 to 4, a method of manufacturing the magnetic head device of the present invention will be described with reference to FIGS.

5A to 5D are explanatory views showing the order of assembling the magnetic head of this example, and FIGS. 5A and 5B are side and plan perspective views of the FPC 114 which is a connecting substrate used in the magnetic head device of the present invention. , Its configuration is shown in FIG. 10A and FIG.
The insulating flexible film base is formed in a substantially V shape and has a substantially square first end portion 114A and a second end portion 114, which have substantially the same configuration as described in the above.
B (not shown) is provided, and a land 117 is formed in the first terminal end portion 114A to form a through hole 117 for joining with the coil terminals 108A and 109A of the recording / reproducing head coil 108 and the erasing head coil 109 of the magnetic head. Three patterns 116 are arranged side by side on the left and right, and each land pattern 116 is connected to a connecting pattern 115 that is connected to a plug provided on the second end portion 114B.

Gimbal 10 shown in FIGS. 5C and 5D.
Reference numeral 5 denotes a frame portion 105A made by punching a square-shaped member made of stainless steel or the like into a square shape and the first and second gimbal plates 105B and 105C in the same manner as described with reference to FIGS. FIG. 8 in which the magnetic head portion 112 and the magnetic shield member 107 described in FIG. 7 are integrated on the front surface side of the second gimbal plate 105C.
A magnetic head 100 such as B is attached. Then, as shown in FIG. 8C, the coil terminals 108A and 109A of the recording / reproducing head coil and the erasing head coil 108 and 109 of the magnetic head 100 are separated from the gap formed between the first and second gimbal plates 105B and 105C. It is made to project.

In the method of manufacturing the magnetic head device of this embodiment, as shown in FIGS. 5A and 5B, the land pattern 116 patterned on the base film of the FPC 114 and the line pattern connected to the land pattern 116 are used. The cover layer 120 is covered with a thermally strong cover layer 120 so as to cover a pattern portion requiring insulation except at least a land pattern portion 116 of the 115.
Gimbal 10 by sticking double-sided adhesive tape 126 on top
5 is adhered with the side of the pattern 115 and the land pattern 116 facing down.

Of course, at this adhesion step, the tips of the coil terminals 108A and 109A protruding from the gimbal 105 are inserted through the through holes 117 formed in the land pattern 116 and fixed. F on the back surface (upper side) of such a gimbal 105
FIG. 5C shows a state in which the pattern 115 and the land 116 of the PC 114 are attached to the lower side.

Next, as shown in FIG. 5D, the solder 118 is poured from the side of the through hole 117 on the back side of the film base on which the pattern 115 and the land pattern 116 of the FPC 114 are not patterned, and between the land pattern 116 and the coil terminals 108A and 109A. Soldering is performed so as to join the.

In the magnetic head device and the manufacturing method thereof as described above, the head coil terminals 108A and 10 of this embodiment are used.
The soldering method will be described with reference to FIG. 1 which is an enlarged side cross-sectional view showing the bonding state of the 9A and the land pattern 116, and FIGS. 2 to 4.

FIG. 1 shows a magnetic recording / reproducing head coil 10
8 and head coil terminal 1 of erasing head coil 109
08A and 109A are gimbal 105 and FPC11
4 shows a state of being inserted through the through hole 117 formed in the land pattern 116 of No. 4. In FIG. 1, the thickness of the terminal plate 127 on which the coil terminals 108A or 109A of the magnetic recording / reproducing head coil 108 or the erasing head coil 109 of the magnetic head 100 is set is the same as that of the conventional terminal plate shown in FIG. The thickness of the terminal plate 127 is thinner than the thickness of the terminal plate 127 by 1 to 2 mm, and the distance G between the upper surface of the terminal plate and the surface of the gimbal 105 is about 0.1 mm in the conventional structure. The gap G is selected to be about 1.1 to 2.1 mm. Therefore, the coil terminal 108A or 10
The total length L ₁ of 9A is selected to be a length obtained by adding the thickness d ₁ of the gimbal 105 and the thickness d _{2 of the} FPC 114 to this 1.1 mm to 2.1 mm. The thickness d _{1 of the} gimbal 105 differs depending on the manufacturer and model, and the FPC 114 is the total of the film base thickness, the cover layer 120 thickness, and the adhesive tape 126 thickness, and the thickness d ₂ is 0.5 to 1.5 mm.
The degree is selected.

The coil terminals 108A and 109A are the gap 105D between the first gimbal plate 105B and the second gimbal plate 105C of the gimbal 105 and the FPC1.
14 are inserted into the through holes 117 formed in the land pattern 116, and the tip ends of the coil terminals 108A and 109A are the through holes 1.
It is arranged so as not to project from the back side of 17.

Next, as shown in FIG. 2, the through hole 11 is formed from the back side of the FPC 114 on which the pattern 115 and the land pattern 116 are not formed by the thread solder 125 and the soldering iron 124.
7, the coil terminal 108A and the like are heated by the soldering iron 124, and then the wire solder 125 containing the resin is melted, so that the solder 118 and the flux are heated through the through holes 117.
08A and 109A and the land pattern 116 are soldered, and a sufficient length of the solder allowance 112 can be secured.

FIG. 3 shows the coil terminals 108A and 109A as seen from the upper side of the through hole 117 of the FPC 114 (direction of arrow A in FIG. 2) and FIG. 4 from the lower side of the through hole 117 (direction of arrow B of FIG. 2). FIG. 4 is a perspective view showing a relationship between the land pattern 116 and the through hole 117. As shown in FIGS. 2 and 3, the FPC 114 mounted and adhered on the gimbal 105 has the pattern 115 and the land pattern 116 in the conventional directions. Differently, these patterns are fixed so as to face the back surface of the gimbal 105, and the assembling order is the same as the conventional one. Further, as in the conventional soldering work, it is not necessary to perform the soldering work by reversing the gimbal in which the magnetic head 100 is sub-assembled as shown in FIGS. 14A and 14B, so that the assembly work and the soldering work from one direction are performed. Can be done. Therefore,
The soldering time can be the same as the conventional one, the reliability after soldering is great, and the workability is easy.

Since there is no metallic substance such as a pattern on the film base (back side) of the FPC 114, the solder 118
The swell can be made flush with the film base, and the solder residue remaining on the film base can be easily removed by wiping.

Further, since the solder flux smoke 123 generated during the soldering work also rises upward from the back side of the FPC 114 as shown in FIG. 2, it is possible to eliminate the harmful effect of getting around the front core of the magnetic head 100 as shown in FIG. And FP
A magnetic head device and a method of manufacturing the magnetic head device can be obtained in which the height h _{1 of} the back surface protruding from C114 can be made completely zero.

In the above-described embodiment, the FPC 114 having the through holes 117 formed in the land pattern 116 is shown in FIGS.
5A and 5B in FIGS. 6A and 6B.
Another embodiment having the same configuration as the above will be described. In FIGS. 6A and 6B, three land patterns 1 formed on the left and right ends of the first end portion 114A of the FPC 114 formed in a substantially square shape in plan view.
A groove 128 is formed between the 16th position and the left and right end edges 114L and 114R of the first terminal end portion 114A instead of the through hole 117, and thus the groove 128 is formed instead of the through hole 117.
Even in the case in which the pattern is formed, the gimbal 105 can be easily soldered by adhering the pattern side down to the back surface of the gimbal 105.
The present invention can also be applied to a magnetic head directly assembled on the base of a carriage or the like instead of the gimbal.

[0043]

According to the magnetic head device and the method of manufacturing the same of the present invention, it is possible to reduce the thickness and size of the gimbal or the base by reducing the height of the back surface to zero, the reliability of soldering, and the magnetic head easy to assemble. An apparatus and a manufacturing method thereof are obtained.

[Brief description of drawings]

FIG. 1 is an enlarged side sectional view of an essential part showing an embodiment of a magnetic head device of the present invention.

FIG. 2 is an explanatory diagram of a soldering method showing an embodiment of a magnetic head device of the present invention.

FIG. 3 is a view on arrow A in FIG.

FIG. 4 is a view on arrow B in FIG.

FIG. 5 is an explanatory view of the assembling order of the magnetic head device of the present invention.

FIG. 6 is a configuration diagram of another FPC used in the magnetic head device of the present invention.

FIG. 7 is an assembly configuration diagram of a conventional magnetic head device.

FIG. 8 is an explanatory diagram of a gimbal mounting of a conventional magnetic head device.

FIG. 9 is an assembled perspective view of a conventional magnetic head device.

FIG. 10 is an explanatory diagram (I) of attaching the FPC to the conventional gimbal.

FIG. 11 is an explanatory view of attaching the FPC to the conventional gimbal (I
I).

FIG. 12 is a diagram (I) illustrating a conventional method of soldering to an FPC.

FIG. 13 is an explanatory diagram (II) of a conventional FPC soldering method.

FIG. 14 is an explanatory diagram of a conventional FPC soldering method (III)
Is.

[Explanation of symbols]

 100 magnetic head 108 magnetic recording / reproducing head coil 109 erasing head coil 105 gimbal 108A, 109A coil terminal 114 FPC 116 land pattern 117 through hole 118 solder 128 groove

Claims (7)

[Claims] 1. A magnetic head device comprising a magnetic head having a coil disposed on a base or a gimbal, wherein a pattern of a connecting substrate connected to a terminal of the coil projected through the base or the gimbal. Magnetic head device, wherein the land is attached to the base or gimbal side. 2. The magnetic head device according to claim 1, further comprising a through hole penetrating from the land side of the connection substrate to the opposite side of the substrate. 3. The magnetic head device according to claim 1, wherein the connection board is a flexible printed board. 4. The land according to claim 1, wherein the land side of the connection board and the base or gimbal are joined together by an adhesive tape.
The magnetic head device according to the item 1. 5. A groove extending from a land position of the connection board to a side edge portion of the board is provided, and the groove is provided in any one of claims 1 to 3. Magnetic head device. 6. A step of penetrating a coil terminal of a magnetic head into a base or a gimbal, and arranging a land of a pattern of a connecting substrate connected to the coil terminal so as to face the base or gimbal,
The step of inserting the coil terminal tip into the through hole or groove provided in the land to such an extent that the coil terminal tip does not protrude; and soldering from the opposite side of the through hole or groove provided in the land of the connection board, A method of manufacturing a magnetic head, comprising the step of joining a terminal and a land. 7. The method of manufacturing a magnetic head according to claim 6, wherein a soldering margin for soldering the land and the coil terminal is interposed between the magnetic head and the connecting substrate.