JPH0723963Y2 - Mold for sealing container of hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to improvement of a mold for a sealing container of a hybrid integrated circuit.

(B) Conventional Technology As shown in FIG. 2, a conventional hybrid integrated circuit is provided with a circuit element (not shown) on a hybrid integrated circuit board (11) to form a desired circuit function, and then a sealed container is formed. (12) was adhered to the hybrid integrated circuit board (11) for sealing. The encapsulation container (12) connects the encapsulation lid part (13), which encloses the circuit element part installed above with a space, and an external circuit fixed to one peripheral edge of the hybrid integrated circuit board (11). Externally derived leads for (14)
Was formed integrally with a resin-filled portion frame (15) surrounding the above with a constant space width.

As shown in FIG. 3, the encapsulation container for the hybrid integrated circuit described above is
It is formed by injecting resin into the space (23) formed by the upper and lower molds (21) (22) from the resin injection port (24) formed at the joint between the upper and lower molds (21) (22). It was

(C) Problems to be solved by the invention The resin used for the sealed container is a thermoplastic resin containing several tens of percent of glass fiber in order to improve strength and heat resistance, and is formed by upper and lower molds. The resin is injected into the enclosed space to form a sealed container.

However, when a sealed container is injection-molded with a conventional mold, long glass fibers are arranged in the injection direction, and when the sealed container is cooled, the container contracts significantly in the direction orthogonal to the injection direction, resulting in a defect. There was a problem. It is considered that this is because long glass fibers are arranged in the injection direction.

(D) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and a predetermined space is formed by the first mold and the second mold, and the first and second molds are formed. In a mold for a sealing container of a hybrid integrated circuit, in which a resin is injected into the space from at least one resin injection port formed by the second mold, a plurality of protrusions are formed on the surface of the second mold. Set up a department to solve the problem.

(E) Action By providing the plurality of convex portions on the surface of the second mold in this manner, the glass fibers contained in the resin injected from the resin injection hole are dispersed by the plurality of convex portions and extend in the injection direction. It is characterized by preventing the glass fibers in a shape from being arranged.

(F) Embodiment The present invention will be described in detail below based on the embodiment shown in FIG.

As shown in FIG. 1, a mold (1) for a sealed container of a hybrid integrated circuit according to the present invention comprises a sealed container formed of a first mold (2) and a second mold (3). A space portion (4) for forming is provided, and a resin injection port (5) for injecting resin into the space portion (4) at the joint portion of the first and second molds (2) (3).
Is provided.

A feature of the present invention is to provide a plurality of convex portions (6) on the surface of the second mold (3). The convex portion (6) is formed on the surface of the second mold (3) with a height of about 2 to 5 mm, and disperses the resin injected by the convex portion (6). More specifically, the resin used in the present invention is a thermoplastic resin containing long glass fibers,
The resin is injected at high speed through the injection port (5) formed in the joint portion of the first and second molds (2) and (3). At this time,
The long glass fibers hit the plurality of convex portions (6) and are dispersed in the space (4).

As a result, the glass fibers contained in the resin are not arranged only in the injection direction but are dispersed in all directions, and it is possible to remarkably reduce the occurrence of shrinkage when the sealed container is cooled.

(G) Effect of the Invention As described in detail above, according to the present invention, by providing a plurality of convex portions on the surface of the second mold, the glass fiber contained in the injected resin is kept in the space. Since the shrinkage of the finished sealed container during cooling can be remarkably alleviated, defects due to the shrinkage of the sealed container can be prevented.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a general hybrid integrated circuit, and FIG. 3 is a sectional view showing a conventional example.

Claims (1)

[Scope of utility model registration request] 1. A predetermined space is formed between a first upper mold and a second lower mold, and at least one is formed at a joint between the first upper mold and the second lower mold. In a mold for a sealing container of a hybrid integrated circuit, in which a thermoplastic resin containing a long glass fiber is injected into the space from resin injection ports at more than one place, a plurality of protrusions are formed on the surface of the second lower mold. A mold for a sealing container of a hybrid integrated circuit, characterized in that a portion is provided, and the glass fiber is applied to and dispersed in the convex portion.