JPH07222902A - Processor - Google Patents

Abstract

(57) [Summary] [Purpose] In a processing device that uses the vapor of the processing liquid to desorb water from the surface of the object to be processed, the processing liquid that has been condensed and liquefied can be collected efficiently or cleanly, and the consumption of the processing liquid can be increased. To save money. [Configuration] In the drainage pipe 26 connected to the drainage port 24b at the bottom of the tray 24, the on-off valve 3 is provided on the downstream side of the trap portion 26a.
0 is provided, and a branch pipe 32 for collecting the treatment liquid is provided in the treatment tank 14 at a position (location) of the drain pipe 26 higher than the upper end of the trap portion 26a. Cooling pipe 36
The plate gutter 38 provided directly under the plate has a height difference in the circumferential direction, and the processing liquid discharge port 14a is formed on the side wall of the processing tank 14 near the lowest part of the gutter. The processing liquid discharge port 38a is connected to the apparatus container 1 via a discharging pipe 42 for collecting the processing liquid.
0 is connected to the inlet of the filter 44 disposed outside the filter 0, and the outlet of the filter 44 is connected to the treatment liquid introduction port 14b on the side wall of the treatment tank 14 via the treatment liquid recovery introduction pipe 46.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a processing apparatus.

[0002]

2. Description of the Related Art In a processing apparatus of this type, a volatile predetermined processing liquid such as IPA (isopropyl alcohol) is heated and vaporized at the bottom of a processing tank, and vapor of the IPA is transferred to an object to be processed such as a semiconductor wafer. By replacing the water adhering to the surface, the water is dropped from the wafer surface. Then, the water desorbed from the surface of the wafer is dropped onto a tray installed in the processing tank, and the water is drained from the tray to a drain tank outside the processing tank through a drain pipe. Further, in order to prevent the vapor of IPA from escaping to the outside of the treatment tank, a cooling corrugated pipe is arranged along the upper side wall of the treatment tank, and the vapor of IPA is condensed (liquefied) by this cooling corrugated pipe, and IPA droplets are condensed. It is designed to be returned to the processing liquid reservoir at the bottom of the processing tank.

[0003]

By the way, droplets of the processing liquid formed by condensation of the processing liquid vapor are also accumulated in the tray. Although the atmospheric temperature in the processing tank is maintained at a substantially uniform temperature, for example, about 80 ° C., the temperature of the outside air is transmitted to the pan through the distribution pipe, and the steam of the processing liquid is cooled and condensed near the pan. Condensation of the processing liquid in such a tray is, of course, performed during the moisture desorption process, but the processing liquid is condensed and discharged by the tray even during standby.

Since this type of conventional processing apparatus drains liquid from the receiving tray through the drainage pipe, the processing liquid accumulated in the receiving tray is uniformly drained during the water desorption process or during standby. . However, the treatment liquid that collects in the saucer mixes with the moisture desorbed from the object to be treated during the moisture desorption process, so even if it is unavoidable to drain it, it is a pure treatment liquid that does not mix with the moisture during standby. It is wasteful to drain this.
In fact, it is not uncommon for this type of processing device to operate for 24 hours, of which the actual working time (actual time spent for water desorption treatment) is about 1/3 and the rest is spent for waiting time. Therefore, the amount of processing liquid that is wastefully drained from the saucer during the standby time is considerably small (for example, about 20 liters) throughout the day, even if the amount is small per unit time.
become.

Further, in the conventional processing apparatus of this kind, a trough for receiving the droplets of the processing solution that naturally drops from the cooling corrugated tube is provided just below the cooling corrugated tube along the side wall of the processing tank, and the processing solution received by this trough is provided. It was collected by dropping from the gap between the gutter and the inner wall to the side of the processing liquid reservoir at the bottom of the processing tank. However, in such a conventional processing liquid recovery method, dirt, dust, and the like adhering to the trough and the inner wall of the processing tank together with the processing liquid to be recovered easily flow down to the processing liquid storage portion. Easily deteriorates,
The processing solution had to be changed frequently.
Further, there is a possibility that the processing liquid dropped from the gap between the gutter and the inner wall of the processing tank may splash and adhere to the object to be processed or the saucer.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a vessel for receiving the moisture desorbed from the object to be treated by the vapor of the treatment liquid, so that the vapor of the treatment liquid During the waiting time, the condensed and accumulated processing liquid is efficiently collected in the processing liquid storage section in the processing tank without being wastefully discharged,
It is an object of the present invention to provide a processing apparatus that saves the consumption of processing liquid.

A second object of the present invention is to collect the processing liquid condensed and liquefied from the steam by cooling the cooling body provided along the inner wall of the upper portion of the processing tank in the processing liquid reservoir in the processing tank in a clean state. Therefore, it is an object of the present invention to provide a processing apparatus that suppresses deterioration of the processing liquid and thus saves consumption of the processing liquid.

[0008]

In order to achieve the above first object, the first processing apparatus of the present invention is an object to be processed in an atmosphere of vapor of a predetermined volatile processing liquid in a processing tank. In the processing device, the water containing the volatile processing liquid that has fallen from the surface of the processing device is collected in a predetermined container installed in the processing tank and drained from the container via a liquid distribution pipe. An on-off valve is provided in the middle of the pipe, and a pipe is branched from the drain pipe at a predetermined position closer to the container side than the on-off valve to return the treatment liquid to the treatment liquid reservoir and has an open tip. Is provided.

In order to achieve the second object,
The second processing apparatus of the present invention is arranged above the steam processing unit in order to cool and condense the steam of a predetermined volatile processing liquid used for the moisture desorption processing on the surface of the object to be processed in the processing tank. A cooling body extending along the side wall of the processing tank at a position, a gutter means for receiving a droplet of the processing liquid dropped from the cooling body at a position below the cooling body, and a filtering of the processing liquid. And a processing means for returning the processing solution collected by the gutter means to the filtering means and returning the processing solution filtered by the filtering means to the processing solution reservoir in the processing tank. And a tube of.

[0010]

In the first processing apparatus of the present invention, the water desorbed from the surface of the object to be processed is once collected in the container and then distributed through the drain pipe. The treatment liquid condensed in the container is also distributed together with water through the drain pipe. The open / close valve is open during the processing time. When the on-off valve closes during the waiting time, the processing liquid condensed in the container is discharged from the processing liquid recovery pipe (branch pipe) in the middle of the drainage pipe in the processing tank, and is recovered as it is in the processing tank. .

In the second treatment apparatus of the present invention, the treatment liquid cooled by the cooling body and condensed is received by the gutter means and sent to the filter through the pipe for collecting the treatment liquid, where impurities and dust are collected. And the like are removed, and then are collected in the processing liquid reservoir in the processing tank through the processing liquid recovery pipe.

[0012]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 and FIG. 2 are a partial sectional front view and a partial sectional side view showing the structure of a processing apparatus according to an embodiment of the present invention. Note that the transport arm 22 in FIG. 1 is omitted in FIG. 2 for simplicity of illustration.

In this processing apparatus, a heating device 12 is arranged at the bottom of a square-bottomed cylindrical container 10 made of, for example, stainless steel, and a side wall of the container 10 is provided on the heating device 12 with some gap left therebetween, for example, quartz. Square bottomed processing tank consisting of 1
4 is mounted.

At the bottom of the processing tank 14, a predetermined volatile processing liquid such as IPA (isopropyl alcohol) 1
6 is stored up to a predetermined liquid level, and the treatment liquid 16 can be replaced or replenished as needed through treatment liquid inlets and drainage ports (not shown) provided on the wall surface or bottom surface of the treatment tank 14. It is supposed to be done. In this way, the bottom of the processing tank 14 forms the processing liquid reservoir 18.

The processing liquid 16 in the processing liquid reservoir 18 evaporates by heating from the heating device 12 at all times while the power is applied to the processing device, that is, during processing or in standby, and the processing liquid 16 is processed above the processing liquid reservoir 18. An atmosphere of vapor of liquid 16 is formed.
Therefore, the vapor processing section or space 20 is set at a substantially intermediate height position in the processing tank 14, and a plurality of, for example, 50 objects to be processed such as semiconductor wafers W1 to W50 are set in the vapor processing section 20 during processing. Are held by the transfer arm 22 while being held or carried.

A quartz tray 24, for example, is installed at the bottom of the processing tank 14 just below the vapor processing section 20 and at a position higher than the liquid level of the processing liquid 16. The legs 24 a integrally attached to the lower surface of the tray 24 are attached to the bottom of the processing tank 14. As shown in FIG. 3, the upper surface (moisture receiving surface) of the tray 24 is selected to have a larger area than that of the vapor processing section 20 of the object W to be processed, and it is detached / dropped from the semiconductor wafers W1 to W50 during processing. The water containing the processing liquid can be received by the saucer 24 directly below.

A drain port 24b is provided at the bottom of the tray 24, and a drain pipe 26 is connected to the drain port 24b.
The drainage pipe 26 passes through the treatment liquid reservoir 18, penetrates the treatment tank 14 and the apparatus container 10, and communicates with an external drainage recovery unit such as a drain tank (not shown). Drainage pipe 2
It is preferable that 6 is composed of a tube made of quartz or Teflon at least in the processing tank 14. Further, a suitable sealing member (not shown) may be provided in the wall hole of the processing vessel 14 and the apparatus container 10 through which the drainage pipe 26 is passed.

In this embodiment, the drain pipe 26 is provided with a U-shaped trap portion 26a outside the apparatus container 10, and an opening / closing valve formed of, for example, an air-operated valve is provided downstream of the trap portion 26a, that is, on the drain tank side. Thirty
Is provided. Further, a branch pipe 32 for recovering the treatment liquid, which branches obliquely upward from a position (location) of the drain pipe 26 higher than the upper end of the trap portion 26a in the treatment tank 14, is integrally formed with the drain pipe 26. The upper end of the branch pipe 32 opens at a position lower than the pan drainage port 24b. As will be described later, the processing liquid condensed in the tray 24 during the standby time is collected in the processing liquid reservoir 18 through the branch pipe 32.

A protective plate 34 made of, for example, Teflon having a large number of through holes is installed below the tray 24 so as to cover the processing liquid reservoir 18. Each leg 3 of this protection plate 34
4a is also attached to the bottom of the processing tank 14. Even if the semiconductor wafer Wi is accidentally dropped from the transfer arm 22, the protective plate 3
4, so that it does not hit the bottom of the processing tank 12.

A spiral cooling pipe 36 is provided in the upper part of the processing tank 14 so as to extend along the side wall. A cooling medium, for example, cooling water is circulated and supplied to the cooling spiral pipe 36, and the steam of the processing liquid rising from the steam processing unit 20 is cooled by the cooling spiral pipe 36 and condensed (liquefied), whereby the processing tank 14 is cooled. It doesn't run away.

Below the cooling flexible pipe 36, a plate gutter 38 made of, for example, quartz for receiving the processing liquid dropped from the flexible pipe 36.
Are provided in a corridor shape along the side wall of the processing tank 14.
The plate gutter 38 has its outer peripheral edge portion closely contacted with the side wall of the processing tank 14 so that the plate surface becomes higher toward the inner peripheral edge portion.
That is, it is fixedly supported by the support member 40 in an inclined posture so as to form a bottom on the outer peripheral edge portion side, and the inner peripheral edge portion 38a is erected to form the return portion 38a. Also, the board gutter 38
Extend at a height difference in the orbiting direction, and the treatment liquid discharge port 1 is provided on the side wall of the treatment tank 14 near the lowest plate gutter.
4a is formed.

The processing liquid discharge port 14a of the board gutter 38 is connected to the inlet of a filter 44 arranged outside the apparatus container 10 via a processing liquid collection discharge pipe 42, and the outlet of the filter 44 collects the processing liquid. It is connected to the processing liquid introduction port 14b on the side wall of the processing tank 14 via the introduction pipe 46 for. The processing liquid introduction port 14b is formed at a position higher than the liquid surface of the processing liquid 16 stored in the processing liquid reservoir 18.

Next, the operation of the processing apparatus in this embodiment will be described with reference to FIGS. 4 and 5, the protective plate 34 is omitted for simplification of illustration.

The transfer arm 22 transfers one lot of semiconductor wafers W1 to W50 immediately after being subjected to a cleaning process with, for example, pure water spray, and reaches the steam processing section 20 in the processing tank 14 as shown in FIG. Lowering and holding the semiconductor wafers W1 to W50 at the position 20 during the processing time. Prior to the start of processing, the opening / closing valve 30 is opened by a control device (not shown). As described above, while the processing apparatus is powered on, that is, while the heating apparatus 12 is operating, the processing solution 16 is supplied from the processing solution reservoir 18 at the bottom of the processing tank 14.
The steam of the treatment liquid is filled up in the tank, particularly in the vicinity of the steam treatment unit 20, with the vapor of the treatment liquid being almost saturated. By placing the semiconductor wafer Wi as the object to be processed in this atmosphere, the water adhering to the wafer surface is replaced by the vapor of the processing liquid, and the water desorbed from the wafer surface falls to the saucer 24 directly below.

The water accumulated in the tray 24 in this way is
As shown in FIG. 4, the liquid flows out of the drain port 24b at the bottom of the dish, flows through the drain pipe 26, and is sent to the drain tank side through the opening / closing valve 30. Further, the treatment liquid generated by the vapor of the treatment liquid condensing in the vicinity of the tray 24 during the treatment is mixed with water and discharged through the drain pipe 26.

When the processing is completed, the transfer arm 22 lifts the semiconductor wafers W1 to W50 and takes them out of the processing bath 14. At this time, the vapor of the cleaning liquid adhering to the surface of the wafer is diffused and separated, and the surface of the wafer is dried. However, in order to accelerate the drying of the object to be processed, a drying mechanism may be provided in the vicinity of the upper opening of the processing tank 14 to blow air or an inert gas such as N2 gas toward the object to be processed.

In the processing bath 14, semiconductor wafers W1 to W
When 50 is carried out, the steam processing unit 20 no longer receives the saucer 24.
However, the water remaining in the tray 24 for a while is drained through the drain pipe 26. Then, after a lapse of a predetermined time from the end of the processing, that is, at the time when the water is completely discharged from the tray 24 and the water in the drain pipe 26 is lowered to a position lower than at least the branch pipe 32,
The opening / closing valve 30 is closed by the control unit. Before the opening / closing valve 30 is closed, when the water content in the drainage pipe 26 drops to a position lower than that in the branch pipe 32, the drainage liquid stays in the upstream portion of the trap portion 26a, so that the atmosphere of the outside air is It is blocked here and does not rise into the processing tank 14.
In this way, the opening / closing valve 30 is closed after a lapse of a predetermined time after entering the standby time.

After the on-off valve 30 is closed, the liquid accumulated in the receiving tray 24 is the liquid of the processing liquid 16 that has cooled and condensed, and is the processing liquid 16 containing no water. As shown in FIG.
The processing liquid 16 accumulated in the saucer 24 is the saucer drainage port 24a.
As soon as it is sent to the drainage pipe 26, it enters the branch pipe 32, drops from the mouth of the branch pipe 32 as droplets 16b, and leaves the treatment liquid reservoir 18
Be recovered to.

As described above, after a lapse of a predetermined time (residual water removal time) after entering the standby time, the processing liquid 16 condensed in the tray 24 is stored in the processing tank 14 via the drain pipe 26 and the branch pipe 32. It is collected in the processing liquid reservoir 18. Since the ratio of the operating time to the standby time is much larger than the processing time, a considerable amount of the processing liquid can be saved in the unit of day or month.

On the other hand, in the upper portion of the processing tank 14, the vapor of the processing liquid 16 is cooled by the cooling spiral pipe 36 and condensed and liquefied while the processing apparatus is operating during the processing time and the standby time.

As shown in FIG. 6, the droplets of the treatment liquid condensed and attached to the surfaces of the tubes of each stage of the cooling corrugated pipe 36 are vertically propagated sequentially along the outer peripheral surface of the tube of the lower stage, and the tubes of the lowest stage. In the vicinity, it grows into a large liquid droplet 16a and falls off from the flexible pipe. During the detachment and dropping, the droplet 16a of the processing liquid may splash to the side of the tube. In the present embodiment, the liquid droplet 16a splashed to the inside of the flexible tube 36, that is, toward the center of the treatment tank, has the return portion 38 of the board gutter 38.
The object W to be processed and the saucer 2 are to be captured by a.
There is no danger of hitting the 4th grade.

The processing liquid dropped from the cooling spiral pipe 36 to the board gutter 38 moves to a lower position in the orbiting direction of the board gutter 38 and is sent from the processing solution discharge port 14a to the filter 44 through the discharge pipe 42, where impurities are contained. After removing dust and dirt, the introduction pipe 4
It is configured to be guided to the processing liquid introduction port 14b through 6 and fall from there to the processing liquid reservoir 18 along the wall of the processing tank 14. Alternatively, the treatment liquid introducing pipe 46 may be projected inward from the treatment liquid introducing port 14b so that the treatment liquid directly drops from the outlet of the pipe 46 to the treatment liquid reservoir 18.

As described above, in the processing apparatus of the present embodiment, the processing liquid 16 condensed and liquefied by the cooling flexible pipe 36 is safely and reliably captured by the plate gutter 38, and the discharge pipe 42 and the introduction pipe for collecting the processing liquid are provided. Since the impurities and dust are removed by the filter 46 and the filter 44 and then collected in the treatment liquid reservoir 18, the treatment liquid 16 is less likely to deteriorate in the treatment tank 14, and the number of times the treatment liquid 16 is replaced is reduced accordingly. The consumption of the liquid 16 is low.

When mounting the plate gutter 38 (or the support member 40) on the inner wall of the processing tank 14, it is necessary to properly align and install the frame-shaped plate gutter 38 from the beginning because of dimensional accuracy. It is often difficult from the point. Therefore, FIG.
, A plurality of, for example, four board gutter pieces 38A, 38
If the board gutter 38 is divided into B, 38C, and 38D, and the board gutter pieces 38i are separately attached to the inner walls, the board gutter 38 can be installed in correct alignment even if the dimensional accuracy varies.

Further, as shown in FIGS. 8 and 9, this split type gutter structure is also applied to the case where a gap is provided between the plate gutter and the treatment tank and the treatment liquid is dropped from the gap. It is possible. In this configuration example, the frame-shaped gutter support member 40 is carried on a quartz gutter receiving seat 50 which is formed by welding at several places, for example, six places at predetermined intervals on the inner wall surface of the processing tank 14. On the gutter support member 40
Split type board gutter 38 (38A, 38B, 38C, 38D)
Is arranged with its outer peripheral surface as close as possible (for example, 0 to 0.5 mm) to the inner wall surface of the processing tank 14. According to this configuration, the treatment liquid that has fallen from the flexible pipe 36 to the board gutter 38 is
It does not flow smoothly from the small gap between the plate gutter 38 and the inner wall surface of the processing tank 14 along the inner wall, and does not bounce toward the object to be processed or the tray 24 and adhere to them.

In the embodiment described above, the opening / closing valve 30 is provided in the drain pipe 26 on the downstream side of the trap portion 26a.
It may be provided upstream of the trap portion 26a, or may be provided inside the processing tank 14. Further, the branch pipe 32 may have any shape and size, and may be provided at a plurality of locations as required. In the processing apparatus of the present invention, the container for receiving the processing liquid detached and dropped from the object to be processed has a shape similar to the tray 24 in the above embodiment.
The shape is not limited to the above, and any shape and structure are possible, for example, a box shape or a bowl shape may be used.

The gutter means is not limited to the plate gutter 38 of the above-described embodiment, but may have any shape and structure, and may have a curved cross section, for example. Further, the treatment liquid may be sent to the discharge port 14a side more rapidly and smoothly by continuously sloping in the circulation direction, and the number of the discharge port 14a or the number of the treatment liquid recovery pipes 42, 46 may be plural. It is also possible to In addition, if necessary, a pipe 42 for collecting the processing liquid,
A pump may be attached to 46, and the filter 44 may be omitted. Further, the cooling body is not limited to the flexible tube structure, and may be a panel structure, for example.

FIG. 10 shows an example of the configuration of a semiconductor wafer cleaning system to which the transfer arm cleaning device according to the above-described embodiment can be applied.

This cleaning system comprises an input buffer mechanism 70, a cleaning device main body 72, and an output buffer mechanism 73. A loader section (wafer carry-in section) 74 and an unloader section (wafer carry-out section) 76 are provided at both ends of the cleaning apparatus main body 72, and a plurality of, for example, nine processing sections 78a to 78i are arranged in a line in the middle section. Has been done.

For example, the first processing unit 78a is a transfer arm cleaning / drying unit, the second processing unit 78b is a wafer chemical cleaning unit, the third and fourth processing units 78c and 78d are wafer cleaning units and the fifth cleaning unit, respectively. Processing unit 78e is a wafer chemical cleaning unit, sixth and seventh processing units 78f and 78g are wafer cleaning units, an eighth processing unit 78h is a transfer arm cleaning / drying unit,
The ninth processing unit 78i is a wafer drying unit. The processing apparatus according to the above-described embodiments may be installed in the ninth processing unit 78i (wafer drying unit).

In front of these processing units 78a to 78i, a plurality of, for example, three transfer robots 102, 10 each equipped with a wafer chuck 106, 106, 106 are provided.
2, 102 are arranged so as to be movable in the arrow Y direction.
Each of the transfer robots 102 is restricted in movement or transfer range in the Y direction, and assigned to each processing unit 7.
Only 8 can be accessed.

The input buffer mechanism 70 and the output buffer mechanism 73 include a carrier transfer arm 86 for transferring the wafer carrier C and a wafer carrier C.
A carrier accommodating portion 88 for temporarily storing the wafer carrier, a carrier mounting table 90 for transferring the wafer carrier C to the outside of the system, a carrier elevator 92 for raising or lowering an empty wafer carrier C, and the like are provided. There is. The cleaning apparatus main body 72 is provided with a carrier transfer mechanism 94 that extends from the upper portion of the loader section 74 to above the transfer apparatuses 82a to 82c and reaches the unloader section 76.

The wafer carrier C emptied by the input buffer mechanism 70 is transferred to the carrier transfer mechanism 94 by the carrier lifter 92 and transferred to the output buffer mechanism 73. During the transfer, the wafer carrier C is cleaned by a cleaning device such as a shower device, and after cleaning, it is dried by a drying device such as a dry air sprayer. Therefore, in the output buffer mechanism 73, the cleaned wafers are transferred and stored in the cleaned and dried clean wafer carrier C.

Although the object to be processed in the above-mentioned embodiment is a semiconductor wafer, the present invention is not limited to the object to be processed, such as LC.
It is also applicable to a processing device for drying a D substrate, a glass substrate, or the like.

[0046]

As described above, according to the first treatment apparatus of the present invention, by providing the drain pipe with the opening / closing valve and the branch pipe, the moisture desorbed from the object to be treated by the vapor of the treatment liquid is provided. The processing liquid that has accumulated due to the condensation of the processing liquid vapor in the receiving vessel is efficiently collected in the processing liquid reservoir inside the processing tank during the waiting time without being wastefully discharged, and the processing liquid consumption amount is increased. Can be saved.

According to the second processing apparatus of the present invention,
Since the processing liquid condensed and liquefied from the vapor by cooling the cooling body is routed through the filter means by the processing liquid recovery pipe from the gutter means, the processing liquid is collected in the processing liquid reservoir in the processing tank.
It is possible to suppress the deterioration of the processing liquid and thus save the consumption of the processing liquid.

[Brief description of drawings]

FIG. 1 is a partial sectional front view showing the overall configuration of a processing apparatus according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional side view showing the overall configuration of the processing apparatus in the embodiment.

FIG. 3 is a schematic plan view showing the area of the tray with respect to the water desorption position in the processing apparatus of the embodiment.

FIG. 4 is a schematic partial perspective view for explaining the action during the processing time in the processing apparatus of the embodiment.

FIG. 5 is a schematic partial perspective view for explaining the operation during the standby time in the processing apparatus of the embodiment.

FIG. 6 is a schematic cross-sectional view showing how the processing liquid dropped from the cooling flexible pipe is received by the return portion of the board gutter in the processing apparatus of the embodiment.

FIG. 7 is a schematic plan view showing a split type gutter structure in the processing apparatus of the embodiment.

FIG. 8 is a schematic perspective view showing a configuration example in which the split type plate gutter structure of the embodiment is applied to a method of collecting the processing liquid from the cooling body by dropping it from the gap between the gutter means and the processing tank.

9 is a schematic side view showing the operation of the split type gutter structure of FIG. 8. FIG.

FIG. 10 is a diagram showing a configuration example of a semiconductor wafer cleaning system in which the processing apparatus according to the present invention is used.

[Explanation of symbols]

 12 heating device 14 treatment tank 16 treatment liquid 18 treatment liquid reservoir 20 steam treatment unit 24 saucer 26 drainage pipe 30 opening / closing valve 32 branch pipe 36 cooling fluted pipe 38 plate gutter 42 discharge pipe for treatment liquid 44 filter 46 for treatment liquid recovery Introductory pipe

Claims (2)

[Claims] 1. A volatile substance which is configured to be capable of accommodating an object to be treated and which has fallen from the surface of the object to be treated in an atmosphere of steam generated by heating a volatile treatment liquid accommodated in a treatment tank. In a processing device in which water containing a treatment liquid is collected in a predetermined container installed in the treatment tank and drained from the container through a drain pipe, an opening / closing valve is provided in the middle of the drain pipe. At the same time, in order to return the treatment liquid to the treatment liquid reservoir, a pipe is provided which branches from the drain pipe at a predetermined position closer to the container side than the on-off valve and has an open tip. Processing equipment. 2. The above treatment at a position higher than the vapor treatment section in order to cool and condense the vapor of a predetermined volatile treatment liquid used for moisture desorption treatment of the surface of the object to be treated in the treatment tank. A cooling body extending along a side wall of the tank, a gutter means for receiving a droplet of the processing liquid dropped from the cooling body at a position lower than the cooling body, and a filter means for filtering the processing liquid. And a pipe for collecting a treatment liquid that sends the treatment liquid collected by the gutter means to the filter means, and returns the treatment liquid filtered by the filter means to the treatment liquid reservoir in the treatment tank, A processing device characterized by being provided.