JPH0722896A - Surface acoustic wave generator and method for assembling the same - Google Patents
Surface acoustic wave generator and method for assembling the sameInfo
- Publication number
- JPH0722896A JPH0722896A JP15936793A JP15936793A JPH0722896A JP H0722896 A JPH0722896 A JP H0722896A JP 15936793 A JP15936793 A JP 15936793A JP 15936793 A JP15936793 A JP 15936793A JP H0722896 A JPH0722896 A JP H0722896A
- Authority
- JP
- Japan
- Prior art keywords
- package
- surface acoustic
- acoustic wave
- electrode
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 6
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、通信機器に用いられる
弾性表面波素子を収容した弾性表面波発生装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave generator containing a surface acoustic wave element used in communication equipment.
【０００２】[0002]
【従来の技術】図２は従来装置の１例を示す斜視図、図
３は同じくその縦断面図である。この従来例はパッケー
ジ１内底部に弾性表面波素子３を収容して導電樹脂接着
剤１１で固定し、パッケージ電極５と弾性表面波素子３
の電極８をＡｕ（金）あるいは、Ａｌ（アルミニウム）
のワイヤー１２によりボンディング接続し、金属キャッ
プ１０で封止してなる構成になっている。2. Description of the Related Art FIG. 2 is a perspective view showing an example of a conventional device, and FIG. 3 is a vertical sectional view of the same. In this conventional example, the surface acoustic wave element 3 is housed in the bottom of the package 1 and fixed by a conductive resin adhesive 11, and the package electrode 5 and the surface acoustic wave element 3 are fixed.
Electrode 8 of Au (gold) or Al (aluminum)
The wire 12 is connected by bonding and is sealed with the metal cap 10.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記従来
例にあっては、ワイヤーボンディング接続のためのワ
イヤー１２のループ形状に制約がありワイヤーループ自
体の高さがパッケージ１の薄型化の障害になっている。
ワイヤーボンディング接続のワイヤー１２とキャップ
１０の機械的・電気的接続を防ぐためにワイヤー１２と
キャップ１０との間にクリアランス（隙間）が必要にな
り小型化への障害になっている。Ａｕあるいは、Ａｌ
のワイヤー１２によるワイヤーボンディング接続が製品
価格の低減の障害になっている。However, in the above-mentioned conventional example, the loop shape of the wire 12 for wire bonding connection is restricted, and the height of the wire loop itself becomes an obstacle to making the package 1 thinner. There is.
A clearance is required between the wire 12 and the cap 10 in order to prevent mechanical / electrical connection between the wire 12 and the cap 10, which is an obstacle to miniaturization. Au or Al
The wire bonding connection by the wire 12 is an obstacle to the reduction of the product price.
【０００４】[0004]
【課題を解決するための手段】本発明は上記の課題を解
決するためになされたものであって、小型で薄型の安価
な表面弾性波発生装置を提供しようとするものである。
即ち、本発明装置は、パッケージ１内底部に凹部２を設
け、この凹部２に弾性表面波素子３を収容し、パッケー
ジ１内底部に回路素子４を配設し、パッケージ１内底部
のパッケージ電極５と回路素子４のパッケージ接続用電
極６及び回路素子４の弾性表面波素子接続用電極７と弾
性表面波素子３の電極８をそれぞれワイヤレスボンディ
ングで接続してなる。又、本発明方法はパッケージ１内
底部に配設される回路素子４の弾性表面波素子接続用電
極７又はパッケージ１内部に設けた凹部２に収容される
弾性表面波素子３の電極８上に金属バンプ９を形成して
両者を接続し、弾性表面波素子３を接続した回路素子４
のパッケージ接続用電極６又はパッケージ１のパッケー
ジ電極５上に金属バンプ９を形成して両者を接続するこ
とを特徴とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a small-sized, thin and inexpensive surface acoustic wave generator.
That is, in the device of the present invention, the recess 2 is provided in the inner bottom of the package 1, the surface acoustic wave element 3 is housed in the recess 2, the circuit element 4 is disposed in the inner bottom of the package 1, and the package electrode of the inner bottom of the package 1 is provided. 5, the package connection electrode 6 of the circuit element 4, the surface acoustic wave element connection electrode 7 of the circuit element 4 and the electrode 8 of the surface acoustic wave element 3 are connected by wireless bonding. Further, the method of the present invention is carried out on the surface acoustic wave element connecting electrode 7 of the circuit element 4 arranged at the bottom of the package 1 or the electrode 8 of the surface acoustic wave element 3 accommodated in the recess 2 provided inside the package 1. A circuit element 4 in which a metal bump 9 is formed to connect the two, and a surface acoustic wave element 3 is connected.
The metal bumps 9 are formed on the package connecting electrodes 6 or the package electrodes 5 of the package 1 to connect them.
【０００５】[0005]
【作 用】このようにパッケージ１内底部に凹部２を設
けて弾性表面波素子３を収容したこと、パッケージ１内
底部の電極５と該底部に配設した回路素子４の電極６及
び回路素子４の電極７と弾性表面波素子３の電極８をそ
れぞれワイヤレスボンディングにより接続したことによ
り回路素子４による機能回路を有している上、小型、薄
型にすることができ、製品価格を大幅に低減することが
できることになる。[Operation] In this way, the concave portion 2 is provided in the inner bottom of the package 1 to accommodate the surface acoustic wave element 3, and the electrode 5 of the inner bottom of the package 1 and the electrode 6 of the circuit element 4 and the circuit element arranged on the bottom. By connecting the electrode 7 of 4 and the electrode 8 of the surface acoustic wave element 3 by wireless bonding, respectively, a functional circuit by the circuit element 4 is provided, and further, it can be made small and thin, and the product price is greatly reduced. You will be able to do it.
【０００６】[0006]
【実施例】図１は本発明実施例の１実施例の構成を示す
縦断面図で、１はパッケージ、１０は金属キャップであ
る。パッケージ１内底部に凹部２が設けられ、この凹部
２に弾性表面波素子３が収容されており、パッケージ１
内底部には回路を形成したＳｉチップやＩＣチップ等の
回路素子４が配置されている。パッケージ１内底部のパ
ッケージ電極５と回路素子４のパッケージ接続用電極６
及び回路素子４の弾性表面波素子接続用電極７と弾性表
面波素子３の電極８がそれぞれＡｕ等のバンプ９を形成
してワイヤレスボンディングで接続されている。1 is a longitudinal sectional view showing the construction of one embodiment of the present invention, in which 1 is a package and 10 is a metal cap. A recess 2 is provided in the bottom of the package 1, and the surface acoustic wave element 3 is housed in the recess 2.
A circuit element 4 such as a Si chip or an IC chip on which a circuit is formed is arranged on the inner bottom portion. The package electrode 5 at the bottom of the package 1 and the package connection electrode 6 of the circuit element 4
Also, the surface acoustic wave element connecting electrode 7 of the circuit element 4 and the electrode 8 of the surface acoustic wave element 3 are connected by wireless bonding by forming bumps 9 of Au or the like.
【０００７】上記の構成において、本実施例の組立てに
ついて説明する。まず、回路素子４の弾性表面波素子接
続用電極７あるいは弾性表面波素子３の電極８上にＡｕ
等のバンプ９を形成し、回路素子４と弾性表面波素子３
の接続を行い、弾性表面波素子３を接続した回路素子４
のパッケージ接続用電極６もしくは、パッケージ１のパ
ッケージ電極５上にＡｕ等のバンプ９を形成し、回路素
子４とパッケージ１の接続を行う。しかる後、金属の薄
板でできたキャップ１０をパッケージ１上部に載せ封止
を行い、組立てを終了する（但し、接続強度の関係上、
補強のためチップ周囲に樹脂を塗布したり、又は封止を
キャップではなく樹脂等でコートする場合もある）。回
路素子４と弾性表面波素子３の接続、回路素子４とパッ
ケージ１の接続工法は、超音波加熱圧着又は半田等の金
属溶融や接着剤（導電性樹脂）等の方法により行われ
る。このようにパッケージ１内底部に凹部２を設けて弾
性表面波素子３を収容したこと、パッケージ１内底部の
電極５と該底部に配設した回路素子４の電極６及び回路
素子４の電極７と弾性表面波素子３の電極８をそれぞれ
ワイヤレスボンディングにより接続したことにより回路
素子４による機能回路を有している上、小型、薄型にす
ることができ、製品価格を大幅に低減することができる
ことになる。The assembly of the present embodiment having the above structure will be described. First, Au is placed on the surface acoustic wave element connecting electrode 7 of the circuit element 4 or the electrode 8 of the surface acoustic wave element 3.
Bumps 9 are formed, and the circuit element 4 and the surface acoustic wave element 3 are formed.
Circuit element 4 to which surface acoustic wave element 3 is connected
The bumps 9 made of Au or the like are formed on the package connecting electrodes 6 or the package electrodes 5 of the package 1 to connect the circuit element 4 and the package 1. Thereafter, the cap 10 made of a thin metal plate is placed on the upper part of the package 1 and sealed, and the assembly is completed (however, due to the connection strength,
Resin may be applied around the chip for reinforcement, or sealing may be coated with resin or the like instead of the cap). The method of connecting the circuit element 4 and the surface acoustic wave element 3 and the method of connecting the circuit element 4 and the package 1 are performed by a method such as ultrasonic thermocompression bonding or metal melting such as soldering or an adhesive (conductive resin). Thus, the concave portion 2 is provided in the inner bottom portion of the package 1 to accommodate the surface acoustic wave element 3, the electrode 5 on the inner bottom portion of the package 1, the electrode 6 of the circuit element 4 and the electrode 7 of the circuit element 4 disposed on the bottom portion. By connecting the electrode 8 of the surface acoustic wave element 3 and the electrode 8 of the surface acoustic wave element 3 by wireless bonding, the circuit element 4 has a functional circuit and can be made small and thin, and the product price can be significantly reduced. become.
【０００８】[0008]
【発明の効果】上述のように本発明によれば、パッケー
ジ１内底部に凹部２を設け、この凹部２に弾性表面波素
子３を収容し、パッケージ１内底部に回路素子４を配設
し、パッケージ１内底部のパッケージ電極５と回路素子
４のパッケージ接続用電極６及び回路素子４の弾性表面
波素子接続用電極７と弾性表面波素子３の電極８をそれ
ぞれワイヤレスボンディングで接続してなるので、パッ
ケージ１内底部の凹部２にパッケージ１内底部に凹部２
を設けて弾性表面波素子３を収容したこと、パッケージ
１内底部の電極５と該底部に配設した回路素子４の電極
６及び回路素子４の電極７と弾性表面波素子３の電極８
をそれぞれワイヤレスボンディングにより接続したこと
により回路素子４による機能回路を有している上、小
型、薄型にすることができ、製品価格を大幅に低減する
ことができる。As described above, according to the present invention, the concave portion 2 is provided in the inner bottom portion of the package 1, the surface acoustic wave element 3 is accommodated in the concave portion 2, and the circuit element 4 is arranged in the inner bottom portion of the package 1. , The package electrode 5 on the inner bottom of the package 1, the package connecting electrode 6 of the circuit element 4, the surface acoustic wave element connecting electrode 7 of the circuit element 4 and the electrode 8 of the surface acoustic wave element 3 are connected by wireless bonding, respectively. Therefore, the recess 2 in the inner bottom of the package 1 is recessed in the inner bottom of the package 1.
Is provided to accommodate the surface acoustic wave element 3, the electrode 5 at the bottom of the package 1, the electrode 6 of the circuit element 4 and the electrode 7 of the circuit element 4 and the electrode 8 of the surface acoustic wave element 3 disposed at the bottom.
Since each of them is connected by wireless bonding, the circuit element 4 has a functional circuit and can be made small and thin, and the product price can be significantly reduced.
【図１】本発明装置の１実施例の構成を示す縦断面図で
ある。FIG. 1 is a vertical cross-sectional view showing the configuration of an embodiment of the device of the present invention.
【図２】従来装置の１例を示す斜視図である。FIG. 2 is a perspective view showing an example of a conventional device.
【図３】同じくその縦断面図である。FIG. 3 is a vertical sectional view of the same.
１ パッケージ ２ 凹部 ３ 弾性表面波素子 ４ 回路素子 ５ パッケージ電極 ６ パッケージ接続用電極 ７ 弾性表面波素子接続用電極 ８ 電極 1 Package 2 Recess 3 Surface Acoustic Wave Element 4 Circuit Element 5 Package Electrode 6 Package Connecting Electrode 7 Surface Acoustic Wave Element Connecting Electrode 8 Electrode
Claims (2)
設け、この凹部（２）に弾性表面波素子（３）を収容
し、パッケージ（１）内底部に回路素子（４）を配設
し、パッケージ（１）内底部のパッケージ電極（５）と
回路素子（４）のパッケージ接続用電極（６）及び回路
素子（４）の弾性表面波素子接続用電極（７）と弾性表
面波素子（３）の電極（８）をそれぞれワイヤレスボン
ディングで接続してなる弾性表面波発生装置。1. A recess (2) is provided in the inner bottom of the package (1), a surface acoustic wave element (3) is housed in the recess (2), and a circuit element (4) is placed in the inner bottom of the package (1). The package electrode (5) at the inner bottom of the package (1), the package connection electrode (6) of the circuit element (4), and the surface acoustic wave element connection electrode (7) of the circuit element (4) and the surface acoustic wave. A surface acoustic wave generator in which the electrodes (8) of the element (3) are connected by wireless bonding.
路素子（４）の弾性表面波素子接続用電極（７）又はパ
ッケージ（１）内部に設けた凹部（２）に収容される弾
性表面波素子（３）の電極（８）上に金属バンプ（９）
を形成して両者を接続し、弾性表面波素子（３）を接続
した回路素子（４）のパッケージ接続用電極（６）又は
パッケージ（１）のパッケージ電極（５）上に金属バン
プ（９）を形成して両者を接続することを特徴とする弾
性表面波発生装置の組立方法。2. Elasticity housed in a surface acoustic wave device connecting electrode (7) of a circuit element (4) arranged at the bottom of the package (1) or in a recess (2) provided inside the package (1). Metal bumps (9) on the electrodes (8) of the surface acoustic wave element (3)
A metal bump (9) on the package connection electrode (6) of the circuit element (4) or the package electrode (5) of the package (1) in which the surface acoustic wave element (3) is connected by forming A method for assembling a surface acoustic wave generator, characterized in that the two are formed and connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15936793A JPH0722896A (en) | 1993-06-29 | 1993-06-29 | Surface acoustic wave generator and method for assembling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15936793A JPH0722896A (en) | 1993-06-29 | 1993-06-29 | Surface acoustic wave generator and method for assembling the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0722896A true JPH0722896A (en) | 1995-01-24 |
Family
ID=15692293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15936793A Pending JPH0722896A (en) | 1993-06-29 | 1993-06-29 | Surface acoustic wave generator and method for assembling the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722896A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892930A (en) * | 2010-03-25 | 2013-01-23 | 三菱丽阳株式会社 | Anodizing device, treatment tank, method for producing roll-shaped mold for imprinting, and method for producing article having plurality of protruding parts on surface |
| JP2019050478A (en) * | 2017-09-08 | 2019-03-28 | 株式会社大真空 | MEMS oscillator |
-
1993
- 1993-06-29 JP JP15936793A patent/JPH0722896A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892930A (en) * | 2010-03-25 | 2013-01-23 | 三菱丽阳株式会社 | Anodizing device, treatment tank, method for producing roll-shaped mold for imprinting, and method for producing article having plurality of protruding parts on surface |
| CN102892930B (en) * | 2010-03-25 | 2015-10-21 | 三菱丽阳株式会社 | The impression manufacture method of roll mould |
| JP2019050478A (en) * | 2017-09-08 | 2019-03-28 | 株式会社大真空 | MEMS oscillator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5869886A (en) | Flip chip semiconductor mounting structure with electrically conductive resin | |
| US5442231A (en) | Semiconductor device | |
| JP2001196488A (en) | Electronic component device and manufacturing method thereof | |
| JP3418373B2 (en) | Surface acoustic wave device and method of manufacturing the same | |
| KR20010021017A (en) | Mounting method for electronic device elements and manufacturing method for surface acoustic wave device | |
| JPS62232948A (en) | Lead frame | |
| JP4014967B2 (en) | Crystal oscillator for surface mounting | |
| JPH0818390A (en) | Surface acoustic wave device | |
| JP3555062B2 (en) | Structure of semiconductor device | |
| JPH10335366A (en) | Semiconductor device | |
| JPH08139241A (en) | Lead frame and semiconductor integrated circuit device using the same | |
| JP2581203B2 (en) | Semiconductor device | |
| KR100218335B1 (en) | Chip size package | |
| JPS638620B2 (en) | ||
| JP3587001B2 (en) | Pressure sensor | |
| JPH10125850A (en) | Lead frame, semiconductor device and method of manufacturing the same | |
| JPH0755014Y2 (en) | Mounting structure | |
| JP2002261580A (en) | Surface acoustic wave device | |
| JP2007281182A (en) | Resin-sealed semiconductor device | |
| JPH0366150A (en) | Semiconductor integrated circuit device | |
| JPH04301910A (en) | Surface acoustic wave device | |
| JPH08181165A (en) | Semiconductor integrated circuit | |
| KR200234101Y1 (en) | Wire Bonding Structure of Semiconductor Package | |
| JPH05308243A (en) | Surface acoustic wave electronic component | |
| JPH0685524U (en) | Surface acoustic wave device |