JPH0722748A - Device for preventing adhesion of harmful object to printed wiring board - Google Patents

Abstract

PURPOSE:To prevent unneeded flux from adhering to the electrode etc. of a printed wiring board without using any masking material such as a tape. CONSTITUTION:A surrounding member 22 for surrounding a region 5 for preventing flux 20 from being adhered to an electrode 2 of a printed wiring board 1 and an emission pipe 24 with an emission port 25 for emitting pressurized gas into the surrounding member 22 are provided to prevent the flux 20 in a mist from entering and being adhered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for preventing harmful substances from adhering to a wiring board such as a printed circuit board to prevent unnecessary flux or solder melt from adhering to the wiring board.

[0002]

2. Description of the Related Art A wiring board has an area where soldering is not required, and this area is also an area where flux or solder melt is not desired to adhere. An example is a connector electrode provided at the end of the wiring board. In the soldering process,
If, for example, flux adheres to the connector electrode, contact failure will occur during use. Therefore, masking was performed by attaching a tape to the electrode to prevent the adhesion of the harmful flux.

FIG. 8 is a plan view showing a conventional example in which a soldering unnecessary area of a wiring board is masked for preventing adhesion of harmful flux and solder. The electrode 2 for a connector is provided in a long shape at a portion which becomes the end portion 1a. 3A is a dividing V for dividing the wiring board 1 into, for example, 18 sheets.
The grooves 3B are also perforations for division. Reference numeral 4 denotes a masking tape (shown by a chain double-dashed line) attached to the electrode 2 as shown by a chain double-dashed line.

In this way, the wiring board 1 is conveyed in the direction of arrow A after the tape 4 is attached to the electrode 2 portion, flux processing and soldering processing are performed, and then the tape 4 is peeled off and then the V-shaped portion is formed. It is divided along the groove 3A and the perforation 3B.

[0005]

By the way, when the wiring board 1 having the electrode 2 is subjected to the flux treatment or the soldering treatment as described above, the region 5 where the electrode 2 is formed is formed.
Although the tape 4 is attached to the tape, attaching the tape 4 requires an operation of attaching the tape 4 and an operation of peeling the tape 4 after the soldering process. After the flux treatment, the adhesive of the tape 4 adheres to the electrode 2 due to the heat during the soldering treatment, so that when the tape 4 is peeled off, the adhesive remains on the electrode 2 in some places. Therefore, a cleaning device for removing this adhesive is provided. However, there is a problem in that the number of working steps is increased and the production cost is increased.

The present invention has been made in order to solve the above-mentioned conventional problems, and a wiring board in which harmful substances are not attached by surrounding an area such as an electrode of the wiring board that does not require soldering with an enclosing member. The purpose of the present invention is to obtain a device for preventing harmful substances from adhering to.

[0007]

A harmful substance adhesion preventing device for a wiring board according to the present invention comprises an enclosing member having an opening for enclosing a region for preventing adhesion of harmful substances.

Further, the enclosing member is provided with an ejection pipe having an ejection port for ejecting the pressurized gas therein.

Further, the ejection ports are formed so as to be distributed over a length substantially the same as the length of the ejection pipe in the longitudinal direction.

Further, the enclosing member has a U-shaped arc-shaped cross section on the side where harmful substances adhere.

Further, the surrounding member has a V-shaped acute angle in cross section on the side to which harmful substances adhere.

Further, since the harmful material attached to the outer side and the lower surface of the enclosing member is promoted, the hanging cover formed in a U-shaped arcuate shape or a V-shaped cross section has the enclosing member of the enclosing member. It is detachably attached to the lower surface.

[0013]

In the present invention, for example, the atomized flux ejected from the ejection port of the spray nozzle is applied except for the portion covered with the enclosing member.

Further, the pressurized gas ejected from the ejection pipe in the enclosing member is discharged to the outside through the gap between the wiring board and the enclosing member, and the intrusion of the mist-like flux is surely prevented.

Further, since the jet outlet is applied over a length substantially the same as the length of the jet pipe in the longitudinal direction, the atomized flux can be prevented from entering the entire opening.

The flux adhering to the side surface or the lower surface of the enclosing member has a U-shaped or V-shaped cross section on the side of the enclosing member on which harmful substances adhere, or drip is promoted by a hanging cover having a similar cross-sectional shape. To be done. Further, the flow of harmful substances such as flux and solder melt becomes smooth.

[0017]

1 is a perspective view showing the outline of an embodiment of the present invention, the same reference numerals as those in FIG. 8 designate the same parts, and in FIG. 1, a spray type fluxer will be described as an example, and 11 is a spray type. Denoted by a flexor is a conveyor 12, which holds or mounts the wiring substrate 1 and conveys it in the direction of arrow A by driving the motor 13. Reference numeral 14 denotes a flux spraying device, 15 is a spray nozzle, which is fixed to a slider 17 of an actuator 16,
By driving the motor 19 via the chain 18, the wiring board 1 is reciprocated in a direction (arrow B direction) intersecting the conveyance direction (arrow A direction) of the wiring board 1, and the flux 20 is sprayed and applied to the wiring board 1. Reference numeral 21 denotes a harmful substance adhesion preventing device (hereinafter referred to as a flux adhesion preventing device), which is an electrode 2 of the wiring board 1.
(In FIG. 1, the electrode 2 is shown on the lower surface, that is, on the surface to which the flux 20 is applied, so that it is shown by a chain double-dashed line.) The members 22 are provided in the number corresponding to the area 5. An opening 23 is provided above the enclosing member 22, and its longitudinal direction is attached in the same direction as the carrying direction of the wiring board 1 (direction of arrow A) so that the electrode 2 is covered even if the wiring board 1 moves. It has become.

FIG. 2 shows a flux adhesion preventing device 21 of FIG.
1 is a side view showing the details of FIG. 1, and the same reference numerals as those in FIG. 1 denote the same parts. Reference numeral 24 denotes an ejection pipe provided in the surrounding member 22. By ejecting a pressurized gas such as ₂ gas, the atomized flux 20 is prevented from adhering to the electrode 2 of the wiring substrate 1 which is held with a slight gap from the upper portion of the opening 23. 26 is a blower pipe for blowing a pressurized gas to the jet pipe 24, 27 is a support stand for attaching and fixing both longitudinal ends of the enclosing member 22, 28 is a base attached to the fluxer 11, and is supported. A height adjusting device 31 for adjusting the height of the enclosing member 22 is provided between the table 27 and the stand 27. Reference numeral 32 is an upper threaded rod, 33 is a lower threaded rod, and threads in mutually opposite directions are formed, and they are respectively screwed into rotatable nuts 34. Also, the lower threaded rod 33
The lower end of is attached to a pedestal 35 on a base 28, and a lower screw rod 33 is fixed by rotating a thumbscrew 36.

The pedestal 35 is provided with slit-shaped holes in its longitudinal direction (direction perpendicular to the plane of the drawing),
The fixed position of the lower screw rod 33, and thus the position of the flux adhesion preventing device 21, can be arbitrarily determined along the slit-shaped hole.

Reference numeral 37 denotes a hanging cover for facilitating the dripping of the flux 20 attached to the side surface or the lower surface of the enclosing member 22 and smoothing the flow of the flux. Screw 38
It is removable by.

FIGS. 3A and 3B show the hanging cover 3 of FIG.
7A is a perspective view showing the shape of FIG. 7, and FIG. 3A is formed in a U-shaped arc shape in section, and FIG. 3B is formed in a V-shaped acute angle shape.

The cross section of the enclosing member 22 shown in FIG. 1 is not limited to the U-shape, but like the hanging cover 37 of FIGS. 3 (a) and 3 (b), the cross section has a U-shaped arc shape or a circular shape. It may be formed in a V-shaped acute angle. Therefore, in this case, the hanging cover 37 is not necessary for the enclosing member 22.

Next, the operation will be described. Wiring board 1
1, after being held or placed on the conveyor 12.
The flux 20 is conveyed in the direction of arrow A in FIG. 2 and sprayed from the spray nozzle 15. At this time, the spray nozzle 15 reciprocates in the direction of arrow B in FIG. 1 by driving the actuator 16, and the wiring board 1 surrounds the enclosing member 22.
The flux 20 is applied except the part of the electrode 2 covered with.

Further, the pressurized gas from the blower pipe 26 is ejected from the ejection port 25 of the ejection pipe 24 to eject the opening 23 and the wiring board 1.
It is possible to prevent the atomized flux 20 from adhering to the electrode 2 because it is discharged to the outside through the gap between and.

As shown in FIGS. 3A and 3B, the flux 20 attached to the side surface or the lower surface of the enclosing member 22 is attached to the enclosing member 22 with a hanging cover 37 having a U-shaped or V-shaped cross section. Accordingly, by making the cross-section of the enclosing member 22 U-shaped or V-shaped, the flux 20 which has become liquid due to being attached to the enclosing member 22 is accelerated. Furthermore, the flow of the mist-like flux 20 becomes smooth, and since the hanging cover 37 can be attached and detached, the work of cleaning the hanging cover 37 becomes easy.

FIG. 4 is a sectional view showing the mounting of the enclosing member 22 when the electrodes 2 of the wiring board 1 are formed on both surfaces of the wiring board 1, and the same reference numerals as those in FIG. 2 indicate the same parts. The reason why the electrode 2 is also on the upper surface in this way is to prevent the mist-like flux 20 that is scattered in the fluxer 11 from adhering to the upper surface, and thereby to prevent even a slight adhesion. can do. The arrow C in the figure indicates the flow of the pressurized gas.

In FIG. 4, the enclosing member 22 has a U-shaped cross section, but the enclosing member 22 may have a V-shaped cross section.

FIG. 5 is an explanatory view showing the flow of the pressurized gas ejected from the ejection pipe 24, the same reference numerals as those in FIG. 2 indicate the same parts, and the arrow C in the figure indicates the flow of the pressurized gas.

FIG. 6 is a schematic diagram showing an example in which the flux adhesion preventing device 21 using a spray-type fluxer can be applied to a foam-type fluxer and a jet-type or flow-type solder bath. , 41 is a foaming flux, and 42 is a foaming flux. Further, 51 is a jet type or flow type solder bath, and 52 is a solder melt.

FIG. 7 is a perspective view showing another embodiment of the present invention. An area (a portion surrounded by a chain double-dashed line) 61 where the flux 20 is not desired to be applied to the flux application surface of the wiring board 1.
If there is any, an enclosing member 62 having the same shape as the region 61 is used. In this case, the region 61 of the wiring board 1 conveyed in the direction of the arrow A and the opening 63 of the enclosing member 62 coincide with each other. The wiring board 1 is once stopped at the position where the spray nozzle 15 is applied with the atomized flux 20. Further, 64 is a blower pipe for sending pressurized gas, 65 is a partition plate that partitions the surrounding member 62 in the vertical direction, and 66 is an ejection port formed in the partition plate 65.

The wiring board 1 thus conveyed has a slight gap with the opening 63 of the enclosing member 62, so that the pressurized gas from the blower pipe 64 enters below the partition plate 65. And is sprayed onto the wiring board 1 and discharged from the opening 63 to the outside.

Therefore, the atomized flux 20 is not applied to the inside of the surrounding member 62.

As described above, in the above-described embodiment, an example in which the spray nozzle 15 ejects the atomized flux 20 as shown in FIG. 1 has been described, but as shown in FIG. The fluxer 41 and the jet or flow type solder bath 51 can be used with the same configuration.

[0034]

As described above, according to the present invention, since the enclosure member having the opening for enclosing the area for preventing harmful substances from adhering to the upper portion is provided above, it is unnecessary to attach the masking member, which has been conventionally performed. Therefore, the production cost can be reduced, the productivity can be improved, and the adhesive does not remain on the electrodes or the like after peeling off the attached mask like the conventional example using the mask. It has the advantage that the reliability of the wiring board can be improved.

Further, since the ejection pipe for ejecting the pressurized gas is provided inside the enclosing member, it is possible to completely prevent the penetration of the mist-like flux.

Further, since the ejection ports for ejecting the pressurized gas are distributed over the length substantially the same as the longitudinal direction of the ejection pipe, it is necessary to prevent the inflow of the liquid flux over almost the entire area of the opening. You can

Further, the enclosing member is formed in a U-shaped arcuate shape or a V-shaped acute angle on the side on which the harmful substances adhere, and the enclosing member is designed to prevent the harmful substances adhering to the lateral and lower surfaces outside thereof from falling. Since the drooping cover that is promoted is detachably attached to the lower surface of the surrounding member, the flux or solder melt that has become liquid due to the surrounding member is run out, and the surrounding member due to the adhesion of the flux or solder is promoted. This has the advantage that the pollution of

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of an embodiment of the present invention.

FIG. 2 is a side view showing details of the flux adhesion preventing device of FIG.

3 is a perspective view showing the shape of the hanging cover of FIG. 2. FIG.

FIG. 4 is a cross-sectional view showing the attachment of the enclosing member.

FIG. 5 is an explanatory diagram showing a flow of a pressurized gas ejected from an ejection pipe with respect to a spray-type fluxer.

FIG. 6 is a schematic configuration diagram showing an example in which a flux adhesion preventing device using a spray type flux can be applied to a foaming type fluxer and a jet type solder bath.

FIG. 7 is a perspective view showing another embodiment of the present invention.

FIG. 8 is a plan view showing a conventional example in which a wiring board is masked.

[Explanation of symbols]

 1 Wiring Board 5 Area 20 Flux 21 Flux Adhesion Preventing Device 22 Enclosing Member 23 Opening 24 Spouting Pipe 25 Spouting 37 Drop Cover

Claims (6)

[Claims] 1. An apparatus used in a flux applying process or a soldering process of a wiring board having a region for preventing harmful substances from adhering, the enclosure member having an opening portion surrounding the region for preventing harmful substances from adhering. A device for preventing harmful substances from adhering to a wiring board, characterized by being provided. 2. The device for preventing adherence of harmful substances to a wiring board according to claim 1, wherein the enclosing member is provided with an ejection pipe having an ejection port for ejecting a pressurized gas therein. 3. The prevention of adherence of harmful substances to a wiring board according to claim 2, wherein the ejection ports are formed so as to be distributed over substantially the same length as the longitudinal direction of the ejection pipe. apparatus. 4. The enclosure member has a U-shaped arc-shaped cross section on the side to which harmful substances adhere.
The device for preventing adherence of harmful substances to a wiring board according to (1) or (2). 5. The enclosure member has a V-shaped acute angle in cross section on the side to which harmful substances adhere.
The device for preventing adherence of harmful substances to a wiring board according to (1) or (2). 6. The enclosure member has a drooping cover formed in a U-shaped arc or V-shape in cross section so that the harmful substances attached to the outer sides and the lower surface of the enclosure member are accelerated. The device for preventing attachment of harmful substances to a wiring board according to any one of claims (1) to (3), which is detachably attached to the lower surface.