JPH07231028A - Conveying apparatus and conveying method - Google Patents

Abstract

PURPOSE:To provide a tunnel type conveying apparatus whereby the height and orientation of a wafer can be so modified as to be adapted to the configurations of the delivering means and the wafer processing means of a processor and whereby the transferrings of such objects to be carried as wafers can be performed smoothly in the boundary region between the processor and the tunnel type carrying apparatus without the complicating and large-sizing of the apparatus. CONSTITUTION:In a tunnel type conveying apparatus, a conveying carriage 9 for mounting a wafer 5 thereon is provided inside a tunnel 7, and the wafer 5 is conveyed in the state wherein the outside air is cut off by a barrier plate 8 to be the crust of the tunnel 7. In this tunnel type carrying apparatus, a platform 1 for putting the wafer 5 thereon, a moving means 4 for moving up and down the platform 1 and a phase modifying means 33 are further provided. By the phase modifying means 33, the circumferential position of an orientation flat provided on the wafer 5 which is in the state wherein the wafer 5 is put on the platform 1 is so modified as to coincide with a predetermined position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device, and more particularly to a tunnel transfer device which has a transfer carriage for mounting a wafer inside a tunnel and transfers the wafer while the outside air is blocked by a tunnel partition wall.

[0002]

2. Description of the Related Art Recently, an extremely high degree of cleanliness is required for semiconductor manufacturing, and in order to prevent particle contamination or molecular contamination such as oxidation, a process such as a wafer is not exposed to the outside air. There is a need to transport between devices. As one of such transfer methods, it has been attempted to connect a plurality of process devices with a tunnel type transfer device, mount a wafer on a transfer carriage, and transfer the wafer in a tunnel. FIG. 11 shows an example of a semiconductor manufacturing line in which a plurality of process devices are connected by a tunnel transfer device.

FIG. 12 is a sectional view taken along the line AA shown in FIG. As shown in this figure, process devices A and B are arranged opposite to each other on both sides of the transfer tunnel 7. Each of the process devices A and B has a robot 1
1 and 12 are arranged, the wafer 5 is transferred from the transfer carriage 9 traveling in the tunnel 7 to the process chambers 25 of the process apparatuses A and B, and, conversely, the processing is completed in the process apparatuses A and B. The processed wafer 5 is processed by the process equipment A,
It is taken out from B and transferred to the carrier 9, and the carrier 9 travels through the tunnel 7 and carries it to the next processing device.

The transport carriage 9 moves inside the tunnel 7 by a linear motor (not shown) mounted outside the partition wall 8 of the tunnel 7, a stop positioning device, and the like, transports the wafer 5, and stops at a predetermined position.

As a tunnel type transfer device, a magnetic levitation transfer device has been developed which allows a transfer carriage to travel inside the tunnel without contacting the partition walls of the tunnel. According to such a transfer device, An object to be transferred such as a wafer can be transferred between the processing devices in an extremely clean environment without generating particles in the tunnel.
An example of such a magnetic levitation transport device is disclosed in detail in PCT / JP93 / 009930 by the present inventors. In this device, a member such as a magnetic sensor or an electromagnet that may generate gas is arranged on the atmosphere side of the partition wall of the tunnel, and the carrier truck inside the tunnel, which is shielded from the outside air through the thin partition wall, is levitated. Similarly, the carrier truck is made to run or stopped by a linear motor or the like arranged outside the partition wall of the tunnel. Further, according to such a magnetic levitation transport device, it is possible for the transport carriage to travel in the orthogonal direction in the tunnel having the orthogonal branches.

[0006]

By the way, in the boundary area between the process apparatus and the tunnel transfer apparatus as described above, the process apparatus A facing each other such as transferring the wafer 5 from the process apparatus A to the process apparatus B. , B in the process apparatus A, the robot 11 of the process apparatus A once places the wafer 5 on the transfer carriage 9, and then the robot 12 of the process apparatus B picks up the wafer 5 on the transfer carriage 9, The operation of transferring into B is performed. That is, between the process devices A and B facing each other,
When the wafer 5 is transferred, the transfer carriage 9 has to be stopped between the process apparatuses A and B as a temporary stand for transferring the wafer 5, although it is not necessary to transfer the wafer 5. Further, when the carrier 9 happens to be moving to another position in the tunnel, the wafer 5
However, the time until the carriage 9 is returned between the process devices A and B is wasted.

Further, as shown in FIG. 13, a method of directly delivering the wafer 5 by the robots 11 and 12 between the process apparatuses A and B can be considered. However, in such a case, as shown in FIG. 14, the fingers 13 and 14 must have shapes that do not interfere with each other. However, the shapes of the fingers 13 and 14 are the process device A,
It is determined corresponding to the shape of a wafer table (not shown) or the like placed in the process chamber 25 of B.
As shown in FIG. 4, it was not easy to change the fingers 13 and 14 so as not to interfere with each other. For this reason, the robots 11 and 1 are installed between the process devices A and B.
The method of directly transferring the wafer 5 with the second fingers 13 and 14 cannot be adopted.

Further, the process devices A and B and the tunnel 7
As a problem of the boundary area between the wafers, there is a difference in height of the wafer transfer surfaces of the connected process apparatuses A and B. The wafer transfer surface of a general process device differs from device to device, and when trying to connect these to a common tunnel transfer device, the range of vertical movement is limited depending on the transfer robot. It may be difficult to give and receive.

Further, there are some process devices in which the robot cannot move vertically. In such a case, as shown in FIG. 15 and FIG.
The intermediate robot chamber 27 is arranged between the robot 7 and the tunnel 7, and the wafer 5 is transferred via the vertically movable robot 28 arranged in the intermediate robot chamber 27 to adjust the height of the wafer transfer surface. Are doing. However, if such an apparatus is further arranged, there is a problem that the wafer transfer apparatus becomes large and expensive.

Further, the wafer is provided with a flat notch called an orientation flat (hereinafter referred to as an orientation flat) for determining the position of the wafer in the circumferential direction. Then, depending on the process equipment, it is necessary to pass the orientation flat to the robot in a predetermined direction.

The present invention has been made for the purpose of solving the above-mentioned various problems, and in the boundary region between the process equipment and the tunnel transfer equipment, the wafer is smoothly transferred without complicating the equipment and increasing the size. It is an object of the present invention to provide a transport device that can do the above.

[0012]

The transport apparatus of the present invention comprises:
A carrier for loading wafers is provided inside the tunnel, and in a carrier device that conveys wafers in a state where the partition wall which is the outer shell of the tunnel blocks the outside air, inside the tunnel,
A table on which the wafer is placed, a moving means for moving the table in the vertical direction, and a phase for correcting the circumferential position of the orientation flat provided on the wafer while being placed on the table to a predetermined position. It is characterized in that it comprises a correction means.

[0013]

When the wafer is placed on the mounting table from the transfer carriage, the mounting table moves up and down so that the height of the transfer surface is the same as the height of the transfer surface of the robot for transferring the wafer. Further, the phase correction means corrects the position of the orientation flat to a predetermined position. Therefore, the operation of the transfer means such as the robot is simple, and the wafer can be delivered and received smoothly while simplifying the configuration.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 shows an arrangement of a process device and a transfer device, and FIG. 2 is a sectional view taken along the line AA of FIG. 1 showing a configuration between the process device and the transfer device. Further, FIG. 3 is a sectional view showing the details of the table. In the following description, the same components as those of the conventional example will be designated by the same reference numerals, and the description thereof will be omitted. As shown in FIG. 1, at the place where the wafer 5 is scheduled to be transferred and delivered via the tunnel 7, that is, at the stop position of the transfer carriage 9 between the process apparatuses A and B, the mounting table 1 is placed. It is arranged. The table 1 is configured to be movable up and down and rotated by the following configuration.

As shown in FIG. 3, an elevating mechanism 4 is attached to the lower surface of the partition wall 8 of the tunnel 7. Lifting mechanism 4
Is a linear guide 4a whose longitudinal direction is the vertical direction,
The slider 4b is slidably supported by the linear guide 4a and is driven by a stepping motor (not shown). A frame 30 having a hollow inside is attached to the slider 4b. A pair of bearings 31, 31 spaced apart from each other in the vertical direction is attached inside the frame 30, and the shaft 2 is supported by the bearing 31 so as to be slidable in the vertical direction. The upper end of the shaft 2 penetrates through the opening 6 formed in the partition 8 below the tunnel 7 and projects into the tunnel 7, and the mounting table 1 is attached to the upper end surface thereof. On the other hand, the lower end of the shaft 2 has a coupling 3
A stepping motor (phase correcting means) 33 is connected via a rotary shaft 2 to the rotary shaft. The table 1 is sized to pass through the opening 6.

A magnetic fluid seal 34 is attached to the upper end opening of the frame 30, and both ends of the airtight and expandable bellows 3 are provided at the outer edge of the magnetic fluid seal 34 and the peripheral edge of the opening 6 of the partition wall 8. Each part is attached. The magnetic fluid seal 34 hermetically seals the gap with the shaft 2, and the bellows 3 hermetically shields the space between the opening 6 and the magnetic fluid seal 34 from the outside. As a result, the inside of the bellows 3 is maintained in the same vacuum as the inside of the tunnel 7.
Then, the table 1 is driven by driving the elevating mechanism 4.
When the wafer 5 is transferred, the wafer 5 is projected into the tunnel 7 from the opening 6 and is housed in the opening 6 when the carriage is stopped or passes over the opening 6.

Next, the window 3 is formed in the partition wall 8 above the tunnel 7.
5 is formed, and the window 35 is sealed with a transparent glass plate 36. A shape recognition sensor 37 is arranged outside the window 35. The sensor 37 recognizes the shape of the wafer 5 and supplies the information to the signal processing control device 38 as a shape signal. The signal processing control device 38 calculates the phase shift of the wafer 5 from the shape signal, and supplies the rotation angle control signal to the stepping motor 33.

Next, FIG. 4 is a view showing the carrier truck 9.
An opening 10 is formed in the carrier truck 9 so as to pass through in the vertical direction, and the table 1 can pass through the opening 10. The wafer 5 is positioned and placed by a plurality of pins 21 attached to the upper surface of the carrier truck 9. The wheels 22 run the carrier truck 9 in the carrying direction, but are not necessary in the magnetic levitation carrier device in which the carrier truck 9 is magnetically levitated to travel without contact with the partition wall 8.

Next, the operation of the carrying device having the above construction will be described. In the initial state, the table 1 is lowered,
It is accommodated in the opening 6 of the partition wall 8. In this state, the carrier 9 carries the wafer 5 and stops on the opening 6 (see FIG. 5). Next, as shown in FIG. 6, the mounting table 1 rises from the opening 6 and passes through the opening 10 of the carrier truck 9 to lift the wafer 5 to the position shown in FIG. 7. In this state,
The shape of the wafer 5 is recognized by the sensor 37.

The sensor 37 supplies the image data of the wafer 5 generated by a television camera (not shown) to the signal processing controller 38. The signal processing control device 38 uses the sensor 3
The image data supplied from No. 7 is compared with the previously stored reference image data. The reference image data means the wafer 5 on the table 1 as shown by the chain double-dashed line in FIG.
The center O ₀ is a predetermined coordinate (x ₀ , y ₀ ) on the xy coordinates, and the orientation flat 5a is data based on an image oriented in the x-axis direction, for example. Further, the actual image data of the wafer 37 on the table 1 is as shown by the solid line in FIG.
The center O _{1 of the} wafer 5 has coordinates (x ₁ , y ₁ ), and
The orientation flat 5a is data based on an image inclined by an angle θ with respect to the x-axis. Then, the signal processing control device 38
From the coordinates (x ₁ , y ₁ ) of the center O _{1 and} the coordinates of the ends P, Q of the orientation flat 5a in the actual image data of the wafer 5,
The angle θ formed by the orientation of the orientation flat 5a with respect to the x-axis is calculated, and the calculation result is supplied to the stepping motor 33 as a control signal for the rotation angle. Stepping motor 33
Rotates the shaft 2 by an angle θ based on the control signal. The sensor 37 continuously sends the image signal of the wafer 5 to the signal processing controller 38. The signal processing control device 38 controls the wafer 5
The image data after the stop is compared with the reference image data, and it is determined whether the difference between them is within the allowable range. Then, if it is not within the allowable range, a control signal of the rotation angle is supplied to the stepping motor 33, and the above steps are repeated. If the difference in the image data is within the allowable range, the height of the stand 1 is set to a predetermined height (the finger 14 of the robot 12 is mounted on the wafer 5).
A control signal is supplied to the elevating mechanism 4 so as to move it to a height at which it can be transferred.

Next, as shown in FIG.
The fingers 14 of the robot 12 are extended to the wafer 5 side,
The wafer 14 is gripped. After that, the mounting table 1 descends and is settled in the opening portion 6, and the transfer carriage 9 moves to another place to transfer the next wafer 5. On the other hand, the fingers 14 move the wafer 5 into a predetermined process chamber 2 in the process apparatus B.
5, the process chamber 25 processes the wafer 5. In this case, since the orientation flat 5a of the wafer 5 is already oriented in the predetermined direction, the positioning of the wafer 5 in the process chamber 25 can be performed with a simple configuration and with high accuracy.

In the transfer apparatus having the above structure, the table 1 is moved up and down so that the height of the wafer 5 can be adjusted to the height of the fingers 13 and 14 of the robots 11 and 12 of the process apparatuses A and B, that is, the transfer surface. Therefore, the wafers can be delivered and received smoothly without complicating the configurations of the robots 11 and 12. Further, since the image data of the wafer 5 from the sensor 37 is processed and the orientation flat 5a is directed to the set direction, the positioning mechanism of the wafer 5 in the process chamber 25 can be simplified.

Next, another embodiment of the present invention will be described with reference to FIG. The embodiment shown in FIG.
Positioning of the wafer 5 as well as the orientation of the orientation flat 5a.
It is also configured to perform the center position of the slider 40b of the lifting mechanism 40 and the frame 30 for that purpose.
The XY table 41 is interposed between the table and the table so that the stand 1 can be stopped at any position within a predetermined horizontal range. As the XY table, various commercially available ones can be used.

In the transfer device having the above structure, in the state shown in FIG. 7, the sensor 37 supplies the image data of the wafer 5 generated by the television camera to the signal processing control device 38, as in the above embodiment. The signal processing control device 38
The image data supplied from the sensor 37 is compared with the previously stored reference image data. At that time, in FIG. 9, not only the phase of the orientation flat 5a in both image data but also the reference center coordinates (x ₀ , y ₀ ) and the actual center coordinates (x ₁ , y ₁ ) in FIG. Is calculated, and the difference between these coordinates in the x and y directions is calculated. Then, the signal processing control device 38 calculates the rotation angle of the wafer 5 and the movement distances in the x and y directions from the phase difference of the orientation flat 5a and the difference of the x and y coordinates, and the control signal of the rotation angle and the x and y directions are calculated. y
And a directional movement control signal. These control signals are
It is supplied to the stepping motor 33 and the XY table 41, respectively. The stepping motor 33 rotates the table 1 based on the control signal, and the XY table 41 moves the frame 30 in the x and y directions based on the control signal to align the centers of the orientation flat 5a and the wafer 5 with the reference position.
Further, the signal processing device 38 compares the position-corrected image signal of the wafer 5 supplied from the sensor 37 with the reference image data, and determines whether the difference between them is within the allowable range. Then, if it is not within the allowable range, a control signal is supplied to the stepping motor 33 and the XY table 41, and the above steps are repeated. If the difference in the image data regarding the orientation and center position of the orientation flat 5a is within the allowable range, a control signal is supplied to the elevating mechanism 4 so that the height of the table 1 moves to the transport surface.

In the transfer apparatus having the above-described structure, not only the orientation of the orientation flat 5a of the wafer 5 but also the center position of the wafer 5 can be adjusted to the reference position on the mounting table 1. Therefore, the wafers in the plurality of process chambers 25 of the process apparatuses A and B can be adjusted. 5
Since the positioning process of step A can be omitted, process device A
The internal structure of B and B can be greatly simplified.

Although the XY table 41 is used to adjust the center position of the wafer 5 in the above-mentioned embodiment, the present invention is not limited to such a structure and, for example, 3 mounted on a lathe. It is also possible to apply the mechanism of the automatic centering chuck of the claw to press the side surface of the wafer 5 on the mounting table 1 from three directions.

[0027]

As described above, according to the present invention, a mounting table for mounting a wafer inside the tunnel, a moving means for moving the mounting table in the vertical direction, and a mounting table mounted on the mounting table are provided. Since the wafer is provided with phase correction means for correcting the circumferential position of the orientation flat provided on the wafer to a predetermined position, the height and orientation of the wafer are determined by the configuration of the delivery means and the wafer processing means of the process equipment. It is modified so as to fit, and therefore, in the boundary area between the process equipment and the tunnel transfer equipment, it is possible to smoothly transfer an object such as a wafer without making the equipment complicated and upsized.

[Brief description of drawings]

FIG. 1 is a plan view showing a layout relationship between a tunnel transfer device and a process device according to each embodiment of the present invention.

FIG. 2 is an A- line in FIG. 1 of the carrying device according to the embodiment of the present invention.
FIG. 6 is a cross-sectional view taken along line A, showing a state in which a wafer is transferred via a mounting table.

FIG. 3 is a cross-sectional view showing details of a mounting table portion in FIG.

FIG. 4 is a perspective view showing details of a carrier vehicle.

FIG. 5 is an A- line in FIG. 1 of the carrying device according to the embodiment of the present invention.
FIG. 6 is a cross-sectional view taken along the line A, showing a state in which the carrier truck is stopped on the stand.

FIG. 6 is an A- line in FIG. 1 of the carrying device according to the embodiment of the present invention.
FIG. 6 is a cross-sectional view taken along the line A, showing a state in which the mounting table rises through the opening of the transport carriage.

FIG. 7 is a diagram showing a state where the mounting table further rises from the state shown in FIG. 6 and reaches a rising end.

FIG. 8 is a diagram showing a state in which the fingers of the robot grip the wafer and the mounting table is lowered from the state shown in FIG. 7;

FIG. 9 is a plan view for explaining a wafer position correcting process.

FIG. 10 is a cross-sectional view showing details of a portion of a stand according to another embodiment of the present invention.

FIG. 11 is a plan view showing a relationship in arrangement between a conventional transfer device and a process device.

FIG. 12 is a cross-sectional view of the conventional transport device taken along the line AA in FIG.

13 is a diagram showing a state where wafers are directly transferred by the fingers of a robot between the process devices on both sides shown in FIG.

FIG. 14 is a diagram showing the relationship between the fingers of the robot shown in FIG. 13 and the wafer.

FIG. 15 is a plan view showing a state in which the intermediate robot chamber is arranged between the process device and the transfer device in FIG.

16 is a sectional view taken along line BB of FIG.

[Explanation of symbols]

 1 table 2 axis 3 bellows 4 lifting mechanism (moving means) 5 wafer 7 tunnel 8 partition 9 carrier truck 30 frame 31 bearing 33 stepping motor (phase adjusting means). 34 magnetic fluid seal 35 window 37 shape recognition sensor 38 signal processing control device

Claims (8)

[Claims] 1. A carrier device for carrying a wafer, wherein a carrier carrying a wafer is provided inside a tunnel, and the wafer is carried in a state where a partition wall serving as an outer shell of the tunnel shuts off outside air.
A mounting table for mounting the wafer inside the tunnel,
It comprises a moving means for moving the mounting table in the vertical direction, and a phase correcting means for correcting the circumferential position of the orientation flat provided on the wafer in a state of being mounted on the mounting table to a predetermined position. A transport device characterized by the above. 2. The transfer apparatus according to claim 1, wherein the moving mechanism is provided with a position correcting unit that corrects the center position of the wafer to a predetermined position. 3. A carrier device for carrying a wafer inside a tunnel, wherein a carrier for carrying a wafer is provided, and the wafer is carried in a state where a partition wall serving as an outer shell of the tunnel shuts off outside air.
A mounting table for mounting the wafer inside the tunnel,
Moving means for moving the table in the vertical direction, phase detecting means for detecting a phase shift between a predetermined circumferential position of the orientation flat and an actual position in a state of being mounted on the table, and And a control means for rotating the mounting table by an angle corresponding to the phase shift based on the detection result of the position detection means. 4. A position detecting means for detecting a positional deviation between a predetermined center position of the wafer and an actual center position of the wafer while being mounted on the mounting table, and a detection result of the position detecting means. 4. The transfer device according to claim 3, further comprising position control means for moving the mounting table to a predetermined position based on the above. 5. The transport carriage is provided with an opening portion penetrating in a vertical direction, and the mounting table is configured to be capable of retracting through the opening portion.
5. The transport device according to any one of 4 to 4. 6. Robots having different transfer surfaces for transferring the wafers are disposed on both sides of the tunnel, and the moving means causes the mounting table to protrude from the opening so that the transfer surfaces are different from each other. The transfer device according to claim 5, wherein the transfer device is configured to transfer the wafer between the transfer devices. 7. A bellows mechanism hermetically sealed from the outside is provided in an opening provided on the lower surface or the upper surface of the partition wall, and a support body for supporting the mounting table is provided inside the bellows mechanism. 7. The transport device according to claim 1, further comprising an elevator mechanism for raising and lowering the support body outside the bellows mechanism. 8. A transporting method for transporting a wafer inside a tunnel, wherein the wafer is transported while the outside air is blocked by a partition wall which is an outer shell of the tunnel, and the wafer is vertically movable inside the tunnel. A wafer is placed on the table, and the phase shift between the predetermined position in the circumferential direction of the orientation flat and the actual position in the state of being placed on the table is detected, and the table is moved based on this detection result. A conveyance method characterized by rotating the lens at an angle corresponding to the phase shift.