JPH0723922Y2 - Chip-type variable electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a chip-type variable resistor whose resistance value can be adjusted or a chip-type variable capacitor whose capacitance can be adjusted. In addition, a rotor member formed of a metal plate is rotatably and pivotally mounted on the upper surface of the fixed substrate, and the rotor member is rotated by a driver tool so that the resistance value and the capacitance can be adjusted. The present invention relates to an improvement of a configured chip type variable electronic component.

[Conventional technology]

As a prior art relating to a chip type variable resistor among these chip type variable electronic parts, FIG. 2 of Japanese Patent Laid-Open No. 63-296203 discloses that a metal is formed on the upper surface of an insulating substrate having an arc-shaped resistance film formed on the upper surface. A plate is formed into a bowl shape with an upward opening, and a rotor member formed by forming a flange portion around the bowl portion is rotatably pivotally mounted, and the rotor member is rotated on the flange portion of the rotor member. A cross-shaped engagement groove for a plus-type driver tool is punched out, and a ring body is formed at one side edge of the flange portion by bending back toward the lower surface of the flange portion. There is described a configuration in which a sliding terminal piece that is integrally connected and is in contact with a resistance film of the insulating substrate is formed in a portion of the ring body that is located on the opposite side of the connection portion with respect to the flange portion. .

As described above, when the cross-shaped engagement groove is formed in the flange portion of the rotor member and the rotor member is rotationally operated by the plus-type driver tool, the minus-type driver is attached to the flange portion of the rotor member. Compared to the case where the engagement groove for the tool is formed in a single letter, the driver tool can be inserted into the engagement groove of the flange portion by rotating the angle by a slight angle, improving the efficiency of the work of adjusting the resistance value. There is an advantage that you can.

In addition, a ring body formed by folding back the flange part toward the lower surface of the flange part is integrally connected to one side edge of the flange part of the rotor member, and the ring part opposite to the connection part to the flange part is connected. If a sliding terminal piece that contacts the resistance film of the insulating substrate is formed in the side portion, the length from the sliding terminal piece to the flange portion of the rotor member becomes longer, so that a spring for the sliding terminal piece is formed. Since the elastic force can be significantly improved, when the rotor member is rotated by the driver tool, it is possible to reduce the fluctuation of the contact pressure of the sliding terminal piece with respect to the resistance film due to the pressing / releasing of the driver tool against the rotor member. Thus, there is an advantage that the resistance value can be adjusted with high accuracy.

[Problems to be solved by the device]

By the way, this type of chip-type variable resistor is sucked by a vacuum suction type collet and automatically mounted on a printed circuit board or the like in an electric device, and in this state, the tip of the driver tool is engaged with the rotor member. The resistance value is adjusted by engaging the groove and rotating the driver tool.

However, when the cross-shaped engaging groove for the plus type driver tool is formed by punching in the flange portion of the rotor member as in the above-mentioned prior art, the engaging groove for the minus type driver tool is formed in one letter shape. Compared to the case, the area of the engaging groove increases, so when automatically mounting the chip type variable resistor on the printed circuit board etc. with the vacuum suction collet, when the vacuum suction collet sucks, the driver Since a large amount of air is sucked from the engaging groove for the tool, suction errors due to the vacuum suction collet frequently occur. In addition to this, the engagement hole is formed in a cross shape in the flange part of the rotor member. Then,
Since the area of the flat surface of the upper surface of the rotor member is reduced, the suction position of the vacuum suction collet is displaced laterally or tilted when suction is performed by the vacuum suction collet. Since it often happens that the product cannot be properly supplied to the predetermined mounting position on the printed circuit board in the correct posture. Therefore, in the automatic mounting process using the vacuum suction collet, there is a high rate of defective mounting. was there.

The present invention is an advantage of rotating a chip type variable electronic component by rotating a rotor member with a plus type driver tool,
That is, it is an object of the present invention to provide a form that can reliably reduce mounting defects in an automatic mounting process using a vacuum suction collet without impairing the advantages of improving the efficiency of adjustment work and improving the adjustment accuracy. It is a thing.

[Means for Solving the Problems]

In order to achieve this purpose, the present invention, on the upper surface of the fixed substrate,
A chip-type variable electronic component formed by rotatably pivoting a rotor member, which is formed in a bowl shape of an upward opening with a metal plate and has a flange portion formed around the bowl portion, on a flange portion of the rotor member. , A cross-shaped engagement groove for a plus-type driver tool in plan view is formed by recessing one of the two engagement grooves extending in the direction intersecting with each other and punching out the other engagement groove. Then, a surface plate formed by folding back the upper surface of the rotor member is integrally connected to one side edge of the flange portion of the rotor member, and an engaging hole for the driver tool is formed in the surface plate. ,
A ring body is integrally formed so as to be overlapped with the engagement groove in the flange portion in a plan view, and the outer peripheral edge of the surface plate is bent back in a folded shape toward the lower surface of the flange portion of the rotor member. Then, the sliding terminal piece with respect to the upper surface of the fixed substrate is formed in a portion of the ring body away from the connecting portion with respect to the surface plate.

[Function and effect of device]

In this manner, the outer peripheral edge of the flange portion of the rotor member is integrally connected to the surface plate formed by bending back toward the upper surface of the rotor member, and the engaging hole for the driver tool is formed in this surface plate. With this configuration, since the large-area opening of the bowl-shaped rotor member can be covered with the surface plate, the flange portion and the surface plate of the rotor member are provided with cross-shaped engaging grooves and engaging holes, respectively. Even in the case where the above is formed, the area of the flat surface on the upper surface of the electronic component, in other words, the area of the flat surface for the vacuum suction collet can be remarkably increased as compared with the prior art.

Further, one of the two engagement grooves formed so as to extend in a cross shape on the flange portion of the rotor member is formed by deforming the flange portion into a concave shape. Since air is hardly sucked into the vacuum suction collet from the one engagement groove when adsorbing, the flange portion of the rotor member is formed with a cross-shaped engagement groove. The amount of air sucked into the vacuum suction collet from the engaging groove can be regulated to a small amount.

As described above, the area of the flat surface for the vacuum suction collet can be increased, and the amount of air sucked into the vacuum suction collet from the engaging groove for the driver tool can be restricted to a small amount, which is a chip type. Since the variable electronic parts can be sucked with the vacuum suction collet in a reliable and accurate posture, the incidence of electronic component mounting failure due to suction mistakes due to the vacuum suction collet and poor suction posture can be calculated. It can surely be reduced.

Since the engagement groove and the engagement hole for the driver tool are formed in the flange portion of the rotor member and the surface plate that overlaps with the upper surface of the flange portion, the engagement depth of the tride tool for the rotor member can be sufficiently increased. Since the rotor member can be secured and the rotor member can be reliably rotated by the plus-type driver tool, the efficiency of the adjustment work by rotating the rotor member can be improved and the adjustment can be performed with high accuracy.

〔Example〕

Hereinafter, in order to explain the drawings when the embodiment of the present invention is applied to a chip type variable resistor, reference numeral 1 in the drawings
Indicates a substrate made of an insulator in which a through hole 2 is formed substantially at the center, and a resistive film 3 is formed on the upper surface of the substrate 1 in an arc shape with the through hole 2 as the center. Terminal electrode films 4 and 5 for both ends of the resistance film 3 are formed on one side surface of the resistance film 3.

Reference numeral 6 indicates a central terminal plate made of a metal plate disposed on the lower surface of the substrate 1, and the central terminal plate 6 is integrally formed with a hollow shaft 7 fitted in the through hole 2. .

Reference numeral 8 denotes a rotor member formed of a metal plate in a bowl shape having an upward opening and integrally formed with a flange portion 8b around the bowl portion 8a. After being fitted on the tip of the hollow shaft 7, it is rotatably attached to the hollow shaft 7 by swaging the tip of the hollow shaft 7 (this swaging portion is indicated by reference numeral 7a). The flange portion 8b of the rotor member 8 is formed with two engagement grooves 9 and 10 for a plus type driver tool (not shown) so as to extend in a cross shape in a plan view.

At this time, one engagement groove 9 of the two engagement grooves extending in the direction intersecting with each other has two cutting lines 9a formed in parallel,
The portion between the cutting lines 9a is formed by denting and deforming to a depth having substantially the same dimension as the plate thickness dimension of the flange portion 8b, and the other engaging groove 10 is formed by punching out the flange portion 8b. Has been formed.

A film 11 made of a heat resistant synthetic resin is attached to the lower surface of the center terminal plate 6 so as to close the inside of the hollow shaft 7.

Then, in the outer peripheral edge of the flange portion 8b of the rotor member 8, a surface plate 12 is provided at a portion located on the extension line of the one engagement groove 9 and a connecting portion 13 having a bent portion line 13a.
The surface plate 12 is integrally connected via the bending line 13a at the position of the connecting portion 13 with respect to the flange portion 8b.
Along the direction toward the upper surface of the rotor member 8 in a folded shape, and the surface plate 12 is provided with a cross-shaped engagement hole 14 for the driver tool in a plan view and the engagement grooves 9 and 10 in the flange 8b. And so as to be overlapped in a plan view.

Furthermore, in the portion of the outer peripheral edge of the surface plate 12 located on the side opposite to the connecting portion 13 with respect to the flange portion 8b,
The ring body 15 is integrally connected through a connecting portion 16 having a bending line 16a, and the ring body 15 is attached to the lower surface of the flange portion 8b along the bending line 16a in the connecting portion 16 with respect to the surface plate 12. Bending in a fold-back direction, and by engraving a semicircular cutting line 14 in a portion of the ring body 16 away from the connecting portion 16 with respect to the surface plate 12, sliding contact with the resistance film 3 is performed. It is formed on the terminal piece 18.

In this case, by closely contacting the proximal end portion of the ring body 15 with the lower surface of the flange portion 8b, the ring body 15 closes the other engagement groove 10 in the flange portion 8b from below, and further, A hole 19 for preventing the interference of the one engagement groove 9 in the flange portion 8b with the bottom plate is formed in a portion of the ring body 15 near the base end.

Further, in the surface plate 12, at a portion located near the sliding terminal piece 18, an indexing notch hole 20 having a rectangular shape in plan view is provided as an indexing means for indicating the position of the sliding terminal piece 18. A notch is formed so as to communicate with 14.

In the above configuration, the flange portion of the rotor member 8
The outer peripheral edge of 8b is integrally connected to a front surface plate 12 which is bent back toward the upper surface of the rotor member 8, and an engaging hole 14 for a driver tool is formed in the front surface plate 12. Then, even if the engagement hole 14 has a cross shape in plan view, the inner diameter of the surface plate 12 can be made smaller than the inner diameter of the flange portion 8b, so that the large opening portion of the bowl-shaped rotor member 8 can be formed by the surface plate 12. Since it can be covered, the area of the flat surface of the upper surface of the resistor, in other words, the area of the flat surface with respect to the vacuum suction collet can be significantly increased as compared with the above-mentioned prior art.

In addition, one of the engagement grooves 9 and 10 formed to extend in a cross shape on the flange portion 8b is formed by denting and deforming the flange portion 8b, so that the resistor is vacuum-adsorbed. When sucked by the collet, air is prevented from being sucked into the vacuum suction collet from the location of the one engagement groove 9, and the amount of air sucked in the vacuum suction collet is regulated to an extremely small amount. This is because it is possible to regulate the amount of air sucked by this vacuum suction collet to a small amount, and the fact that the area of the flat surface for the vacuum suction collet can be increased, and the resistor is reliably In addition, it is possible to adsorb in an accurate posture.

Then, the driver tool engages with both the engaging hole 14 of the surface plate 12 and the engaging grooves 9 and 10 of the flange 8b,
By sufficiently securing the engagement depth dimension of the driver tool and fitting the driver tool into the engagement hole 14 of the surface plate 12, the rotor member 8 can be reliably and accurately rotated, so that the resistance can be improved. The work of adjusting the value can be performed efficiently and with high accuracy.

When the ring body 15 closes the other engagement groove 10 in the flange 8b from below as in the embodiment, air is sucked from the engagement grooves 9 and 10 in the flange portion 8b to the vacuum suction collet. Since this can be prevented, the suction of the resistor by the vacuum suction collet can be made more reliable, and the mounting failure can be further reduced.

Although the above embodiment has been applied to the chip type variable resistor, it goes without saying that the present invention can be applied to other variable electronic components such as the chip type variable capacitor.

[Brief description of drawings]

The drawings show an embodiment of the present invention. Fig. 1 is a plan view of a chip type variable resistor, Fig. 2 is a front view, Fig. 3 is a right side view, and Fig. 4 is a view taken along line IV-IV of Fig. 1. Sectional view, FIG. 5 shows V- in FIG.
FIG. 6 is a development view of the rotor member, which is a sectional view taken along line V. 1 ... Substrate, 2 ... Through hole, 3 ... Resistive film, 4,5 ... Terminal electrode film, 6 ... Central terminal plate, 7 ... Hollow shaft, 8 ... Rotor member, 8a ... Bowl type Part, 8b ... Flange part, 9 ... one engaging groove, 10 ... other engaging groove, 12 ... face plate, 13 ...
… Connecting part, 14 …… engaging hole, 15 …… ring body, 16 …… connecting part, 18 …… sliding terminal piece.

Claims (1)

[Scope of utility model registration request] 1. A chip type variable comprising a rotor member formed on a top surface of a fixed substrate in a bowl shape having an upward opening with a metal plate, and having a flange portion formed around the bowl portion so as to be rotatable. In the electronic component, the flange portion of the rotor member is provided with a cross-shaped engagement groove in a plan view with respect to the plus type driver tool, and one of the two engagement grooves extending in a direction intersecting with each other is formed by denting deformation. , The other engaging groove is formed by punching, and one surface edge of the flange portion of the rotor member is integrally connected to a surface plate formed by bending back toward the upper surface of the rotor member. An engaging hole for the driver tool is formed in the face plate so as to overlap with an engaging groove in the flange portion in a plan view, and is folded toward an outer peripheral edge of the surface plate toward a lower surface of the flange portion of the rotor member. Return A chip characterized in that a ring body formed by bending in a circular shape is integrally connected, and a sliding terminal piece for the upper surface of the fixed substrate is formed in a portion of the ring body apart from a connection portion for the surface plate. Variable type electronic components.