JPH07226351A - Process control system for semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] It is easy to use, can set complex processes, can easily meet the film-forming specifications of each customer, and can prevent gas explosion / leakage and ensure safety. [Structure] A lower-level control device 1 for controlling a film forming process of a wafer in a film forming chamber, an input device 2 for inputting a film forming pattern or the like for forming a film on a wafer, and displaying the film forming pattern or the like. A display device 3, a storage device 4 for storing a previously set film forming pattern, the input device 2, a display device 3
And a control device 5 for controlling the storage device 4, processing the film formation pattern stored in the storage device 4, transmitting the film formation pattern data to the lower control device, and controlling the same. Parameter setting for displaying a control parameter indicating a film pattern on the display device 3 and its screen display means 8; film formation pattern switching for switching two or more film formation patterns stored in the storage device 4 and its display means 9;
The control device 5 is provided with permission / non-permission determination and display means 10 for the input from the input device 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control system for controlling a semiconductor manufacturing apparatus for forming a film on a semiconductor wafer, and more particularly to a control system for a composite process.

[0002]

2. Description of the Related Art FIG. 7 is a block diagram showing a configuration of an example of a conventional system. The film forming system of the semiconductor manufacturing apparatus determines by creating and editing a recipe which is a collection of film forming patterns. A recipe is a set of specific film formation patterns (film formation procedure and control data). A conventional process-compatible control system inputs a lower-level control device 1 that controls a film forming process of a wafer in a plurality of, for example, three film forming chambers 11A to 11C, a film forming pattern for performing a film forming process of a wafer, and the like. An input device 2, a display device 3 for displaying the film formation pattern and the like, a storage device 4 for storing a preset film formation pattern and the like, the input device 2 and the display device 3
And a control device 5 for controlling the storage device 4, processing the film formation pattern stored in the storage device 4, transmitting the film formation pattern data to the lower control device 1, and controlling the data. The control device includes a recipe editing unit 6 that creates and edits a recipe that is a collection of film formation patterns that obtains film formation pattern data that is transmitted to the lower-level control device 1, and a recipe schedule display unit 7 that manages and displays the progress of the recipe. Please give it to 5.

A specific procedure for using the above structure will be described below. One recipe which is a film forming pattern of the semiconductor manufacturing apparatus is prepared for one film forming chamber. This recipe is stored in the storage device 4 in advance by displaying the recipe editing front face shown in FIG. 8 in the storage device 4 by the recipe editing means 6 for each of the film forming chambers 11A to 11C. In FIG. 8, REAC (Si (n)), REA
C (a-Si (i)), REAC (a-Si (n +))
Indicates the type of treatment, and indicates heating or treatment time, heating temperature (low) and (high), pressure, high-frequency power, used gas, etc. The control device 5 processes the recipe stored in the storage device 4, and controls the lower-level control device 1 according to the contents of the recipe. The progress of the control is displayed on the display device 3 by the recipe schedule display means 7, and the operator
You will know how much the processing of the device has progressed.
In this recipe, even if the same film formation is performed, there are many cases where a slight difference occurs between operators. Further, even when a film is formed by using the same gas, a film having different characteristics is formed due to the difference in processing temperature, elapsed time, and atmospheric pressure. In this case, since the same gas is used, there is no risk of contamination of the reaction chamber. Therefore, the recipe is often changed in order to find the best processing method for each operator.

[0004]

In the above-mentioned conventional example, it is necessary to rewrite the recipe in the storage device for the change, and the recipe used so far is erased from the storage device by this rewriting work. . That is, since the recipe (film formation pattern) is fixed, only a single film formation pattern can be set, and depending on the customer's specifications,
There is a problem that it is necessary to prepare a plurality of pages when the screen needs to be changed and a screen having a different film formation name is used while requiring a lot of man-hours, which deteriorates the operability of the operator. When changing the film formation pattern, change the program that constitutes the film formation pattern,
The method of creating the desired film formation pattern is adopted. Gases used for film formation include those that are easy to explode or poisonous depending on the condition, or those that are easily explosive when a plurality of gases are mixed, those that are toxic, and the like. The gas used for the normal film formation pattern was the result of thorough examination of safety, etc., and there is no problem in its use, but the film formation pattern created suddenly confirmed the safety of the gas used for this. Although it should not be implemented unless it is done afterwards, since the higher-level control device does not recognize this situation, it is not possible to prevent the use of dangerous gas, which not only impairs safety but also There is a problem that the recipe cannot be set twice in the film forming chamber.

[0005]

The present invention has been made in order to solve the above-mentioned problems, and a plurality of film formation patterns can be simultaneously set in one film formation chamber, and film formation specifications for each customer. To provide a process-compatible control system for semiconductor manufacturing equipment, which enables the user to set multiple film formation names and film formation patterns on a single page and also allows the user to set film formation patterns. . That is, the system of the present invention includes a lower control device 1 for controlling a film forming process of a wafer in a film forming chamber, an input device 2 for inputting a film forming pattern for forming a film on a wafer, and the film forming pattern. And the like, a storage device 4 for storing a preset film formation pattern, etc., the input device 2, the display device 3 and the storage device 4 are controlled and stored in the storage device 4. A parameter for processing the film-forming pattern, transmitting the film-forming pattern data to the lower-level control device 1 and controlling the same, and displaying a control parameter indicating the film-forming pattern on the display device 3. Setting and screen display means 8 thereof, film formation pattern switching for switching two or more film formation patterns stored in the storage device 4 and display means 9 thereof, permission / non-permission determination of input from the input device 2, and its And shows means 10 comprising brought Yes to the control device 5.

[0006]

[Operation] The film formation pattern stored in the storage device 4 is processed by the controller 5, and the film formation pattern data is transmitted to the lower controller 1 by the controller 5 to control the lower controller. The wafer is subjected to film formation processing in the film formation chambers 11A to 11C controlled by the lower-level control device, and the progress of the control is displayed on the display device 3. The control parameter setting indicating the film formation pattern is performed by the input device 2 by displaying the parameter setting screen on the display device 3 by the parameter setting and its screen display means 8, and switching of the film formation pattern stored in the storage device 4. Is performed by the input device 2 by switching and displaying the film formation pattern on the display device 3 by the display means 9 thereof, and the data in the storage device 4 is updated. The input determination information from the input device 2 is displayed on the display device 3 by the permission / non-permission determination display function 10.

[0007]

1 is a block diagram showing the configuration of an embodiment of the system of the present invention. In FIG. 1, 1 is a plurality, for example, 3
A lower-level control device that controls a film forming process of a wafer in each of the film forming chambers 11A to 11C, and includes a control unit and a transparent vacuum controller. Reference numeral 2 denotes an input device for inputting a film forming pattern or the like for forming a film on a wafer, which is a keyboard, a mouse or the like. Reference numeral 3 is a display device for displaying a film formation pattern or the like, such as a CRT or LCD. Reference numeral 4 denotes a storage device for storing a preset film formation pattern or the like, such as a floppy disk device or a fixed disk device. Reference numeral 5 denotes a control device having a microcomputer as a central processing unit, which controls the input device 2, the display device 3 and the storage device 4, processes the film formation pattern stored in the storage device 4, and stores the film formation pattern data in a lower order. It is transmitted to the control device 1 to control it.
The control device 5 sets and displays the parameter setting for displaying the control parameter indicating the film forming pattern on the display device 3, and the film forming pattern switching for displaying two or more film forming patterns stored in the storage device 4 and the display thereof. It has means 9 and means for permitting / inhibiting the input from the input device 2 and displaying the means 10.

The parameter setting of the control device 5 which transmits the film formation pattern data to the subordinate control device 1 and the film display pattern switching processing are performed by using the screen display means 8 on the parameter setting screen, and the film formation conditions (data ) Is rewritten. A processing flow is shown in FIG. 2 and a specific example is shown in Table 1.

[0009]

[Table 1]

The operator sets the parameter setting screen mode 3
2 is set and selected from the inputs 1 to 9 according to the type of film to be processed, the entered number is judged and judged by the display means 10, and when the desired number is stored in the storage device 4. . Then, the parameter data is transmitted to the lower-level controller 1, and the film forming conditions are rewritten.

FIG. 3 (A) is a diagram showing the relationship between the film type and the reaction treatment name on the parameter setting screen of the present invention, FIG. 3 (B).
Is a diagram showing the relationship between time and bals. Tables 2 to 9 show edit items for the film types 1 to 9 in the present invention, respectively.

[0012]

[Table 2]

[0013]

[Table 3]

[0014]

[Table 4]

[0015]

[Table 5]

[0016]

[Table 6]

By changing the contents of the parameter setting screen mode 32, the film formation pattern can be edited with the items required for the film formation. Film type No. Items 6 to 8 are unused and cannot be edited. Film type No. 9 is for super users, and edit items are fully open.

By setting the film forming conditions as described above with reference to FIG. 2, the recipe setting corresponding to the film forming conditions can be performed on one recipe screen. The processing flow is shown in FIG. All necessary memory areas in the storage device 4 are cleared once in order to secure a memory area for setting the film forming conditions 1 to 9 and to clarify a value that does not recognize data in the memory. The display screen of the display device 3 is set to a parameter setting screen (recipe edit screen) shown in FIG. 5 by the parameter setting and display means 8, and the input device 2 sets control parameters (film forming conditions). In the example of FIG. 5, the film type N
o. This is the case of 1. The control parameter is written in the storage device 4. The data stored in the storage device 4 depending on the film forming conditions can be edited if the flag in the storage device 4 is 1 in the parameter setting screen, and the data stored in the storage device 4 can be masked. The set film forming conditions are stored in an external storage device. In FIG. 5, R1 to R3 represent first to third film forming chambers in which the film forming process of the wafer is controlled by the lower controller 1, and H represents a heating chamber.

Next, the overall operation flow of the present invention is shown in FIG. The operator calls the parameter setting screen mode 32 from the subordinate control device 1, and the display device 3 displays the parameter setting screen mode 32.
The parameter setting screen shown in is displayed, and one of the inputs 1 to 9 is selected and set according to the type of the processed film. On this occasion,
Parameter data is transmitted from the control device 5 to the subordinate control device 1. For example, input 1 (Depo Name: BGES
M) is selected to change to the recipe setting screen shown in FIG. 5, and the film forming conditions are called from the file of the storage device 4 to set the film forming conditions. Then, the recipe is set, the recipe data is stored in a file, and the recipe data is transmitted from the control device 5 to the subordinate control device 1 to execute the recipe. In the case of this example, the film type No. The film treatment of No. 1 is performed. When changing the film formation pattern, the parameter setting screen shown in FIG. 3 may be displayed and changed.

[0020]

As described above, according to the present invention, different film formation patterns can be used on one screen, operability can be improved by switching pages, and setting errors can be prevented.
Easy to use. A composite process setting that simultaneously sets a plurality of film forming patterns for film forming processing in one film forming chamber can be performed, and film forming specifications for each customer can be easily met. Multiple types of film formation names and film formation patterns can be switched on a single page. Controller 5 and lower controller 1A-
By transmitting the film formation pattern data between 1C on the parameter setting screen, the film formation patterns can be mutually recognized, gas explosion and leakage can be prevented, and safety can be secured. It is possible to easily add or change the control settings by changing the screen format. It is possible to omit the program change of the recipe function due to the specification change.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of a system of the present invention.

FIG. 2 is a processing flowchart in the case of setting parameters and rewriting film forming conditions using the parameter setting screen of the present invention.

3A and 3B are diagrams showing a relationship between a film type and a reaction treatment name on a parameter setting screen of the present invention, and a view showing a relationship between time and pulse, respectively.

FIG. 4 is a processing flowchart for setting film forming conditions using the parameter setting screen of the present invention.

FIG. 5: Recipe edit screen 1 when inputting film forming conditions of the present invention
It is a figure which shows an example.

FIG. 6 shows an overall operational flowchart of the present invention.

FIG. 7 is a block diagram showing a configuration of an example of a conventional system.

FIG. 8 is a diagram showing an example of a conventional recipe edit screen.

[Explanation of symbols]

 1 Lower Control Device 2 Input Device 3 Display Device 4 Storage Device 5 Control Device 6 Recipe Editing Means 7 Recipe Schedule Displaying Means 8 Control Parameter Setting and Its Screen Displaying Means 9 Film Forming Pattern Switching and Its Displaying Means 10 Input Permission / Denyment Determination And its display means 11a to 11C First to third film forming chambers

Claims (1)

[Claims] 1. A lower control device for controlling a film forming process of a wafer in a film forming chamber, an input device for inputting a film forming pattern and the like for forming a film on a wafer, and displaying the film forming pattern and the like. A display device, a storage device that stores a preset film formation pattern, and the like, controlling the input device, the display device, and the storage device, processing the film formation pattern stored in the storage device, and forming the film formation pattern data. In a process-compatible control system for a semiconductor manufacturing apparatus, which comprises a control device for controlling the control device by transmitting it to a lower-level control device, and a parameter setting and its screen display means for displaying a control parameter indicating a film formation pattern on the display device, Film formation pattern switching for switching between two or more film formation patterns stored in the storage device and display means therefor, determination of permission / non-permission of input from the input device, and a table thereof A process-corresponding control system for a semiconductor manufacturing device, characterized in that the control device is provided with indicating means.